The invention relates to an electroless nickel plating solution and an electroless nickel plating process for a flexible printed circuit board. The electroless nickel plating solution of the present invention comprises the following components: nickel salt, calculated as Ni2+ content, is 4.5-5.5g/L; reducing agent, 15-40g/L; complexing agent, 20-100g/L Stabilizer, 0.01~10mg/L; Accelerator, 0.001~1g/L; Low stress additive, 0.01~10g/L; The low stress additive is sodium naphthalene disulfonate, sodium benzenesulfonate, saccharin, gelatin, One or more of butynediol, acetic acid, coumarin, formaldehyde, and acetaldehyde. In the chemical nickel plating process of the present invention, the temperature of the chemical nickel plating liquid is 75-90 DEG C, the pH value of the chemical nickel plating liquid is 4.5-5.4, and the chemical nickel plating time is 15-30 minutes. The electroless nickel plating solution and the electroless nickel plating process of the present invention can effectively reduce the stress of the nickel layer, improve the toughness of the nickel layer, make the nickel layer have good bending performance, and meet the production and assembly requirements of flexible printed circuit boards , to further improve the yield rate.