185 results about "Electroless nickel" patented technology

The present application relates to the field of wastewater treatment, and provides a treatment system and method for electroless nickel-plating waste liquid. The treatment system comprises a decomplexing pretreatment system; an oxidation-decomplexing system comprising a redox reactor and a decomplexing reactor which are connected in sequence, wherein an oxidizing agent in the redox reactor is oxygen, and an oxidizing agent in the decomplexing reactor is hydrogen peroxide; a chemical precipitation system comprising a neutralization reaction tank and a sedimentation tank which are connected in sequence, wherein the sedimentation tank is equipped with a filter system; and an evaporation crystallization system comprising an evaporation device, a crystallization device, and a separation device which are arranged in sequence. In the treatment system and method for electroless nickel-plating waste liquid, a two-stage oxidation method is employed to achieve oxidation and decomplexing of the waste liquid; in addition, combining chemical precipitation treatment and evaporation crystallization treatment not only reduces the waste liquid treatment cost but also avoids the introduction of other impurities, and allows for the separation of nickel salts and phosphate salts, so that the operation is easy and convenient, the treatment cost is low, the nickel removal rate is high, and resource utilization of nickel is facilitated.

The invention relates to the technical field of waste liquid treatment, in particular to a method for efficiently separating nickel, hypophosphorous acid and ammonia from chemical nickel plating waste liquid, which comprises the following steps: S1, nanofiltration: carrying out nanofiltration separation on chemical nickel plating waste water by using a roll type nanofiltration membrane to obtain nickel-containing waste water and waste water containing hypophosphorous acid and ammonia; s2, bipolar membrane electrodialysis: setting an arrangement mode of a bipolar membrane electrodialysis system as follows: sequentially arranging an anode, a first bipolar membrane, an anionic membrane, a cationic membrane, a second bipolar membrane and a cathode, introducing wastewater containing hypophosphorous acid and ammonia into a desalination chamber, and adding deionized water into an acid chamber and an alkali chamber to obtain a hypophosphorous acid solution and ammonia gas; separation of hypophosphorous acid and ammonia is realized; according to the method, hypophosphite and ammonium in the chemical nickel-plating waste liquid are efficiently separated, and the method has important significance on improving the resource utilization efficiency of phosphorus and ammonia in the chemical nickel-plating waste liquid and reducing the treatment difficulty and treatment cost of the chemical nickel-plating waste liquid.

The invention provides a chemical nickel plating solution with controllable plating speed and phosphorus content. The chemical nickel plating solution comprises the following components in concentration content: 13-28 g / L of main salt, 12-25 g / L of a reducing agent, 3-80 g / L of a composite complexing agent, 4-15 mg / L of a stabilizing agent, 10-30 g / L of a buffering agent and 10-40 mg / L of a wetting agent, the composite complexing agent contains 1-40g / L of amine complexing agent. According to the chemical nickel-plating solution disclosed by the invention, the chemical nickel-plating rate can be controlled and the requirements of different phosphorus contents in a nickel-plating layer can be met by only adopting one basic chemical nickel-plating solution formula by only changing the content of the amine complexing agent, cooperating with the combined action of other substances and simultaneously adaptively adjusting the plating conditions, so that the production process is simplified, and the production cost is reduced. The production cost is reduced, and the application prospect is wide.

The invention belongs to the technical field of chemical nickel equipment, and particularly relates to a three-dimensional swinging chemical nickel device for semiconductor parts, which comprises an outer groove, an inner groove, a support, a driving mechanism, a lifting mechanism, a transverse moving mechanism, a longitudinal moving mechanism, a swinging frame and a workpiece suspension frame, and the driving mechanism comprises a driving motor, a driving eccentric wheel, an adjusting rod, a linkage rocker and a driving shaft. The lifting mechanism comprises a lifting belt clamping plate assembly, a lifting rod, a lifting guide assembly, a vertical driving frame and a riding wheel assembly. When the driving shaft rotates, the lifting rod drives the swing frame to move up and down. The transverse moving mechanism comprises a linkage eccentric wheel, a linkage driving lever and a transverse cam groove plate, and the linkage driving lever drives the swing frame to move left and right when ascending and descending. The longitudinal moving mechanism comprises a longitudinal cam groove plate, a V seat fixing plate, a longitudinal moving guide rail and a guide rail support, and the V seat fixing plate longitudinally moves relative to the guide rail support. According to the invention, three-dimensional swinging of the workpiece can be realized, and the chemical nickel plating quality of semiconductor parts is improved.

The present application provides a corrosion-resistant and thermal-shock-resistant composite layer based on a tin layer, a corrosion-resistant and thermal-shock-resistant treatment method for an aluminum substrate, and an aluminum terminal. The corrosion-resistant and thermal-shock-resistant composite layer based on a tin layer comprises an alkaline copper layer, a pyrophosphate copper layer, a chemical nickel layer, and a tin layer; the thickness of the alkaline copper layer is 1-10 μm, the thickness of the pyrophosphate copper layer is 2-18 μm, the thickness of the chemical nickel layer is 1-30 μm, and the thickness of the tin layer is 3-30 μm. The corrosion-resistant treatment method for an aluminum substrate comprises the step of providing the corrosion-resistant and thermal-shock-resistant composite layer based on a tin layer on the surface of an aluminum substrate. The surface of the corrosion-resistant aluminum terminal is provided with the corrosion-resistant and thermal-shock-resistant composite layer based on a tin layer. The composite layer in the present application has excellent performance, and can still have a good corrosion resistance after experiencing cyclic thermal shocks; the present application can still meet 240H salt spray corrosion resistance requirements after experiencing cyclic thermal shocks.

The present disclosure provides a corrosion-resistant and temperature shock-resistant composite layer, a treatment method for corrosion resistance and temperature shock resistance of an aluminum base material, and an aluminum terminal. The corrosion-resistant and temperature shock-resistant composite layer comprises a copper layer prepared by alkaline copper electroplating, a copper layer prepared by copper pyrophosphate electroplating, an electroless nickel layer and a silver layer, the thickness of the copper layer prepared by alkaline copper electroplating being1-10 μm, the thickness of the copper layer prepared by copper pyrophosphate electroplating being 2-18 μm, the thickness of the electroless nickel layer being1-30 μm, and the thickness of the silver layer being 0.2-25 μm. The treatment method for corrosion resistance of an aluminum base material comprises the step of providing a corrosion-resistant and temperature shock-resistant composite layer on the surface of an aluminum base material. A corrosion-resistant and temperature shock-resistant composite layer is provided on the surface of a corrosion-resistant aluminum terminal. The composite layer in the present disclosure has excellent performance, can still have good corrosion resistance after being subjected to temperature cycling shocks, and can still satisfy the 120 H salt-spray corrosion resistance requirement after being subjected to temperature cycling shocks.

The invention discloses a PCB processing technology for printing multi-layer stepped thick gold plating, and belongs to the field of multi-layer PCB processing. The PCB processing technology for printing multi-layer stepped thick gold plating comprises the following steps: designing a PCB, and carrying out hierarchical planning; overlapping and laminating the insulating material and the copper foil layer according to the design, and performing interlayer alignment by using an optical alignment system; laser drilling equipment is adopted to drill holes in the laminated plate for electrical connection and hole penetrating; a chemical nickel-copper plating process is used, and plating is carried out in the hole wall; forming a circuit pattern on the surface of the plating layer by using a photoetching technology; redundant materials are removed by using an etching technology; plating thick gold on the copper layer by using an electroplating technology; and measuring the thickness of the gold-plated layer, assembling the processed PCB, and carrying out electrical test. In the laminating process, the optical alignment system is used for carrying out interlayer alignment, so that the alignment precision is ensured, and the problems of signal transmission loss, short circuit or open circuit and the like are avoided.

The application belongs to the technical field of chemical production, and particularly relates to a chemical nickel plating wastewater treatment equipment. In the treatment process, repeated precipitation and filtration are needed, which leads to slow treatment efficiency. The following scheme is proposed, which comprises a treatment cylinder, the lower side of the treatment cylinder is fixedly connected with a cylinder seat, a water inlet is formed in the treatment cylinder, a water inlet pipe is fixedly connected in the water inlet, a water outlet is formed in the bottom of the treatment cylinder, a drain pipe is fixedly connected in the water outlet, valves are arranged on the water inlet pipe and the drain pipe, and a top plate is arranged above the treatment cylinder. The disclosed chemical nickel plating wastewater treatment equipment utilizes the magnetism of nickel to adsorb solid nickel in wastewater, so that the solid nickel in wastewater can be conveniently adsorbed and removed. The electromagnetic iron is electrified to generate magnetic properties, so that the solid nickel can be quickly adsorbed and subsequently separated and separated. The solid nickel does not need to be repeatedly filtered, and the recovery efficiency of the solid nickel in wastewater is improved.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The invention belongs to the technical field of composite material casting, and relates to an aluminum / iron double-metal composite material based on a chemical nickel-plating layer and a preparation method of the aluminum / iron double-metal composite material based on the chemical nickel-plating layer, a nickel layer with uniform thickness is preset on the surface of an iron base material in advance in a chemical plating mode, and the effect of thoroughly isolating direct contact between an aluminum material melt and the solid iron base material is achieved. The interface phase composition regulation and control of the aluminum / iron bimetallic composite material can be realized, the interface defects are greatly reduced, and the interface bonding strength is improved.

A sleeve includes a first surface treated portion treated with electroless nickel plating at least on both ends in an axial direction, in an inner circumferential surface thereof. The first surface treated portion has an inner diameter smaller than other portions of the inner circumferential surface by a film thickness of first plating, and slidably supports a spool valve element.

The invention provides a repairing method suitable for an engine case connecting bolt. The method comprises the following steps that S1, chemical stripping and fine treatment are conducted on the connecting bolt, an old plating layer on the surface of the connecting bolt is removed, and the surface of the connecting bolt is evenly coarsened; s2, a nitric acid-phosphoric acid binary acid system is adopted to conduct soaking treatment on the connecting bolt treated in the step S1 at the normal temperature, and a passive film on the surface of the connecting bolt is removed; s3, the connecting bolt treated in the step S2 is subjected to chemical nickel plating; and S4, the connecting bolt treated in the step S3 is subjected to hot water stabilization and dehydrogenation treatment, and the repaired connecting bolt is obtained. The invention provides a set of process from old plating layer removal, passive film removal and chemical nickel plating to hydrogen brittleness avoidance, so that the whole repair process is highly controllable, the product quality is stable and repeatable, and the problem of batch scrapping caused by batch difference and process uncontrollability in the prior art is solved.

Method for the automated determination of the content of a stabilizer reacting with a palladium(II) salt in a chemical nickel bath, the method comprising: the extraction of a sample of the chemical nickel bath, the volume of which is measured, and the transfer of the sample into a vessel whose wall is transparent to light at least at two opposite points, the connecting line between the two points passing through the sample, the portionwise addition of measured volumes of an aqueous solution of the palladium(II) salt to the sample, wherein the solution has a known concentration of palladium(II) salt, wherein the sample is stirred, and wherein the addition is continued until a discoloration of the sample due to precipitation of nickel is observed, and the calculation of the stabilizer content based on the total volume of solution added to the sample up to the point of discoloration, characterized by the fact that The solution is added by a dosing device which is controlled by a control device. The detection of discoloration is carried out using an optical sensor that is located outside the vessel and measures the transmittance of the sample to light along the aforementioned connecting line. the control device is connected to the optical sensor and stops adding the solution when the optical sensor detects the discoloration of the sample, and The light is infrared light.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.

The utility model provides a chemical nickel plating wastewater treatment and nickel and phosphorus resourceful treatment device which is characterized by comprising an oxidation unit, a phosphorus recovery unit and a nickel recovery unit, the oxidation unit comprises a reaction tank; the phosphorus recovery unit consists of a first reaction tank, a second reaction tank and a first sedimentation tank; and the nickel recovery unit consists of a third reaction tank, a fourth reaction tank and a second sedimentation tank. A water inlet pipe is arranged at the lower part of the reaction tank; a first dosing pipe and a second dosing pipe are arranged at the top of the reaction tank; a blow-down pipe is arranged at the bottom of the reaction tank; and baffle plates are sequentially and alternately arranged up and down in the reaction tank. According to the utility model, resource utilization of phosphorus and nickel can be realized on the basis of realizing that all indexes of treated effluent reach the standard.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The invention discloses a chemical nickel-plated layer blackening agent and a blackening method, the chemical nickel-plated layer blackening agent comprises the following components: 400-900g / L of phosphoric acid, 400-900g / L of saturated carboxylic acid, 10-300g / L of an oxidizing agent and 10-100g / L of carbamide, the high-concentration phosphoric acid is used as a main catalyst for a chemical nickel-plated layer (nickel-phosphorus alloy layer) blackening reaction, the complex reaction can be ensured to be stably carried out, and the chemical nickel-plated layer blackening agent can be used for blackening the chemical nickel-plated layer (nickel-phosphorus alloy layer). Meanwhile, due to the high viscosity of phosphoric acid, local peroxidation reaction is prevented, and the defect that in the prior art, a black film layer is generally uneven in color after a nickel-phosphorus alloy layer is blackened is overcome; in addition, saturated carboxylic acid is used as a source of a film-forming substance nitrated carbon chain, so that the defects of poor wear resistance and poor adhesive force of a black film layer after the nickel-phosphorus alloy layer is blackened are overcome; the provided chemical blackening agent for the chemical nickel plating layer has a good blackening effect on a high-phosphorus chemical nickel plating layer, a medium-phosphorus chemical nickel plating layer or a low-phosphorus chemical nickel plating layer. The process is simple to operate, and the formed black film is uniform, has the blackness close to that of carbon black, is well combined with a base material and is not easy to fall off.

The utility model discloses an electroless nickel-palladium-gold production line capable of stably moving materials, belongs to the technical field of circuit board production, and aims to solve the problems that a circuit board in a hanging basket cannot be well subjected to nickel-palladium-gold deposition treatment due to unstable movement and hanging baskets with different sizes cannot be supported by a support frame. Comprising a fixed box body, electroplating pools, a moving mechanism, a lifting mechanism, a fixed mechanism, a second sliding rail and a second sliding block, the electroplating pools are uniformly arranged in the fixed box body, the moving mechanism is arranged above the fixed box body, the lifting mechanism is arranged above the moving mechanism, the fixed mechanism is arranged in and below the lifting mechanism, and the second sliding rail is arranged in the fixed box body. The second sliding rail is arranged above the lifting mechanism; through the arrangement of the moving mechanism, the lifting mechanism, the second sliding rail and the second sliding block, the stability of the connecting seat in the moving process is jointly guaranteed, and therefore the moving stability of a circuit board in the hanging basket above is guaranteed.

The present invention relates to electroless nickel alloy plating baths, methods of depositing nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits. The invention relates to an electroless nickel alloy plating bath comprising nickel ions; additional reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxygen-containing ions thereof, and mixtures thereof; at least one reducing agent adapted to reduce the nickel ions and the additional reducible metal ions to their respective metal states; complexing agents CA1, CA2, CA3 and CA4, wherein CA1, CA2, CA3 and CA4 are all different from one another.

Provided is a plated film which has excellent heat resistance and thermal shock resistance and is suitable for metal sintering bonding. The plating film for metal sintering bonding is characterized in that the plating film for metal sintering bonding has (A) an electroless nickel-phosphorus plating film, and the phosphorus content of the (A) electroless nickel-phosphorus plating film is 4 mass% or less when the electroless nickel-phosphorus plating film is taken as 100 mass%.

The invention discloses a water electroplating process for a PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) material thin decorative part. The water electroplating process comprises the following treatment steps: pretreatment; activating treatment: after the surface of the thin decorative part made of the PC / ABS material is roughened, the rough surface of the thin decorative part made of the PC / ABS material is activated, so that the rough surface of the thin decorative part made of the PC / ABS material can accept deposition of plating metal; chemical plating treatment: carrying out chemical nickel plating treatment on the to-be-plated surface of the PC / ABS material thin decorative part; electroplating treatment: carrying out copper plating treatment, nickel plating treatment and chromium plating treatment on the chemical nickel surface of the PC / ABS material thin decorative part; wherein the thickness range of the plated copper is 24-28 [mu] m, the thickness range of the plated nickel is 1-3 [mu] m, and the thickness range of the plated chromium is 0.01-0.04 [mu] m; and post-treatment: carrying out cleaning treatment and drying treatment on the electroplated PC / ABS material thin decorative part to obtain the PC / ABS material thin decorative part. By means of the water electroplating process, the problem that the strength of the PC / ABS material decorating part is poor after water electroplating can be solved.

A method of producing a flexible nickel phosphorus coating on a substrate. The substrate includes a dielectric material having a copper layer thereon. The method comprises the steps of: (1) activating the substrate with a palladium activation solution to catalyze the substrate, and 2) contacting the activated substrate with an electroless nickel phosphorus plating bath comprising: (i) a source of nickel ions; (ii) a hypophosphite ion source; (iii) at least one metal complexing agent; and (iv) an organic flexible additive. The nickel-phosphorus plating layer deposited on the substrate shows a columnar grain structure.

The application discloses an electro-catalysis-plasma coupling device for recovering elemental nickel from chemical nickel waste liquid and relates to the technical field of wastewater treatment. The device comprises a movable box body, an electrolysis unit and a plasma treatment unit arranged in the movable box body. The device integrates electrolysis, plasma, temperature control and circulation in the movable box body, has a compact structure, is convenient to transport and deploy on site, and is suitable for various scenes such as laboratories, electroplating workshops and wastewater treatment stations. A heating device is arranged in the electrolytic tank to heat and maintain the electrolyte in a target temperature range. A plasma generator is arranged to perform plasma quenching treatment on the electrolyte during electrolysis, significantly improve the concentration of free nickel ions in the electrolyte, improve the electrodeposition effect, and control the wastewater to quickly reach the electrolysis water level through the overflow port, the stainless steel rod, the magnetic pump, the check valve and the distribution box. The discharged electrolyte can be sent back to the electrolytic tank for re-electrodeposition by changing the placement of the water inlet pipe, thereby improving the recovery amount of nickel.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuit module die. In some embodiments, the SF may be electroless nickel plating and electroless palladium immersion gold (ENEPIG). In other embodiments, SF may be gold leaching electroless palladium leaching (IGEPIG). In other embodiments, the SF may include an electrolytic palladium gold layer on the indium layer or on the ferrocobalt layer.

The present application relates to the field of wastewater treatment, and specifically discloses a treatment system and treatment method for chemical nickel plating waste liquid. The treatment system includes: a complex breaking pretreatment system; an oxidation complex breaking system, including a redox reactor and a complex breaking reactor connected in sequence, wherein the oxidant of the redox reactor is oxygen, and the oxidant of the complex breaking reactor is hydrogen peroxide; a chemical precipitation system, including a neutralization reaction tank and a sedimentation tank connected in sequence, and the sedimentation tank is equipped with a filtration system; an evaporation crystallization system, including an evaporation device, a crystallization device and a separation device arranged in sequence. This treatment system and treatment method for chemical nickel plating waste liquid adopts a two-stage oxidation method to achieve oxidation and complex breaking of the waste liquid, and combines chemical precipitation treatment and evaporation crystallization treatment at the same time, which not only reduces the treatment cost of the waste liquid, but also does not bring in other impurities, and can separate nickel salts and phosphates, is easy and simple to operate, has low treatment cost, and high nickel removal rate, which is conducive to realizing nickel resource utilization.

A wheel includes a hub portion configured to rotate about a rotational axis. A plurality of blades extends radially outward from the hub portion. Each blade of the plurality of blades includes a leading edge and a trailing edge. The hub portion and the plurality of blades include a substrate metal that includes aluminum or an alloy thereof. The substrate metal of the plurality of blades has coated directly thereon a first coating layer including electroless nickel-phosphorous. The first coating layer has coated directly thereon a second hard coating layer that overlies the leading edges of the plurality of blades and that is formed of a physical vapor deposition-compatible material.

A wheel includes a hub portion configured to rotate about a rotational axis. A plurality of blades extends radially outward from the hub portion. Each blade of the plurality of blades includes a leading edge and a trailing edge. The hub portion and the plurality of blades include a substrate metal. The substrate metal of the plurality of blades has coated directly thereon a coating layer that has a hardness of about 800 HV or greater and that includes electroless nickel-phosphorous having a phosphorous content of from about 2 to about 4 wt. %.