136 results about "Electroless nickel" patented technology

The present application relates to the field of wastewater treatment, and provides a treatment system and method for electroless nickel-plating waste liquid. The treatment system comprises a decomplexing pretreatment system; an oxidation-decomplexing system comprising a redox reactor and a decomplexing reactor which are connected in sequence, wherein an oxidizing agent in the redox reactor is oxygen, and an oxidizing agent in the decomplexing reactor is hydrogen peroxide; a chemical precipitation system comprising a neutralization reaction tank and a sedimentation tank which are connected in sequence, wherein the sedimentation tank is equipped with a filter system; and an evaporation crystallization system comprising an evaporation device, a crystallization device, and a separation device which are arranged in sequence. In the treatment system and method for electroless nickel-plating waste liquid, a two-stage oxidation method is employed to achieve oxidation and decomplexing of the waste liquid; in addition, combining chemical precipitation treatment and evaporation crystallization treatment not only reduces the waste liquid treatment cost but also avoids the introduction of other impurities, and allows for the separation of nickel salts and phosphate salts, so that the operation is easy and convenient, the treatment cost is low, the nickel removal rate is high, and resource utilization of nickel is facilitated.

The invention belongs to the technical field of chemical nickel equipment, and particularly relates to a three-dimensional swinging chemical nickel device for semiconductor parts, which comprises an outer groove, an inner groove, a support, a driving mechanism, a lifting mechanism, a transverse moving mechanism, a longitudinal moving mechanism, a swinging frame and a workpiece suspension frame, and the driving mechanism comprises a driving motor, a driving eccentric wheel, an adjusting rod, a linkage rocker and a driving shaft. The lifting mechanism comprises a lifting belt clamping plate assembly, a lifting rod, a lifting guide assembly, a vertical driving frame and a riding wheel assembly. When the driving shaft rotates, the lifting rod drives the swing frame to move up and down. The transverse moving mechanism comprises a linkage eccentric wheel, a linkage driving lever and a transverse cam groove plate, and the linkage driving lever drives the swing frame to move left and right when ascending and descending. The longitudinal moving mechanism comprises a longitudinal cam groove plate, a V seat fixing plate, a longitudinal moving guide rail and a guide rail support, and the V seat fixing plate longitudinally moves relative to the guide rail support. According to the invention, three-dimensional swinging of the workpiece can be realized, and the chemical nickel plating quality of semiconductor parts is improved.

The application belongs to the technical field of chemical production, and particularly relates to a chemical nickel plating wastewater treatment equipment. In the treatment process, repeated precipitation and filtration are needed, which leads to slow treatment efficiency. The following scheme is proposed, which comprises a treatment cylinder, the lower side of the treatment cylinder is fixedly connected with a cylinder seat, a water inlet is formed in the treatment cylinder, a water inlet pipe is fixedly connected in the water inlet, a water outlet is formed in the bottom of the treatment cylinder, a drain pipe is fixedly connected in the water outlet, valves are arranged on the water inlet pipe and the drain pipe, and a top plate is arranged above the treatment cylinder. The disclosed chemical nickel plating wastewater treatment equipment utilizes the magnetism of nickel to adsorb solid nickel in wastewater, so that the solid nickel in wastewater can be conveniently adsorbed and removed. The electromagnetic iron is electrified to generate magnetic properties, so that the solid nickel can be quickly adsorbed and subsequently separated and separated. The solid nickel does not need to be repeatedly filtered, and the recovery efficiency of the solid nickel in wastewater is improved.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

A sleeve includes a first surface treated portion treated with electroless nickel plating at least on both ends in an axial direction, in an inner circumferential surface thereof. The first surface treated portion has an inner diameter smaller than other portions of the inner circumferential surface by a film thickness of first plating, and slidably supports a spool valve element.

The invention provides a repairing method suitable for an engine case connecting bolt. The method comprises the following steps that S1, chemical stripping and fine treatment are conducted on the connecting bolt, an old plating layer on the surface of the connecting bolt is removed, and the surface of the connecting bolt is evenly coarsened; s2, a nitric acid-phosphoric acid binary acid system is adopted to conduct soaking treatment on the connecting bolt treated in the step S1 at the normal temperature, and a passive film on the surface of the connecting bolt is removed; s3, the connecting bolt treated in the step S2 is subjected to chemical nickel plating; and S4, the connecting bolt treated in the step S3 is subjected to hot water stabilization and dehydrogenation treatment, and the repaired connecting bolt is obtained. The invention provides a set of process from old plating layer removal, passive film removal and chemical nickel plating to hydrogen brittleness avoidance, so that the whole repair process is highly controllable, the product quality is stable and repeatable, and the problem of batch scrapping caused by batch difference and process uncontrollability in the prior art is solved.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.

The utility model provides a chemical nickel plating wastewater treatment and nickel and phosphorus resourceful treatment device which is characterized by comprising an oxidation unit, a phosphorus recovery unit and a nickel recovery unit, the oxidation unit comprises a reaction tank; the phosphorus recovery unit consists of a first reaction tank, a second reaction tank and a first sedimentation tank; and the nickel recovery unit consists of a third reaction tank, a fourth reaction tank and a second sedimentation tank. A water inlet pipe is arranged at the lower part of the reaction tank; a first dosing pipe and a second dosing pipe are arranged at the top of the reaction tank; a blow-down pipe is arranged at the bottom of the reaction tank; and baffle plates are sequentially and alternately arranged up and down in the reaction tank. According to the utility model, resource utilization of phosphorus and nickel can be realized on the basis of realizing that all indexes of treated effluent reach the standard.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The utility model discloses an electroless nickel-palladium-gold production line capable of stably moving materials, belongs to the technical field of circuit board production, and aims to solve the problems that a circuit board in a hanging basket cannot be well subjected to nickel-palladium-gold deposition treatment due to unstable movement and hanging baskets with different sizes cannot be supported by a support frame. Comprising a fixed box body, electroplating pools, a moving mechanism, a lifting mechanism, a fixed mechanism, a second sliding rail and a second sliding block, the electroplating pools are uniformly arranged in the fixed box body, the moving mechanism is arranged above the fixed box body, the lifting mechanism is arranged above the moving mechanism, the fixed mechanism is arranged in and below the lifting mechanism, and the second sliding rail is arranged in the fixed box body. The second sliding rail is arranged above the lifting mechanism; through the arrangement of the moving mechanism, the lifting mechanism, the second sliding rail and the second sliding block, the stability of the connecting seat in the moving process is jointly guaranteed, and therefore the moving stability of a circuit board in the hanging basket above is guaranteed.

The present invention relates to electroless nickel alloy plating baths, methods of depositing nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits. The invention relates to an electroless nickel alloy plating bath comprising nickel ions; additional reducible metal ions selected from the group consisting of molybdenum ions, rhenium ions, tungsten ions, copper ions, oxygen-containing ions thereof, and mixtures thereof; at least one reducing agent adapted to reduce the nickel ions and the additional reducible metal ions to their respective metal states; complexing agents CA1, CA2, CA3 and CA4, wherein CA1, CA2, CA3 and CA4 are all different from one another.

Provided is a plated film which has excellent heat resistance and thermal shock resistance and is suitable for metal sintering bonding. The plating film for metal sintering bonding is characterized in that the plating film for metal sintering bonding has (A) an electroless nickel-phosphorus plating film, and the phosphorus content of the (A) electroless nickel-phosphorus plating film is 4 mass% or less when the electroless nickel-phosphorus plating film is taken as 100 mass%.

The invention discloses a water electroplating process for a PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) material thin decorative part. The water electroplating process comprises the following treatment steps: pretreatment; activating treatment: after the surface of the thin decorative part made of the PC / ABS material is roughened, the rough surface of the thin decorative part made of the PC / ABS material is activated, so that the rough surface of the thin decorative part made of the PC / ABS material can accept deposition of plating metal; chemical plating treatment: carrying out chemical nickel plating treatment on the to-be-plated surface of the PC / ABS material thin decorative part; electroplating treatment: carrying out copper plating treatment, nickel plating treatment and chromium plating treatment on the chemical nickel surface of the PC / ABS material thin decorative part; wherein the thickness range of the plated copper is 24-28 [mu] m, the thickness range of the plated nickel is 1-3 [mu] m, and the thickness range of the plated chromium is 0.01-0.04 [mu] m; and post-treatment: carrying out cleaning treatment and drying treatment on the electroplated PC / ABS material thin decorative part to obtain the PC / ABS material thin decorative part. By means of the water electroplating process, the problem that the strength of the PC / ABS material decorating part is poor after water electroplating can be solved.

A method of producing a flexible nickel phosphorus coating on a substrate. The substrate includes a dielectric material having a copper layer thereon. The method comprises the steps of: (1) activating the substrate with a palladium activation solution to catalyze the substrate, and 2) contacting the activated substrate with an electroless nickel phosphorus plating bath comprising: (i) a source of nickel ions; (ii) a hypophosphite ion source; (iii) at least one metal complexing agent; and (iv) an organic flexible additive. The nickel-phosphorus plating layer deposited on the substrate shows a columnar grain structure.

The application discloses an electro-catalysis-plasma coupling device for recovering elemental nickel from chemical nickel waste liquid and relates to the technical field of wastewater treatment. The device comprises a movable box body, an electrolysis unit and a plasma treatment unit arranged in the movable box body. The device integrates electrolysis, plasma, temperature control and circulation in the movable box body, has a compact structure, is convenient to transport and deploy on site, and is suitable for various scenes such as laboratories, electroplating workshops and wastewater treatment stations. A heating device is arranged in the electrolytic tank to heat and maintain the electrolyte in a target temperature range. A plasma generator is arranged to perform plasma quenching treatment on the electrolyte during electrolysis, significantly improve the concentration of free nickel ions in the electrolyte, improve the electrodeposition effect, and control the wastewater to quickly reach the electrolysis water level through the overflow port, the stainless steel rod, the magnetic pump, the check valve and the distribution box. The discharged electrolyte can be sent back to the electrolytic tank for re-electrodeposition by changing the placement of the water inlet pipe, thereby improving the recovery amount of nickel.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuit module die. In some embodiments, the SF may be electroless nickel plating and electroless palladium immersion gold (ENEPIG). In other embodiments, SF may be gold leaching electroless palladium leaching (IGEPIG). In other embodiments, the SF may include an electrolytic palladium gold layer on the indium layer or on the ferrocobalt layer.

A wheel includes a hub portion configured to rotate about a rotational axis. A plurality of blades extends radially outward from the hub portion. Each blade of the plurality of blades includes a leading edge and a trailing edge. The hub portion and the plurality of blades include a substrate metal that includes aluminum or an alloy thereof. The substrate metal of the plurality of blades has coated directly thereon a first coating layer including electroless nickel-phosphorous. The first coating layer has coated directly thereon a second hard coating layer that overlies the leading edges of the plurality of blades and that is formed of a physical vapor deposition-compatible material.

A wheel includes a hub portion configured to rotate about a rotational axis. A plurality of blades extends radially outward from the hub portion. Each blade of the plurality of blades includes a leading edge and a trailing edge. The hub portion and the plurality of blades include a substrate metal. The substrate metal of the plurality of blades has coated directly thereon a coating layer that has a hardness of about 800 HV or greater and that includes electroless nickel-phosphorous having a phosphorous content of from about 2 to about 4 wt. %.

The invention relates to a manufacturing method of a selective chemical nickel ceramic-based printed circuit board for a power module, and aims to solve the technical problems that a chemical nickel layer is easy to yellow and a copper surface is easy to oxidize in a subsequent process in the prior art. The method comprises the following steps: pasting a protective film and performing laser windowing on a ceramic-based copper-clad plate with a manufactured circuit for the first time, exposing an area needing chemical nickel plating, and performing chemical nickel plating; after the film is torn off, the second time of protection film pasting and laser windowing are carried out, the copper surface area needing to be treated is accurately exposed, and meanwhile the plated nickel layer is tightly covered with the protection film; and finally, carrying out anti-oxidation treatment on the exposed copper surface. The core of the invention lies in a collaborative process of two-time film pasting and laser windowing, and a film is pasted again after chemical nickel plating to protect a nickel layer, so that the nickel layer is completely isolated from acid and alkali liquid medicine in the subsequent copper surface treatment, the yellowing phenomenon of the nickel layer is fundamentally avoided, and the cleanness and weldability of the copper surface are ensured.

[Problem] To provide: a nickel plating film that has suitable bath stability, pattern deposition properties, and plating deposition properties in a fine pad part, and excellent in solder connection reliability and surface smoothness; and an electroless nickel plating solution useful for forming the plating film. [Solution] A nickel plating film is formed on an object to be plated by subjecting the object to be plated to surface treatment using an electroless nickel plating solution that contains at least S2+ and a Co metal and in which the Co metal is included in the form of Co2+ and Co3+.

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.

This invention relates to the field of materials science and technology, and discloses a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates. The method includes: analyzing target ratio combinations of key variables to establish an initial nickel plating solution; plating a preset ceramic substrate using the initial nickel plating solution, and recording the current pH value during the initial nickel plating process; analyzing the pH adjustment parameters of the initial nickel plating solution, marking the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameters to determine the failure point of the initial nickel plating solution; performing nickel plating on the ceramic substrate using the initial nickel plating solution to obtain a nickel-plated ceramic substrate; identifying the critical load for plating peeling off the nickel-plated ceramic substrate to determine the adhesion of the nickel-plated ceramic substrate; analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate; outputting the composition optimization parameters of the initial nickel plating solution; and performing composition optimization of the nickel plating solution based on the composition optimization parameters. This invention can improve the optimization effect of the nickel plating solution composition.

The application discloses a kind of nickel-coated graphite powder, additive, electroplating solution and its electroplating process, the additive is particulate matter electroplating nano nickel additive, with complexing agent, current dispersing agent, low potential deposition accelerator and lubricant, the mass ratio of its complexing agent, current dispersing agent, low potential deposition accelerator is 40~100:10:1, in the proportion, electroplating can form a large number of microcrystalline nucleus, but its growth is inhibited, so as to obtain crystalline meticulous nano nickel electroplating layer.The electroplating solution has the additive, and the process parameters are stable during plating process, and the nickel-coated graphite after plating has the advantages of easy water washing, low surface resistance, aging resistance and the like.The electroplating process first uses chemical plating to plate a layer of nickel on the surface of graphite, completely covers the surface of particles, and then electroplates a layer of electroplated nickel on the chemical nickel to obtain nickel-coated graphite powder, which has better surface conductivity, good adhesion, good dispersibility, uniform plating layer and excellent performance as conductive filler.

The present application relates to the technical field of corrosion-resistant coating, in particular to a post-treatment method for improving corrosion resistance of electroless nickel coating in plasma environment. The method comprises composite sol preparation, workpiece coating, plasma-assisted curing and subsequent heat treatment of inorganic-organic hybrid coating framework. The method makes the surface of electroless nickel workpiece form a firm inorganic-organic hybrid coating framework combined with the electroless nickel coating at low temperature by preparing composite sol and plasma-assisted curing, and in-situ immobilizes rare earth elements. The subsequent heat treatment promotes the further condensation of the inorganic-organic hybrid coating framework, realizes pore collapse and structure densification, thereby forming a final dense corrosion-resistant coating, and fixes the rare earth elements in the dense corrosion-resistant coating by chemical bonding. Thus, the risk of thermal stress and interface peeling caused by heat curing process is eliminated, and long-term, stable and reliable protection of the substrate under extremely harsh working conditions is realized.

A method for manufacturing a member for manufacturing a semiconductor device includes: (a) a step of forming a recess in a surface of an insulating material layer; (b) a step for forming a first electroless Ni plating layer on the surface of the insulating material layer and the inner surface of the recess by electroless nickel plating; (c) a step for forming a Cu plating layer on the first electroless Ni plating layer; (d) a step in which the Cu plating layer and the first electroless Ni plating layer formed on the surface of the insulating material layer are removed to form a wiring layer including the Cu plating layer in the recess; and (e) a step for forming a second electroless Ni plating layer by electroless nickel plating on the exposed surface of the wiring layer, the first electroless Ni plating layer containing nickel and boron, and the boron content of the first electroless Ni plating layer being 0.3-1.0 mass% based on the mass of the first electroless Ni plating layer.

A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and / or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

The invention relates to the technical field of advanced materials of an integrated circuit packaging COF technology, in particular to a method for inhibiting diffusion plating and skip plating of chemical nickel plating of a superfine circuit of an integrated circuit packaging flexible substrate and application. According to the method, through the systematic synergistic effect of pre-dipping treatment before activation, activation treatment and post-dipping treatment, the uniformity of line activation can be promoted, the deposition rate of nickel plating around the line can be regulated and controlled, diffusion plating and skip plating phenomena caused by non-uniform adsorption amount of palladium on the two sides of the line are improved, nickel plating deposition between fine lines is reduced, and the service life of the line is prolonged. And the problem of nickel bridging of the fine line caused by over-strong palladium activity or palladium residues at intervals of the fine line is avoided. The method has the advantages of being simple in process, easy and convenient to operate, low in production cost and capable of being suitable for large-scale production, and can be well applied to the chemical nickel plating process of the superfine circuit of the flexible substrate with the line width smaller than 12 micrometers and the line width larger than 50 micrometers at the same time.