57 results about "Electroless nickel" patented technology

The invention provides a repairing method suitable for an engine case connecting bolt. The method comprises the following steps that S1, chemical stripping and fine treatment are conducted on the connecting bolt, an old plating layer on the surface of the connecting bolt is removed, and the surface of the connecting bolt is evenly coarsened; s2, a nitric acid-phosphoric acid binary acid system is adopted to conduct soaking treatment on the connecting bolt treated in the step S1 at the normal temperature, and a passive film on the surface of the connecting bolt is removed; s3, the connecting bolt treated in the step S2 is subjected to chemical nickel plating; and S4, the connecting bolt treated in the step S3 is subjected to hot water stabilization and dehydrogenation treatment, and the repaired connecting bolt is obtained. The invention provides a set of process from old plating layer removal, passive film removal and chemical nickel plating to hydrogen brittleness avoidance, so that the whole repair process is highly controllable, the product quality is stable and repeatable, and the problem of batch scrapping caused by batch difference and process uncontrollability in the prior art is solved.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

Provided is a plated film which has excellent heat resistance and thermal shock resistance and is suitable for metal sintering bonding. The plating film for metal sintering bonding is characterized in that the plating film for metal sintering bonding has (A) an electroless nickel-phosphorus plating film, and the phosphorus content of the (A) electroless nickel-phosphorus plating film is 4 mass% or less when the electroless nickel-phosphorus plating film is taken as 100 mass%.

The invention discloses a water electroplating process for a PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) material thin decorative part. The water electroplating process comprises the following treatment steps: pretreatment; activating treatment: after the surface of the thin decorative part made of the PC / ABS material is roughened, the rough surface of the thin decorative part made of the PC / ABS material is activated, so that the rough surface of the thin decorative part made of the PC / ABS material can accept deposition of plating metal; chemical plating treatment: carrying out chemical nickel plating treatment on the to-be-plated surface of the PC / ABS material thin decorative part; electroplating treatment: carrying out copper plating treatment, nickel plating treatment and chromium plating treatment on the chemical nickel surface of the PC / ABS material thin decorative part; wherein the thickness range of the plated copper is 24-28 [mu] m, the thickness range of the plated nickel is 1-3 [mu] m, and the thickness range of the plated chromium is 0.01-0.04 [mu] m; and post-treatment: carrying out cleaning treatment and drying treatment on the electroplated PC / ABS material thin decorative part to obtain the PC / ABS material thin decorative part. By means of the water electroplating process, the problem that the strength of the PC / ABS material decorating part is poor after water electroplating can be solved.

A method of producing a flexible nickel phosphorus coating on a substrate. The substrate includes a dielectric material having a copper layer thereon. The method comprises the steps of: (1) activating the substrate with a palladium activation solution to catalyze the substrate, and 2) contacting the activated substrate with an electroless nickel phosphorus plating bath comprising: (i) a source of nickel ions; (ii) a hypophosphite ion source; (iii) at least one metal complexing agent; and (iv) an organic flexible additive. The nickel-phosphorus plating layer deposited on the substrate shows a columnar grain structure.

The application discloses an electro-catalysis-plasma coupling device for recovering elemental nickel from chemical nickel waste liquid and relates to the technical field of wastewater treatment. The device comprises a movable box body, an electrolysis unit and a plasma treatment unit arranged in the movable box body. The device integrates electrolysis, plasma, temperature control and circulation in the movable box body, has a compact structure, is convenient to transport and deploy on site, and is suitable for various scenes such as laboratories, electroplating workshops and wastewater treatment stations. A heating device is arranged in the electrolytic tank to heat and maintain the electrolyte in a target temperature range. A plasma generator is arranged to perform plasma quenching treatment on the electrolyte during electrolysis, significantly improve the concentration of free nickel ions in the electrolyte, improve the electrodeposition effect, and control the wastewater to quickly reach the electrolysis water level through the overflow port, the stainless steel rod, the magnetic pump, the check valve and the distribution box. The discharged electrolyte can be sent back to the electrolytic tank for re-electrodeposition by changing the placement of the water inlet pipe, thereby improving the recovery amount of nickel.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuit module die. In some embodiments, the SF may be electroless nickel plating and electroless palladium immersion gold (ENEPIG). In other embodiments, SF may be gold leaching electroless palladium leaching (IGEPIG). In other embodiments, the SF may include an electrolytic palladium gold layer on the indium layer or on the ferrocobalt layer.

A wheel includes a hub portion configured to rotate about a rotational axis. A plurality of blades extends radially outward from the hub portion. Each blade of the plurality of blades includes a leading edge and a trailing edge. The hub portion and the plurality of blades include a substrate metal. The substrate metal of the plurality of blades has coated directly thereon a coating layer that has a hardness of about 800 HV or greater and that includes electroless nickel-phosphorous having a phosphorous content of from about 2 to about 4 wt. %.

The invention relates to a manufacturing method of a selective chemical nickel ceramic-based printed circuit board for a power module, and aims to solve the technical problems that a chemical nickel layer is easy to yellow and a copper surface is easy to oxidize in a subsequent process in the prior art. The method comprises the following steps: pasting a protective film and performing laser windowing on a ceramic-based copper-clad plate with a manufactured circuit for the first time, exposing an area needing chemical nickel plating, and performing chemical nickel plating; after the film is torn off, the second time of protection film pasting and laser windowing are carried out, the copper surface area needing to be treated is accurately exposed, and meanwhile the plated nickel layer is tightly covered with the protection film; and finally, carrying out anti-oxidation treatment on the exposed copper surface. The core of the invention lies in a collaborative process of two-time film pasting and laser windowing, and a film is pasted again after chemical nickel plating to protect a nickel layer, so that the nickel layer is completely isolated from acid and alkali liquid medicine in the subsequent copper surface treatment, the yellowing phenomenon of the nickel layer is fundamentally avoided, and the cleanness and weldability of the copper surface are ensured.

[Problem] To provide: a nickel plating film that has suitable bath stability, pattern deposition properties, and plating deposition properties in a fine pad part, and excellent in solder connection reliability and surface smoothness; and an electroless nickel plating solution useful for forming the plating film. [Solution] A nickel plating film is formed on an object to be plated by subjecting the object to be plated to surface treatment using an electroless nickel plating solution that contains at least S2+ and a Co metal and in which the Co metal is included in the form of Co2+ and Co3+.

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.

This invention relates to the field of materials science and technology, and discloses a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates. The method includes: analyzing target ratio combinations of key variables to establish an initial nickel plating solution; plating a preset ceramic substrate using the initial nickel plating solution, and recording the current pH value during the initial nickel plating process; analyzing the pH adjustment parameters of the initial nickel plating solution, marking the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameters to determine the failure point of the initial nickel plating solution; performing nickel plating on the ceramic substrate using the initial nickel plating solution to obtain a nickel-plated ceramic substrate; identifying the critical load for plating peeling off the nickel-plated ceramic substrate to determine the adhesion of the nickel-plated ceramic substrate; analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate; outputting the composition optimization parameters of the initial nickel plating solution; and performing composition optimization of the nickel plating solution based on the composition optimization parameters. This invention can improve the optimization effect of the nickel plating solution composition.

The present application relates to the technical field of corrosion-resistant coating, in particular to a post-treatment method for improving corrosion resistance of electroless nickel coating in plasma environment. The method comprises composite sol preparation, workpiece coating, plasma-assisted curing and subsequent heat treatment of inorganic-organic hybrid coating framework. The method makes the surface of electroless nickel workpiece form a firm inorganic-organic hybrid coating framework combined with the electroless nickel coating at low temperature by preparing composite sol and plasma-assisted curing, and in-situ immobilizes rare earth elements. The subsequent heat treatment promotes the further condensation of the inorganic-organic hybrid coating framework, realizes pore collapse and structure densification, thereby forming a final dense corrosion-resistant coating, and fixes the rare earth elements in the dense corrosion-resistant coating by chemical bonding. Thus, the risk of thermal stress and interface peeling caused by heat curing process is eliminated, and long-term, stable and reliable protection of the substrate under extremely harsh working conditions is realized.

A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and / or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.

The utility model provides a kind of chemical nickel plating wastewater pretreatment tank body device, it is characterized in that, including integrated reaction tank and integrated in the pH adjusting area, dosing mixing area, mixed reaction area and strengthening mixing reaction area communicated in sequence in the reaction tank.The utility model realizes the dynamic coupling of active oxidizing material and pollutant conversion efficiency in wastewater treatment process by the synergic control of hydraulic circulation unit and oxidation breakage module, to build the directional reaction system of complex nickel decomposition-phosphate generation. In summary, the device effectively solves the bottleneck problem of treatment efficiency caused by uneven mixing, incomplete breakage and excessive land occupation in traditional oxidation process, provides zero mechanical stirring loss, high pollutant conversion rate and land area reduction intensive technical scheme for electroplating wastewater pretreatment.

The application discloses a method for electroless nickel-palladium-gold plating on an alumina high-temperature co-fired ceramic substrate, and belongs to the technical field of electroless nickel-palladium-gold plating. The method comprises the following steps: hanging, oil removal, micro-etching, glass micro-etching, acid pickling, palladium activation, inhibition, electroless nickel-boron plating, pre-plating of palladium, electroless palladium plating and electroless gold plating. The method is used for electroless nickel-palladium-gold plating on an alumina high-temperature ceramic tungsten metal to modify the metal, so that the workpiece has good weldability and bondability, the gold wire bonding strength can reach 280 mN, the average gold ribbon bonding tension is greater than 500 mN, and the average chip shear strength reaches 5.11 Kgf, all of which reach the relevant technical standards of the national military standard.

The present application relates to a kind of processes for thickening nickel plating of high phosphorus without burr, specifically comprising metal substrate pretreatment, plating solution preparation, plating solution post-treatment and electroless nickel plating steps. The plating solution composed of sodium phosphate dibasic, nickel sulfate, sodium hypophosphite, sodium fluoride, sodium citrate, propionic acid, bismuth nitrate, chelidamic acid, copper sulfate and sodium dodecyl sulfate is used for electroless nickel plating after compounding with composite stabilizer C. Composite stabilizer C is compounded by stabilizer A and stabilizer B according to a volume ratio of 2:1, wherein stabilizer A is composed of sodium thiosulfate and potassium iodate, and stabilizer B is composed of sodium dodecyl sulfate and ammonium molybdate. The present application overcomes the generation of burr while ensuring the thickening of the coating, and the coating is uniform, low cost, environmentally friendly and durable. The utilization rate of nickel in the plating solution is high, and the service life of the plated part is long.

The invention relates to the technical field of image processing, in particular to a method for detecting abnormity of a plating layer of a precision part treated by an aluminum alloy chemical nickel plating process, which comprises the following steps of: according to gray similarity between pixel points in an opening operation image of a gray image of the surface of a chemical nickel plating plating layer of a target part; dividing the grayscale image into at least two sub-regions with the same size; obtaining at least two suspected texture regions in each sub-region, and obtaining the texture distribution uniformity degree in each sub-region according to the position distribution of each suspected texture region in each sub-region; obtaining the texture difference degree in each sub-region according to the gray similarity and the area similarity between each suspected texture region in each sub-region and other suspected texture regions; through comparing the similarity of the texture distribution uniformity degree and the similarity of the texture difference degree between the sub-regions, the plating layer abnormal region is detected, and the accuracy of detecting the part plating layer abnormity is improved.

The application provides a preparation method of wear-resistant chemical nickel-boron alloy plating of a neodymium-iron-boron rare earth permanent magnet material, and comprises the following steps: S1, ultrasonic cleaning: in order to remove small metal powder and impurities in the pores of the surface of the part, the part is placed into an ultrasonic cleaning machine, and the part is ultrasonically cleaned with type B pure water for 15-20 minutes, and the ultrasonic cleaning temperature is 10-40 DEG C; S2, magnesium oxide oil removal: in order to completely remove the oil stains of the part, clean soft hair brushes are used to carefully wipe the surface to be plated with magnesium oxide powder for 2-3 times. The application provides a preparation method of wear-resistant chemical nickel-boron alloy plating of a neodymium-iron-boron rare earth permanent magnet material, and the material is subjected to acid corrosion, activation, nickel immersion and chemical nickel-boron plating processes, and then vacuum heat treatment is performed, so that the problem of low corrosion resistance and easy chipping of the neodymium-iron-boron rare earth permanent magnet material is solved, the surface hardness of the part is improved, and the function and service life of the product are increased.

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.

The invention belongs to the technical field of aluminum-copper composite material pre-plating treatment, and particularly provides an aluminum-copper composite alloy material chemical nickel-phosphorus alloy deposition pre-treatment process which comprises the following steps of neutral oil removal, water washing, alkali etching, water washing, acid etching, water washing, zinc deposition, water washing, nickel-phosphorus alloy chemical plating, water washing and drying. The acid etching is carried out by adopting an acid etching solution, and the acid etching solution comprises phosphoric acid and nitric acid. The pretreatment process disclosed by the invention has the advantages of few working procedures and high plating layer binding force.

The application relates to the technical field of iron core surface treatment, in particular to an iron core surface treatment process which comprises a first motor, a first driving gear disc, a fixed supporting base, a rotating adjusting main body and a sand blasting treatment main body. The first driving gear disc is rotatably arranged on the upper portion of the side end of the fixed supporting base, the first driving gear discs are fixedly connected through fixing rods, and the first motor is fixedly arranged on the side end of the fixed supporting base. The rotating adjusting main body can be used for synchronously fixing multiple iron cores, the sand blasting treatment main body can be used for fully and quickly sand blasting treating the fixed iron cores without dead angle, the rotating adjusting main body can be used for controlling and adjusting the fixed iron cores, and the whole iron core is conveniently and quickly electroplated with chemical nickel.

The invention belongs to the technical field of electroplating, and particularly relates to a magnesium-aluminum alloy nickel plating material and a preparation method thereof. The preparation method of the magnesium-aluminum alloy nickel plating material comprises the following steps: (1) pretreatment; (2) oil removal: the pretreated magnesium-aluminum alloy is subjected to oil removal; (3) first alkaline etching; (4) acid etching; (5) descaling for the first time; (6) secondary alkaline etching; (7) descaling for the second time; (8) zinc deposition; (9) alkaline chemical nickel plating; (10) carrying out acidic chemical nickel plating; (11) recycling; (12) secondary cleaning; and (13) drying is conducted, specifically, the magnesium-aluminum alloy is dried, and the magnesium-aluminum alloy nickel-plated material is obtained. The magnesium-aluminum alloy nickel plating material prepared through the method is high in plating layer binding force, excellent in weldability and high in heat resistance, impact resistance and salt spray resistance.

The application relates to the technical field of nickel plating of circuit boards, and particularly discloses a chemical nickel plating equipment and process for integrated circuit boards, wherein a supporting plate frame is slidably connected with the side surface of a nickel plating tank, the bottom of the supporting plate frame is fixedly connected with the output end of a driving member one, sliding grooves are arranged on the two sides of the supporting plate frame, a driving member two is fixedly connected with the top of the supporting plate frame, a protection component is fixedly connected with the side surface of the supporting plate frame, one end of a connecting shaft one is fixedly connected with the side surface of a clamping plate, the side surfaces of the connecting shaft one and a connecting shaft two are slidably connected with the inner side of the sliding grooves, and the bottom of the connecting shaft one is fixedly connected with an extension rod one. When the integrated circuit board is lifted and shaken after being plated with nickel, the integrated frame formed by folding is annular and can surround and collect the liquid drops and splashes, acid and alkali corrosion of the frame is avoided, liquid medicine across the tank is prevented from dropping, and cross contamination of the tank liquid is completely prevented.

The invention discloses a special engineering plastic surface metallization treatment process, which is applied to waveguide antenna plastic substrate metallization, and specifically comprises the following steps: S1, oil removal: carrying out oil removal on the surface of engineering plastic by using an oil removal liquid, S2, affinity: carrying out affinity on the surface of the engineering plastic by using a sulfonic acid solvent, s3, etching: etching the surface of the engineering plastic by using a mixed solution of alkali / a first organic solvent, S4, surface conditioning: performing surface conditioning on the engineering plastic by using an acid solution of hydroxylamine / a second organic solvent, and S5, post-treatment: sequentially performing activation, peptization, chemical nickel / copper plating and electroplating, on the basis of an engineering plastic metal coating process, affinity treatment, etching treatment and surface conditioning treatment are preferentially carried out on the engineering plastic, and the binding force between the engineering plastic and a metal coating is improved.

A method for manufacturing an electroless nickel-plated component is provided. According to this, an electroless nickel-plated layer formed on a component surface can prevent elements in the alloy of various components exposed to high-temperature environments of 600 °C or higher from becoming volatile, and due to the plated layer stably maintaining adhesiveness for a long period of time and having high hardness, abrasion resistance, and corrosion resistance, can also protect the component surface under various physical / chemical environments, and can therefore be widely applied to components in various devices, such as SOFCs, used in high-temperature conditions.

The invention relates to diamond anode centrifugal enrichment nickel concentration equipment. The equipment comprises an electrolytic bath; the cathode assembly is arranged at one end in the electrolytic bath; the diamond anode assembly is arranged at the other end in the electrolytic bath; the four shaft rods are mounted in the electrolytic bath in a rectangular manner, and the four shaft rods are distributed on the two sides of the cathode assembly and the diamond anode assembly; the spiral blade is wound on the outer wall of the shaft rod; the plurality of turbulent flow columns are uniformly distributed in an area between the cathode assembly and the diamond anode assembly; a communicating pipe; according to the method, the electrochemical oxidation technology of the diamond anode is ingeniously combined with the centrifugal separation technology, efficient enrichment and concentration of nickel in the low-concentration nickel-containing solution are achieved, the recovery rate and purity of nickel are improved, the production cost is reduced, and the method is suitable for industrial production. And the mobility of the chemical nickel wastewater on the two sides of the cathode and the anode in the electrolytic tank is remarkably accelerated through the innovative design, so that the overall performance of the equipment is greatly improved.

The invention discloses a microcrystalline glass substrate with metalized through holes and a preparation method of the microcrystalline glass substrate, and belongs to the field of electronic device adapter plate manufacturing. The substrate comprises a microcrystal glass plate base material and a through hole vertically penetrating through the upper and lower planes of the microcrystal glass plate base material, and a metalized conductive structure is formed in the through hole. The preparation method comprises the following steps: performing irradiation modification on a selected area of a microcrystalline glass thin plate by adopting CO2 pulse laser to convert microcrystals in the thin plate into an amorphous phase, and then selectively and efficiently etching a laser modified columnar area in a corrosive liquid to form a through hole; the inner wall of the through hole is activated by SnCl2 in the later period, chemical nickel plating is conducted, annealing is conducted to form a seed layer so that the through hole can be filled through electro-coppering, and finally chemical mechanical polishing is used for removing metal on the surface of the microcrystal thin plate to complete preparation. According to the invention, the problem of processing the through hole of the microcrystalline glass is solved, and meanwhile, the palladium-free activation process is adopted, so that the cost is remarkably reduced, and an ideal substrate solution is provided for electronic packaging with high performance, high reliability and high cost performance.

The invention discloses a high-stability alkaline chemical nickel-phosphorus-copper plating ternary alloy plating solution and a plating method, and belongs to the technical field of metal surface treatment. According to the method, sodium citrate, sodium pyrophosphate and sodium lactate are compounded to serve as complexing agents, urea and thiourea or lead nitrate are combined to serve as stabilizing agents, the preferential replacement reaction of Cu < 2 + > is effectively inhibited, and uniform codeposition of the Ni-P-Cu ternary alloy is achieved. The plating solution is high in stability under the conditions that the pH is 9.0-10.0 and the temperature is 63-68 DEG C, can be used for preparing a thick plating layer with the copper content being 5% or above and the thickness being larger than or equal to 50 microns, is suitable for various base materials such as magnesium alloy, carbon steel and stainless steel, and has the advantages of being low in energy consumption, wide in application range, excellent in plating layer performance and the like.