The invention discloses a
copper bar surface anti-oxidation treatment process, and belongs to the technical field of
metal material surface protection and
corrosion resistance evaluation, and the
copper bar surface anti-oxidation treatment process comprises the following steps: carrying out film removal activation and micro roughening treatment on a
copper bar; the copper bar is placed in an
aqueous solution containing
hypophosphite or
phosphate and treated for 1-5 minutes at the temperature of 60-90 DEG C, so that a P-enriched
interface layer is formed on the copper
surface layer, and the P atomic fraction of the
interface layer is 2%-8%; depositing an aluminum
oxide or
titanium oxide thin layer on the
interface layer by adopting an
atomic layer deposition process, wherein the substrate temperature is 80-120 DEG C and the
total thickness is 5-30 nm; a
phosphorus-rich interface layer is constructed in sequence, a compact inorganic
thin layer is deposited, low-energy pulse
laser sealing is implemented, and a
silicon-
oxygen sealing layer containing a two-dimensional sheet layer is formed, so that the
oxygen blocking capability and the appearance stability can still be considered under the
thin layer condition; the problem that
electricity and color are difficult to stabilize at the same time when the thickness of a traditional single-layer or random laminated film is limited is solved.