1714results about "Liquid/solution decomposition chemical coating" patented technology

The invention relates to the technical field of rare earth metal electrolysis cathode protection coatings, in particular to a high-temperature-corrosion-resistant yttrium-stabilized zirconia gradient coating on the surface of a tungsten cathode. A metallurgically bonded strong bonding bottom layer is constructed on a tungsten substrate through surface pretreatment and reactive sintering, then an atmosphere plasma technology is adopted to spray a creep-resistant gradient layer with continuous components to buffer thermal stress, and finally a sol-gel technology is utilized to construct an extremely compact corrosion-resistant surface layer in a superposition mode. The high-temperature-corrosion-resistant yttrium-stabilized zirconia gradient coating is constructed through a multi-scale and multi-mechanism synergistic effect, the problems that a tungsten cathode coating is insufficient in binding force and poor in thermal shock resistance are fundamentally solved, molten salt permeation can be blocked, and the service life of a tungsten cathode in a severe environment is remarkably prolonged.

The invention discloses a component gradient iridium tantalum coating anode and a preparation method thereof, the component gradient iridium tantalum coating anode comprises a titanium-based bottom layer, a middle layer and a surface active layer structure with component gradient, and the middle layer and the active layer are both prepared through a thermal decomposition method. And the intermediate layer is prepared on the titanium substrate and is composed of TiO2 / Ta2O5 mixed oxide. The surface active layer is prepared on the outer side of the middle layer and comprises a plurality of layers of IrO2 / Ta2O5 oxide coatings with different iridium-tantalum proportions. Compared with a traditional uniform coating anode, the prepared component gradient iridium tantalum coating anode can relieve the stress concentration phenomenon and reduce coating cracking, the service life of the anode is remarkably prolonged, and the catalytic activity of the anode is remarkably improved; the modified carbon nano tube is added into the active layer precursor solution, so that the conductivity change caused by component gradient is improved, and the cell voltage of the component gradient iridium tantalum coating anode is effectively reduced; and moreover, the iridium content is lower, and the preparation cost of the electrode is reduced.

The invention belongs to the field of materials, and particularly relates to a composite thermal interface material and a preparation method thereof. The preparation method comprises the following steps: plating non-reactive metal, non-reactive metal carbide or non-reactive ceramic on the surface of diamond micro powder, inducing lattice defects on the surface of a plating layer and alloying a local interface by combining a mechanical force field, and defoaming to obtain the composite thermal interface material. The composite thermal interface material has high thermal conductivity and long-term stability, and the contradiction between excessive alloying of a traditional reactive coating and high interface thermal resistance of a non-reactive coating is solved. The method is particularly suitable for the field of thermal management of high-end electronic devices such as 5G chips and power modules.

The invention belongs to the technical field of conductive microsphere preparation, and particularly relates to a surface-roughened nickel-plated conductive microsphere and a preparation method and application thereof. The preparation method comprises the following steps: carrying out pretreatment to enable the surfaces of the polymer microspheres to contain nickel ions, reducing the nickel ions into nickel nanoparticles, activating the microspheres and carrying out chemical plating. According to the invention, the specific surface area of the conductive microspheres is increased by reducing the nickel nanoparticles on the surfaces of the microspheres, a large amount of impurities cannot be generated among the microspheres, and adhesion among the microspheres can be effectively prevented. According to the prepared conductive microspheres, the plating layer and the polystyrene microspheres are firmly combined, and the risk that the conductivity is reduced due to the fact that the surface of the plating layer falls off is reduced. The preparation method is safe, environment-friendly, simple, convenient and suitable for industrial production requirements.

The invention relates to the technical field of corrosion-resistant coatings, in particular to a post-treatment method for improving the corrosion resistance of a chemical nickel-plated layer in a plasma environment. Comprising the following steps: preparing composite sol, coating a workpiece, carrying out plasma-assisted curing, and then carrying out heat treatment on an inorganic-organic hybrid coating framework; an inorganic-organic hybrid coating framework firmly combined with a nickel-plated layer is formed on the surface of a chemical nickel-plated workpiece under a low-temperature condition by preparing composite sol and matching with plasma-assisted curing, and rare earth elements are immobilized in situ; the inorganic-organic hybrid coating framework is further condensed through subsequent heat treatment, pore collapse and structural densification are achieved, and therefore the final compact corrosion-resistant coating is formed, and rare earth elements are fixed in the compact corrosion-resistant coating in a chemical bonding mode; therefore, thermal stress and interface stripping risks caused by a thermocuring process are eliminated, and long-acting, stable and reliable protection on a matrix under extremely harsh working conditions is realized.

A device for holding at least one planar substrate (1,2) in an apparatus for non-immersive wet-chemical treatment of the substrate (1,2) comprises a pair of flow guide surfaces (23,24;50,51;88,89) on opposite sides of a space (28;55;93) for accommodating an edge region of at least one substrate (1). The flow guide surfaces (23,24;50,51;88,89) extend in a first direction (-z) to respective edges (25,26;52,53;90,91) and extend in a second direction (y) transverse to the first direction (-z). Each of the edges (25,26;52,53;90,91) bounds a gap (27;54;92) for insertion of an edge region of at least one substrate (1) into the space (28;55;93). A dimension of the space (28;55;93) in a third direction (x) transverse to the first and second directions (-z,y) decreases in the first direction (-z) over at least part of an extent in the first direction (-z) of the space (28;55;93). The device comprises at least one first array (15;44;76) of protruding engagement features and at least one second array (16;45;77) of protruding engagement features, protruding towards each other from first and second engagement feature supports (19;20;47;49;81;84), respectively. The first and second arrays (15,16;44,45;76,77) extend in the second direction (y). The engagement feature supports (19;20;47;49;81;84) are at least partially movable with respect to each other to move the first and second arrays (15,16;44,45;76,77) in the third direction (x). The protruding engagement features are located in the space (28;55;93) at a distance from the edges (25,26;52,53;90,91) in opposite direction (z) to the first direction (-z). The space (28;55;93) is accessible to liquid at a distance from the edges (25,26;52,53;90,91) in opposite direction (z) to the first direction (-z).

The invention discloses a titanium-based-iridium tantalum oxidation coating anode and a preparation method and application thereof, and belongs to the technical field of anode preparation, and the preparation process of the titanium-based-iridium tantalum oxidation coating anode comprises the steps that a titanium substrate is brushed with a solution containing a tantalum source A, then sintering is conducted, brushing-sintering is repeated, and a tantalum-coated titanium substrate is obtained; the tantalum-coated titanium substrate is brushed with the iridium-tantalum oxidation coating liquid, then sintering is carried out, and brushing-sintering is repeated, so that the tantalum-coated titanium substrate is obtained; the iridium-tantalum oxidation coating liquid contains a tantalum source B, an iridium source and a zirconium source; in the iridium tantalum oxidation coating liquid, the mass ratio of tantalum to iridium is (6-7): (4-5), according to the preparation method provided by the invention, through two times of brushing, the tantalum content in the titanium-based-iridium tantalum oxidation coating anode is more than 5% greater than the iridium content, and when the titanium-based-iridium tantalum oxidation coating anode is used for an alkaline citric acid electroplating system, the decomposition of a complexing agent can be effectively inhibited, the components of the electroplating liquid are maintained to be stable, so that the quality of a plating layer is ensured, and the service life of the plating layer is prolonged. The maintenance cost of the plating solution is reduced and the service life is prolonged.

The invention relates to the technical field of integrated circuit manufacturing, in particular to a soaking device for a PCB. Comprising a box body, a feeding carrier roller set and a discharging carrier roller set are installed on the box body, a soaking pool, a liquid storage pool and a power pool are arranged in the middle of the box body, a power carrier roller set is obliquely arranged in the soaking pool, a motor is installed in the box body, a rotating roller is rotationally connected in the power pool, and a motor is installed in the rotating roller. An output shaft of the motor penetrates through the power pool and is fixedly connected with the rotating roller, and the rotating roller is slidably connected with moving strips which are evenly distributed in the circumferential direction. According to the PCB soaking device, the PCB is driven to move through the power carrier roller set in the soaking pool, the liquid medicine is driven to flow through the rotating rollers and the moving strips, the liquid medicine penetrates through or bypasses the PCB to circularly flow, the problem of poor cohesion between different processes in the PCB production process is solved, and the treatment efficiency of the PCB soaking process is improved through the structural design.

The invention discloses a coating and a method for recovering precious metals in a physical vapor deposition process. The coating mainly comprises a silver coating positioned on the lower layer and an organic silicon modified layer positioned on the surface of the silver coating. Before precious metal is recycled, the coating is prepared on the surface of the position where precious metal needs to be recycled in the physical vapor deposition process, after physical vapor deposition is completed, an adhesive tape is adopted to be pasted to the surface of the coating, and then the precious metal is stripped from the surface of the coating in a mode of tearing the adhesive tape; or scraping the surface of the coating by adopting a tool, so that the noble metal is stripped from the surface of the coating, and stripped noble metal chips are collected; and finally, the adhesive tape with the precious metal or the collected precious metal scraps are heated, and the precious metal is recycled from a heating product. According to the method, efficient stripping and efficient recycling of the precious metal can be achieved, the coating has no influence on physical vapor deposition equipment and the technological process, and the method is simple in technology, high in operability, environmentally friendly, free of pollution and high in economical efficiency when the precious metal is recycled and can be applied to the recycling process of the precious metal on a large scale.

The invention belongs to the field of hard alloy materials, and provides a modified high-performance non-magnetic hard alloy and a preparation process thereof. The surface of a WC particle is chemically plated with a Ni-P-B-Cr-Cu amorphous shell layer, and a binding phase is converted into Ni3P and Ni3B nanophase through two-stage sintering. The WC alloy comprises the following components in parts by weight: 85-95 parts of WC, 12-25 parts of a binding phase and 0.5-1.4 parts of a grain growth inhibitor, the nanophase accounts for 35-50% of the volume of the binding phase and 35-50% of the total volume of the binding phase, and the grain size is 80-125 nm; the average grain size of WC is 0.6-1.0 [mu] m; and the thickness of an interface P enrichment layer is 8-15 nm (the coverage rate is 85-95%). Through interface engineering and controlled crystallization from amorphous to nanocrystalline, the relative magnetic conductivity is 1.001-1.015, the hardness HRA is 90.5-93.0, the strength TRS is 2.2-3.0 GPa, the toughness KWP is 300-450 N / mm, and the magnetic saturation strength is 0.02-0.15 T. The problem of decoupling of the magnetic property and the mechanical property of a traditional non-magnetic hard alloy is solved, and the non-magnetic hard alloy is suitable for magnetic sensitive environments such as semiconductor equipment, precise measurement, MRI tools and oil service logging.

The invention discloses high-oxidation-resistance flaky silver-coated copper particles and a preparation method thereof, and relates to the technical field of silver-coated copper powder. The process comprises the steps of flaky copper powder preparation, copper powder pretreatment, silver coating plating and post-treatment. The surface of the copper powder is pretreated, and active sites on the surface of the copper powder are reduced; secondly, a zinc phosphate plated film is formed, full coverage of a silver layer is achieved by adding nano-silver to assist in a silver ammonia solution, meanwhile, micropores of the silver layer are filled, and the compactness of the silver-coated copper powder is improved; besides, the silver content of the silver-coated copper powder is controlled to be 8.7-14.6%, and the normal-temperature oxidation resistance of the silver-coated copper powder is improved, so that the optimal anti-oxidation effect is achieved, and performance deterioration caused by oxidation is reduced.

The invention relates to the technical field of photovoltaics, and discloses photovoltaic conductive silver-coated copper micro powder and a preparation method thereof, and the preparation method aims to solve the problem that performance and cost of existing silver-coated copper micro powder in photovoltaic application are difficult to consider at the same time. Through pH adjustment, organic pre-bonding treatment and gradient ammonification, the activity of the copper powder is reserved, and a uniform copper-ammonia complexing layer is constructed; in the chemical silver plating stage, the pretreatment liquid is added into a composite base solution containing a complexing agent, organic amine, a dispersing agent and a combined reducing agent, and a silver-ammonia solution is dropwise added for reaction under ultrasonic dispersion and nitrogen introduction protection; and in the post-treatment stage, a finished product is obtained through ethanol reflux desorption, antioxidant treatment, vacuum drying, low-temperature plasma activation and screening, uniform and complete coating of a silver layer can be achieved under the low silver content, and a feasible path is provided for replacing photovoltaic pure silver powder with silver-coated copper micro powder on a large scale.

The present application provides a heat exchanger and a manufacturing method of a heat exchanger. The heat exchanger includes a metal substrate, the metal substrate has a fluid channel for circulating a heat exchange medium; and the heat exchanger further includes a coating, the coating includes resin, silica and titanium dioxide, and the coating is arranged to cover at least part of a surface of the metal substrate. Silica particles and titanium dioxide particles are conducive to the formation of a complex micro-nano structure, and leveling and stability of hydrophilic resin contribute to long-term maintenance of the micro-nano structure. The coating of the heat exchanger according to the present application has excellent hydrophilic durability.

A heat exchanger with a heat-exchanging portion is electrochemically deposited onto a base (for thermal coupling to a heat source) or directly on the heat source. The heat-exchanging portion comprises extensions that define openings (e.g., channels) for passing heat transfer fluid through the heat exchanger. The geometry of these c and / or openings varies throughout the exchange to achieve different unit-area thermal conductivities for at least two different portions of the heat-receiving surface. For example, the thickness, height, spacing, shape, and / or materials of the heat-exchanging extensions may be selected to achieve the desired heat transfer at each zone. This variability in unit-area thermal conductivities may be used to accommodate for “hot spots”, heating of the heat transfer fluid, fluid dynamics, and other factors associated with the heat exchanger operation. Electrochemical additive manufacturing (ECAM) is used to fabricate at least heat-exchanging extensions thereby enabling precise and zone-specific thermal transfer characteristics.

The invention provides a preparation method of silver-coated copper powder, and belongs to the technical field of metal powder treatment. The used copper particle suspension contains a complexing agent, so that the activity of the copper particles can be reduced, the reaction rate of reduction coating can be reduced when a silver-ammonia complexing solution is added, and a compact silver layer slowly and uniformly grows on the surface of each copper particle; the reduction of the activity of the copper particles slows down the replacement reaction of silver ions and copper, and the situation that the coating surface is rough and loose due to the generation of overlarge silver particles is avoided; the silver grows slowly and compactly, so that the surface of the coated silver layer is smooth and compact on the basis of lower usage amount of the silver source; the preparation method is simple in process, low in silver content and low in production cost, and the coated silver layer is smooth and compact in surface.

The invention provides a composite nickel seed layer and a preparation method thereof, a solar cell and a photovoltaic module, and relates to the technical field of solar cells. The composite nickel seed layer comprises a nickel-based alloy layer and a nickel main body layer; wherein the nickel-based alloy layer is a nickel-phosphorus alloy layer or a nickel-boron alloy layer; and a nano nickel crystal nucleus is coated in the nickel-based alloy layer. The composite seed layer structure is used for replacing a seed layer of a single material or structure, and the problems that the resistivity of a nickel seed layer main body material is high, the thickness of a nickel plating layer is not uniform, and the electrical performance and the yield of a battery are poor are solved.

A method of preparing 2-hydroxyadpic acid and adipic acid is provided. The method of preparing 2-hydroxyadpic acid and adipic acid comprises a step of the electrolysis of 2,5-furandicarboxylic acid using a metal electrode at a constant current in a sulfuric acid solution containing a quaternary ammonium salt. The metal electrode is a bismuth electrode or a lead electrode. The quaternary ammonium salt is represented by formula (I):wherein R1 to R4 are independently a C2-5 hydrocarbon group, and X− is ClO4−, H2PO4−, or Br−.

The invention relates to the technical field of composite metal materials, in particular to a silver-coated graphene copper composite material and a preparation method thereof, and aims at solving the problems that traditional silver-coated copper powder is high in silver consumption, copper is oxidized due to the fact that a silver layer is prone to being damaged, and conductivity is insufficient. The method comprises the steps that a graphene coating layer is formed on a copper powder substrate in situ through chemical vapor deposition, and graphene copper powder is obtained; performing etching treatment on the graphene copper powder to controllably expose part of the copper substrate so as to form anchoring points for silver ion deposition; carrying out reduction treatment on the etched graphene copper powder so as to ensure that an anchoring site has chemical activity; in a reductive liquid phase environment, enabling a chemical silver plating solution to react with the graphene copper powder subjected to reduction treatment, and guiding silver ion deposition by utilizing an anchoring point, so as to form a silver coating layer on the surface of the graphene coating layer; and separating and drying the reacted system to obtain the silver-coated graphene copper composite material. The material is better in oxidation resistance and conductivity, and the process is free of waste liquid.

The invention discloses a coating for a chemical plating process and a preparation method of the coating, and belongs to the field of three-dimensional precision machining. The coating is arranged on the surface of a base material, and based on the mass percentage of the coating, the coating comprises 55%-85% of a cross-linked product of an epoxy resin AB agent, 1%-5% of nano metal particles and 10%-40% of water-soluble polymers. The coating is adopted for a chemical plating process, the process steps are few, and the binding force between a metal circuit and a base material in the prepared three-dimensional interconnection molding device is excellent.

The invention discloses a non-oriented silicon steel composite material and a preparation method thereof.The method comprises the steps that powder of Ce, La and Y elements is subjected to ball milling, and ground powder with the particle size smaller than or equal to 8 micrometers is obtained; adding 0.5-1.2 wt% of nano TiO2 as a modifier into the ground powder, and uniformly depositing a rare earth composite layer on the surface of a non-oriented silicon steel substrate by adopting a magnetron sputtering method to obtain a silicon steel plate; stacking the multiple layers of silicon steel plates to form a laminated layer; zirconia sol is coated on interlayer contact surfaces of the multiple layers of silicon steel plates; standing at a preset temperature for a preset period of time, so that gelation-dehydration-inorganic conversion of the zirconium oxide sol layer is completed, and an assembled silicon steel plate is obtained; and carrying out post-treatment on the assembled silicon steel plate to obtain the non-oriented silicon steel composite material. The magnetic performance, the mechanical toughness and the low-temperature service reliability of the non-oriented silicon steel material are improved.

An intermediate article has a non-electrically conductive substrate having first and second opposing surfaces; and a catalytic ink disposed as a pattern of half-tone dots on at least the first opposing surface. Copper metal can be plated on the pattern of catalytic ink to provide a copper metal pattern that have antimicrobial properties. The resulting antimicrobial article can then be applied to various surfaces to mitigate the spread of infectious agents from one person to another.

To extend the lifespan of plating baths used for forming metal oxide films and to enable more efficient use of the plating baths. [Solution] The method for forming a metal oxide film comprises the steps of forming a metal oxide film on the surface of a plated object using a plating bath containing a metal compound that forms the film and a boron compound that acts as a reducing agent, and regenerating the plating bath using an adsorption filter that adsorbs boric acid.

The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

The invention discloses a micro-through-hole structure polymer metallization method for guided wave transmission, and belongs to the technical field of photoelectric device processing, a polymer substrate is used for replacing a traditional all-metal material, and the micro-through-hole structure polymer metallization method for guided wave transmission is achieved through the multi-stage processes of plasma activation, chemical coarsening, sensitization, chemical plating, electroplating and the like. And forming a compact and high-adhesion metal layer on the inner surface of the through hole of the polymer substrate. In the process, a microfluid pump or a peristaltic pump is adopted to drive the solution to circularly flow in the through hole and the microcavity. According to the micro-through-hole structure polymer metallization method for guided wave transmission, dynamic flowing of a chemical plating solution in a micro-through hole and an internal cavity is achieved by introducing a micro-fluid pump or a peristaltic pump, and therefore a uniform, compact and firmly-attached metal layer is obtained.

An organometallic compound is provided which includes a central metal atom; and organic ligands capable of forming polydentate bonds to the central metal atom. Related methods and articles having a metal carbide coating are also provided.

The invention discloses a wear-resistant hybrid core-shell electric contact material and a preparation method, and relates to the technical field of electric contact materials, the electric contact material is prepared by taking copper as a matrix, adding SiC (at) Cu composite powder, CNT (at) Cu composite powder, Ti3SiC2 powder and a rare earth oxide dopant, and preparing the composite powder, mixing the powder, forming, sintering and the like. The composite powder with the core-shell structure is prepared through chemical plating, magnetron sputtering, chemical vapor deposition and other technologies, the interface wettability of a reinforcing phase and a copper matrix is effectively improved, through the multi-element hybrid reinforcing design, the hardness, abrasion resistance and heat conduction performance of the material are synergistically improved, the thermal expansion coefficient and the friction factor are reduced, and the service life of the material is prolonged. The prepared electric contact material has excellent comprehensive performance, can be widely applied to the fields of electric locomotive pantograph slide plates, electronic packaging and the like, and is stable and controllable in preparation process and suitable for industrial production.

The invention relates to a preparation process of a metal ceramic bionic multilayer film, and belongs to the technical field of metal ceramic films, and the metal ceramic bionic multilayer film comprises a porous metal matrix, a gradient transition layer, a bionic lamination layer and a nanopore separation layer. According to the method, the failure problem of a traditional metal ceramic film under the extreme working condition is systematically solved through the multi-level innovative design, firstly, in the aspects of thermal stress elimination and interface strengthening, a five-layer gradient transition layer structure with the ceramic content changing is adopted, and the plasma spraying-laser remelting synchronous machining technology is combined; the thermal expansion coefficient of the metal matrix and the ceramic layer is continuously and gradually changed, so that the interface thermal stress is effectively reduced, the bonding strength is improved, the problems of cracking and layering under the high-temperature working condition are effectively solved, the service life is effectively prolonged, the structure is strengthened and toughened, and the bionic lamination design simulates the'brick-mud 'structure of a shell pearl layer; the nano-scale metal layer absorbs crack energy, and the ceramic layer provides rigid support, so that the fracture toughness is effectively improved.

This invention relates to the field of photovoltaic technology and discloses a conductive silver-coated copper micropowder for photovoltaic applications and its preparation method. This preparation method aims to solve the problem of balancing performance and cost in existing silver-coated copper micropowders for photovoltaic applications. In this invention, during the pretreatment stage, the base copper powder is acid-washed but not water-washed. It undergoes pH adjustment, organic pre-bonding treatment, and gradient ammoniation to retain the activity of the copper powder and construct a uniform copper-ammonia complex layer. In the chemical silver plating stage, the pretreatment solution is added to a composite base liquid containing a complexing agent, organic amine, dispersant, and combined reducing agent. A silver-ammonia solution is then added dropwise under ultrasonic dispersion and nitrogen protection. In the post-treatment stage, the product undergoes ethanol reflux desorption, antioxidant treatment, vacuum drying, and low-temperature plasma activation, followed by sieving to obtain the final product. This method can achieve uniform and complete silver coating even with low silver content, providing a feasible path for the large-scale replacement of pure silver powder for photovoltaic applications with silver-coated copper micropowder.

The application relates to the technical field of aluminum bronze material, in particular to a high-hardness aluminum bronze material and a preparation method thereof. The application comprises the following steps S1: raw materials are put into a vacuum induction melting furnace, smelting is carried out at 1250-1350 DEG C, alloy liquid is obtained; the alloy liquid is continuously cast at 1150-1300 DEG C, a cast ingot is obtained; the cast ingot is extruded to form an aluminum bronze material; step S2: after the aluminum bronze material is polished, polished, cleaned and dried, a primer material is synchronously fed to a dry aluminum bronze material in a magnetic field assisted laser cladding mode to obtain a primer layer; step S3: a wear-resistant material is synchronously fed to the primer layer in a magnetic field assisted laser cladding mode to obtain a wear-resistant layer, and tempering is carried out to obtain the high-hardness aluminum bronze material.

A non-electrically antimicrobial conductive article can be prepared by: A) providing a non-electrically conductive substrate with first and second opposing surfaces; B) disposing a pattern of a catalytic ink, having unconnected features, on the first opposing surface of the non-electrically conductive substrate, and drying, curing, or drying and curing the pattern of catalytic ink to form an intermediate article; C) electrolessly plating copper metal in registration with the pattern of catalytic ink, to provide a pattern of unconnected copper metal features in registration with the pattern of catalytic ink, to form the non-electrically conductive antimicrobial article, and D) optionally passivating the pattern having unconnected copper metal features. The prepared antimicrobial article can provide antimicrobial properties when applied to various surfaces that are frequently touched, to inhibit or reduce the transmission of various microorganisms from one person to another.