535results about "Resistor manufacture" patented technology

The invention discloses a 3D (three-dimensional) rocker potentiometer assembling machine. The 3D rocker potentiometer assembling machine comprises a stander, wherein the stander is provided with a rotatable transporting tray, and the rotatable transporting tray is provided with a plurality of storage grooves for storing rocker assemblies; a mechanical hand mechanism and a rocker assembly transporting mechanism, corresponding to the storage grooves, are arranged on the surface of the stander and the periphery of the rotatable transporting tray, the stander is also provided with a controller which is connected with the rotatable transporting tray, the mechanical hand mechanism and the rocker assembly transporting mechanism, and the controller is connected with an electric control system below the stander. By adopting the 3D rocker potentiometer assembling machine, a 3D rocker potentiometer can be automatically assembled and tested; not only can the production efficiency be greatly improved compared to the manual assembling, but also the labor cost is saved.

The invention provides a carbon ceramic resistor and a preparation method thereof, and relates to the technical field of special material production of power systems and electrical equipment. The preparation method comprises the steps that carbon-containing electric conductor raw materials are mixed to obtain a first mixed raw material, and the carbon-containing electric conductor raw materials comprise, by mass, 15 parts of gluconic acid, 10 parts of aluminum oxide and 55 parts of deionized water; performing hydrothermal reaction on the first mixed raw material to obtain a carbon-containing conductor precursor; the carbon-containing conductor precursor is carbonized in a protective atmosphere, a carbon-containing conductor of a core-shell structure is obtained, and the carbon-containing conductor takes aluminum oxide as an inner core and takes a conductive carbon material formed by gluconic acid as a conductive outer shell; mixing the carbon-containing electric conductor with the core-shell structure with a carbon ceramic matrix raw material to obtain a resistor blank; and sintering the resistor blank to obtain the carbon ceramic resistor. The uniformity, the stability and the reliability of the carbon ceramic resistor are improved, so that the carbon ceramic resistor can better meet the application requirements of ultrahigh-voltage and extra-high-voltage alternating-current power transmission systems.

To improve stability of gauge characteristics in a strain gauge having a resistor formed on a substrate having flexibility.SOLUTION: A strain gauge has: a resin-made substrate having flexibility; a functional layer formed of metal, an alloy, or a compound of metal directly on one face of the substrate; a resistor having α-Cr as a main component and formed of a film including Cr, CrN, and Cr2N directly on one face of the functional layer; and an insulating resin layer covering the resistor. The functional layer has a function to promote crystal growth of the α-Cr and deposit a film having the α-Cr as a main component. The thickness of the resistor is 0.05 μm or more and 2 μm or less. The thickness of the functional layer is 1 nm or more and 100 nm or less. The coefficient of expansion of the substrate is within a range of 7 ppm / K to 20 ppm / K.SELECTED DRAWING: Figure 2

The invention provides an optimization method and an optimization device for electrical performance of a ZnO piezoresistor based on O2 heat treatment. According to the method, O2 is introduced into the ZnO varistor under the condition of heat treatment, and oxygen vacancies in the ZnO varistor are reduced under the oxygen atmosphere, so that the donor concentration is reduced, the carrier concentration is reduced, and the electrical performance of the ZnO varistor is remarkably improved. Besides, the optimization device provided by the invention is used for the heat treatment step in the electrical performance improvement process of the ZnO varistor, and the front and back surfaces of the ZnO varistor can be in full contact with gas in the heat treatment process, so that the electrical performance is uniformly and effectively improved.

The invention discloses a piezoresistor assembling device, and belongs to the technical field of electronic component manufacturing equipment. The problems that existing piezoresistor assembly mostly depends on manual or semi-automatic equipment, production efficiency is low, consistency is poor, all mechanisms are lack of effective cooperation and need manual intervention, resistor insertion deflection is prone to occurring, sand filling is uneven, and cover plate correction precision is low are solved. The device comprises a shell feeding mechanism, a resistor feeding mechanism, a cover plate feeding mechanism, a material inserting mechanism, a sand filling mechanism, a cover plate assembling mechanism, a driving mechanism, a supporting mechanism and a control system. The supporting mechanism supports all the mechanisms, the driving mechanism drives the shell to move at the stations of the material inserting mechanism, the sand filling mechanism and the cover plate assembling mechanism, the control system coordinates all the mechanisms to act, and all the mechanisms sequentially complete feeding of the shell, the resistor and the cover plate, insertion of the resistor into the shell, sand filling and cover plate assembling. The device is mainly used for automatically completing full-process assembly of the piezoresistor, continuous automatic production is achieved, and the assembly efficiency and the product consistency are improved.

The invention discloses a method for manufacturing a high-precision carbon oil resistor circuit board for a vehicle, which comprises the following steps of: attaching a thick copper layer and a micro-adhesive film to form an attaching plate, and manufacturing a groove in the attaching plate corresponding to a resistor pattern; the thickness of the thick copper layer is greater than the depth of the groove; the grooves are filled with carbon oil, then curing processing is carried out, carbon oil patterns are formed, and the whole board forms a carbon oil pattern board; laminating the first single-sided copper-clad plate and the carbon oil pattern plate; the first single-sided copper-clad plate is opposite to the carbon oil pattern; removing the micro-adhesive film, carrying out copper reduction treatment on the thick copper layer, exposing the carbon oil pattern, forming a carbon oil pattern double-sided board, then manufacturing a circuit pattern, and carrying out post-process processing to form a circuit board; the precision of the carbon oil pattern manufactured through the reverse manufacturing process is far higher than that of traditional silk-screen printing, and the problem that the resistance value of the carbon oil pattern exceeds the standard due to the fact that the processing size of the carbon oil pattern is not easy to control in a silk-screen printing ink manufacturing mode in the prior art is solved.

A thin film resistor and a method of fabricating the same are provided. The thin film resistor includes a substrate, a first end electrode, a second end electrode, a resistor layer, an electrostatic protection layer and an electrostatic electrode layer disposed on the resistor layer. The first end electrode and the second end electrode are disposed on two end portions of an upper surface of the substrate, respectively. The resistor layer and the electrostatic protection layer are disposed on the upper surface of the substrate. The electrostatic protection layer is disposed adjacent to one side of the resistor layer. The electrostatic protection layer includes two separated portions, and at least one of the two separated portions has a tip portion. Therefore, electrostatic charges can be prevented from flowing into the resistor layer, and moisture penetration into the resistor layer can be blocked.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

A force sensor (10) and a method for measuring a force are disclosed. The force sensor (10) comprises a first non-conductive substrate (1) and a second non-conductive substrate (4). A first electrode (2a) and a second electrode (2b) are disposed on the first substrate (1) and offset to each other. A first conductive layer (3) is disposed on the first substrate (1) and is conductively connecting the first electrode (2a) and the second electrode (2b) with a first layer resistance (R1). A second conductive layer (5) is disposed on the second substrate (4). The second conductive layer (5) is configured to conductively connect the first electrode (2a) and the second electrode (2b) via the second conductive layer (5) with a second layer resistance (R2) when the first non-conductive substrate (1) and the second non-conductive substrate (4) approach each other.

The invention relates to the technical field of multi-column lightning arresters, in particular to a multi-column lightning arrester parallel matching method, which comprises the following steps of S1, performing aging screening and energy tolerance testing on zinc oxide resistor discs of the same batch; s2, measuring the direct-current reference voltage Uref of the resistor discs, the leakage current I0 under 0.75 Uref, the impact residual voltage UL under the lightning wave and the operation residual voltage US under the operation wave one by one; s3, screening the resistor discs for three times; and S4, high-low matching is carried out by taking the operation residual voltage US as a main matching basis, so that the operation residual voltage deviation of each column of series resistor disc group is smaller than a first preset value, and the direct current reference voltage numerical value deviation is smaller than a second preset value. The strict screening process ensures the consistency of the performance of the resistor discs, and the reasonable grouping mode makes the electrical performance of each column resistor disc group more balanced, thereby achieving the effect of improving the operating wave endurance capability and the current sharing characteristic of the multi-column lightning arrester, and reducing the probability of faults caused by uneven current distribution of the MOV.

The invention discloses a film platinum resistor temperature sensor, which comprises an aluminum oxide insulating substrate, a titanium film, a platinum film resistor layer, a protective layer, a platinum metal lead and encapsulating slurry, the titanium thin film is deposited on the surface of the aluminum oxide insulating substrate, the platinum thin film resistance layer is deposited on the surface of the titanium thin film, the protection layer is deposited on the surface of the platinum thin film resistance layer, the platinum metal lead is welded on a bonding pad on the platinum thin film resistance layer, and the packaging slurry is coated on the protection layer and the platinum thin film resistance layer. According to the invention, the platinum film temperature sensor with high precision, good consistency, wide temperature measurement range and strong stability is obtained through arrangement and allocation of a multi-layer structure.

An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler and a titanium-containing inner filler. The polymer matrix has a fluorine-free polyolefin-based polymer. The titanium-containing inner filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing inner filler accounts for 1-9% by volume of the PTC material layer.

The invention relates to the technical field of resistor trimming, and discloses a resistor trimming control method, a control mechanism, a laser resistor trimming machine and a storage medium. The method comprises the steps of obtaining an initial resistance value and a target resistance value of a target resistor body; a resistance correction strategy is determined according to the initial resistance value and the target resistance value, the resistance correction strategy comprises a rough machining stage and a fine machining stage, the resistance value range value of the rough machining stage is smaller than that of the fine machining stage, and the initial resistance correction parameter in the rough machining stage is partially or completely higher than that in the fine machining stage; the target resistor body is subjected to resistance trimming according to the resistance trimming strategy, and the real-time resistance value of the target resistor body is obtained; and according to the real-time resistance value, the initial resistance trimming parameter of the current machining stage is regulated and controlled, and a corresponding machining control signal is output. According to the method, the resistance trimming parameters are gradually regulated and controlled in a staged mode, the resistance trimming parameters of the current processing stage are dynamically regulated and controlled in combination with the real-time resistance value, accurate control over the resistance value variation in the resistance trimming process of the target resistor body is achieved, and the resistance trimming precision is improved.

The invention relates to a method for preparing a carbon ceramic resistor through photocuring forming, and belongs to the technical field of photocuring forming. Adding the ceramic particles, a photoinitiator and a dispersing agent into the resin, and fully mixing to obtain carbon ceramic resistor photocuring forming slurry; then carrying out photocuring forming to obtain a carbon ceramic resistor biscuit; the biscuit is heated in a non-oxidizing protective gas atmosphere, so that the organic matter is cracked, and carbon obtained after the organic matter is cracked is reserved in the biscuit; then heating the biscuit in an oxygen-containing atmosphere, so that part of carbon in the biscuit reacts with oxygen to generate oxycarbide; and sintering the biscuit in a non-oxidizing protective gas atmosphere, so that the ceramic particles are connected with one another, and the carbon ceramic resistor is obtained. The prepared carbon ceramic resistor is uniform in ceramic particle distribution, small and uniform in pore, and compact in crystal grain accumulation.

A sensor device including a conductive graphene film covered on at least one side by a graphene support layer of parylene, a detection element configured to sense an environmental change, and an electrode. The parylene repairs some defects of the conductive graphene film without damaging, polluting, or degrading the conductivity of conductive graphene film.

The invention relates to a carbon composite ceramic linear resistor and a preparation method and application thereof. The preparation method of the carbon composite ceramic linear resistor provided by the invention comprises the following steps: uniformly mixing aluminum oxide, clay and nano carbon black to obtain mixed powder; determining the mass of the powder based on the volume of a mold cavity of a mold and the target density of the carbon composite ceramic linear resistor, accurately weighing the mixed powder according to the calculated mass of the powder, filling the mixed powder into the mold, and carrying out hot pressed sintering to obtain a sample; and carrying out surface treatment on the sample to obtain the carbon composite ceramic linear resistor. Compared with a carbon ceramic resistor disc sintered at normal pressure, the density and porosity of the resistor disc are accurately controlled through fixed mold hot pressing, the resistivity is accurately controlled, the preparation method is simple, the cost is low, the yield is remarkably increased, and the carbon ceramic resistor disc is favorably put into actual industrial production.

An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as α-PVDF, β-PVDF and γ-PVDF. The total amount of α-PVDF, β-PVDF and γ-PVDF is calculated as 100%, and the amount of α-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.

The utility model relates to the technical field of NTC (Negative Temperature Coefficient) resistor element processing, in particular to an NTC resistor element lead branching assembly, which comprises a supporting seat, a centering clamping mechanism is arranged on the surface of the supporting seat, the centering clamping mechanism consists of a servo motor, a rotating arm, a pull rod and two groups of clamping plates, the two clamping plates are slidably connected to the surface of the supporting base. The surface of the clamping plate is connected with a branching mechanism, and the branching mechanism is used for branching NTC resistor element leads; the surface of the supporting seat is connected with a pushing mechanism; and the pushing mechanism is used for pushing the wire separating mechanism to move to realize wire separating work. According to the utility model, the automation degree is improved, manual auxiliary operation is not needed in the branching process, the labor intensity is reduced, and the working efficiency is improved; and the whole branching process is automatically completed by a machine, and manual operation does not exist in the process, so that the branching positions are relatively uniform.

The present invention discloses a carbon composite ceramic linear resistor and a preparation method thereof, belonging to the technical field of power electronic components. The present invention provides a preparation method of a carbon composite ceramic linear resistor, which comprises the following steps: uniformly mixing bentonite, silicon carbide and nano carbon black to obtain a powder material, uniformly mixing the powder material and ethanol, drying, adding a binder solution, and performing green body forming to obtain a green body after forming; under the atmosphere of a nitrogen element-containing gas, keeping the green body at 1150 °C to 1300 °C to obtain a specimen; after polishing the specimen, spraying aluminum to obtain a carbon composite ceramic linear resistor. The method for preparing the carbon composite ceramic linear resistor of the present invention can reduce the resistivity of the material and improve the thermal shock resistance of the ceramic resistor.

A resistive element of this chip resistor has a first trimming groove and a second trimming groove formed therein. A first end of the first trimming groove is located at a third edge of the resistive element, and a second end of the first trimming groove is located at a position closer to a fourth edge of the resistive element and closer to a first electrode than the position of the first end. The first trimming groove has a shape extending from the first end toward the fourth edge and further extending toward the second end. A third end of the second trimming groove is located at the third edge of the resistive element, at a position closer to a second edge than the first end, and a fourth end of the second trimming groove is located at a position closer to the fourth edge and closer to a second electrode than the position of the third end. The second trimming groove has a shape extending from the third end toward the fourth edge and further extending toward the fourth end.

A resistor includes a substrate, a first electrode, a resistive layer, a second electrode, and an insulating layer. The substrate surface has a first side and a second side opposite to each other in a first direction. The first electrode is arranged on the surface of the substrate and comprises a first end portion located on the first side and a first extending portion which is connected with the first end portion and extends towards the second side. The resistive layer is disposed on the first electrode. The second electrode is arranged on the resistance layer and comprises a second end portion located on the second side and a second extending portion which is connected with the second end portion and extends towards the first side. The insulating layer is disposed on the second electrode and covers the first extension portion, the resistive layer and the second extension portion. The resistor has a trench pattern extending in a first direction, the trench pattern extending through the insulating layer, the second electrode, and the resistive layer on a normal to the substrate. The resistor can help to control the resistance value and improve the yield.

The invention relates to the technical field of material rolling structures, in particular to a semiconductor ceramic chip resistor material disc which comprises inner discs, a connecting shaft, an outer ring, a fixing assembly, a supporting assembly and a rolling assembly, the connecting shaft is connected between the two inner discs, the rolling assembly is connected to the outer walls of the inner discs, the outer ring is connected to the outer walls of the inner discs, and the fixing assembly is connected to the supporting assembly. An annular groove is formed in the inner wall of the outer ring, and the rolling assembly is connected with the annular groove. By arranging the inner disc and the outer ring, an original overall structure is divided into a double-layer structure, in the feeding process, the inner disc rotates in the outer ring, then the situation that the whole material disc rotates in a tray of a chip mounter and rubs with the tray is avoided, and then generation of static electricity is reduced; the rotating resistance of the outer ring in the tray is further increased, rotation of the outer ring is avoided, and due to the fact that no friction exists between the outer ring and the tray, abrasion of the outer ring is reduced, and the service life of the charging tray is prolonged.

This application relates to the field of thermistor materials technology, specifically disclosing a high resistivity, low B-value thermistor material, a chip resistor, and a method for preparing the same. The high resistivity, low B-value thermistor material provided in this application comprises a base material and 2-10% by weight of additives; the base material comprises Mn3O4, Co3O4, SrO, ZnO, and TiO2 in a weight ratio of (10-40):(5-15):(20-60):(5-10):(1-15); the additives comprise CaO, Fe2O3, and SiC in a weight ratio of (5-20):(10-50):(9-35); this application also provides a chip resistor made using the above-mentioned thermistor material. The chip resistor obtained in this application has high resistivity and a low B-value, which can meet the requirements for use in negative temperature coefficient thermistors.

The application belongs to the technical field of resistance sheet production, and particularly relates to a resistance sheet spraying device, which comprises a frame, the bottom end of the frame is rotationally connected with a lower mold plate, and the two sides of the lower mold plate are fixedly provided with side plates; the top end of the frame is provided with a lifting device, the power output end of the lifting device is provided with a motor, the power output end of the motor is provided with an upper mold plate, and the two sides of the upper mold plate are slidably connected with the corresponding side plates; the top surface of the lower mold plate is provided with a first through groove and a first air duct, the first air duct is located outside the first through groove; the bottom surface of the upper mold plate is provided with a second through groove and a second air duct, and the second air duct is located outside the second through groove; one side is provided with a spray gun, and the other side is provided with a telescopic device, and the power output end of the telescopic device is fixedly provided with an air guiding device. When the resistance sheet spraying device is used, the spraying operation can be completed without needing to wrap a rubber sleeve on the outer periphery of the resistance sheet, and the technical problems caused by the use of the rubber sleeve do not exist.

The invention discloses a semiconductor piezoresistive device and a preparation method thereof. The preparation method comprises the following steps: cleaning an SOI wafer and depositing a silicon dioxide layer; forming an ohmic contact region and a rectangular piezoresistive region structure through photoetching, etching and heavy doping processes; performing wet etching on the exposed rectangular window part of the piezoresistive region by using a corrosive liquid after photoetching, and forming a hole structure with a trapezoidal longitudinal section in the silicon nano-film; metal is sputtered after photoetching, and annealing is carried out to form ohmic contact; etching the buried oxide layer, performing wet etching on a part of the buried oxide layer, filling photoresist as a supporting structure, and performing undercutting on the residual buried oxide layer to form a large-size hollow silicon nano film; transferring the large-size hollow silicon nano film to a flexible substrate by adopting a double transfer printing method; and finally, printing an electrode and completing packaging. According to the method, the sensitivity and the transfer printing success rate of the silicon nano film are effectively improved through the design of the large-size hollow structure and the photoresist supporting transfer printing process.

This invention provides a method for producing polymer positive temperature coefficient (PPTC) materials that are suitable for flexible applications and have a low environmental impact. [Solution] A method for preparing a PPTC compound and conformally applying the compound to a substrate, comprising the steps of: preparing and mixing raw materials to form a PPTC mixture; processing the PPTC mixture in a polymer compounding apparatus; heating the PPTC mixture and performing a beam irradiation step on the polymer compound to be extruded as a PPTC compound to crosslink the polymer chains within the PPTC compound; and applying the PPTC compound to the substrate using a high-temperature application step. Here, the PPTC compound is heated and conformally applied to the surface of the substrate.

The invention discloses a preparation method of a buried resistor printed circuit and a printed circuit board, and the method comprises the steps: determining the length of a resistor body corresponding to a buried resistor according to the resistance value of the buried resistor to be formed and the preset sheet resistance of resistor paste, and preparing a disconnection part on a target copper foil circuit of a target PCB according to the length of the resistor body and the preset buried resistor shape, wherein the target copper foil circuit is provided with connecting parts at the two ends of the disconnected part; after pretreatment is carried out on each disconnection part and the corresponding connection part, resistance paste with a preset thickness is printed on the disconnection parts in a silk-screen mode through a preset silk-screen plate so as to form a first resistor body, and pretreatment comprises copper foil deoxidation, connection part circuit surface coarsening and disconnection part circuit surface washing and cleaning; and carrying out high-temperature curing on the first resistor body, and carrying out resistance trimming on the cured and molded second resistor body by using a laser resistance trimming instrument so as to mold a buried resistor on the target copper foil circuit, thereby obtaining a buried resistor printed circuit.

The application provides a high-B-value linear NTC thermistor material with good batch consistency, a preparation method thereof and a thermistor element, relates to the technical field of NTC thermistor materials, and is characterized in that a NiO-ZnO binary oxide system is selected, ZnO is used as a main crystal phase, the conductive behavior and resistance-temperature characteristics of the material are controlled through a small amount of NiO, a NiO-ZnO linear NTC thermistor material directly physically compounded by NiO and ZnO is formed, the system composition is more simplified, the composite path is shorter, the phase composition is more easily controlled, the composition fluctuation and the organization non-uniformity caused by the complex second phase generation process, the insufficient local reaction or the uneven phase distribution can be reduced, and therefore the performance dispersion between different batches is reduced, and the consistency and the repeatability of the material preparation are improved.

The invention discloses an automatic bending and steering mechanism for resistor assembly, which realizes breakthrough progress in a resistor disc assembly technology: manual intervention is thoroughly eliminated through full-process automation, and the requirement of a single-line operator is reduced to zero; the working procedures are highly integrated, so that the time consumed from feeding to assembling of a single resistor disc is shortened, and the production speed is remarkably increased compared with that of a traditional production line; the systematized precision guarantee ensures that the bending angle qualification rate and the assembly dislocation rate approach to zero, and the technical advantages are converted into remarkable market efficiency and efficiency dimensions in industrial-grade mass production, and the output per unit time is improved; in the cost dimension, the manpower cost is saved, and the repair cost of defective products is reduced; in the aspect of space dimension, the occupied area of equipment is reduced, the flexibility of production line recombination is greatly enhanced, and comprehensively, the relation of resistor assembly production lines is redefined fundamentally, an automatic upgrading normal form with high economical efficiency and replicability is provided for the electronic manufacturing industry, and excellent comprehensive efficiency and industrial value are created.

The utility model discloses an assembly tool for a heavy-load lightning arrester core group, and relates to the technical field of lightning arrester core group assembly. The device comprises an assembly block, a clamping opening is formed in the upper end face of the assembly block, two containing openings communicated with the interior of the clamping opening are formed in the upper end face of the assembly block, the clamping blocks are arranged in the containing openings, the core assembly bodies are arranged in the clamping openings, and lightning arrester electrodes are arranged on the upper end face of the core assembly bodies. Inverted-U-shaped frames are fixed to the upper end faces, located in front of and behind the lightning arrester electrode, of the assembly blocks, a movable annular plate is arranged between the two inverted-U-shaped frames located above the lightning arrester electrode, and a linkage rod is arranged under the movable annular plate. The clamping block is pushed by the air cylinder to clamp the core assembly body, so that the assembly work can be operated by a single person, and meanwhile, the linkage rod can be automatically reset through the matched use of the linkage rod and the movable ring plate.