51results about "Resistor manufacture" patented technology

The invention discloses a 3D (three-dimensional) rocker potentiometer assembling machine. The 3D rocker potentiometer assembling machine comprises a stander, wherein the stander is provided with a rotatable transporting tray, and the rotatable transporting tray is provided with a plurality of storage grooves for storing rocker assemblies; a mechanical hand mechanism and a rocker assembly transporting mechanism, corresponding to the storage grooves, are arranged on the surface of the stander and the periphery of the rotatable transporting tray, the stander is also provided with a controller which is connected with the rotatable transporting tray, the mechanical hand mechanism and the rocker assembly transporting mechanism, and the controller is connected with an electric control system below the stander. By adopting the 3D rocker potentiometer assembling machine, a 3D rocker potentiometer can be automatically assembled and tested; not only can the production efficiency be greatly improved compared to the manual assembling, but also the labor cost is saved.

This application relates to the field of thermistor materials technology, specifically disclosing a high resistivity, low B-value thermistor material, a chip resistor, and a method for preparing the same. The high resistivity, low B-value thermistor material provided in this application comprises a base material and 2-10% by weight of additives; the base material comprises Mn3O4, Co3O4, SrO, ZnO, and TiO2 in a weight ratio of (10-40):(5-15):(20-60):(5-10):(1-15); the additives comprise CaO, Fe2O3, and SiC in a weight ratio of (5-20):(10-50):(9-35); this application also provides a chip resistor made using the above-mentioned thermistor material. The chip resistor obtained in this application has high resistivity and a low B-value, which can meet the requirements for use in negative temperature coefficient thermistors.

The application belongs to the technical field of resistance sheet production, and particularly relates to a resistance sheet spraying device, which comprises a frame, the bottom end of the frame is rotationally connected with a lower mold plate, and the two sides of the lower mold plate are fixedly provided with side plates; the top end of the frame is provided with a lifting device, the power output end of the lifting device is provided with a motor, the power output end of the motor is provided with an upper mold plate, and the two sides of the upper mold plate are slidably connected with the corresponding side plates; the top surface of the lower mold plate is provided with a first through groove and a first air duct, the first air duct is located outside the first through groove; the bottom surface of the upper mold plate is provided with a second through groove and a second air duct, and the second air duct is located outside the second through groove; one side is provided with a spray gun, and the other side is provided with a telescopic device, and the power output end of the telescopic device is fixedly provided with an air guiding device. When the resistance sheet spraying device is used, the spraying operation can be completed without needing to wrap a rubber sleeve on the outer periphery of the resistance sheet, and the technical problems caused by the use of the rubber sleeve do not exist.

The application provides a high-B-value linear NTC thermistor material with good batch consistency, a preparation method thereof and a thermistor element, relates to the technical field of NTC thermistor materials, and is characterized in that a NiO-ZnO binary oxide system is selected, ZnO is used as a main crystal phase, the conductive behavior and resistance-temperature characteristics of the material are controlled through a small amount of NiO, a NiO-ZnO linear NTC thermistor material directly physically compounded by NiO and ZnO is formed, the system composition is more simplified, the composite path is shorter, the phase composition is more easily controlled, the composition fluctuation and the organization non-uniformity caused by the complex second phase generation process, the insufficient local reaction or the uneven phase distribution can be reduced, and therefore the performance dispersion between different batches is reduced, and the consistency and the repeatability of the material preparation are improved.

A printable paste for producing an electrical component, including a printable, non-conductive coating, electrically conductive particles and ceramic NTC particles, wherein the electrically conductive particles and the ceramic NTC particles are homogeneously distributed in the printable, non-conductive coating. There is also provided a method for producing a printable paste, a thin film including the printable paste, a method for producing the thin film, and a temperature sensor and an inrush current limiter including the thin film having the printable paste.

The utility model provides a kind of micro pattern repair resistance device of ceramic metal film resistor, belong to micro-nano manufacturing technology field, including numerical control machine tool, support plate fixedly installed on the outer surface of numerical control machine tool, and ultraviolet laser is arranged to the outside of support plate;Self-locking mechanism, including the fixed frame fixedly connected to the outer surface of support plate, the connecting shaft fixedly installed in the inner surface of the fixed frame by bearing sleeve, the gear fixedly set in the outer end surface of the connecting shaft, the toothed plate engaged with the outer surface of the gear.The utility model can not only use the automatic gravity of ultraviolet laser to quickly install it by the cooperation between each component in self-locking mechanism, but also can automatically lock it after ultraviolet laser installation by locking assembly, so that ultraviolet laser can complete installation in a short time, and ensure that the laser after each replacement can be firmly locked.

This application relates to the field of thermistor technology, specifically disclosing an NTC thermistor material, a chip resistor, and its preparation method and application. The NTC thermistor material provided in this application comprises a base material and 3-13% additives by weight; the base material comprises Mn3O4, Co3O4, Al2O3, Fe2O3, and ZnO in a weight ratio of (10-40):(10-50):(1-15):(10-25):(5-19); the additives comprise MgAl2O4, Nb2O5, and TiO2 in a weight ratio of (1-200):(1-10):(5-25); this application also provides a chip resistor made using the NTC thermistor material. The NTC thermistor material provided in this application has a high material constant B value and a low room temperature resistivity ρ. 25 It can meet the application requirements of high-precision and high-reliability temperature sensors.

A stereoscopic arch ignitor resistor and manufacturing method thereof are provided. The stereoscopic arch ignitor resistor includes a substrate, an alloy layer, a combustible material accommodating portion, and a lateral conductive layer. The alloy layer is disposed on a first surface of the substrate. The alloy layer includes an arch lead, a first connecting portion, and a second connecting portion. The combustible material accommodating portion is positioned between the arched lead and the substrate. The arch lead defines a volume of combustible material of the combustible material accommodating portion. The lateral conductive layer is disposed on the alloy layer. The lateral conductive layer abuts against a side surface of the substrate. The stereoscopic arch-type ignition resistance element is configured to reduce ignition distance and / or increase contact area with combustible material.

Provided are a composite device for automotive electric parts and a manufacturing method thereof. The composite device includes: a multi-layered ceramic capacitor having a plurality of first and second internal electrodes alternately arranged; a multi-layered ceramic varistor having a plurality of third and fourth internal electrodes arranged to face each other, the multi-layered ceramic varistor being stacked on one side surface of the multi-layered ceramic capacitor; an adhesive layer made of an insulating heat dissipation ceramic adhesive for bonding the multi-layered ceramic capacitor and the multi-layered ceramic varistor; and first and second external electrodes which connect the plurality of first and second internal electrodes exposed to both end portions of the multi-layered ceramic capacitor with the plurality of third and fourth internal electrodes exposed to both end portions of the multi-layered ceramic varistor, respectively.

sensor element (1) for measuring a temperature - a carrier (2), - at least one functional layer (3) arranged on a top surface (2a) of the support, wherein the functional layer (3) has a material with a temperature-dependent electrical resistance, - at least one upper electrode (5), wherein a first contact area (c1) is formed between the at least one upper electrode (5) and the functional layer (3), - at least one lower electrode (4), wherein a second contact area (c2) is formed between the at least one lower electrode (4) and the functional layer (3), wherein the functional layer (3) is at least partially embedded between the at least one lower electrode (4) and the at least one upper electrode (5), and wherein the functional layer (3), the at least one upper electrode (5), and the at least one lower electrode (4) are designed and arranged such that a specific electrical resistance of the sensor element (1) is achieved. wherein the sensor element (1) has a plurality of upper electrodes (5) and a plurality of lower electrodes (4) connected in series, whereby a resistance is determined - by the size of the respective first contact area (c1) and / or - by the size of the respective second contact area (c2) and / or - by a relative position of the first contact areas (c1) and the second contact areas (c2) and / or - by a size of overlap areas (o) between first contact areas (c1) and second contact areas (c2) and / or - by a number of resistors connected in series.

The application provides a preparation method of a thick film low resistance resistor based on Ts gradient and three simultaneous principles, and is particularly applied to the field of low resistance (0.01-5 ohms / square). In view of the technical problems of high cost, narrow process window and poor interface reliability of the Ag-Pd-RuO2 ternary noble metal system in the prior art, the application adopts an Ag / Pd porous conductive network to replace the traditional ternary system, designs a gradient temperature sintering process based on the glass softening point gradient matching principle (Ts_G1<Ts_C1<Ts_R), constructs a three-dimensional porous conductive structure through high-length-diameter-ratio flaky silver, and realizes precise regulation and control of the temperature coefficient by combining a nano-palladium surface modification technology. On the premise of completely abandoning the high-cost noble metal RuO2, the application improves the interface matching, improves the device reliability, and realizes the cost reduction and performance improvement of the low resistance end thick film resistor paste.

The utility model discloses a kind of grain folding machine material conveying guiding positioning device, including the conveying belt for the grain folding conveying of part;The rear side of the surface end of the conveying belt is provided with the guide plate for the guiding positioning of part, and the front side of guide plate surface is embedded with ball;The left side of the end of conveying belt is provided with the guide block for cooperation with guide plate, and the rear side of guide block is provided with guide camber, and the guide camber on guide block is opposite side with guide plate It is arranged in "V" shape.This scheme can be accurately guided, real-time monitoring and have flexible adjustment function, to solve the positioning and conveying problem of resistance material before grain folding processing, improve production efficiency and product consistency.

A method for manufacturing a ceramic electronic component that includes: forming a modeled object by applying a ceramic material, a metal material, and a disappearing material by 3D printing, the modeled object including an electronic component main body containing the ceramic material and the metal material, a support body that contains the ceramic material and that is disposed around at least a portion of a periphery of the electronic component main body, and a disappearing body that contains the disappearing material and that is disposed between the electronic component main body and the support body; firing the modeled object at a temperature higher than or equal to a temperature at which the disappearing body disappears; and isolating the support body from the modeled object after firing so as to obtain the ceramic electronic component.

A resistor substrate production method according to the present invention comprises: a coating step for coating an ink that contains a solvent, a thermosetting resin, and conductive particles onto a substrate and forming a conductive coating film; a drying step for drying a workpiece, which is obtained by providing the conductive coating film on the substrate, at a second temperature that is lower than a first temperature at which a curing reaction of the thermosetting resin progresses, and removing the solvent; a hot pressing step for sandwiching the workpiece after the drying step between a first press platen and a second press platen, which are kept at the first temperature, pressing the workpiece, and partially curing the thermosetting resin; and a firing step for placing the workpiece after the hot pressing step into a firing furnace, firing the workpiece at the first temperature, and completing the curing of the thermosetting resin. In the hot pressing step, pressing is performed after a cushioning sheet that is softer than the pressing surface of the first press platen has been placed between the pressing surface of the first press platen and the workpiece. Therefore, the produced resistor substrate has excellent wear resistance with respect to sliding.

To provide a multilayer varistor capable of suppressing the occurrence of migration.SOLUTION: A multilayer varistor 1 includes a sintered body 11, a first internal electrode 12A, a second internal electrode 12B, a first external electrode 14A, a second external electrode 14B, and a high resistance layer 13. The first internal electrode 12A and the second internal electrode 12B are provided inside the sintered body 11. The first external electrode 14A is provided onto the surface of the sintered body 11 and is electrically connected to the first internal electrode 12A. The second external electrode 14B is provided to the surface of the sintered body 11 and is electrically connected to the second internal electrode 12B. The high resistance layer 13 covers at least part of the surface of the sintered body 11, and the high resistance layer 13 has multiple cracks on the surface.SELECTED DRAWING: Figure 1

Provided is a method for making a high-resistance value coaxial shunt, including providing resistor bodies, the resistor bodies being provided in a stacked manner, and a conducting length of each of the resistor bodies being greater than the physical length of the resistor bodies in a stacked state. According to the method for making a high-resistance value coaxial shunt provided by the present disclosure, by providing the resistor bodies as the stacked structure, the conducting length of the resistor bodies can be effectively prolonged so that in the case that the conducting area and the physical length of the resistor bodies are not changed, the magnitude of the resistance is increased. The present disclosure further provides a current detection system.

The application discloses a method for pre-synthesizing a ruthenium-based conductive phase in stages and application, and relates to the technical field of electronic functional materials and thick film resistance. The method for pre-synthesizing the ruthenium-based conductive phase in stages comprises the following steps: mixing the ruthenium-based conductive phase and rare earth oxides to obtain mixed raw materials; and performing a pre-synthetic heat treatment on the mixed raw materials to obtain a pre-synthetic conductive phase. In order to study the application effect of the pre-synthetic conductive phase prepared by the application in the preparation of a PTC thermistor film, the pre-synthetic conductive phase is used to prepare the PTC thermistor film, and the specific steps are as follows: mixing the pre-synthetic conductive phase with glass powder, auxiliary oxides and an organic carrier, and then rolling to obtain PTC thermistor paste; and the PTC thermistor film can be prepared subsequently; under the same paste preparation and sintering conditions, the PTC thermistor paste prepared by the method has significantly improved consistency of sheet resistance and resistance temperature coefficient. The application has clear process structure and good repeatability, and is suitable for the preparation of a ruthenium-based PTC thermistor paste.

The application discloses a resistor information integration method, comprising the following steps: step one, testing the resistor to determine its parameters; step two, converting the parameters into digital codes; step three, encoding the digital codes into patterns; and step four, using a laser marking machine to engrave the patterns on the resistor surface. The resistor information integration method sets specific patterns on the resistor surface, integrates and transmits key parameters closely related to the reliability of the resistor, and the parameters include but are not limited to the correlation coefficients of the calibration curve or the temperature compensation curve, the resistance, the temperature coefficient characteristic value and the like, so that the rapid transmission and complete traceability of the parameters are realized, and the reliability and stability of the resistor in practical application are ensured.

The present invention relates to a sensor element (1) for measuring temperature, comprising a carrier (2), a temperature-dependent resistor (10) arranged on a top surface (2a) of the carrier (2), and a shunt resistor (20) arranged on the top surface (2a) of the carrier (2), wherein the temperature-dependent resistor (10) comprises a first electrode (12), a second electrode (13), and a functional layer (11) made of a material with a temperature-dependent electrical resistance, wherein the first and second electrodes (12, 13) are thin-film electrodes, and the functional layer (11) is a thin film, wherein the shunt resistor (20) is electrically connected to at least one of the electrodes (12, 13) of the temperature-dependent resistor (10), and wherein the shunt resistor (20) is formed by a thin film. A further aspect relates to a method for manufacturing the sensor element.

The application discloses a Jerusalem unit double-layer FSS broadband wave-absorbing structure and a preparation method and application thereof, and belongs to the field of electromagnetic wave-absorbing technology design in electromagnetic stealth technology. The structure is sequentially arranged from bottom to top as a metal bottom layer, a dielectric layer 1, a patterned resistance layer 1, a dielectric layer 2 and a patterned resistance layer 2. Periodic array distributed multiple unit cell structures are formed on the surfaces of the patterned resistance layer 1 and the patterned resistance layer 2, and each unit cell structure adopts a Jerusalem cross pattern. The Jerusalem unit double-layer FSS broadband wave-absorbing structure provided by the application has a wide-frequency absorption characteristic. Through the regulation of geometric sizes on a macro scale and the structure design on a micro scale, the wave-absorbing structure can realize an absorption rate of more than 99% in a full frequency band of 8-12 GHz, and has a good absorption effect on low-frequency electromagnetic waves.

This invention discloses a method for manufacturing an electronic component, the electronic component itself, and a thin-film resistor. The method for manufacturing the electronic component includes: forming a through-hole in a ceramic substrate; forming a resistive film on one side of the ceramic substrate; forming a metal layer on both sides of the ceramic substrate, the metal layer covering a portion of the resistive film, and a portion of the metal layer located within the through-hole; forming a conductive structure on one side of the metal layer, a portion of the conductive structure forming a first electrode, a second electrode, and a circuit structure on one side of the ceramic substrate; forming a third electrode on the other side of the conductive structure, the third electrode being electrically connected to the first electrode, the second electrode, or the circuit structure; forming an insulating protective layer on one side of the resistive film to cover the portion of the resistive film not covered by the metal layer; and forming an auxiliary welding structure on one side of the second electrode.

A columnar resistor and a method of laser trimming for manufacturing the same are provided. The columnar resistor includes a resistance layer disposed on the surface of a columnar substrate and the resistive layer includes a resistance determining area, a first resistance adjustment area, and a second resistance adjustment area. The resistance determining area is configured to form a first laser-trimming line and achieve a first resistance value by a first laser-trimming. The first resistance adjustment area is configured to form a second laser-trimming line and achieve a second resistance value by a second laser-trimming. The resistance value is precisely adjusted by two laser-trimming processes of the resistive layer, thereby improving the stability of product manufacturing.

In one embodiment, a method includes forming a temperature measurement assembly including a plurality of thermally coupled layers of a first thermally conductive material, where an inner layer of the plurality of thermally coupled layers includes one or more voids defined therein, where each void receives a thermistor secured in the void using a second thermally conductive material, a second thermally conductive material thermally couples the thermistor to the inner layer. The method further includes positioning a temperature measurement assembly on and in thermal communication with the surface of the device, and measuring a temperature of the surface of the device using the thermistor.

The utility model belongs to the field of resistor bending technology especially a resistor bending structure, include: base plate, the top of base plate places straight strip type resistor, recess, be located on the base plate, two fixed rods, fixedly install in the two sides inner wall of recess, sliding seat, slidingly install on two fixed rods, electric push rod, fixedly install on the top of sliding seat, limit block, slidingly install on the top of sliding seat, the output shaft of electric push rod and the side contact of limit block, electric push rod is used for adjusting the position of limit block, and limit block is used for limiting the one end of straight strip type resistor, bending assembly, be located on the base plate, be used for bending straight strip type resistor. The utility model through limit block is limited to the end of straight strip type resistor, makes every time bending position fixed, avoids appearing deviation, can adjust the position of limit block through electric push rod, adapts to different bending demand.

A fixture is provided that can easily and appropriately accommodate a workpiece in a sheet receiving section. The workpiece to be processed and stored in the sheet receiving section (8) is defined as a cuboid with length L1, width W1, and thickness T1 (L1>W1≥T1). When an imaginary cuboid with length L2, width W2, and thickness T2 (W2≥T2) is inserted into the sheet receiving section (8), the cuboid that can abut against the bottom and whose width W2×thickness T2 is the largest is defined as the maximum cross-sectional cuboid (MR). The end face of the maximum cross-sectional cuboid (MR) that abuts against the bottom of the sheet receiving section (8) is defined as the maximum imaginary bottom face (MS) of the sheet receiving section (8). The maximum imaginary bottom face (MS) has a long side d1 and a short side d2, where d1 can be equal to d2. The maximum depth of the sheet receiving section (8) is defined as Zmax, and the minimum depth is defined as Zmin. At this time, all the multiple chip storage units (8) that satisfy equations (1) and (2) satisfy equations (3) to (7), W1 < d1…(1)T1 < d2…(2)d1 < 2W1…(3)d2 < 2T1…(4)1 / 2×L1 < Zmin…(5)Zmax < 3 / 2×L1…(6)d1 < L1…(7).

Disclosed in the present invention are a laser cutting and oxidation prevention processing method for an inner-layer resistor to improve resistance precision. The method comprises: determining parameters of laser cutting on the basis of the material, dimensions and required resistance change of a resistor, and making preparations before laser cutting of the resistor; accurately positioning the prepared resistor on a laser cutting workstation, and selecting a suitable cutting method to cut the resistor on the laser cutting workstation; and a laser cutting machine cutting the resistor on the basis of the preset parameters, and testing the surface of the cut resistor. By trimming the edges of the resistor that has been etched twice, the width direction precision of the resistor can reach + / -5 μm, thereby improving the resistance tolerance from + / -10 % to + / -2 %. Resistor laser cutting is used to dimensionally trim a completed resistor, and the resistor with uneven edges is trimmed by a CO2 laser optical path, such that the resistor dimensions become uniform and the dimensions are closer to the theoretical width. After etching and laser trimming of the resistor are completed, resin is coated on the resistor to achieve protection of a resistor layer.

A high-temperature resistant resistor is provided and includes a substrate layer, a first surface electrode layer, and a second surface electrode layer. The first surface electrode layer is disposed on a first surface of the substrate layer, the resistance layer partially attaches the first electrode layer and the substrate layer, the second surface electrode layer is aligned with the first surface electrode layer, and attached on the first surface electrode layer and the resistance layer, so that the resistance layer is fixed between the first electrode layer and the second electrode layer. The first surface electrode layer, the resistance layer and the second surface electrode layer form a composite structure to suppress the change in resistance value of the high-temperature resistant resistor at high temperatures.

A surface-adhesive overcurrent protection element includes at least one PTC material layer, a first conductive layer, a second conductive layer, a first electrode, a second electrode, at least one insulating layer, and a capping layer. The PTC material layer comprises a crystalline polymer and conductive fillers dispersed within the crystalline polymer. The first and second conductive layers are respectively disposed on the first and second surfaces of the PTC material layer. The first and second electrodes are electrically connected to the first and second conductive layers, respectively. An insulating layer is disposed between the first and second electrodes for electrical isolation. The capping layer comprises a fluorinated polymer material and covers the entire outer surface of the surface-adhesive overcurrent protection element.

The application discloses a carbon composite ceramic linear resistor and relates to the technical field of carbon ceramic resistors; the carbon composite ceramic linear resistor comprises a ceramic base body and a conductive phase dispersed in the ceramic base body, and the conductive phase is composed of flaky graphite and carbon black; the flaky graphite and the carbon black are adopted as the conductive phase of the carbon ceramic resistor, the carbon black has fine particles and can be filled into the gaps of the ceramic aggregate, the carbon black particles not only compensate for the anisotropy of the flaky graphite, but also have a larger specific surface area compared with the graphite, which is beneficial to forming more conductive paths, so that the resistivity of the carbon ceramic linear resistor is effectively reduced, the resistivity of the carbon ceramic linear resistor can be regulated by designing the proportion of the conductive carbon material, and the energy tolerance level of the carbon ceramic resistor is significantly improved.

The present disclosure provides a preparation method of a tantalum nitride film, and belongs to the technical field of semiconductors. The preparation method comprises the following steps: providing a primary etching solution, the primary etching solution being used for dissolving an oxide; immersing a tantalum nitride sample in the primary etching solution; providing a secondary etching solution, the secondary etching solution being a mixed solution of ammonia, hydrogen peroxide and pure water; and immersing the tantalum nitride sample in the secondary etching solution to obtain a tantalum nitride film by etching. The present disclosure can effectively control the etching rate of the tantalum nitride film and improve the etching uniformity of the tantalum nitride film.