1988 results about "Surface mounting" patented technology

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

The invention relates to the technical field of image data processing, and discloses an element mounting quality detection method for a chip mounter, which comprises the following steps of: synchronously acquiring images before and after element mounting and a vacuum pressure signal of a mounting suction nozzle, compensating vibration by utilizing an inherent substrate background area in the images, obtaining an optical position deviation through image difference and mass center calculation, and calculating the surface mounting quality of the element according to the optical position deviation. And finally, logically associating the deviation with the change characteristic of the pressure signal, and classifying the physical process of the mounting event. According to the invention, through the collaborative diagnosis of optical detection and physical signals, the physical reason of the mounting event can be clearly distinguished; the inherent limitation caused by vibration interference and unclear fault attribution during high-speed operation of a traditional detection mode is avoided, and the method has good adaptability to incoming material elements with different appearances.

The invention discloses a positioning calibration method of surface mounting equipment, equipment, a medium and a product, and relates to the technical field of printed circuit boards, a first position of a bonding pad on a circuit board and a second position of an element pin of an element to be mounted are obtained through recognition by using an image recognition model, the confidence coefficient is recorded, and when matching calculation is carried out, the positioning calibration accuracy is improved. And carrying out position transformation calculation on the positions of the bonding pad and the element pin matched in the current iteration, calculating a transformed position error in combination with the confidence coefficient, and outputting a final matching result of the bonding pad and the element pin and a corresponding final space mapping parameter after a first iterative calculation condition is met. According to the method, the influence of a low-confidence-coefficient position detection result on space mapping parameter calculation is effectively reduced, the stability and reliability of the final space mapping parameter are ensured, compared with traditional position error calculation, the method has higher anti-interference capability, and the accuracy of positioning matching of high surface mounting equipment is improved.

The invention discloses a surface-mounted element welding defect detection method based on transfer learning and SimAM-SASPPF-YOLOv8, and belongs to the technical field of industrial automation and computer vision. The problems that in the prior art, a traditional surface-mounted element welding defect detection method cannot process complex defects, and the number of defect samples is small, so that the generalization ability is limited, and the algorithm detection precision is low are solved. The method comprises the following steps: establishing a PCBA defect detection data set and a PCBA element detection data set; a SimAM-SASPPF-YOLOv8 network structure is established, and transfer learning pre-training based on element detection is carried out; introducing a maximum mean value difference loss function to carry out defect detection transfer learning training on the PCBA defect detection data set; and performing defect detection and identification on the PCBA defect detection data set through the trained network model. The method improves the detection precision and the detection speed, and can be applied to surface-mounted element welding defect detection.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The utility model relates to the technical field of electronic component surface mounting, in particular to an electronic component surface mounting device. The chip mounter comprises a machine body, an air cylinder is fixedly connected to the upper surface of the machine body, a chip mounting head is fixedly connected to the output end of the air cylinder, a supporting table is arranged below the chip mounting head, the lower surface of the supporting table is fixedly connected with the machine body, a fixing device is arranged on the upper surface of the machine body, and the fixing device comprises four positioning blocks. The lower surfaces of the four positioning blocks are fixedly connected with the machine body, the four positioning blocks are evenly distributed on the upper surface of the machine body, one end of the machine body is fixedly connected with a supporting plate, a driving motor is arranged on the upper surface of the supporting plate, the output end of the driving motor is fixedly connected with a screw rod, the screw rod penetrates through the two positioning blocks in a threaded mode, and the two positioning blocks are fixedly connected with the machine body. The arc surface of the screw rod is provided with a bidirectional thread, and the arc surface of the screw rod is in threaded connection with two adjusting plates. The problem that manual fixing efficiency is low is solved.

The invention discloses a folding rudder unfolding time testing system and method based on computer vision. The folding rudder unfolding time testing system comprises a workbench, a rudder surface mounting assembly, a limiting assembly, a camera support assembly and a data collecting and processing module. The data acquisition and processing module comprises a computer and a high-speed camera; the control surface mounting assembly and the limiting assembly are arranged on the workbench, the camera support assembly is arranged on one side of the workbench, and the high-speed camera is mounted on the camera support assembly and is in communication connection with the computer. According to the method, after the test is finished, an image sequence collected in the unfolding process of the folded rudder to be tested can be automatically stored, the motion angle of the movable rudder surface in each image is calculated, the unfolding time is calculated, and a time-motion angle chart is drawn.

The invention discloses a surface mounting detection system in semiconductor packaging, which relates to the field of automatic detection, and comprises a data acquisition module, a preprocessing module, a data processing module, a display module, a display module, a display module, a display module, a display module and a display module, and is characterized in that the data acquisition module acquires temperature information, a morphology image and a reflected light image of the surface of the semiconductor packaging in real time and simultaneously collects historical data of the semiconductor packaging; the system comprises a data preprocessing module for preprocessing collected temperature information, morphology images and reflected light images, a data fusion module for fusing the preprocessed information and images to form a multi-modal feature vector, a three-dimensional reconstruction module for generating a three-dimensional image of semiconductor packaging through a three-dimensional reconstruction algorithm and a multi-modal data set, a defect identification module for identifying defects of the semiconductor packaging, and a detection module for detecting the defects of the semiconductor packaging. And establishing a defect identification model based on the multi-modal feature vector, and outputting a defect identification result. Through CNN multi-scale analysis, defects under different scales can be captured, the weight of each mode is dynamically adjusted through a self-attention mechanism, it is ensured that a detection strategy can be flexibly adjusted according to the actual situation, and the accuracy and flexibility of defect recognition are improved.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The invention discloses a modular sip transceiver assembly based on HTCC, and belongs to the technical field of satellite communication. The modular transceiver assembly mainly comprises two radio frequency front end sip modules, two secondary frequency conversion sip modules, two local oscillator carrier plate sip modules, a power supply and an FPGA control module. The whole assembly mainly comprises five radio frequency systems and four receiving channels which are completely the same and are almost consistent with the other transmitting channel in structure, modular design is adopted, a mature microwave substrate processing technology is combined with an existing micro-assembly process, and through an HTCC ceramic tube shell and a sip technology, surface mounting application of a microwave 3D module is achieved, and meanwhile light-weight and small-size design is achieved. According to the three-dimensional stacked packaging, various passive devices can be subjected to interlayer integration, the assembly integration level is greatly improved, an expected complete machine system can be verified more quickly and flexibly, especially for a multi-path system, only a single module needs to be used for testing in the earlier stage, and the three-dimensional stacked packaging module is suitable for various communication occasions.

A protective lens stack comprises a base layer including a polyethylene terephthalate (PET) film containing a UV blocking additive and one or more removable lens layers stacked on top of the base layer. Each of the removable lens layers may include a PET film and a first adhesive disposed on a bottom surface of the PET film. Refractive indices of the base layer and the one or more removable lens layers may be matched to within 0.2. Each layer of the protective lens stack, including the base layer and each of the removable lens layer(s), may have less than 0.5% haze. The protective lens stack may be used as a face shield or may be surface mountable using a second adhesive disposed on a bottom surface of the PET film containing the UV blocking additive.

The invention relates to the technical field of die bonding, in particular to a mounting assembly and die bonding equipment. The mounting assembly comprises a first fixing seat, a first fixing plate and a second fixing plate are arranged on the first fixing seat at intervals, a first driving part is mounted on the first fixing plate, a second driving part is mounted on the second fixing plate, a load mechanism is mounted on the first driving part, and a mounting mechanism is mounted on the second driving part; and the loading mechanism and the mounting mechanism are driven by the first driving piece and the second driving piece to move towards each other or move away from each other. The vibration generated in the moving process of the mounting mechanism is counteracted through the reverse movement of the load mechanism, so that the mounting precision is improved.

A molded surface mount package includes: a power semiconductor die attached to a metallic pad with a first side facing the pad and a second (opposite) side facing away from the pad, the metallic pad forming a first power terminal exposed at a surface mounting side of the package; a second power terminal, a first sense terminal, and a gate terminal each exposed at the surface mounting side and spaced apart from the first power terminal; a first electrical connection between the second power terminal and a first power pad at the second side of the die; a second electrical connection between the gate terminal and a gate pad at the second side of the die; a third electrical connection between the first sense terminal and a first sense pad at the second side of the die; and a first redundant electrical connection for the second or third electrical connection.

A power amplifier device includes a substrate, a power transistor die, and one or more surface mount components. The substrate has substrate die contacts exposed at a first substrate surface, and additional substrate contacts exposed at a second substrate surface. The power transistor die includes an integrated transistor. The transistor includes a control terminal and a first current conducting terminal coupled, respectively, to first and second die contacts at the first die surface, and a second current conducting terminal coupled to a third die contact at a second die surface. The surface-mount components are connected to the additional substrate components, and the surface-mount components are electrically coupled through the substrate to the first and second die contacts. The power amplifier device also includes an encapsulation material layer covering the surface-mount components and the second substrate surface.

The invention provides a test method and device for surface mounting production, equipment and a storage medium. The method comprises the steps of collecting image information and an electric signal after surface mounting of a printed circuit board; pre-processing the image information to generate a pre-processed image; performing ellipse fitting on the preprocessed image to determine geometric features of the bonding pad; performing cross-modal feature fusion on the electrical signal feature vectors corresponding to the electrical signals and the geometric features to construct a multi-dimensional defect description matrix; inputting the multi-dimensional defect description matrix into a neural network model, and outputting a defect type classification label and a corresponding confidence score; and generating a dynamic test path planning scheme through an optimization algorithm according to the defect type classification label and the confidence score. By extracting the geometric features of the bonding pad, constructing the defect description matrix fusing the electric signals and the geometric information, and performing defect identification through the neural network, deep collaboration and information complementation between modals are realized, and the identification capability of complex defects is effectively improved.

Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and / or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small footprint that is designed to be surface mounted.

The invention relates to the technical field of sensors, and provides a six-dimensional force sensor which comprises a shell, the top of the shell is fixedly connected with a force contact plate, the bottom of the shell is fixedly connected with a bottom plate, an elastic body assembly is arranged on the inner side of the shell, and the elastic body assembly comprises a stress block concentrically arranged on the inner side of the shell. The outer side of the stress block is fixedly connected with a plurality of strain beams, the strain beams are distributed around the stress block at equal angles, the ends, away from the stress block, of the strain beams are fixedly connected with the inner wall of the shell, and the upper face and the lower face of each strain beam are fixedly connected with a pair of first parallel strain gauges and a pair of splayed strain gauges. The strain gauges are only arranged on the upper surface and the lower surface of the strain beam, so that manual operation in a narrow space is avoided, full-automatic surface mounting is realized, the time consumed for surface mounting of a single sensor is greatly shortened, the qualified rate of finished products is increased, and the reworking cost is reduced.

The invention relates to the technical field of laser processing, in particular to surface-mounted inductor multi-surface vision laser paint stripping equipment which comprises a rectangular base, a Y-axis sliding table and a base are fixedly connected to the outer surface of the upper end of the rectangular base, and an X-axis sliding table is movably connected to the outer surface of the upper end of the Y-axis sliding table; a camera frame is fixedly connected to the outer surface of the right side of the X-axis sliding table, and a CCD camera assembly is arranged on the outer surface of the right side of the camera frame. According to the invention, through the innovatively designed protective shell structure and linkage mechanism, the technical problem that the optical element of the traditional laser paint stripping equipment is exposed and polluted is fundamentally solved, specifically, a lifting protection scheme driven by an electric telescopic rod is initiated for the first time; the protective shell moves upwards under the action of the electric telescopic rod and forms a closed space with the rectangular base plate, sealing fit is achieved through the second rubber pad, and workshop dust, oil mist and condensate water erosion is isolated.

The utility model discloses an electronic component surface mounting device, and relates to the technical field of electronic component surface mounting. The electronic element surface mounting device comprises a workbench, a portal frame and an operation box are arranged at the top of the workbench, a manipulator is arranged in the portal frame, the operation box comprises a box body, the box body is slidably connected to the top of the workbench, ventilation openings are formed in the two sides of the box body, and the ventilation openings are communicated with the portal frame. A lifting device is arranged on the outer wall of the front portion of the box body and comprises a fixing plate, according to the electronic element surface mounting device, a baffle and a round rod drive a rubber plate to move downwards by pressing a push plate, and when pressing is released, a spring located between the push plate and the top of a U-shaped clamping plate rebounds, so that the rubber plate moves upwards; a circuit board placed in the device is clamped up and down, and the circuit board is clamped left and right through operation of a bidirectional screw and left and right first sliding blocks, so that free and rapid clamping is realized when an electronic element is subjected to surface mounting, and time is saved.

A method of making a Surface Mount Device (SMD) light-emitting diode (LED) plug-in light string is disclosed. The method includes: connecting positive and negative poles of an SMD to a first and a second metal conductors, respectively; encapsulating at least a top portion of the SMD with a colloid; connecting the first and second metal conductors to first and second wires, respectively; inserting a rear plug in a space between the first and second wires to form a partially-finished assembly; and waterproofing the partially-finished assembly.

A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability.

The invention relates to the technical field of inertial units, and discloses a surface-mounted inertial measurement unit IMU module and a preparation method, the surface-mounted inertial measurement unit IMU module comprises a substrate, the substrate is provided with at least one IMU chip and a control chip, the bottom of the substrate is provided with an external bonding pad used for surface mounting, the IMU module is mounted in front of an external mainboard after packaging is completed, and the IMU chip is connected with the control chip. The calibration of inertial parameters is completed, and the calibration parameters are stored in an internal storage unit of the control chip; the substrate is a ceramic substrate, a sealing box dam is arranged on the periphery of the substrate, the top of the sealing box dam is fixedly connected with an upper cover, and an airtight or nearly airtight packaging structure is formed. According to the compact surface-mounted inertial measurement unit IMU module and the preparation method thereof, the compact surface-mounted inertial measurement unit IMU module has the advantages of capability of avoiding welding stress influence, stable performance, low cost, small size, easiness in automatic production and the like, and the problems of poor performance stability, high cost, high production complexity and huge size of an IMU module in the prior art are solved.

The invention discloses an AOI back inspection reflection inhibition method based on black flannelette pasting, and relates to the technical field of AOI detection, and the method comprises the steps: placing a to-be-detected silicon wafer on a silver gray aluminum material carrying platform; starting the AOI equipment to collect a background image; black flannelette is selected as a reflection inhibition material; black flannelette is attached to the center detection area of the silver gray aluminum material carrying table, and the light source perpendicular incidence area is of a double-layer structure formed by combining a bottom-layer reflective sticker and surface-layer black flannelette. After surface mounting is completed, the background image is collected again; and performing defect identification on the acquired background image, and outputting a detection report. According to the invention, through the physical light absorption characteristic of the black flannelette, the average gray value of the reflection area of the carrying platform is reduced, the high-intensity mirror reflection interference is effectively eliminated, the difference between the background gray level and the edge gray level of the silicon wafer after mounting is obvious, image analysis software can realize accurate edge searching by setting the minimum identification gray level threshold, and meanwhile, the edge searching precision is improved. The black flannelette can improve the background gray scale stability and reduce the interference of gray scale fluctuation on a threshold segmentation algorithm.

The utility model provides a surface-mounted PIR sensor. The surface-mounted PIR sensor comprises a PCB substrate, a signal conditioning chip, a supporting structure, a sensitive component, a PCB cover plate and an optical filter, the signal conditioning chip is arranged on the first surface of the PCB substrate and is used for leading out a signal to the second surface of the PCB substrate through a circuit arranged on the PCB substrate; the supporting structure surrounds the signal conditioning chip and is arranged on the first surface of the PCB substrate; the sensitive component is arranged above the signal conditioning chip through the supporting structure, and the sensitive component is electrically connected with the signal conditioning chip; the PCB cover plate surrounds the signal conditioning chip, the supporting structure and the sensitive component and is arranged on the substrate edge of the first surface of the PCB substrate; the optical filter is arranged on the PCB cover plate, and a closed space is defined by the optical filter, the PCB cover plate and the PCB substrate, so that the production cost of the patch type PIR sensor is reduced, and the electromagnetic shielding effect is improved.

The invention discloses an automatic chip mounting line for modules, which comprises a chip mounting unit I, a chip mounting unit II, a chip mounting unit III, a chip mounting unit IV and a welding module, and is characterized in that all processing units are provided with main transmission systems and backflow conveying systems for conveying welding trays; a backflow lifting system used for carrying the welding trays between the main conveying system and the backflow conveying system is further installed at the first patch unit and the second patch unit at the end of the production line, and the first patch unit, the second patch unit, the third patch unit and the fourth patch unit are each provided with a corresponding feeding machine head and a corresponding feeding mechanism. According to the invention, the welding tray is arranged on the base plate, so that chip mounting is carried out in the conveying process of the welding tray, welding is carried out through the welding module after chip mounting is completed, the base plate is identified in the initial processing stage, different feeding processing procedures can be selected conveniently, the device is suitable for production of semiconductor devices of different types, and the production convenience and the production efficiency are improved.

The invention discloses a reflow soldering curve measuring method. The method comprises the steps that S1, a temperature measuring plate is manufactured; the temperature measuring plate comprises an aluminum substrate, a device is fixedly arranged above the aluminum substrate by smearing silver adhesive, a thermocouple is arranged on the device, the front end of the thermocouple is fixedly arranged on a device body through conductive adhesive, and a wire body on the thermocouple is fixed through high-temperature-resistant adhesive tape. One end, far away from the thermocouple, of the wire body is connected to a furnace temperature measuring instrument, and the surface temperature of the device is detected and recorded in the measuring process; s2, measuring a curve; and S3, data management. The invention belongs to the field of reflow soldering curve measuring methods, and particularly relates to a reflow soldering curve measuring method. According to the method, by designing and combining existing test methods, furnace temperature curves of reflow corresponding to devices of different packaging types are innovated on the basis of IPC-JEDEC J-STD-020F-2022 Moisture Reflow Sensitivity for Non-Hermetic Surface Mount Devices (SMDs), and the accuracy rate of selecting the reflow curve during a pretreatment test is improved.

The invention provides a dual-chip die-bonding chip mounter, and relates to the technical field of semiconductor packaging, and the dual-chip die-bonding chip mounter comprises a chip mounter main body, a lead frame feeding mechanism is hung on the left side of the chip mounter main body, and a lead frame receiving mechanism is hung on the right side of the chip mounter main body; the lead frame conveying mechanism is installed in a working area inside the chip mounter main body, the left end of the lead frame conveying mechanism is attached to a discharging port of the lead frame feeding mechanism, and the right end of the lead frame conveying mechanism is attached to a feeding port of the lead frame receiving mechanism; the whole process is automatically circulated from empty frame feeding, conveying to finished product receiving, manual frequent intervention and turnover are not needed, the labor intensity is reduced, the automation level and operation continuity of a production line are improved, and the problems that manual intervention or cooperative operation of multiple sets of manipulators is often needed, the automation degree is limited, high integration of feeding and discharging mechanisms cannot be achieved, and the production efficiency is high are solved. The overall coordination of the equipment is insufficient; and the time consumption of the die bonding and surface mounting process is long.

The invention discloses a bridging defect visual detection method for a solder paste detection instrument, a storage medium and equipment, and belongs to the technical field of surface mounting defect detection. In order to solve the problems that an existing bridging defect visual detection algorithm in a solder paste detection instrument is high in complexity and the detection accuracy needs to be improved, a solder paste area binary image is obtained based on a binary image and a solder paste area binary image, and then a solder paste printing area in the solder paste detection area binary image is removed; obtaining a binary image of the solder paste overflowing the solder paste printing area; taking a pixel of a solder paste printing area in the solder paste detection area image as a target, taking other pixels as a background, and adopting a chessboard distance to measure the length of the solder paste overflowing from the solder paste printing area; obtaining the distance between each pixel in the overflowing solder paste and the solder paste printing area through the binary image and the distance transformation image of the solder paste overflowing from the solder paste printing area, searching the maximum value and the minimum value, taking the difference between the maximum value and the minimum value as the distance of the solder paste overflowing from the solder paste printing area, and judging that the bridging defect exists if the difference exceeds a length threshold value.

The invention relates to the field of circuit board processing automation equipment, and discloses a circuit board chip mounter and a dispensing mechanism, the circuit board chip mounter comprises a support, the top of the support is provided with a positioner, the exterior of the positioner is provided with a material taking device through screws, the material taking device comprises a mounting table and a positioning plate, and the top of the mounting table is provided with a pneumatic pump; a conveying pipe connected with the output end of the pneumatic pump is arranged in the mounting table, the bottom end of the conveying pipe is fixedly connected with a main flow divider, the output end of the main flow divider is fixedly connected with four secondary flow dividers, the output ends of the secondary flow dividers are fixedly connected with four material taking heads, and the multiple material taking heads are mounted in the positioning plate; the material taking head comprises a fixed box fixedly mounted at the top of the positioning plate and a movable shell slidably connected into the positioning plate. According to the device and the method, the glue is synchronously blow-dried while the surface mounting operation is completed, an additional drying station is not needed, and the influence of vibration and temperature and humidity environment changes on the surface mounting stability of the component in the conveying process is avoided.