3116 results about "Surface mounting" patented technology

The invention discloses a mounting device for a surface-mounted rotating mirror in a vehicle-mounted laser radar. Comprising a working platform, a framework positioning module, at least one reflector adsorption module and an angle detection module, wherein the framework positioning module is arranged on the working platform and is used for fixing a rotating mirror framework; the reflector adsorption module is used for adsorbing a reflector and attaching the adsorbed reflector to the rotating mirror framework; the angle detection module is used for detecting the angle of the reflector; the reflector adsorption module is arranged around the framework positioning module, and the angle detection module is matched with the reflector adsorption module. And the controller generates a corresponding angle adjustment signal according to detection data of the angle detection module and controls the reflector angle adjustment mechanism to adjust the angle of the adsorbed reflector. The reflector surface mounting device has the advantage that the surface mounting precision and the surface mounting efficiency of the reflector can be improved.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

A device includes a package body including a central flange and an amplifier module mounted to the central flange of the surface-mount device. The amplifier module includes a module substrate mounted to the central flange. The module substrate includes a first die mount window, a first circuitry on a first surface of the module substrate, a second circuitry on the first surface of the module substrate, and a first amplifier die mounted on the central flange. The first amplifier die is at least partially disposed within the first die mount window and the first amplifier die is electrically connected to the first circuitry and the second circuitry. The first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.

The invention relates to the technical field of deep learning, and discloses an abnormal prompt learning-based industrial defect detection method and a storage medium, the abnormal prompt learning-based industrial defect detection method comprises the following steps: using a CLIP network to extract global features and local features of a normal PCB sample; designing a plurality of abnormal prompts about surface mounting defects on the basis of a PCB normal sample by using semantic connection; performing prompt learning by using the explicit anomaly boundary to obtain sufficient defect anomaly prompts; and performing surface mounting defect anomaly detection according to the defect anomaly prompt. According to the semantic connection provided by the invention, the prompt of the normal sample of the PCB is converted into the defect abnormity prompt which is difficult to obtain in industry, the abnormal boundary is displayed to obtain the accurate defect abnormity prompt, and the distance between the defect abnormity prompt feature and the normal sample prompt and the distance between the defect abnormity prompt feature and the normal visual feature are increased; therefore, anomaly detection under the condition that an abnormal sample image cannot be provided can be realized.

The invention relates to a cooling structure for an ultraprecise linear motor and belongs to the technical field of linear motors. The cooling structure solves the problem of proneness to heat exchange with environment caused by high side temperature of two-side surface-mounted cooling structures of existing linear motors. The cooling structure comprises a winding supporting portion, a winding and a heat conductive portion, wherein the winding is fixed on the surface of the winding supporting portion, the heat conductive portion is arranged on the surface on the outer side and fixedly connected with the winding supporting portion, the heat conductive portion is a copper foil ring which fits the outer profile of the winding and is sleeved and fixed on the surface on the outer side of the winding, or the heat conductive portion is a copper foil heat conductive ring formed by arraying multiple copper foil sections in a dispersed manner, the copper coil heat conductive ring fits the outer profile of the winding, and each copper coil section is fixed on the surface on the outer side of the winding. The cooling structure for the ultraprecise linear motor is suitable for cooling of linear motors.

The invention relates to the technical field of semiconductor devices, in particular to a highly-integrated 2.5 D packaging structure and method, and the structure comprises a supporting frame structure, a carrier plate, and an auxiliary structure. A chip is arranged on the front surface of the carrier plate, and a bonding wire is arranged between the chip and the carrier plate; a component is arranged on the back surface of the carrier plate, the carrier plate is arranged in an inner cavity of the supporting frame structure, a solder ball is arranged at the bottom end of the supporting frame structure, and an auxiliary structure is arranged in the supporting frame structure; surface mounting is mainly carried out on the back surface of the carrier plate, so that functional devices can be concentrated on one carrier plate to work, the space utilization rate is improved, and more components are added; and moreover, the auxiliary structure has an auxiliary heat dissipation effect on the packaging structure, and convenience is provided for the installation work of the packaging structure through the connecting assembly arranged in the auxiliary structure.

A motor rotor assembly machine comprises a base station, a rotating table is arranged on the base station, the rotating table is composed of a rotating disc and a fixed disc which are coaxially fixed, the fixed disc is fixedly arranged relative to the base station, and the rotating disc is driven by a rotating motor. Positioning tools which are used for placing a rotor and flow among a plurality of processing stations are annularly distributed on the rotating disc; the multiple processing stations are sequentially a feeding station, a marking station, a dispensing station, a chip mounting station, a shaping station, a curing station, a discharging station and a cleaning station in the rotating direction of the rotating table, and a feeding mechanism, a marking mechanism, a dispensing mechanism, a chip mounting mechanism, a shaping mechanism, a curing mechanism, a discharging mechanism and a cleaning mechanism are arranged in the corresponding stations. Compared with the prior art, the marking and surface mounting processes can be fully automatically carried out, the automation degree is high, and the production efficiency is high. And an eight-station design is adopted, and a standard reaching process is subdivided into four processes of dispensing, surface mounting, shaping and curing, so that the assembly quality of the surface mounting is ensured.

The invention relates to the technical field of image data processing, and discloses an element mounting quality detection method for a chip mounter, which comprises the following steps of: synchronously acquiring images before and after element mounting and a vacuum pressure signal of a mounting suction nozzle, compensating vibration by utilizing an inherent substrate background area in the images, obtaining an optical position deviation through image difference and mass center calculation, and calculating the surface mounting quality of the element according to the optical position deviation. And finally, logically associating the deviation with the change characteristic of the pressure signal, and classifying the physical process of the mounting event. According to the invention, through the collaborative diagnosis of optical detection and physical signals, the physical reason of the mounting event can be clearly distinguished; the inherent limitation caused by vibration interference and unclear fault attribution during high-speed operation of a traditional detection mode is avoided, and the method has good adaptability to incoming material elements with different appearances.

An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a central section, and at least two vertically stacked functional volume sections in the central section, wherein a pitch at an integrated circuit component mounting side of the integrated circuit substrate is not more than 150 μm.

The invention discloses a positioning calibration method of surface mounting equipment, equipment, a medium and a product, and relates to the technical field of printed circuit boards, a first position of a bonding pad on a circuit board and a second position of an element pin of an element to be mounted are obtained through recognition by using an image recognition model, the confidence coefficient is recorded, and when matching calculation is carried out, the positioning calibration accuracy is improved. And carrying out position transformation calculation on the positions of the bonding pad and the element pin matched in the current iteration, calculating a transformed position error in combination with the confidence coefficient, and outputting a final matching result of the bonding pad and the element pin and a corresponding final space mapping parameter after a first iterative calculation condition is met. According to the method, the influence of a low-confidence-coefficient position detection result on space mapping parameter calculation is effectively reduced, the stability and reliability of the final space mapping parameter are ensured, compared with traditional position error calculation, the method has higher anti-interference capability, and the accuracy of positioning matching of high surface mounting equipment is improved.

An LED chip feeding and assembling device is characterized by comprising a lamp strip, an LED chip, a patch carrier and a patch feeding mechanism. The lamp strip comprises a plurality of varnished wires which are arranged in parallel; the surface mounting carrier is provided with first wire slots corresponding to a plurality of parallel enamelled wires at intervals and in outline arrangement, the cross section of each first wire slot is in a V shape with an opening facing the vertical upper part, the enamelled wires pass through the surface mounting carrier through the first wire slots in the horizontal direction, a plurality of chip slots are arranged vertically below the first wire slots, and the chip slots are arranged below the chip slots. The head end and the tail end of each chip groove are close to at least two adjacent enameled wires. The patch feeding mechanism comprises a conveying track, a plurality of feeding manipulators, a sliding rack, a horizontal sliding track, a rack driving mechanism, a lifting cylinder, a plurality of suction cup mechanisms and a suction cup lifting table; and the patch loading mechanism drives the patch carrier to carry the LED chip to be soldered with the enameled wire.

The invention discloses a surface-mounted element welding defect detection method based on transfer learning and SimAM-SASPPF-YOLOv8, and belongs to the technical field of industrial automation and computer vision. The problems that in the prior art, a traditional surface-mounted element welding defect detection method cannot process complex defects, and the number of defect samples is small, so that the generalization ability is limited, and the algorithm detection precision is low are solved. The method comprises the following steps: establishing a PCBA defect detection data set and a PCBA element detection data set; a SimAM-SASPPF-YOLOv8 network structure is established, and transfer learning pre-training based on element detection is carried out; introducing a maximum mean value difference loss function to carry out defect detection transfer learning training on the PCBA defect detection data set; and performing defect detection and identification on the PCBA defect detection data set through the trained network model. The method improves the detection precision and the detection speed, and can be applied to surface-mounted element welding defect detection.

The invention discloses low-silver lead-free tin-based solder paste and a preparation method thereof, and belongs to the field of welding materials. The soldering paste is composed of 85 wt%-87.5 wt% of tin-based powder brazing filler metal and 12.5 wt%-15 wt% of scaling powder, wherein the tin-based powder brazing filler metal comprises 0.35 wt%-0.6 wt% of Ag, 0.5 wt%-0.8 wt% of Cu, 1.0 wt%-4.0 wt% of Bi, 0.05 wt%-0.08 wt% of Ni and the balance Sn; the soldering flux is composed of rosin, a solvent, an active agent, a thixotropic agent, a film-forming agent, a PH regulator, a surfactant, a phenolic antioxidant and a corrosion inhibitor. The soldering paste has excellent low residue, good wettability and welding reliability, and is especially suitable for surface mount technology (SMT) in the electronic and electric appliance industry.

The invention discloses a patch pump, and particularly relates to the technical field of medicine delivery, the patch pump comprises a double faced adhesive tape, one side of the double faced adhesive tape is fixedly connected with an upper cover, a medicine bag assembly is clamped between the upper cover and the double faced adhesive tape, one end of the medicine bag assembly is communicated with a medicine inlet valve, and the other end of the medicine inlet valve is communicated with a needle inlet assembly linked with the medicine bag assembly; liquid medicine is stored in the medicine bag assembly in a pressure mode, the needle inserting assembly adjusts the sectional area of a flow channel of the liquid medicine according to the medicine feeding pressure change of the medicine bag assembly, the medicine feeding flow of the liquid medicine passing through the needle inserting assembly is stable, the patch pump provides injection power through the elastic medicine bag, an additional power device is not needed, and the patch pump is simple and compact in structure, light in weight and convenient to use. The automatic adjusting device can adjust the sectional area of the flow channel according to the injection pressure of the elastic medicine bag, and it is ensured that the medicine injection rate is relatively stable.

A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.

The utility model relates to the technical field of electronic component surface mounting, in particular to an electronic component surface mounting device. The chip mounter comprises a machine body, an air cylinder is fixedly connected to the upper surface of the machine body, a chip mounting head is fixedly connected to the output end of the air cylinder, a supporting table is arranged below the chip mounting head, the lower surface of the supporting table is fixedly connected with the machine body, a fixing device is arranged on the upper surface of the machine body, and the fixing device comprises four positioning blocks. The lower surfaces of the four positioning blocks are fixedly connected with the machine body, the four positioning blocks are evenly distributed on the upper surface of the machine body, one end of the machine body is fixedly connected with a supporting plate, a driving motor is arranged on the upper surface of the supporting plate, the output end of the driving motor is fixedly connected with a screw rod, the screw rod penetrates through the two positioning blocks in a threaded mode, and the two positioning blocks are fixedly connected with the machine body. The arc surface of the screw rod is provided with a bidirectional thread, and the arc surface of the screw rod is in threaded connection with two adjusting plates. The problem that manual fixing efficiency is low is solved.

The invention discloses a folding rudder unfolding time testing system and method based on computer vision. The folding rudder unfolding time testing system comprises a workbench, a rudder surface mounting assembly, a limiting assembly, a camera support assembly and a data collecting and processing module. The data acquisition and processing module comprises a computer and a high-speed camera; the control surface mounting assembly and the limiting assembly are arranged on the workbench, the camera support assembly is arranged on one side of the workbench, and the high-speed camera is mounted on the camera support assembly and is in communication connection with the computer. According to the method, after the test is finished, an image sequence collected in the unfolding process of the folded rudder to be tested can be automatically stored, the motion angle of the movable rudder surface in each image is calculated, the unfolding time is calculated, and a time-motion angle chart is drawn.

The invention relates to the technical field of solder paste connecting surface detection, in particular to a solder paste connecting surface optical detection device applied to SMT surface mounting processing, which comprises a support plate and a conveying table used for conveying a PCB, the front side of the support plate is provided with a recess compensation detection mechanism and a position adjusting shooting mechanism, the recess compensation detection mechanism comprises a rectangular plate, and the rectangular plate is provided with a position adjusting shooting mechanism. A plurality of rectangular boxes with the bottoms open are fixedly connected to the right side of the rectangular plate, rectangular bases are slidably connected to the inner sides of the rectangular boxes, and circular blocks are fixedly connected to the bottoms of the rectangular bases. The device can effectively detect the thickness of the solder paste, can compensate and eliminate a recess formed at a probe entering position, improves the accuracy of detection through the probe, can sequence the infiltrated probes, avoids shielding and other conditions during observation, enables the plurality of infiltrated probes to be located at effective observation positions of a camera, and improves the detection accuracy. And the accuracy of solder paste detection is further improved.

The invention discloses a human-computer interaction method and device of SMT detection equipment, equipment and a medium, and relates to the technical field of surface mounting, and the method comprises the steps that a voice control panel establishes physical connection with a host based on a communication interface; triggering a conversion chip in the voice control panel to convert a USB communication mode into a UART communication mode based on the physical connection; based on the UART communication mode, a received voice instruction is compiled through a UART serial port communication protocol, a data frame used for representing the voice instruction is obtained and sent to SMT detection equipment, and the data frame is used for controlling the SMT detection equipment to execute corresponding operation. The method can be applied to the SMT PCBA manufacturing industry of electronic manufacturing.

A semiconductor package includes a multilayer package substrate with a top layer including top filled vias through a top dielectric layer and top metal layer providing a top surface for leads and traces connected to the leads, and a bottom layer including bottom filled vias including contact pads through a bottom dielectric and metal layer. The top filled vias are for connecting the bottom and top metal layer. The bottom metal filled vias are for connecting the bottom metal layer to the contact pads. An integrated circuit (IC) die has nodes in its circuitry connected to the bond pads. The IC die is flipchip mounted onto the leads. A passive device(s) is surface mounted by an electrically conductive material on the top metal layer electrically connected between at least one adjacent pair of the leads. A mold compound is for encapsulating at least the IC die and passive device.

The invention discloses a surface mounting detection system in semiconductor packaging, which relates to the field of automatic detection, and comprises a data acquisition module, a preprocessing module, a data processing module, a display module, a display module, a display module, a display module, a display module and a display module, and is characterized in that the data acquisition module acquires temperature information, a morphology image and a reflected light image of the surface of the semiconductor packaging in real time and simultaneously collects historical data of the semiconductor packaging; the system comprises a data preprocessing module for preprocessing collected temperature information, morphology images and reflected light images, a data fusion module for fusing the preprocessed information and images to form a multi-modal feature vector, a three-dimensional reconstruction module for generating a three-dimensional image of semiconductor packaging through a three-dimensional reconstruction algorithm and a multi-modal data set, a defect identification module for identifying defects of the semiconductor packaging, and a detection module for detecting the defects of the semiconductor packaging. And establishing a defect identification model based on the multi-modal feature vector, and outputting a defect identification result. Through CNN multi-scale analysis, defects under different scales can be captured, the weight of each mode is dynamically adjusted through a self-attention mechanism, it is ensured that a detection strategy can be flexibly adjusted according to the actual situation, and the accuracy and flexibility of defect recognition are improved.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The invention is applicable to the technical field of semiconductor devices, and provides a surface-mounted IMU (inertial measurement unit) and a preparation method thereof, and the surface-mounted IMU comprises a PCBA (printed circuit board assembly), a ceramic adapter plate, an MEMS (micro-electromechanical system) inertial chip and a Teflon cover plate; a groove is formed in the ceramic adapter plate; the size of the groove is suitable for the MEMS inertial chip; the bottom bonding pad of the ceramic adapter plate is connected with the top bonding pad of the ceramic adapter plate through a half hole; the MEMS inertial chip is arranged in the groove and is bonded with the ceramic adapter plate through an insulating gold wire; the ceramic adapter plate is welded on the assembly surface of the PCBA; the Teflon cover plate and the PCBA form a cavity, and the ceramic adapter plate and the MEMS inertial chip are placed in the cavity. The requirements of small size, high precision and low power consumption can be met at the same time, the burden of a vehicle-mounted power supply is relieved, and the requirement for the integration level of the whole vehicle is improved.

The utility model discloses an LED bulk material chip mounter which comprises a chip mounting device and a bulk material supply device arranged on one side of the chip mounting device. The bulk material supply equipment comprises two transfer mechanisms, a feeding flat vibration mechanism arranged between the two transfer mechanisms and the chip mounting equipment, and two vibration disc mechanisms arranged on the two opposite sides of the two transfer mechanisms respectively; the vibration disc mechanism is used for feeding materials one by one and recognizing the directions of the materials. Each transferring mechanism is used for transferring the materials to the feeding flat vibration mechanism from one vibration disc mechanism, and the transferring mechanisms are used for adjusting and positioning the materials according to the recognized material direction; the feeding flat vibration mechanism is used for transferring materials from one end of the transferring mechanism to one end of the chip mounting equipment; and the surface mounting equipment is used for taking the material from the feeding flat vibration mechanism, correcting, adjusting and positioning the material and mounting the material on the substrate. According to the utility model, the condition of waiting time when the chip mounting equipment takes materials is avoided, so that the productivity is greatly improved; in addition, the angle of the material can be adjusted and positioned twice, and the problems of yin and yang surfaces and blurred display screens after the LED lamp beads are pasted are solved.

The invention relates to an FPCA (Flexible Principal Component Analysis) product dispensing method and an FPCA product. The method comprises the following steps: assembling a flexible circuit board and an assembly element by adopting a surface mounting technology to obtain an FPCA product; carrying out preheating treatment on the FPCA product, and then carrying out dispensing treatment on the FPCA product; and performing high-temperature curing treatment on the dispensed FPCA product. The technical problems that in the prior art, high-temperature curing is directly carried out after dispensing filling is carried out between the switch key and the flexible plate, the phenomenon of glue splashing can occur, the flexible plate can be polluted, and the product quality is affected can be solved.

A method for detecting a sound field in an outside environment of a solid structure is provided. The solid structure comprises at least one sound transducing element, which is a part of the solid structure and forms a part of an outer surface of the solid structure, wherein the incident sound falls at least partly onto the sound transducing element. The method comprises obtaining sensor data from at least one vibration sensor, which is mounted onto a mounting surface of the at least one sound transducing element, wherein the at least one vibration sensor detects vibrations in the at least one sound transducing element, which are induced into the at least one sound transducing element by the incident sound field, processing the sensor data to generate output data, and providing the output data.

The invention discloses a stacked chip lead bonding packaging structure and a preparation method. The preparation method comprises the following steps: preparing a temporary bonding adhesive film layer on the surface of a glass slide; preparing a metal anti-reflection layer on the surface of the temporary bonding adhesive film layer; preparing a rewiring layer on the metal anti-reflection layer; mounting and stacking a chip group on the surface of the rewiring layer; performing plastic packaging; removing the glass slide, and exposing the temporary bonding adhesive film layer; removing the temporary bonding glue layer to expose the metal anti-reflection layer; removing the metal anti-reflection layer to expose the metal bonding pad; solder balls are arranged on the metal bonding pads; and grinding and cutting to obtain the packaging body. According to the invention, the rewiring layer is used for replacing an organic substrate, a plurality of chips are mounted on the rewiring layer, interconnection among the chips is carried out through lead bonding, and signals are connected to the rewiring layer through lead bonding, so that the organic substrate is omitted, the risk of material breakage caused by imbalance of supply and demand is avoided, and the packaging cost is reduced; the method is suitable for industrial popularization.

The invention discloses a modular sip transceiver assembly based on HTCC, and belongs to the technical field of satellite communication. The modular transceiver assembly mainly comprises two radio frequency front end sip modules, two secondary frequency conversion sip modules, two local oscillator carrier plate sip modules, a power supply and an FPGA control module. The whole assembly mainly comprises five radio frequency systems and four receiving channels which are completely the same and are almost consistent with the other transmitting channel in structure, modular design is adopted, a mature microwave substrate processing technology is combined with an existing micro-assembly process, and through an HTCC ceramic tube shell and a sip technology, surface mounting application of a microwave 3D module is achieved, and meanwhile light-weight and small-size design is achieved. According to the three-dimensional stacked packaging, various passive devices can be subjected to interlayer integration, the assembly integration level is greatly improved, an expected complete machine system can be verified more quickly and flexibly, especially for a multi-path system, only a single module needs to be used for testing in the earlier stage, and the three-dimensional stacked packaging module is suitable for various communication occasions.

The utility model relates to the technical field of chip mounters, and discloses an automatic chip mounter for electronic components, which comprises a bottom plate, a connecting rod is fixedly mounted on the upper surface of the bottom plate close to the front end, a controller for controlling electronic equipment is arranged at the upper end of the connecting rod, four vertical plates are fixedly mounted on the upper surface of the bottom plate, and the vertical plates are fixedly mounted on the upper surface of the bottom plate. The four vertical plates are arranged on the upper surface of the bottom plate in a rectangular array mode, transverse plates are fixedly installed on the surfaces of the vertical plates, driving motors are fixedly installed on the transverse plates, and threaded rods are fixedly installed at the output ends of the driving motors. After the surface mounting of one of a plurality of surface mounting positions on the electronic component is completed, the rotating direction of the pulley can be controlled through the controller, so that the pulley drives the sliding frame to move left and right, and the surface mounting of the other surface mounting positions of the electronic component is facilitated; therefore, the chip mounting efficiency and the chip mounting effect of the electronic component are improved.

The invention provides automatic gluing and patching equipment for magnetic cores, which comprises an equipment platform and a tray for bearing the magnetic cores, one side of the equipment platform is provided with a dispensing and patching mechanism, and the other side of the equipment platform is provided with an assembling and pressing mechanism; the glue dispensing and surface mounting mechanism comprises a translation conveying assembly arranged at one end of the equipment platform and used for driving the trays to move and a conveying-out assembly arranged at the other end of the equipment platform and used for conveying the trays to the assembling and pressing mechanism, and the feeding end of the conveying-out assembly corresponds to the discharging end of the translation conveying assembly; the assembling and pressing mechanism comprises a main conveying belt arranged on the equipment platform, and the conveying direction of the main conveying belt is opposite to the conveying direction of the translation conveying assembly. The automatic gluing and patching equipment for the magnetic core has the advantages of being high in integration degree, reasonable in structural size design, low in use cost, energy-saving and environment-friendly, can be suitable for gluing and patching of the magnetic core, and is beneficial to improving the gluing and patching efficiency of the magnetic core.