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57158 results about "Conductor Coil" patented technology

An electromagnetic coil is an electrical conductor such as a wire in the shape of a coil, spiral or helix. Electromagnetic coils are used in electrical engineering, in applications where electric currents interact with magnetic fields, in devices such as electric motors, generators, inductors, electromagnets, transformers, and sensor coils.

Implantable medical device incorporating integrated circuit notch filters

Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The IC fabricated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the IC chip substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.
Owner:MEDTRONIC INC

Implantable medical device incorporating miniaturized circuit module

Implantable medical devices (IMDS) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof. An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The integrated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the RF module substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.
Owner:MEDTRONIC INC

Power line coupling device and method

A power line coupler for communicating data signals over a power distribution system having a first and second overhead energized medium voltage power line conductors is provided. In one embodiment, the coupler includes a first lightening arrestor having a first end and a second end, wherein the first end of the first arrestor is connected to the first power line conductor. The coupler further includes a first high frequency impedance having a first end connected to the second end of the first lightening arrestor and the first impedance having a second end connected to a neutral conductor of the power line distribution system. The coupler may further include a second lightening arrestor having a first end and a second end, wherein the first end of the second arrestor is connected to the second power line conductor. The coupler further including a second high frequency impedance having a first end connected to the second end of the second lightening arrestor and a second end connected to the neutral conductor. The first high frequency impedance and the second high frequency impedance may each comprise an air core coil that forms an inductor. The coupler may further include a balun having a first winding and a second winding, wherein the first winding is coupled to a communication device, and wherein the second winding has a first end connected to the first end of the first high frequency impedance and a second end connected to the first end of the second high frequency impedance.
Owner:CHEMTRON RES

Thin film write head with interlaced coil winding and method of fabrication

The preferred embodiment of the present invention provides a write head having an interlaced conductor coil winding and method of fabrication. The interlaced winding of the present invention may have alternating turns of a first and a second coil. In the preferred embodiment, the side walls of successive coil turns are separated by an ultra thin inorganic insulation which defines the distance between successive turns of the first and second coil. In one method of fabrication, a conductive seed layer is deposited on a generally planar insulative surface, a resist mask is formed on the seed layer, and a conductive material deposited on the exposed seed layer to form the turns of the first coil. The masked portions of the seed layer are removed, after resist mask removal, to electrically isolate the turns of the first coil. The inorganic insulation may be formed in a layer conformal with the first coil. The second coil is formed between the turns of the first coil. A seed layer and mask may be used to facilitate second coil deposition. Etching, or planarization, may be used to electrically isolate the turns of the second coil. A capping layer may be formed over any exposed conductor material to insulate the winding from an upper pole structure or other overlying structure. Embodiments of the present invention may have multiple layers of conductor winding having some conventional, or all interlaced coil structure.
Owner:WESTERN DIGITAL TECH INC
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