2results about How to "Improve stand-alone performance" patented technology

A method for dynamic beam optimization in satellite communication and a satellite communication terminal are disclosed. The terminal has a locally pre-installed hybrid architecture deep learning model. The specific steps are as follows: The terminal collects spatiotemporal feature data such as space, time, orbit, interference, and position in real time and stores it in a local historical database; it calculates the instantaneous phase angle of the satellite based on the position features and satellite ephemeris, identifies the scene type, and adapts the interference features to obtain optimized features; it extracts historical multi-frame spatiotemporal position features that match the current phase angle, combines them with the optimized features to construct a multi-dimensional feature matrix, inputs it into the model, and outputs spatial and temporal feature scores; it calculates dynamic weights by combining real-time interference and scene, balances the spatiotemporal score decision ratio, integrates historical reputation scores to calculate a comprehensive beam score, selects the optimal beam, and stores the decision result back into the local historical database. This invention integrates spatiotemporal multi-dimensional features, scene-based signal processing, and local deep learning inference to achieve beam optimization, improving the reliability of satellite communication and the efficiency of beam decision-making.

This application provides a chip package module, including a first conductive frame, a first bare die disposed on the first conductive frame, and a second conductive frame disposed at an interval beside the first conductive frame. The chip package module further includes a first conductive connecting sheet, a second bare die, and a conductive cover plate. The first conductive connecting sheet is connected to a surface of the first bare die away from the first conductive frame, and extends to be lapped on the second conductive frame. The second bare die is laminated on the first bare die and is connected to the first conductive connecting sheet. The conductive cover plate is connected to a surface of the second bare die away from the first conductive frame and extends to be connected to the first conductive frame. The first conductive connecting sheet and the conductive cover plate are used to implement electrical interconnection between the first bare die and the second bare die that are vertically laminated, and the two bare dies are packaged inside one device, so that performance of a single device is improved. This application further provides a power module including the chip package module, an electronic device, and a method for manufacturing the chip package module.