42results about "Magnetic-bias transformers" patented technology

Shown and described is a coaxial transformer (17) with a coaxial cable (1) forming a primary winding (19) with an inner conductor (3) and a conductive cable shield (7), a secondary conductor (21) forming a secondary winding (23), at least one magnetic core (25), and an earth connection (11) that can be connected to a reference potential, wherein the primary and secondary windings (19, 23) are each arranged in relation to the magnetic core (25), wherein the earth connection (11) is electrically connected to the cable shield (7) so that the inner conductor (3) can be shielded by the cable shield (7). Also shown and described is a method (100) for producing a coaxial transformer (17).

Galvanic insulation device (2) comprising: an upper coil (2a) extending into a first insulating layer (8); a lower coil (2b) extending into a second insulating layer (9); a galvanic insulation region (11) extending between the first (8) and the second (9) insulating layers; and at least a first conductive via (15; 18). Each of the upper coil (2a) and the lower coil (2b) comprises a respective plurality of turns (4; 5) and furthermore a respective first electrical contact region (4a; 5a) and a respective second electrical contact region (4b; 5b), electrically coupled to the respective plurality of turns (4; 5). The first conductive via (15; 18) is coupled to a first structural portion (28; 30) of the upper coil (2a) or the lower coil (2b), coupled to the respective turns (4; 5) or to the respective first (4a; 5a) or second (4b; 5b) electrical contact region. The first structural portion (28; 30) comprises a first stress dissipation region (24; 26) having a curved shape and having a first end (24'; 26') misaligned along a first axis (Z) with respect to the other of the upper coil (2a) and the lower coil (2b).

Aspects of the present disclosure include systems, structures, circuits, and methods providing integrated circuit (chip) packages or modules having a transformer that is disposed or mounted on or to a side of the lead frame opposite to the related semiconductor dies of the chip package. The transformer may be placed on a PCB structure. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a galvanically isolated gate driver or other high voltage circuit.

The invention relates to a planar transformer with improved reliability. A galvanic insulation device includes: an upper coil in a first insulating layer; a lower coil in the second insulating layer; a current insulating region extending between the first insulating layer and the second insulating layer; and a first conductive via. Each of the upper coil and the lower coil includes a turn, a first electrical contact region and a second electrical contact region electrically coupled to the turn. A first conductive via is coupled to the first structural portion of the lower coil (2b), to the turn or to the first or second electrical contact area. The first structural portion includes a first stress dissipation region having a curved shape and not aligned with the upper coil.

To provide an RF filter that allows RF power to be provided to a heating element in an RF electrode without ingress.SOLUTION: A radio frequency (RF) filter includes an inductive element having a plurality of coil sections collectively forming a non-split coil of a cable of a twisted magnetic wire. The coil sections have different winding pitches. The cable of the twisted magnetic wire is configured for at least one channel, with two wires per channel. The cable of the twisted magnetic wire is connected at a first end to an electrical component that is to receive power from a power source, and the cable of the twisted magnetic wire is connected at a second end to a power source. A terminating capacitive element is electrically connected between a reference ground potential and each wire of the cable of the twisted magnetic wire at a respective location between the second end of the inductive element and the power source.SELECTED DRAWING: Figure 6

A high-power telescoped transformer can be used to provide efficient power conversion in an electric vehicle (EV) fast charger. The telescoped transformer includes a pair of concentric toroidal magnetic cores, with a primary set of windings that wraps around both cores and a secondary set of windings that wraps around one of the cores. By using a shorter total length of wire for the windings, resistive power losses are reduced, compared with conventional transformer and inductance combinations. This also results in a reduced volume of the EV fast charger. Multiple transformer modules can be coupled in series to form a high power EV charger.

A current transformer for a ground fault circuit breaker (GFCI) may include an iron core having a closed loop shape, the iron core having a first side, a second side, and an iron core opening, and a sense coil wound around the iron core, the sense coil configured to be magnetically coupled to a plurality of conductors passing through the iron core opening. The current transformer may include a first magnetic shield disposed on a first side of the core over the sense coil, and a second magnetic shield disposed on a second side of the core over the sense coil.

A transformer component (1) comprises at least one winding (2) being formed by a single turn of a wire (5) having a wire insulation ( 6 ), and a molded body (4), in which the wire (5) including the wire insulation (6) is at least partially embedded.

This insulation module is provided with: a first conductor and a second conductor, which are buried in an insulating layer so as to face each other at a distance in the thickness direction of the insulating layer; a first electrode which is connected to the first conductor; a second electrode which is connected to the second conductor, while being arranged at a position that is away from the first electrode when viewed from the thickness direction of the insulating layer; a passivation layer which is formed on the surface of the insulating layer; a low dielectric constant layer which is formed on the surface of the passivation layer, and has a lower dielectric constant than the passivation layer; and a mold resin which covers the low dielectric constant layer.

The pulse receiving circuit (221) constituting the signal transmission device (200) includes: a first pulse detector (221E) that receives a differential input between a first received pulse signal (S3), i.e., an internal signal (s21) at the secondary winding (231s) of the first transformer (231), and a second received pulse signal (S4), i.e., an internal signal (s22) at the secondary winding (232s) of the second transformer (232); a second pulse detector (221F) that receives a differential input between the first received pulse signal (S3) and the second received pulse signal (S4), wherein the input polarity is opposite to the input polarity of the first pulse detector (221E); and a logic unit (221H) that generates a received pulse signal (S5) based on the output signals (s23, s24) of the first and second pulse detectors (221E, 221F), respectively.

A balun includes an unbalanced terminal; balanced terminals; first and second main lines; and first and second sub-lines. The first main line has an end connected to the unbalanced terminal. The second main line has an end connected to the first main line and an end that is open. Each of the first and the second sub-lines is connected between the balanced terminal and a reference potential, respectively. The second sub-line includes a first partial line connected to the balanced terminal, and a second partial line connected between the first partial line and the reference potential. The second main line includes a third partial line connected to the first main line, and a fourth partial line connected to the third partial line. The distance between the first partial line and the third partial line is shorter than the distance between the second partial line and the fourth partial line.

An electrical system includes an insulating substrate; a magnetic coupler comprising coils disposed on opposites sides of the insulating substrate, wherein the coils are at least partially aligned such that a magnetic field generated by current flow through a first of the coils induces an electromotive force in a second of the coils; and a capacitive coupler having plates disposed on opposites sides of the insulating substrate, wherein the plates comprises elongate conductors that are coupled together without forming loops and arranged at least partially beneath or in an interior of the coils of the magnetic coupler on the insulating substrate

According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

Galvanic insulation device includes an upper coil in a first insulating layer; a lower coil in a second insulating layer; a galvanic insulation region extending between the first and the second insulating layers; and a first conductive via. Each of the upper coil and the lower coil includes turns, a first electrical contact region and a second electrical contact region, electrically coupled to the turns. The first conductive via is coupled to a first structural portion of the lower coil (2b), coupled to the turns or to the first or second electrical contact region. The first structural portion includes a first stress dissipation region having a curved shape and misaligned to the upper coil.

According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

This application provides an isolation transformer. The isolation transformer is applicable to a power converter, the power converter further includes a first power conversion module and a second power conversion module, the isolation transformer includes a high-voltage winding, a low-voltage winding, and a solid insulation housing, the high-voltage winding is connected to the first power conversion module, and the low-voltage winding is connected to the second power conversion module. The high-voltage winding has a solid insulation layer, a conducting layer or a semi-conducting layer is disposed on the solid insulation layer, and the conducting layer or the semi-conducting layer is grounded. The solid insulation housing has an opening surface, the opening surface faces the second power conversion module, the solid insulation housing covers the low-voltage winding and the high-voltage winding that has the solid insulation layer, a conducting layer or a semi-conducting layer is disposed on the solid insulation housing, and the conducting layer or the semi-conducting layer of the solid insulation housing is grounded. In this application, a volume of the isolation transformer can be reduced, power density of the power converter can be improved, and low costs and high applicability can be ensured.

Described herein are on-chip isolator devices that can be employed in high-power applications and that are designed to enhance high common-mode transient immunity (CMTI) without sacrificing isolator gain. An isolator device includes two dies. A first die supports an isolation barrier and the second die is barrierless. The second die is barrierless in that it lacks isolation materials that are commonly used to sustain isolation barriers in on-chip isolator devices (e.g., polyimide). To enhance CMTI despite the absence of a further isolation barrier formed on the second die, the second die is provided with a tapped impedance element, an impedance element having a tap that couples the impedance element to a reference potential (e.g., to ground). The secondary side of the isolator of the first die is coupled to the tapped impedance element of the second die, thus creating a discharge path for common-mode transients.

This insulating transformer includes: a transformer including an insulating layer, a first coil that is embedded in the insulating layer, has a first signal end and a first ground end, and is configured to be capable of applying low voltage to the first signal end, and a second coil that is arranged separated from the first coil in a thickness direction of the insulating layer, has a second signal end and a second ground end, and is configured to be capable of applying high voltage to the second signal end; a capacitor including a first capacitor electrode that is disposed between the first coil and the second coil and is connected to the first ground end of the first coil, and a second capacitor electrode that is disposed between the first capacitor electrode and the second coil and is connected to the second ground end of the second coil; a first insulating film interposed between the first coil and the first capacitor electrode; and a second insulating film interposed between the second coil and the second capacitor electrode.

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having with gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The windings of the first and second winding pairs are offset and rotated 180 degrees with respect to the other winding in the pair. The third winding performs a Gm boost function.

The invention relates to a coaxial transformer (17) having: a coaxial cable (1) which forms a primary winding (19) and has an inner conductor (3) and a conductive cable shield (7); a secondary conductor (21) which forms a secondary winding (23); at least one magnetic core (25); and an earthing connection (11) which is connectable to a reference potential, wherein the primary and the secondary winding (19, 23) are each arranged in relation to the magnetic core (25), and the earthing connection (11) is electrically connected to the cable shield (7) such that the inner conductor (3) can be shielded by the cable shield (7). The invention also relates to a method (100) for producing a coaxial transformer (17).

Aspects of the present disclosure include systems, structures, circuits, and methods of providing an integrated circuit (chip) package or module having a transformer disposed or mounted on an opposite side of a lead frame from an associated semiconductor die of the chip package. The transformer may be placed on the PCB structure. In some examples, an insulating coating may be disposed on the package to increase the isolation capability of the final package. The packages and modules may include various types of circuitry; in some examples, a chip package or module may include an electrically isolated gate driver or other high voltage circuit.

An electronic circuit, the electronic circuit comprising a first die. The first die comprises a first coil; a second coil; and an electrically conductive loop that defines a first-die region within the loop, wherein the first coil is in the first-die region and the second coil is located outside the first-die region.

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having with gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The winds of the first and second winding pairs are off set and rotated 180 degrees with respect to the other winding in the pair. The third winding performs a Gm boost function.

To provide a power conversion device capable of preventing the generation of eddy currents and improving magnetic coupling.SOLUTION: There is provided a power conversion device 100 equipped with a primary-side transformer 110 to which a primary AC voltage V1 is input from a primary-side circuit 10, and a secondary-side transformer 120 that outputs a secondary AC voltage V2 of lower voltage than the primary AC voltage V1 to a secondary-side circuit 20. The primary-side transformer 110 has a primary-side primary winding 111 to which the primary AC voltage V1 is input, and a primary-side secondary winding 112 to which power is transmitted from the primary-side primary winding 111. The secondary-side transformer 120 has a secondary-side primary winding 121 that constitutes a closed circuit 130 together with the primary-side secondary winding 112, and a secondary-side secondary winding 122 that outputs the secondary AC voltage V2 with power transmitted from the secondary-side primary winding 121. The primary circuit 10 and the closed circuit 130 are connected to a common potential.SELECTED DRAWING: Figure 1

A voltage-isolated transformer and integrated circuit package includes a substrate with opposed first and second surfaces and including a plurality of conductive traces, with a recess disposed in the second surface. The plurality of conductive traces includes a first group and a second group that are galvanically separate. A magnetic core is disposed on the first surface of the substrate. The magnetic core can include a soft ferromagnetic material. First and second coils are configured about the magnetic core and connected to the first and second groups of conductive traces, respectively, with the first and second coils and magnetic core being configured as a transformer. First and second integrated circuit die are disposed in the recess on the second surface. A dam is disposed on the first surface of the substrate and surrounding the magnetic core. An encapsulant disposed in the dam and encapsulating the magnetic core.

According to one embodiment, an isolator includes a first electrode, a second electrode, a conductive body, and a first insulating layer. The second electrode is provided on the first electrode and separated from the first electrode. The conductive body is provided around the first and second electrodes along a first plane perpendicular to a first direction. The first direction is from the first electrode toward the second electrode. The first insulating layer is provided on the second electrode. The first insulating layer includes silicon, carbon, and nitrogen.