28results about "Magnetic-bias transformers" patented technology

Aspects of the present disclosure include systems, structures, circuits, and methods providing integrated circuit (chip) packages or modules having a transformer that is disposed or mounted on or to a side of the lead frame opposite to the related semiconductor dies of the chip package. The transformer may be placed on a PCB structure. In some examples, an insulating coating may be placed on the package to increase the isolation capability of the final package. The packages and modules may include various types of circuits; in some examples, chip packages or modules may include a galvanically isolated gate driver or other high voltage circuit.

To provide an RF filter that allows RF power to be provided to a heating element in an RF electrode without ingress.SOLUTION: A radio frequency (RF) filter includes an inductive element having a plurality of coil sections collectively forming a non-split coil of a cable of a twisted magnetic wire. The coil sections have different winding pitches. The cable of the twisted magnetic wire is configured for at least one channel, with two wires per channel. The cable of the twisted magnetic wire is connected at a first end to an electrical component that is to receive power from a power source, and the cable of the twisted magnetic wire is connected at a second end to a power source. A terminating capacitive element is electrically connected between a reference ground potential and each wire of the cable of the twisted magnetic wire at a respective location between the second end of the inductive element and the power source.SELECTED DRAWING: Figure 6

A transformer component (1) comprises at least one winding (2) being formed by a single turn of a wire (5) having a wire insulation ( 6 ), and a molded body (4), in which the wire (5) including the wire insulation (6) is at least partially embedded.

This insulation module is provided with: a first conductor and a second conductor, which are buried in an insulating layer so as to face each other at a distance in the thickness direction of the insulating layer; a first electrode which is connected to the first conductor; a second electrode which is connected to the second conductor, while being arranged at a position that is away from the first electrode when viewed from the thickness direction of the insulating layer; a passivation layer which is formed on the surface of the insulating layer; a low dielectric constant layer which is formed on the surface of the passivation layer, and has a lower dielectric constant than the passivation layer; and a mold resin which covers the low dielectric constant layer.

An electrical system includes an insulating substrate; a magnetic coupler comprising coils disposed on opposites sides of the insulating substrate, wherein the coils are at least partially aligned such that a magnetic field generated by current flow through a first of the coils induces an electromotive force in a second of the coils; and a capacitive coupler having plates disposed on opposites sides of the insulating substrate, wherein the plates comprises elongate conductors that are coupled together without forming loops and arranged at least partially beneath or in an interior of the coils of the magnetic coupler on the insulating substrate

According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

According to one embodiment, an isolator includes first and second electrodes, first and second insulating portions, and a first dielectric portion. The first insulating portion is provided on the first electrode. The second electrode is provided on the first insulating portion. The second insulating portion is provided around the second electrode along a first plane perpendicular to a first direction. The second insulating portion contacts the second electrode. The first dielectric portion is provided between the first and second insulating portions. At least a portion of the first dielectric portion contacts the second electrode and is positioned around the second electrode along the first plane. A distance between a lower end of the second electrode and a first interface between the first dielectric portion and the second insulating portion is less than a distance between the first interface and an upper end of the second electrode.

This insulating transformer includes: a transformer including an insulating layer, a first coil that is embedded in the insulating layer, has a first signal end and a first ground end, and is configured to be capable of applying low voltage to the first signal end, and a second coil that is arranged separated from the first coil in a thickness direction of the insulating layer, has a second signal end and a second ground end, and is configured to be capable of applying high voltage to the second signal end; a capacitor including a first capacitor electrode that is disposed between the first coil and the second coil and is connected to the first ground end of the first coil, and a second capacitor electrode that is disposed between the first capacitor electrode and the second coil and is connected to the second ground end of the second coil; a first insulating film interposed between the first coil and the first capacitor electrode; and a second insulating film interposed between the second coil and the second capacitor electrode.

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having with gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The windings of the first and second winding pairs are offset and rotated 180 degrees with respect to the other winding in the pair. The third winding performs a Gm boost function.

Aspects of the present disclosure include systems, structures, circuits, and methods of providing an integrated circuit (chip) package or module having a transformer disposed or mounted on an opposite side of a lead frame from an associated semiconductor die of the chip package. The transformer may be placed on the PCB structure. In some examples, an insulating coating may be disposed on the package to increase the isolation capability of the final package. The packages and modules may include various types of circuitry; in some examples, a chip package or module may include an electrically isolated gate driver or other high voltage circuit.

An electronic circuit, the electronic circuit comprising a first die. The first die comprises a first coil; a second coil; and an electrically conductive loop that defines a first-die region within the loop, wherein the first coil is in the first-die region and the second coil is located outside the first-die region.

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having with gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The winds of the first and second winding pairs are off set and rotated 180 degrees with respect to the other winding in the pair. The third winding performs a Gm boost function.

To provide a power conversion device capable of preventing the generation of eddy currents and improving magnetic coupling.SOLUTION: There is provided a power conversion device 100 equipped with a primary-side transformer 110 to which a primary AC voltage V1 is input from a primary-side circuit 10, and a secondary-side transformer 120 that outputs a secondary AC voltage V2 of lower voltage than the primary AC voltage V1 to a secondary-side circuit 20. The primary-side transformer 110 has a primary-side primary winding 111 to which the primary AC voltage V1 is input, and a primary-side secondary winding 112 to which power is transmitted from the primary-side primary winding 111. The secondary-side transformer 120 has a secondary-side primary winding 121 that constitutes a closed circuit 130 together with the primary-side secondary winding 112, and a secondary-side secondary winding 122 that outputs the secondary AC voltage V2 with power transmitted from the secondary-side primary winding 121. The primary circuit 10 and the closed circuit 130 are connected to a common potential.SELECTED DRAWING: Figure 1

A voltage-isolated transformer and integrated circuit package includes a substrate with opposed first and second surfaces and including a plurality of conductive traces, with a recess disposed in the second surface. The plurality of conductive traces includes a first group and a second group that are galvanically separate. A magnetic core is disposed on the first surface of the substrate. The magnetic core can include a soft ferromagnetic material. First and second coils are configured about the magnetic core and connected to the first and second groups of conductive traces, respectively, with the first and second coils and magnetic core being configured as a transformer. First and second integrated circuit die are disposed in the recess on the second surface. A dam is disposed on the first surface of the substrate and surrounding the magnetic core. An encapsulant disposed in the dam and encapsulating the magnetic core.

According to one embodiment, an isolator includes a first electrode, a second electrode, a conductive body, and a first insulating layer. The second electrode is provided on the first electrode and separated from the first electrode. The conductive body is provided around the first and second electrodes along a first plane perpendicular to a first direction. The first direction is from the first electrode toward the second electrode. The first insulating layer is provided on the second electrode. The first insulating layer includes silicon, carbon, and nitrogen.

The present application relates to a filter configuration method, which is not configured by a low-pass filter or a band-pass filter when configuring an electromagnetic wave shielding filter, but is configured by a magnetic field transmission method, which transmits only a desired signal while maintaining the shielding of an undesired electromagnetic wave. The present application relates to an electromagnetic wave shielding filter for high-frequency communication, which is configured with an elliptical ferrite core inside the filter, a primary coil and a secondary coil are arranged at both ends, and then, for the elliptical magnetic core, a tail is made of an electromagnetic wave shielding material, the signal on the primary coil side is transmitted to the secondary coil in the form of a magnetic field, and the remaining undesired common mode component is removed.

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The windings of the first and second winding pairs are offset and rotated 180 degrees with respect to the other winding in the pair. The third winding pair performs a Gm boost function.

This transformer chip, which forms a signal-transmitting device, has, for example, a first wiring layer, a second wiring layer different from the first wiring layer, a primary winding formed on the first wiring layer, a secondary winding formed on the second wiring layer to be magnetically coupled with the primary winding, and a shield electrode formed as to be disposed between the primary winding and the secondary winding.

The radio frequency (RF) filter includes an inductive element having multiple coil sections that collectively form an undivided coil of twisted magnetic wire cable. At least two adjacent coil sections have different winding pitches. The twisted magnetic wire cable includes two wires per channel and is configured for at least one channel. The twisted magnetic wire cable is configured at the first end of the inductive element for connection to an electrical component that will receive power from a power source. The twisted magnetic wire cable is configured at the second end of the inductive element for connection to a power source. Termination capacitive elements are electrically connected between the reference ground potential and each wire of the twisted magnetic wire cable at each location between the second end of the inductive element and the power source.

The invention provides a battery pack equalization board based on a bidirectional pulse injection type transformer. The battery pack equalization board comprises a multi-winding isolation transformer, a primary side pulse switch circuit, a plurality of monomer side equalization modules and an isolation driving circuit. The primary side of the multi-winding isolation transformer is connected with two ends of the battery pack; each equalization module is used for being connected with a battery monomer in parallel, and is connected with a corresponding winding through a bidirectional switch unit to form a selectable charging / discharging path; the isolation driving circuit receives an external control signal and drives the switch to act after electrical isolation. The equalization board is a pure power execution module and cooperates with a primary side switch and a single side switch under external control to realize bidirectional energy transfer among single bodies in the battery pack. According to the invention, the problems of energy waste, slow speed and high temperature rise of the existing passive equalization and the problems of complex topology, hardware redundancy, high cost and insufficient electrical isolation of the active equalization are solved, and the high-string-number battery pack consistency management requirements of high efficiency, safety and low cost under multiple working conditions can be met.

This insulation module is provided with: a first conductor and a second conductor, which are buried in an insulating layer so as to face each other at a distance in the thickness direction of the insulating layer; a first electrode which is connected to the first conductor; a second electrode which is connected to the second conductor, while being arranged at a position that is away from the first electrode when viewed from the thickness direction of the insulating layer; a passivation layer which is formed on the surface of the insulating layer; a low dielectric constant layer which is formed on the surface of the passivation layer, and has a lower dielectric constant than the passivation layer; and a mold resin which covers the low dielectric constant layer.

A fully symmetrical and balanced monolithic or multi-die integrated circuit transformer device is described. The device can comprise a first and second transformer. The first and second transformer can each comprise a symmetrical bottom coil including electrically conductive crossovers between individual windings of pairs of adjacent windings. Each of the bottom coils can further comprise a first, a second differential terminal, and a center tap third terminal electrically connected to the inner-most winding of the bottom coil. Each transformer can further comprise a spiral top coil electrically connected to an encompassed inner pad and a laterally offset outer pad, the top coil, inner pad, and outer pad including a shared electrically conductive integrated circuit layer. The respective top coils of each transformer can be overlaid and separated from the respective bottom coils by an electrically insulating dielectric layer.

To suppress the occurrence of surface discharge. [Solution] The transchip 80 comprises a first coil 41A and a second coil 42A arranged opposite to each other spaced apart in the z direction, a first electrode pad 81 connected to the first coil 41A, a second electrode pad 82 provided at a position spaced apart from the first electrode pad 81 in a plan view and connected to the second coil 42A, a passivation layer 150 formed on the surface 85s of the insulating layer 85 and made of a material containing silicon nitride, a low dielectric layer 160 formed on the surface 150s of the passivation layer 150 and made of a material containing silicon oxide and having a lower dielectric constant than the passivation layer 150, and a mold resin 110 covering the low dielectric layer 160.

To provide a coil device that includes a first coil and a second coil which are insulated by polyimide, and suppresses the deformation of polyimide.SOLUTION: A coil device comprises: a substrate 1 having a first main surface and a second main surface opposite to the first main surface; a first insulation film 2 that is provided so as to be contacted to the substrate 1 in a first direction side in the case where a direction directed from the second main surface to the first main surface is a first direction; a first coil part 8 that is provided so as to be contacted to the first direction side to the first insulation film 2, and is a spiral-like conductive film; a second insulation film 4 that is provided so as to cover the first direction side of a first coil part 8 and the first direction side of the first insulation film 2 where the first coil part 8 is not provided; a second coil part 12 that is provided so as to be contacted to the first direction side of a second insulation film 4, and is the spiral-like conductive film; and a first groove 9 that is provided to the second insulation film 4, and includes a width to the first direction on the first direction side of the second insulation film 4 in a region inner from an outer peripheral end of the second coil part 12 in a plan view.SELECTED DRAWING: Figure 1

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having with gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The windings of the first and second winding pairs are offset and rotated 180 degrees with respect to the other winding in the pair. The third winding performs a Gm boost function.

A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having with gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The windings of the first and second winding pairs are offset and rotated 180 degrees with respect to the other winding in the pair. The third winding performs a Gm boost function.