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432results about "Printed inductances" patented technology
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Data and power isolation with double isolation barrier
A packaged integrated circuit (IC) including a package substrate. The package substrate includes pins; a first metal layer on the pins; a second metal layer on the first metal layer; vias on the second metal layer; an insulation material covering the pins, the first metal layer, the second metal layer, and the vias, and exposing surfaces of the pins and the vias. The packaged IC further includes a semiconductor die on the package substrate, the semiconductor die having a surface opposing the second metal layer; metal posts coupled between the semiconductor die and the exposed surfaces of the vias; and a mold compound covering the semiconductor die and the metal posts, in which the surface is separated from the second metal layer by the insulation material and the mold compound.
Owner:TEXAS INSTRUMENTS INC
Planar inductor structure with integrated shielding to contain electric field
PendingUS20250273386A1Transformers/inductances coils/windings/connectionsTransformers/inductances magnetic coresPlanar inductorPrinted circuit board
An example planar inductor includes a winding structure including a plurality of conductive windings arranged in layers of a printed circuit board (PCB) around a core, where the plurality of conductive windings include at least a top winding and a bottom winding. The planar inductor includes a conductive shield encasing the winding structure. The conductive shield includes an upper conductive shield layer disposed over the winding structure in a first direction, a lower conductive shield layer disposed under the winding structure in a second direction opposite the first direction, an inner conductive shield disposed within and around the plurality of conductive windings, and an outer conductive shield disposed around and outside the plurality of conductive windings.
Owner:VIRGINIA TECH INTELLECTUAL PROPERTIES INC
Signal and power isolation with double isolation barrier
PCT designated stageWO2025184142A1Near-field transmissionSemiconductor/solid-state device detailsSemiconductor chipDie (integrated circuit)
A packaged integrated circuit (IC) (300) including a package substrate (110). The package substrate includes pins (321); a first metal layer (323) on the pins; a second metal layer (325) on the first metal layer; vias (322, 324, 326) on the second metal layer; an insulation material (308a, 308b) covering the pins, the first metal layer, the second metal layer, and the vias, and exposing surfaces of the pins and the vias. The packaged IC further includes a semiconductor die (101) on the package substrate, the semiconductor die having a surface (301) opposing the second metal layer; metal posts (305a, 305b) coupled between the semiconductor die and the exposed surfaces of the vias (326); and a mold compound (304, 304a) covering the semiconductor die and the metal posts, in which the surface is separated from the second metal layer (325) by the insulation material (308a) and the mold compound (304a).
Owner:TEXAS INSTRUMENTS INC
Passive component, three-dimensional device, and method for manufacturing passive component
ActiveUS12412698B2Transformers/inductances coils/windings/connectionsSolid-state devicesSurface roughnessMechanical engineering
A passive component includes a body portion having a first main surface and a passive element at least a part of which is provided inside the body portion. The first main surface at least partially includes a flat surface made of an inorganic substance and having a surface roughness of equal to or less than 1 / 1000 of a thickness of the body portion in a direction orthogonal to the first main surface or equal to or less than 10 nm.
Owner:MURATA MFG CO LTD
Multilayer inductor
A multilayer inductor is provided. The multilayer inductor includes a multilayer winding portion comprising a plurality of coil layers that are vertically stacked, and having an inner surface that defines a hollow of the plurality of coil layers and having an outer surface that defines an outer side and a magnetic compensator made of a soft magnetic material and comprising a magnetic wall located at at least one of the inner surface or the outer surface of the multilayer winding portion.
Owner:SAMSUNG ELECTRONICS CO LTD
Tunable inductor device
ActiveUS12525553B2Semiconductor/solid-state device detailsSolid-state devicesElectrical conductorInductor
Disclosed is a tunable inductor device having a substrate, a planar spiral conductor having a plurality of spaced-apart turns disposed over the substrate, and a phase change switch (PCS) having a patch of a phase change material (PCM) disposed over the substrate between and in contact with a pair of adjacent segments of the plurality of spaced-apart turns, wherein the patch of the PCM is electrically insulating in an amorphous state and electrically conductive in a crystalline state. The PCS further includes a thermal element disposed adjacent to the patch of PCM, wherein the thermal element is configured to maintain the patch of the PCM to within a first temperature range until the patch of the PCM converts to the amorphous state and maintain the patch of the PCM within a second temperature range until the first patch of PCM converts to the crystalline state.
Owner:QORVO US INC
Multilayer coil component
ActiveUS12488936B2Transformers/inductances coils/windings/connectionsPrinted inductancesElectrical conductorElectrical connection
A multilayer coil component includes an element body, a coil, and an external terminal. The element body includes a plurality of insulator layers that is laminated. The coil is disposed in the element body. The external terminal includes a plurality of conductor layers that is laminated. The external terminal is electrically connected to the coil. The element body includes a main face and a first side face adjacent to the main face. The external terminal is embedded in the element body in such a way as to be separated from the first side face and exposed from the main face. The external terminal includes a first separated face that is separated from the first side face as being separated from the main face.
Owner:TDK CORP
Inductor with increasing outer fill density
PendingUS20250342998A1Transformers/inductances coils/windings/connectionsPrinted inductancesInductor windingsMechanical engineering
A structure includes a first layer having inductor windings. An inner area of the first layer is at least partially enclosed by the inductor windings and an outer area of the first layer is separated from the inner area by the inductor windings. This structure further includes a second layer having structural fill elements. The first layer and the second layer are parallel, and the second layer is relatively below the first layer in a direction perpendicular to the first layer. The density of the structural fill elements aligned below the inner area is less than the density of the structural fill elements aligned below the outer area.
Owner:GLOBALFOUNDRIES US INC
Methods and apparatus for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansion
Systems, apparatus, articles of manufacture, and methods for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansion are disclosed. An example substrate for an integrated circuit package includes: a first glass layer having a first coefficient of thermal expansion (CTE); a second glass layer having a second CTE, the second CTE different from the first CTE; a conductive material extending through a first hole in the first glass layer and a second hole in the second glass layer; and a magnetic material between an inner wall of the first hole and the conductive material.
Owner:INTEL CORP
Coil electronic component
ActiveUS12424375B2Transformers/inductances casingsTransformers/inductances coils/windings/connectionsElectronic componentComposite material
A coil electronic component includes a support substrate, a coil pattern disposed on the support substrate, an encapsulant encapsulating at least portions of the support substrate and the coil pattern, and external electrodes disposed externally on the encapsulant and connected to the coil pattern. The coil pattern includes a seed layer having a thickness of 1.5 μm or less and a plating layer disposed on the seed layer.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD
Integration of directional couplers with power combiners
PendingUS20260018774A1Multiple-port networksTransformers/inductances detailsPower combinerSoftware engineering
An example device includes a first primary coil, a second primary coil, a combined power output, a first directional coupler output, a second directional coupler output. The example device also includes a secondary coil coupled to the combined power output, configured to magnetically couple to the first primary coil, and configured to magnetically couple to the second primary coil. The example device further includes a tertiary coil configured to magnetically couple to the secondary coil and including a first end coupled to the first directional coupler output, and a second end coupled to the second directional coupler output.
Owner:TEXAS INSTRUMENTS INC
Chip-type electronic components
PendingJP2026054828ATransformers/inductances coils/windings/connectionsPrinted inductancesElectrical conductorElectronic component
To provide a chip-type electronic component that can achieve both sufficient bonding strength during mounting and mitigation of stress concentration at the boundary between the base body and the electrode portion. [Solution] The chip-type electronic component 1A comprises a base body 2 formed by stacking a plurality of base layers 11, an internal conductor 3 disposed inside the base body 2, and an external electrode 4 electrically connected to the internal conductor 3 and embedded in the base body 2 flush with the outer surface of the base body 2. The outer surface of the base body 2 is provided with grooves M extending in a direction perpendicular to the stacking direction of the base layers 11 across the base body 2 and the external electrode 4.
Owner:TDK CORP
Semiconductor device
A semiconductor device is provided. The semiconductor device includes a first conductive layer and second conductive layer. The second conductive layer is disposed opposite to the first conductive layer. One of the first conductive layer and the second conductive layer includes a first grounding net and a first signal ball-pad. The first grounding net has a first ground void, and the first signal ball-pad is disposed in the first ground void. The first signal ball-pad has a first ball-pad diameter, the first ground void has a first ground void diameter, and a ratio of the first ground void diameter to the first ball-pad diameter is equal to or greater than 1.2.
Owner:MEDIATEK INC
Semiconductor device package and method of manufacturing the same
ActiveCN113628831BFixed transformers or mutual inductancesPrinted inductancesDevice materialSemiconductor
The present disclosure relates to semiconductor device packages and methods of manufacturing the same. The semiconductor device package includes a substrate having a first surface and a second surface opposite the first surface. The semiconductor device package also includes a first electrically conductive layer disposed over the first surface of the substrate and an insulating layer disposed over the first surface of the substrate. The semiconductor device package also includes a magnetically conductive layer disposed between the first electrically conductive layer and the insulating layer. The magnetically conductive layer has a bottom surface facing the first surface of the substrate, a top surface opposite the first surface of the substrate, and a side surface extending between the bottom surface of the magnetically conductive layer and the top surface of the magnetically conductive layer. Another embodiment of the present disclosure relates to a method of manufacturing a semiconductor device package.
Owner:ADVANCED SEMICON ENG INC
Multilayer coil components
ActiveJP7747008B2Transformers/inductances coils/windings/connectionsUnwanted magnetic/electric effect reduction/prevention
To provide a laminate type coil component including a determination mark that can suppress an increase in floating capacitance.SOLUTION: A laminate type coil component 1 includes a multilayer body 10, and a first external electrode 21 and a second external electrode 22 electrically connected to a coil L. The coil L is formed by electrically connecting a plurality of coil conductors 32a to 32d stacked with an insulating layer. The multilayer body 10 includes a first end surface 11 and a second end surface 12 that face each other in a length direction. On a surface excluding the first end surface and the second end surface where the first external electrode is disposed, a first determination mark 50 is provided. The first determination mark 50 includes a first mark conductor pattern that is in contact with an inner surface of the external electrode and has its surface spreading in a direction perpendicular to an axial direction of the coil L. The first mark conductor pattern includes a notch at a position facing a coil shaft A of the coil L.SELECTED DRAWING: Figure 4A
Owner:MURATA MFG CO LTD
Inductor components
ActiveCN114388238BTransformers/inductances coils/windings/connectionsUnwanted magnetic/electric effect reduction/preventionInductorElectric current flow
This invention provides an inductor component. There is a concern that the lead-out electrodes may excessively interrupt magnetic flux when current flows through the inductor wiring. The inductor component (10) includes a blank (20). The blank (20) has a mounting surface (21) and a top surface (22) that are parallel to each other, a first end surface (23) and a second end surface (24) that are parallel to each other, and a first side surface and a second side surface that are parallel to each other. Inductor wiring (30) is disposed inside the blank (20). A first lead-out electrode (40) is connected to a first end in the extending direction of the inductor wiring (30). A second lead-out electrode (50) is connected to a second end in the extending direction of the inductor wiring (30). The lower surfaces of the first lead-out electrode (40) and the second lead-out electrode (50) are exposed from the mounting surface (21) of the blank (20). The first lead-out electrode (40) is a quadrangular prism extending in the height direction (Td). The first lead electrode (40) is exposed from the first end face (23) and the first side face.
Owner:MURATA MFG CO LTD
Coil components
Owner:SAMSUNG ELECTRO MECHANICS CO LTD
Thermal interface material heat transfer antennas
PCT designated stageWO2025259305A1Transformers/inductances coolingSemiconductor/solid-state device detailsDevice materialHeat transmission
A semiconductor device having a front and a back and comprising a package substrate, an epoxy base layer applied to a back side of the package substrate, and a planar inductor in the epoxy base layer is etched to make a trench at the back of the semiconductor device in the epoxy base layer adjacent the planar inductor, and a thermal interface material is put in the trench, whereby a heat transfer antenna is formed. A semiconductor device has a package substrate having a front and a back; an epoxy base layer applied to a back side of the package substrate, a planar inductor at the back of the package substrate in the epoxy base layer, and a heat transfer antenna at the back of the package substrate in the epoxy base layer.
Owner:MICROCHIP TECHNOLOGY INC
Stacked integrated passive device
ActiveUS12651708B2Multiple fixed capacitorsFixed capacitor electrodesEngineering physicsMechanical engineering
A device according to some embodiments includes a first IPD die including a first SiC substrate. The first IPD die has a first surface and a second surface on the first SiC substrate opposite the first surface and includes a first contact and at least one first metal portion on the respective surfaces of the first SiC substrate. The device further includes a second IPD die including a second SiC substrate. The second IPD die has a third surface and a fourth surface on the second SiC substrate opposite the third surface and includes a second contact and at least one second metal portion on the respective surfaces of the second SiC substrate. The device further includes an electrical interconnection structure between one of the first and second surfaces of the first IPD die and one of the third and fourth surfaces of the second IPD die.
Owner:MACOM TECH SOLUTIONS HLDG INC
inductor component
ActiveCN115440485BTransformers/inductances coils/windings/connectionsUnwanted magnetic/electric effect reduction/preventionParasitic capacitorInductor
The present application provides an inductor component capable of reducing the parasitic capacitance between a coil and an external electrode. The inductor component includes a core, a coil, a first external electrode, and a second external electrode. The core has a first end surface and a second end surface at both end sides in a length direction. The first external electrode and the second external electrode are respectively provided at the first end surface side and the second end surface side with respect to the center of the length direction of the core and are exposed from the outer surface of the core. At least a part of the portion of the first external electrode exposed from the outer surface of the core and at least a part of the portion of the second external electrode exposed from the outer surface of the core do not overlap each other when viewed from the first end surface side in the length direction. The center of gravity of the area of the portion of the first external electrode exposed from the outer surface of the core and the center of gravity of the area of the portion of the second external electrode exposed from the outer surface of the core are located on opposite sides with respect to the center of the width direction of the core.
Owner:MURATA MFG CO LTD
Inductor component
PendingUS20250349454A1Fixed inductances without magnetic coreTransformers/inductances coils/windings/connectionsElectrical conductorInductor
An inductor component includes a coil wiring line having a meandering shape meandering in a first direction and extending in a second direction crossing the first direction; first and second external terminals; a first connection conductor that extends in a third direction crossing the first direction and the second direction and that is connected to the first external terminal and the coil wiring line; and a second connection conductor that extends in the third direction and that is connected to the second external terminal and the coil wiring line. When viewed in the third direction, a coil center line is between a first center line and a second center line, the coil center line being a center of the coil wiring line in the first direction and extending parallel to the second direction.
Owner:MURATA MFG CO LTD
Wafer level packaging process for thin film inductor
PendingCN120569791AConductive/insulating/magnetic material on magnetic film applicationTransformers/inductances detailsThin membraneInductor
An integrated circuit (IC) package, the integrated circuit (IC) package including: an integrated circuit (IC) die including an input / output (I / O) pad; and a vertical thin film inductor (TFI) extending substantially vertically from the I / O pad to the solder bump.
Owner:QUALCOMM INC
Coil component
PendingCN121839381ATransformers/inductances coils/windings/connectionsPrinted inductancesElectrical conductorHemt circuits
The invention provides a coil component which is not easy to generate a flash phenomenon on a circuit substrate. A coil component (100) is provided with: an element body (110) having a mounting surface (111); a coil part embedded in the element body (110) and comprising conductor layers (L1-L4) stacked in a Z direction parallel to the mounting surface (111); an insulating resin (130) positioned between the element body (110) and the coil part; a terminal electrode (121) that protrudes from the mounting surface (111) and is connected to one end of the coil part; and a terminal electrode (122) that protrudes from the mounting surface (111) and is connected to the other end of the coil part. The insulating resin (130) has an exposed portion (131) which is located between the terminal electrode (121) and the terminal electrode (122) on the mounting surface (111) and which is exposed so as to protrude from the mounting surface (111).
Owner:TDK CORP
Laminated coil component
ActiveUS12640303B2Multiple-port networksTransformers/inductances coils/windings/connectionsMechanical engineeringPhysics
A laminated coil component includes an element body, a first terminal electrode and a second terminal electrode, and a coil, the coil includes a first wiring portion, a second wiring portion, and a pillar portion, the pillar portion has a first pillar member and a second pillar member alternately laminated in a second direction, and an area of a first surface and an area of a second surface of the first pillar member are larger than an area of a first surface and an area of a second surface of the second pillar member, or smaller than the area of the first surface and the area of the second surface of the second pillar member.
Owner:TDK CORP
Laminated coil component
ActiveUS12592335B2Transformers/inductances coils/windings/connectionsPrinted inductancesElectrical conductorElectrical connection
A laminated coil component includes an element body including insulating layers laminated in a lamination direction, a coil inside the element body, and an external electrode on a surface of the element body and electrically connected to the coil. The coil includes a coil conductors laminated in the lamination direction and electrically connected via a via conductor penetrating the insulating layer in the lamination direction. The coil conductors include a first laminated portion including three or more of the coil conductors adjacent to each other, a second laminated portion including the coil conductors adjacent to each other such that a number of the coil conductors in the second laminated portion is the same as a number of the coil conductors in the first laminated portion, and an intermediate portion adjacent to and between the first and second laminated portions and including one or two of the coil conductors.
Owner:MURATA MFG CO LTD
Coil component
PendingCN121617799ATransformers/inductances coils/windings/connectionsPrinted inductancesElectrical conductorConductor Coil
Owner:TDK CORP
Laminate non-planar radio-frequency choke device
A laminate non-planar radio-frequency (RF) choke device includes a first RF choke. The first RF choke has a first winding structure including a plurality of first conductive traces and a plurality of first vias. The first conductive traces are formed on a first layer and a second layer of a laminate. The first vias are formed between the first layer and the second layer of the laminate. The first vias are stitched in a winding direction through the first conductive traces.
Owner:MEDIATEK INC +1
Methods of fabricating coupled coaxial inductors in package structures
PendingUS20260004962A1Transformers/inductances coils/windings/connectionsTransformers/inductances magnetic coresInductorEngineering physics
Microelectronic integrated circuit package structures include a package substrate with a core, and an inductor having a length extending vertically through the core. The inductor includes a magnetic material on a sidewall of the core, and a first conductive liner on a sidewall of the magnetic material, where a portion of the first conductive liner that is in a plane orthogonal to the length of the inductor comprises a first opening. A portion of a second conductive liner on the sidewall of the magnetic material that is in the plane comprises a second opening, where the first opening and the second opening face each other and are separated by a distance.
Owner:INTEL CORP
inductor component
ActiveCN115440484BTransformers/inductances coils/windings/connectionsInductances/transformers/magnets manufactureElectrical connectionInductor
The present application relates to an inductor component, comprising: a substrate; a coil provided on the substrate and wound in a spiral shape along an axis; and a first external electrode and a second external electrode provided on the substrate and electrically connected to the coil, the substrate including a substrate having first and second main surfaces facing each other, and an insulating layer provided on the first main surface, the coil including: a first coil wiring provided on the first main surface and covered by the insulating layer; a second coil wiring provided on the second main surface; and a first through wiring and a second through wiring provided to pass through the substrate from the first main surface to the second main surface and arranged on opposite sides of the axis, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring being connected in this order to form at least a portion of the spiral shape, at least a portion of the first external electrode being provided above the first coil wiring and provided on the insulating layer in a manner separated from the first coil wiring.
Owner:MURATA MFG CO LTD
An electronic module
ActiveCN115250571BPrinted circuit aspectsTransformers/inductances coils/windings/connectionsElectronic componentPhysics
An electronic module includes a circuit board, a plurality of electronic components disposed on and electrically connected to the circuit board, a package disposed on the circuit board to encapsulate the plurality of electronic components, wherein a first recess is formed in the package, and a first electrode, wherein at least a portion of an electrode of an external component is disposed in the first recess and electrically connected to the first electrode of the electronic module.
Owner:CYNTEC