14results about How to "Reduce signal reflection" patented technology

The invention discloses a control optimization method of a low standing-wave ratio narrow-band filter based on plasmon, and relates to the field of filter plasmon optimization control. According to the method, numerical solution is carried out on the second-order nonlinear differential equation through the fourth-order Runge-Kutta method, the dynamic coupling relation between the plasmon filter and the nonlinear resonator can be accurately described, and therefore accurate regulation and control over frequency response are achieved. In addition, by means of the optimization method, the standing-wave ratio of the narrow-band filter can be effectively reduced, signal reflection is reduced, and the transmission efficiency of the system is improved.

This invention relates to a differential modulator based on a double-layer lithium niobate waveguide and its fabrication method, belonging to the field of optical communication technology. It includes an optical structure and an electrical structure; the optical structure includes a beam splitter, a first lithium niobate modulation waveguide, a second lithium niobate modulation waveguide, and a beam combiner; wherein the output end of the beam splitter is connected to the input ends of the two lithium niobate modulation waveguides, and the input end of the beam combiner is connected to the output ends of the two lithium niobate modulation waveguides; the crystal axes Z-directions of the first and second lithium niobate modulation waveguides are opposite; the electrical structure includes GSSG differential electrodes and on-chip terminating resistors; wherein the differential electrodes are sequentially arranged with a first ground electrode, a first signal electrode, a second signal electrode, and a second ground electrode; both the first and second lithium niobate modulation waveguides are disposed between the first and second signal electrodes. This invention improves modulation efficiency and enhances device stability and modulation bandwidth.

The utility model discloses a broadband low intermodulation connector belongs to the technical field of connector, and its technical scheme main points include the connector body, the top of connector body inboard installs dynamic pre -tension mechanism, the top and bottom of connector body inner wall all are set up with the anti -loose mechanism, dynamic pre -tension mechanism includes disc spring, connector, several slide holes and several limit rods, the top of connector body inboard is installed to disc spring, and disc spring in dynamic pre -tension mechanism can automatically compensate the pre -tension fluctuation of vibration, temperature change or the plugging wear and tear through the elastic deformation, ensure that the contact pressure between connector and the docking equipment always keeps stable, avoid the contact resistance mutation, and the guiding effect of cooperation slide hole and limit rod, limit the radial deviation of connector, guarantee the coaxiality of inner and outer conductor contact, reduce signal reflection and loss to maintain the low intermodulation performance in broadband.

The application discloses a kind of broadband MMIC delay line chips based on constant resistance delay network, including input port, output port and six sequentially connected delay units, the input port is connected with the output port by six sequentially connected delay units;Each of the delay unit includes first port, second port, reference state transmission line, constant resistance delay network and first switch-eighth switch;The constant resistance delay network includes coupled microstrip line, and parallel capacitor loaded on coupled microstrip line.The application is based on the gating of constant resistance delay network and series-parallel switch, realizes delay and ground state selection, can improve isolation, and effectively reduce chip volume.

The utility model relates to an anti-pad structure for optimizing a PCB high-speed via hole, which comprises a via hole pile, the via hole pile penetrates through a multi-layer PCB, and two ends of the via hole pile are respectively connected with differential signal pair wires; the combined elliptical anti-bonding pads are distributed at the wire inlet and the wire outlet of the via hole pile and are composed of a large elliptical bonding pad and a small elliptical bonding pad which are tangent, the long axis length of the large ellipse is D1, the short axis length of the large ellipse is d1, the long axis length of the small ellipse is D2, and the short axis length of the small ellipse is d2; the single circle anti-bonding pad is arranged in the copper column area of the via hole pile, the diameter of the single circle anti-bonding pad is d3, and d3 is larger than the diameter d0 of the via hole and smaller than d1. According to the anti-bonding pad structure for optimizing the PCB high-speed via hole, the combined elliptical anti-bonding pad realizes impedance gradual change from differential routing to a copper column area by means of a specific size proportion, and signal reflection at the two ends of a via hole pile is reduced; a single circle anti-bonding pad optimizes impedance in a copper column area and is matched with a U-shaped shunting groove to shield electromagnetic interference, and meanwhile, a diversion groove is communicated with the U-shaped shunting groove to form a three-stage backflow path, so that crosstalk is reduced.

The application relates to an antenna and an audio device, which project in a direction perpendicular to a mainboard plane to define a main antenna projection area, a ground wire projection area and a mainboard projection area respectively, at least part of the main antenna projection area is configured to be outside the mainboard projection area, at least part of the ground wire projection area is configured to be outside the mainboard projection area, and the interference of the mainboard on the antenna is reduced. The first end of an extension ground wire and the first end of a main antenna, and the second end of the extension ground wire and the second end of the main antenna are coupled and connected respectively, that is, the main antenna and the extension ground wire are connected in a bidirectional coupling mode. Part or all of the antenna wiring is configured outside the mainboard projection area, the antenna is reconstructed in a double-coupled antenna design mode, a plurality of antenna resonance modes can be realized, the antenna has the advantages of small signal reflection and balanced radiation direction, the external radiation efficiency of the antenna can be improved, and the wireless data transmission scene requirements under the conditions of long distance and through a wall can be fully met.

The present application relates to a kind of printed wiring board deep jump layer hole processing method and printed wiring board, wherein printed wiring board deep jump layer hole processing method includes the following steps: providing printed wiring board with multilayer structure, the printed wiring board includes target inner layer;The depth control drilling processing is carried out to the printed wiring board, to form blind hole from the surface of the printed wiring board to the direction of the target inner layer, the bottom of the blind hole and the target inner layer between remaining preset thickness insulation layer;The laser drilling processing is carried out to the blind hole of the depth control drilling processing completion, to remove the insulation layer reserved at the bottom of the blind hole, until the target inner layer is exposed, to form the jump layer hole that the surface of the printed wiring board and the target inner layer are communicated.The method of the present application can complete high-quality jump layer hole processing from surface layer to deep layer inner layer in printed wiring board under the premise of keeping small aperture.

The utility model discloses a kind of ball grid array packaging structure and PCB of guaranteeing impedance continuity, by the asymmetric spacing of control signal unit and two side ground unit, so that signal unit is offset to one side ground unit, the trace channel of the other side of signal unit is widened, the trace channel of widened not only can double trace, but also can be with thicker line width, so that the characteristic impedance of differential line is consistent on signal transmission path, significantly reduce signal reflection and waveform distortion risk, especially suitable for high-frequency, high-speed signal transmission scene, can ensure signal integrity.

The utility model discloses a hybrid capacitor with a protection function, which relates to the technical field of capacitors and comprises a connecting base and two groups of ceramic chips arranged at the top of the connecting base, a first capacitor chip is arranged between the two groups of ceramic chips, and a second capacitor chip is further arranged between the two groups of ceramic chips. The top of the connecting base is provided with a connecting groove, and the outer side of the connecting base is provided with a heat dissipation opening, so that the problems that the ESL of the existing hybrid capacitor is relatively large, so that the insertion loss of a high-frequency and decoupling circuit is large, and when the hybrid capacitor is used at a position with relatively strong signal interference, high inductance interference is easily caused to the capacitor; according to the high-frequency communication device, the capacitor structure can be applied to the high-frequency communication device, and meanwhile, the stability of the whole structure is improved.

The invention discloses a low noise amplifier and a wireless transceiver system. The low-noise amplifier comprises an input matching network, a first-stage amplification network, an inter-stage matching network, a second-stage amplification network and an output matching network. The input end of the input matching network inputs a single-ended signal, and the output end is connected with the first end of the first-stage amplification network; the third end of the first-stage amplification network is connected with the first end of the inter-stage matching network, and the fourth end is grounded; the second end of the inter-stage matching network is connected with the first end of the second-stage amplification network, the third end of the inter-stage matching network is connected with the second end of the second-stage amplification network, and the fourth end of the inter-stage matching network is connected with the third end of the second-stage amplification network; the first end of the output matching network is connected with the fourth end of the second-stage amplification network, the second end is connected with the fifth end of the second-stage amplification network, and the third end and the fourth end output differential signals. According to the technical scheme provided by the embodiment of the invention, the conversion of the radio-frequency signal from a single end to a differential end can be realized, and the low-noise performance is realized on the premise of low power consumption.

The invention relates to a multifunctional multi-scene application device for pulling out an equipment joint, which comprises two clamp arms with equal length, a hole is formed in the central area of each clamp arm, a rotating shaft is arranged in each hole, and the two clamp arms are connected through the rotating shaft; one end of each clamp arm is an LC / SC optical fiber connector pulling end, and the other end of each clamp arm is an FC optical fiber connector and coaxial cable connector pulling end; the tail end of the LC / SC optical fiber connector pulling end is provided with a miniature clamping jaw. Tail ends of the FC optical fiber pulling connector and the coaxial cable connector end are provided with clamp heads. According to the invention, the efficiency, the convenience and the safety of the joint pull-out operation can be improved, and the risk of damage to lines and equipment due to misoperation can be effectively reduced.

The present invention discloses a DDR topology structure and a PCB board, wherein the DDR topology structure includes a main segment routing connecting a central node and a control signal transmitting end, a first DDR connected to a termination resistor through at least one termination routing, and a second DDR connected to the central node through multiple segment routings. Since the DDR topology structure provided by the present invention is not symmetrically arranged, such a DDR topology structure can realize the layout of an odd number of DDRs and improve signal integrity; at the same time, since the first DDR is terminated with the termination resistor, the termination resistor can reduce the signal reflection of the first DDR and improve the signal quality; and various devices in the DDR topology structure are distributed along multiple directions respectively, which can reduce the wiring area compared with the fly-by topology structure which is only arranged in a chain along one direction.

The utility model provides a quick-plug type radio frequency test connector, which comprises an outer conductor, a central conductor, a perforated insulator and an elastic joint, the inner part of the outer conductor is hollow, the central conductor is coaxially arranged in the outer conductor, the perforated insulator is arranged between the outer conductor and the central conductor, and the elastic joint is arranged at one side of the inner part of the outer conductor. Through the arrangement of the elastic joint structure, the quick-plug radio frequency test connector can realize plug-and-test with radio frequency test equipment, and overcomes the problem of low test efficiency caused by threaded butt joint in the prior art.

The utility model relates to passive device technical field discloses a kind of attenuating piece type absorbency high-frequency load device, including the circular recess being opened in the heat dissipation shell inside, the cylindrical cavity is fixedly installed in the circular recess inside, the first recess is opened in the cylindrical cavity inside, the high-frequency (24G) attenuating piece is fixedly installed in the first recess, the high-frequency (24G) attenuating piece side and the circular recess bottom in heat dissipation shell abut;This kind of attenuating piece type absorbency high-frequency load device, rotates bolt by inside hexagonal spanner, makes and connects the sliding block of rotating bolt sliding into the Ω type recess formed between high-frequency device attenuating piece and cylindrical cavity, fine tuning to its cavity internal impedance, to reduce its reflected standing wave ratio, increase its effective absorption high-frequency (24G) signal energy efficiency, and sliding block also pledge high-frequency device attenuating piece makes high-frequency device attenuating piece and cylindrical cavity contact effect better, reduce signal reflection.