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5975results about "Waveguide type devices" patented technology

Megawatt corrugated waveguide attenuator

The invention discloses a megawatt corrugated waveguide attenuator. A first standard corrugated waveguide segment, a second smooth waveguide segment, a third mode changing waveguide segment, a fourth main attenuation waveguide segment, a fifth mode changing waveguide segment, a sixth smooth waveguide segment, a seventh mode changing waveguide segment and an eighth standard corrugated waveguide segment are sequentially arranged on a waveguide tube, wherein the first standard corrugated waveguide segment supports HE11 mode transmission, the second smooth waveguide segment achieves conversion from an HE11 mode to a TE11 and TM11 hybrid mode, the third mode changing waveguide segment achieves conversion from the TE11 and TM11 hybrid mode to an EH11 mode, the fourth main attenuation waveguide segment conducts attenuation on power, the fifth mode changing waveguide segment achieves conversion from the EH11 in the surplus power to a TE11 mode, the sixth smooth waveguide segment is used for TE11 mode transmission, the seventh mode changing waveguide segment achieves conversion from the TE11 mode to an HE11 mode, and the eighth standard corrugated waveguide segment supports HE11 mode transmission. According to the megawatt corrugated waveguide attenuator, the uniformity of the power attenuation magnitude per unit length inside the whole main attenuation segment can be achieved due to the design of periodic corrugations; due to the special design of waterways, the impact of high-flow-rate cooling water on waveguide walls can be reduced, and the consistency of the flow rate of the water in the whole water jacket can also be ensured.
Owner:INST OF PLASMA PHYSICS CHINESE ACAD OF SCI

Modular transmission system and method

A modular broadband transmission system and method include an input signal connector that receives an input signal which is then divided into N parts and amplified with an amplifier have N power amplifier modules. Outputs of the N power amplifier modules are passed through transmission lines and to a radial combiner that combines the outputs. The radial combiner, transmission lines and power amplifier modules are configured such that if one of the power amplifier modules fails, the other power amplifier modules may still operate acceptable well, with minimal impact on total output power. An output of the amplifier is provided to a coupler that measures a power level of the output signal and feeds the measured power level back to a controller where the controller adjust an overall output power based on the number of the power amplifier modules that are functioning properly. Each of the power amplifier modules have a processor such that respective of the power amplifier modules may be taken off-line, and replaced while the other power amplifier modules continue to operate in a transmit mode of operation. The modular broadband transmission system and method may conveniently be used as either a broadband booster for amplifying a plurality of input signals, or a head and transmitter configured to amplify one or more different input signals.
Owner:THALES BROADCAST & MULTIMEDIA

Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities

A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.
Owner:GLOBALFOUNDRIES US INC
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