918results about "Antenna arrays manufacture" patented technology

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

A antenna array (20) includes a plurality of periodic or aperiodic arranged sub-arrays (22). Each sub-array (22) includes a plurality of antenna elements (32) arranged in the form of a spiral (30). The sub-arrays (22) can comprise various spiral shapes to provide the required physical configuration and operational parameters to the antenna array (20). The elements (32) of each sub-array (22) are arranged to minimize the number of such elements (32) that intersect imaginary planes perpendicular to the spiral and passing through the spiral center. Such an orientation of the elements (32) minimizes grating lobes in the antenna pattern.

A vertically stacked array antenna structure is described. The structure comprises a radiating layer, a passive layer disposed under said radiating layer, an active layer disposed under said passive layer, and an interface assembly. The radiating layer comprises an array of radiating elements. The passive layer has only passive components. At least a part of the passive components includes an array of RF duplexers corresponding to the array of radiating elements. The active layer comprises RF amplifiers. The interface assembly comprises at least one metallic frame which is in direct thermal coupling with the RF amplifiers. The interface assembly is configured for providing thermal communication of the active layer with a heat exchanger.

An antenna array comprises a substrate; a plurality of projecting, tapering structures disposed in an array and attached to a first major surface of said substrate, the plurality of projecting, tapering structures defining a plurality of waveguides therebetween; and a plurality of box-shaped structures disposed in an array and attached to a second major surface of the substrate, the plurality of box-shaped structures defining a plurality of waveguides therebetween, the plurality of waveguides defined by the plurality of projecting, tapering structures aligning with the plurality of waveguides defined by the plurality of box-shaped structures. The substrate includes a plurality of probes for feeding the plurality waveguides.

The invention is directed to a wireless network arrangement in which nodes comprise multi-faceted multi-beam antennas and in which wireless backhaul is provided using those multi-faceted multi-beam antennas. In particular, the invention is directed to a wireless communication node comprising: an antenna defining a first wireless coverage area and a second wireless coverage area. The first wireless coverage area extends in a first beam pattern and the second wireless coverage area extends in a second beam pattern and the second beam pattern comprises at least one directional beam having a direction which is variable. Associated apparatus, methods, programs, and subscriber services are also provided.

Methods and apparatus are presented which reduce the overall cost and increase the imaging capability for medium and long range automotive radar sensing applications through the combination of a high signal-to-noise ratio and wide dynamic range radar waveform and architecture, antenna arrangement, and a low cost packaging and interconnection method. In accordance with aspects of the present invention, one way a high signal-to-noise ratio and wide dynamic range imaging radar with reduced cost can be achieved is through the combination of a pulsed stepped-frequency-continuous-wave waveform and electrically beam-switched radar architecture, utilizing a planar package containing high-frequency integrated circuits as well as integrated high-frequency waveguide coupling ports, coupled to a multi-beam waveguide-fed twist-reflector narrow beam-width antenna. Other methods and apparatus are presented.

Exemplary embodiment can utilize the properties of tunable thin-film, material (e.g., graphene) to efficiently modulate the intensity, phase, and/or polarization of transmitted and/or reflected radiation, including mid-infrared (“mid-IR”) radiation. Exemplary embodiments include planar antennas comprising tunable thin-film material sections and metallic sections disposed in contact with the tunable thin-film material sections, each metallic section having a gap with at least one dimension related to a wavelength of the radiation, which in some embodiments may be less than the wavelength. The metallic layer may comprise rods arrange in one or more shapes, or one or more apertures of one or more shapes. Embodiments of the antenna may also comprise a substrate, which may be a semiconductor or conductor in various embodiments. Embodiments also include systems, computer-implemented methods, devices, and computer-readable media for effectuating desired modulation of incident radiation by, e.g., varying the doping level of the tunable thin-film material.

An antenna includes an antenna layer, a coupling layer, and a feeder circuit layer. The antenna layer includes antennas elements. First and second antennas elements are arranged in such a manner that the centers thereof are aligned in a first direction. A third antenna element is arranged in such a manner that the third antenna element is separated from the first antenna element in a second direction and centers of the antennas elements are not aligned in the second direction. A waveguide is formed in the coupling layer.

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first substrate, a second substrate, an interposer substrate, a semiconductor chip, a package body and a first antenna layer. The first substrate comprises a grounding segment. The interposer substrate is disposed between the second substrate and the first substrate. The semiconductor chip is disposed on the second substrate. The package body encapsulates the second substrate, the semiconductor chip and the interposer substrate, and has a lateral surface and an upper surface. The first antenna layer is formed on the lateral surface and the upper surface of the package body, and electrically connected to the grounding segment.

A modular feed network is provided with a segment base provided with a feed aperture, a corner cavity at each corner and a tap cavity at a mid-section of each of two opposite sides. A segment top is provided with a plurality of output ports. The segment top is dimensioned to seat upon the segment base to form a segment pair. the segment base provided with a plurality of waveguides between cavities of the segment base. The modular feed network is configurable via a range of feed, bypass and/or power divider taps seated in the apertures and/or cavities to form a waveguide network of varied numbers of output ports by routing across one or more of the segment tops. For example, the modular feed network may comprise 1, 4 or 16 of the segment bases retained side to side.

A phased array antenna includes a semiconductor wafer, with radio frequency (RF) circuitry fabricated on top side of the semiconductor wafer. There is an array of antenna elements above the top side of the semiconductor wafer, and a coaxial coupling arrangement coupling the RF circuitry and the array of antenna elements. The coaxial coupling arrangement may include a plurality of coaxial connections, each having an outer conductor, an inner conductor, and a dielectric material therebetween. The dielectric material may be air.

A compact waveguide antenna array feed system provides antenna element ports spaced along an array face by less than one free-space wavelength in at least one dimension, while retaining a thickness in a direction perpendicular to the array face of less than one and one-half free-space wavelength.

An integrated phased array including an array of antenna elements (130), a plurality of waveguides (122), a beam forming network (120), and an RF switch (110). The phased array may further comprise a monolithic integration module (160) comprising a dielectric layer (165) sandwiched between two conductive layers (166, 167).

A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards. A quick connect/disconnect assembly is operative with the housing for allowing the housing to be rapidly connected and disconnected to the antenna circuit contact members interconnect circuits between boards.