6582 results about "Microstrip" patented technology

A wireless communication system is provided that includes an antenna structure adapted for coupling to a medical device antenna when the medical device is not implanted in a patient's body. The antenna structure effectively extends the medical device antenna length, thereby improving the efficiency and reliability of a communication link between the medical device and a programmer or monitor outside the implanted environment. The antenna structure is fabricated from any conductive material, which may be in the form of conductive wire, tape, ink, foil, film, adhesive or the like, and is attached to a portion of a medical device packaging assembly or another accessory device or substrate such as a pouch or overlay. The antenna structure may be a monopole, dipole, slot antenna, microstrip patch, or loop antenna, and may be fixed or movable relative to the substrate on which it is implemented.

Methods and systems for a smart antenna utilizing leaky wave antennas (LWAs) are disclosed and may include a programmable polarization antenna including one or more pairs of LWAs configured along different axes. One or more pairs of leaky wave antennas may be configured to adjust polarization and/or polarity of one or more RF signals communicated by the programmable polarization antenna. RF signals may be communicated via the configured programmable polarization antenna utilizing the configured one or more pairs of the leaky wave antennas. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The polarization and/or polarity may be configured utilizing switched phase modules. The LWAs may include microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The LWAs may be integrated in one or more integrated circuits, packages, and/or printed circuit boards.

The invention relates to the technical field of radar, in particular to a millimeter-wave quasi-optical integrated dielectric lens antenna and an array thereof. The array consists of a microstrip integrated antenna, a dielectric lens, an objective lens, an array base, a reflecting mirror, a protective cover and a beam transfer switch; one end face of the dielectric lens is a hemisphere or an ellipsoid, while the other end face is a cylindrical section; the microstrip integrated antenna is generated by an dielectric substrate, the front surface of the dielectric substrate is closely adhered tothe cylindrical section of the dielectric lens and serves as a feed source, and the back surface is grounded; the hemispherical or ellipsoidal end face of the dielectric lens is an antenna radiating surface; the length of the cylindrical part of the dielectric lens can be changed; the antenna array is arranged into a linear array or an area array; the array base and the reflecting mirror have conical quasi-optical reflecting mirror surfaces; the focus of the objective lens of the linear array or the area array aligns with the central line of the dielectric lens; the protective cover is arranged outside; and the antenna array is controlled by the beam transfer switch. The antenna structure has strong shock resistance and dust prevention, and is suitable for millimeter-wave radars for planes, automobiles and ships, and receiving/emitting sensing of communication equipment.

A dual-polarized microstrip antenna includes: at least one metal radiating patch, i.e. a first metal radiating patch; at least one ground metal layer whereon excitation micro-slots are etched; at least one dielectric layer, i.e. a first dielectric layer it is preferred that the dielectric layer is a resonant dielectric layer such as a resonant dielectric layer of air or other layers of optimization resonant materials; at least one set of bipolar excitation microstrip lines; the dielectric layer is between the first metal radiating patch and the ground metal layer. The dual-polarized microstrip antenna of multi-layer radiation structure is designed in a relatively small volume, which effectively saves the cost of antenna installation and maintenance, and is widely applied in the fields of mobile communication and internet technology.

The invention relates to millimetric packaged electronic components for applications at high frequencies greater than 45 GHz. According to the invention, to facilitate the design of a system including MMIC chips working at these frequencies, it is proposed to use packages containing one or more chips, these packages making it possible to work at these frequencies and including two types of port: a port with transition by contactless electromagnetic coupling providing a connection with an antenna at the high working frequency F via a waveguide; and a port with microstrip or coaxial line type transition enabling a connection at a subharmonic frequency F/N (preferably N=6 or 4 or, if necessary, 3) of the working frequency.

Methods and systems for an integrated voltage controlled oscillator (VCO)-based transmitter and on-chip power distribution network are disclosed and may include supplying bias voltages and/or ground to a chip utilizing conductive lines. One or more VCOs and low-noise amplifiers (LNAs) may each be coupled to a leaky wave antenna (LWA) integrated in the bias voltage and/or ground lines. One or more clock signals may be generated utilizing the VCOs, which may be transmitted from the LWAs coupled to the VCOs, to the LWAs coupled to the LNAs. RF signals may be transmitted via the LWAs, and may include 60 GHz signals. The LWAs may include microstrip and/or coplanar waveguides, where a cavity length of the LWAs may be dependent on a spacing between conductive lines in the waveguides. The LWAs may be dynamically configured to transmit the clock signals at a desired angle from a surface of the chip.

A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

A effectively balanced dipole antenna is provided comprising an unbalanced microstrip antenna having a transmission line interface and a planar balun connected to the transmission line interface of the antenna. The balun can be coplanar or multi-planar. For example, a coplanar balun includes an unbalanced coplanar transmission line, with a signal line interposed between a pair of coplanar grounds, and a pair of planar stubs plan-wise adjacent the coplanar grounds. The coplanar grounds are connected to the plane stubs with conductive lines proximate to the antenna transmission line interface. A microstrip planar balun includes an unbalanced microstrip signal line, a microstrip ground formed on the dielectric layer underlying the signal line, and a pair of planar stubs, plan-wise adjacent the microstrip ground. The planar stubs can be located on the same dielectric layer as the signal line or the ground. A stripline planar balun is also provided.

Disclosed relates to a microstrip antenna, particularly, relates to a dual band microstrip antenna including two slots. The microstrip antenna includes a conductor plate having a first hole and a substrate having a microstrip patch where slots of two different sizes are positioned, the substrate being located on a top of the conductor plate.

High-frequency couplers and coupling techniques are described utilizing artificial composite right/left-handed transmission line (CRLH-TL). Three specific forms of couplers are described; (1) a coupled-line backward coupler is described with arbitrary tight/loose coupling and broad bandwidth; (2) a compact enhanced-bandwidth hybrid ring coupler is described with increased bandwidth and decreased size; and (3) a dual-band branch-line coupler that is not limited to a harmonic relation between the bands. These variations are preferably implemented in a microstrip fabrication process and may use lumped-element components. The couplers and coupling techniques are directed at increasing the utility while decreasing the size of high-frequency couplers, and are suitable for use with separate coupler or couplers integrated within integrated devices.

A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

The invention relates to a device for guiding electromagnetic waves from a wave guide (10), in particular a multi-band wave guide, to a transmission line (20), in particular a micro strip line, arranged at one end of the wave guide (10), comprising coupling means (30-1, . . . , 30-7) for mechanical fixation and impedance matching between the wave guide (10) and the transmission line (20). It is the object of the invention to improve such a structure in the way that manufacturing is made easier and less expensive than according to prior art. According to the present invention that object is solved in the way that the coupling means comprises at least one dielectric layer (30) being mechanically connected with the main plane of the transmission line, the geometric dimension of that at least one dielectric layer extending along the propagation direction of the electromagnetic waves being correlated with the center frequency of electromagnetic waves in order to achieve optimised impedance matching.

A waveguide bandpass filter for use in microwave and millimeter-wave satellite communications equipment is presented. The filter is based on a substrate integrated waveguide (SIW) having several cascaded oversized SIW cavities. The filter is implemented in a printed circuit board (PCB) or a ceramic substrate using arrays of standard metalized via holes to define the perimeters of the SIW cavities. Transmission lines of a microstrip line, a stripline or coplanar waveguide are used as input and output feeds. The transmission lines have coupling slots for improved stopband performance. The filter can be easily integrated with planar circuits for microwave and millimeter wave applications.

A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The method comprises, first, providing a substrate. The substrate is etched through to form holes for planned shielded vias with microstrip ground plane. A first dielectric layer is formed overlying the top side of the substrate and lining the holes. A first conductive layer is deposited overlying the first dielectric layer and lining the holes. A second dielectric layer is deposited overlying the first conductive layer and lining the holes. A second conductive layer is deposited overlying the second dielectric layer and filling the holes. The second conductive layer is planarized to confine the second conductive layer to the holes and to thereby complete the shielded vias with microstrip ground plane. Silicon carrier modules and stacked, multiple integrated circuit modules are formed using shielded vias with microstrip ground plane to improve RF performance.

A fixed frequency continuously beam-steerable leaky-wave antenna in microstrip is disclosed. The antenna's radiating strips are loaded with identical shunt-mounted variable-reactance elements, resulting in low reverse-bias-voltage requirements. By varying the reverse-bias voltage across the variable-reactance elements, the main beam of the antenna may be scanned continuously at fixed frequency. The antenna may consist of an array of radiating strips, wherein each strip includes a variable-reactance element. Changing the element's reactance value has a similar effect as changing the length of the radiating strips. This is accompanied by a change in the phase velocity of the electromagnetic wave traveling along the antenna, and results in continuous fixed-frequency main-beam steering. Alternatively, the antenna may consist of two long radiating strips separated by a small gap, wherein identical variable-reactance elements are mounted in shunt across the gap at regular intervals. A continuous change in the reactance value has a similar effect as changing continuously the width of the radiating strips. This results in a continuous change in the phase velocity of the electromagnetic wave traveling along the antenna, thereby achieving continuous fixed-frequency main-beam steering.

A dual-polarization wireless base station antenna that implements vertical electrical downtilt and sidelobe reduction using beam steering circuit that includes a variable power divider and a multi-beam beam forming network. The variable power divider includes a single adjustable control element to divide an input voltage signal into a pair of complimentary amplitude voltage drive signals that exhibit matched phase and constant phase delay through the variable power divider. The beam forming network is configured as a double-sided, edge-connected microstrip module mounted to a main panel, which support the antenna elements in a vertical column organized into sub-arrays in a manner that implements sidelobe reduction. The power distribution network connecting the beam steering network to the antenna elements implements beam tilt bias and sidelobe reduction through coordinated phase shifting implemented through transmission media trace length adjustment.

A system having a UHF RFID transceiver is adapted to communicate exclusively with a single electro-magnetically coupled transponder located in a predetermined confined transponder operating region. The system includes a near field coupling device comprising a plurality of lines connected in parallel with an unmatched load. The near field coupling device may be formed, for example on a printed circuit board with a plurality of electrically interconnected traces and a ground plane. The system establishes, at predetermined transceiver power levels, a mutual electro-magnetic coupling which is selective exclusively for a single transponder located in a defined transponder operating region. Also included are methods for selective communication with the transponder in an apparatus such as a printer-encoder.