The invention provides an electro-thermal-magnetic-force
coupling field
finite element simulation life prediction method for a board-level
electronic packaging device, relates to the field of
electronic packaging reliability analysis and
finite element simulation, and aims to solve the problems that life prediction depends on single /
partial field coupling, neglects the influence of electromagnetic force and
magnetic field, lacks a multi-field transmission mechanism, and cannot predict the life of the board-level
electronic packaging device. Therefore, the problems of large prediction deviation and incapability of realizing full-field
coupling are solved. According to the method, a real
welding spot model is firstly built and repaired, a board-level packaging three-dimensional structure
subdivision grid is constructed, electromagnetic force and additional heat are obtained through electro-magnetic coupling, heat-force coupling loading is input to calculate
heat stress, at least two fatigue models are substituted, and the service life of a key
welding spot is calculated. Electro-thermal-magnetic-force full-coupling
simulation is achieved, life prediction precision is improved through multi-model fusion, multi-
package and multi-load
adaptation is achieved, a reliable basis is provided for electronic
package design, the test period is shortened, the experiment cost is reduced, and development of
package reliability research towards multi-field life prediction is promoted.