547results about "Protective material radiating elements" patented technology

An antenna assembly can include a base portion and a cover, the cover configured to be removably coupled to the base portion. The antenna assembly can include a modem positioned on or above the base portion, a ground plane, and a multi-band antenna.

An aircraft-mounted mobile communicator for communicating with one or more satellites or base stations is disclosed. The aircraft-mounted mobile communicator includes a radome structure and one or more antenna elements embedded within or proximate to a shell of the radome structure that maximizes an aperture of the one or more antenna elements, wherein the one or more antenna elements are configured to operate over one or more frequency bands.

The invention provides an integrated package and a method of manufacturing the same. The integrated package includes: an antenna module, the antenna module including an antenna module substrate and a top antenna structure, the top antenna structure disposed on the antenna module substrate; a first sealant that seals the antenna module; a first redistribution structure disposed on a bottom surface of the first encapsulant, the first redistribution structure including a bottom antenna structure configured to be electromagnetically energetically coupled with the top antenna structure; and a semiconductor chip mounted on a bottom surface of the first redistribution structure and electrically coupled with the bottom antenna structure.

A dadome with a surface varying refraction angle for phased array antennas, includes an electromagnetic wave active area which consists of a dielectric substrate and two dual-polarized meta-surfaces. The dual-polarized meta-surfaces are made of plurality of periodically arranged metallic meta-atoms with open, rotational symmetric, and non-continuous geometrical patterns. The meta-atoms overlap complementarily between the two sides of the dielectric substrate and are periodically arranged into at least two groups covering a space region the angular radiation pattern of a planar array antenna. The geometric dimensions of the meta-atoms vary within each group so that to form an electromagnetic transmissive phase gradient within that group and different from one group to another. The periodicity Δp of the meta-atoms is between λ / 4 and λ / 1.3, λ being the wavelength of an incident electromagnetic wave from a planar array antenna.

[0060] The invention relates to a high-frequency chip arrangement 100. The high-frequency chip arrangement comprises a high-frequency chip 112 configured to radiate and receive high-frequency waves, and a first housing 114, 115 having a cavity, consisting of a housing cover 115 and a substrate 114, wherein the first housing surrounds the high-frequency chip when the housing cover is attached to the substrate. The high-frequency chip is arranged on a top surface of the substrate such that it radiates the high-frequency waves away from the substrate. The substrate, the high-frequency chip, and the first housing form a module 110.The high-frequency chip arrangement has a second housing 120 that surrounds at least the module, wherein an intermediate space 121 between the module and the second housing is filled with a potting compound 104, so that the module is completely surrounded by the potting compound and the high-frequency waves pass through the first housing, the potting compound, and the second housing.

An antenna device for automotive radar applications includes a printed circuit board having a front face and a back face and an electronic component which is interconnected to the printed circuit board and an antenna layer having a front face and a back face, which back face is interconnected to the front face of the printed circuit board. At least one waveguide aperture is interconnected to the front face of the antenna layer and is communicatively connected to the electronic component by at least one waveguide channel, wherein the at least one waveguide channel comprises a conductive surface for guiding an electromagnetic field between the electronic component and is formed by a recess arranged between the back face of the antenna layer and the front face of the printed circuit board.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

Disclosed herein are implementations of systems and methods for providing antenna in package flexible components of wearable devices. A system can include a flexible component having a back plane layer disposed along a length of the flexible component. The system can include an antenna package having an insulating layer comprising a dielectric material disposed above the back plane layer and a circuitry layer disposed above at least a portion of the insulating layer and comprising one or more electrical components for processing antenna signals. The antenna package can include an antenna layer comprising an antenna pattern disposed above the circuitry layer and configured for wireless communication of the antenna signals using the wearable device. The back plane layer can be disposed between antenna layer and a surface of the flexible component configured to interface with a user wearing the wearable device.

A biostimulator, such as a leadless cardiac pacemaker, having a patch antenna integrated into a housing, is described. The housing includes an annular wall that contains electronic circuitry of the biostimulator and provides a ground plane of the antenna. The patch antenna includes a meandering trace embedded in a curved dielectric layer that is mounted on the annular wall. The trace provides a conductor of the antenna and the dielectric layer provides a dielectric substrate of the antenna between the conductor and the ground plane. The electronic circuitry contained within the annular wall is electrically connected to the trace via an electrical feedthrough that passes through the annular wall and the dielectric layer. The electrical feedthrough places the electronic circuitry in communication with the antenna to transmit or receive wireless communication signals from an external device. Other embodiments are also described and claimed.

A cascadable radar element for use in a radar measuring device for carrying out a digital beam transformation process, having at least one transmitting antenna and at least one receiving antenna which are integrated in the radar element, as well as an input connection and an output connection for local oscillator signals.

An integrated package and a method for making the same are provided. The integrated package includes: an antenna module including: an antenna module substrate; and a top antenna structure disposed on the antenna module substrate; a first encapsulant encapsulating the antenna module; a first redistribution structure disposed on a bottom surface of the first encapsulant, wherein the first redistribution structure includes a bottom antenna structure configured for coupling electromagnetic energy with the top antenna structure; and a semiconductor chip mounted on a bottom surface of the first redistribution structure and electrically coupled with the bottom antenna structure.

This antenna device is provided with a rectifier circuit which receives radio waves in space and the electric field energy of a quasi-electrostatic field and rectifies an AC signal to DC, and comprises an antenna unit which is configured from a first antenna element which is used in contact with a human body in a state in which the human body is not grounded to a ground that is the earth, and a second antenna element which is a separate conductor from the first antenna element and which is provided so as not to contact the human body. An input line for outputting to the rectifier circuit the part of the AC signal outputted from the antenna unit that is from the first antenna element used in contact with the human body, is connected in series with the rectifier circuit. FIG. 2

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

Scalable and easily manufactured cavity resonator radiator arrays for millimeter wave or terahertz phased array antenna applications are provided. In one aspect, an antenna device includes: a first component including a substrate having antenna feedlines within a first dielectric and a ground plane disposed on the first dielectric; a second component, coupled to the first component, including a metallic grid having a plurality of cavities filled with a second dielectric to provide an array of cavity resonator radiators, where the ground plane includes aperture slots between the antenna feedlines and the cavity resonator radiators. The antenna feedlines can include first and second antenna feedlines for dual-polarization, located in different layers, for enhanced port isolation. A method of forming an antenna device is also provided where the metallic grid having the plurality of cavities filled with the second dielectric can be formed using 3D printing, metal stamping and / or laser cutting.

An antenna module includes a mounting board with a flat plate shape, and a power supply circuit to supply a radio frequency signal. The power supply circuit is mounted on the mounting board, and a radiating electrode is arranged on the power supply circuit. A dielectric fills a region around the power supply circuit and the radiating electrode. A conductive layer covers at least part of the dielectric. In the dielectric, a lens part is formed at a position overlapping the radiating electrode in plan view of the mounting board. The dielectric includes a first region in which the lens part is formed and a second region other than the first region, and the conductive layer is formed in the second region.

The invention relates to a radar antenna device (1) for a vehicle (20), comprising a composite window pane (2) and at least one radar device (13) configured to transmit and / or receive a radar beam (6). The at least one radar device (13) comprises a corresponding antenna unit (5) and a corresponding amplifier unit (12). The amplifier unit (12) is configured to provide an electrical drive signal (8) to the antenna unit (5) and / or to receive an electrical echo signal (9) from the antenna unit (5). The invention provides that the antenna unit (5) is arranged in the composite window pane (2) of the vehicle (20), the amplifier unit (12) is arranged on a surface of the composite window pane (2), and the antenna unit (5) and the amplifier unit (12) are spatially separated from each other and are electrically conductively connected to each other via a connecting element (11) arranged in the composite window pane.

An antenna module (100) is provided with a dielectric substrate (130), a radiation element (121), a ground electrode (GND), power supply wiring (140), a via (V1) connected to the radiation element (121), and an auxiliary electrode (150). The dielectric substrate has main surfaces (131, 132) facing each other. The ground electrode is disposed farther to the main surface (132) side in the dielectric substrate than the radiation element, so as to face the radiation element. The power supply wiring transmits a high-frequency signal to a power supply point (SP1) of the radiation element. The auxiliary electrode is connected to the via and is disposed between the radiation element and the ground electrode. The power supply point is disposed at a position offset from the center of the radiation element in a first direction. The via is connected to the radiation element at a position offset from the center of the radiation element in a second direction opposite to the first direction. In a plan view from the normal direction of the dielectric substrate, the auxiliary electrode protrudes from the radiation element in the second direction.

Provided is an antenna integrated structure in which an antenna is inserted into ground vehicle, marine ship and aircraft structure, and more particularly, a sandwich panel type antenna integrated latticecore having a structure for improving communication performance of an antenna module.

An antenna module of an electronic device is implemented as a phased array antenna implemented on a dielectric cover substrate. The dielectric substrate may comprise: a first layer having a first conductive layer including a first opening and a second opening on a surface of the dielectric substrate; a second layer having a second conductive layer including a fourth opening and a fifth opening in the dielectric substrate; and a third layer having a third conductive layer including a third opening in the dielectric substrate. The antenna module may comprise: a dielectric cover layer; and a dielectric substrate having a surface mounted facing the dielectric cover layer.

This application relates to a radiating element and an antenna. The radiating element includes two sets of orthogonally polarized half-wave dipoles and two feed components. Each set of half-wave dipoles includes two radiators arranged at relative intervals. The two feed components are arranged one-to-one with the two sets of half-wave dipoles. Each feed component includes a metal support and a feed element. One end of the metal support is electrically connected to one of the radiators of the corresponding half-wave dipole, and the other end of the metal support is used for grounding. The feed element is electrically connected to the other radiator of the corresponding half-wave dipole. The radiating element provided by this application is small in size and lightweight.

The application discloses a built-in radio frequency antenna for a radio frequency negative hydrogen ion source and a manufacturing process, the radio frequency antenna has 2.5-3.5 turns, and the average loop diameter is 58mm; the coating of the built-in radio frequency antenna is an enamel structure, when the enamel structure simultaneously satisfies the conditions that the coating thickness is 0.6-0.7mm, the relative dielectric constant is less than 30, and the coating resistivity is greater than 45000Ω.cm, the warping voltage is close to 0; the process method comprises the following steps: manufacturing a sheet-shaped porcelain enamel; covering layer dipping; drying the copper antenna with the covering layer; firing the finished product; putting the dried copper antenna with the glaze into a melting furnace for firing and heat preservation; taking out the finished product and cooling to normal temperature. The steps (2) to (4) are repeated until the thickness of the glaze layer reaches about 0.6-0.7mm. The application effectively solves the problem of plasma back-bombing antenna, and the enamel coating is adopted, so that the cost is low, the manufacturing is simple, the material is solid, and the adhesion, impact resistance and thermal shock resistance are excellent.

This method for manufacturing a transparent antenna module comprises: a mask pattern formation step for forming mask patterns for antenna patterning on glass or a transfer substrate; an antenna pattern formation step for forming antenna patterns on the glass or the transfer substrate so as to insert the antenna patterns between the mask patterns; and a mask pattern removal step for removing the mask patterns from the upper portion of the glass or the transfer substrate so that only the antenna patterns are arranged on the glass or the transfer substrate.

Transmitter network antenna cell The present description relates to a transmitter network antenna cell (105) comprising: – a semiconductor substrate (201); – a first polarizer (207a), located on the side of a first face (201a) of the semiconductor substrate; – a second polarizer (207b), located on the side of a second face (201b) of the semiconductor substrate opposite the first face; and – at least one radiating element (203-1, 203-2) interposed between the second face (201b) of the semiconductor substrate and the second polarizer (207b), said at least one radiating element being adapted to switch between at least two phase states. Abbreviation figure: Fig. 2

This electronic component module that is attached using a hot melt adhesive agent to a member provided with a conductor pattern comprises: a first base; a coupling electrode that is provided on a first surface of the first base for electromagnetic coupling with the conductor pattern; and a second base that is provided on the first surface of the first base to cover the coupling electrode. The thermal resistance between the coupling electrode and the second base is smaller than the thermal resistance between the coupling electrode and the first base.

The invention belongs to the technical field of antennas and microwaves, and discloses an antenna housing integrated array antenna unit and system. The antenna unit comprises a main shell, a parasitic patch layer, an auxiliary shell, a main patch layer, a printed board feed layer, a reflection bottom plate, a radio frequency coaxial connector and screws. According to the antenna unit, broadband wide-angle scanning can be realized through slot coupling and parasitic patch loading; according to the invention, current transmission is destroyed or resonance is caused by slotting and the like, and second and third harmonics are inhibited; by designing the shape of the patch, the link loss can be reduced, and the antenna efficiency is improved; the antenna array plane architecture of the traditional ground radar is that an antenna and an antenna housing are independently designed, and the antenna and the antenna housing are integrally designed, so that the link loss is reduced; the metal layer is plated inside the PPS medium, the PPS medium has characteristics, and the antenna material has a protection function and is good in environmental adaptability.

An antenna element includes an insulative substrate including first and second main surfaces arranged in an up-down direction. At least one antenna conductor layer is provided on the first main surface of the insulative substrate. At least one insulative substrate non-forming region is provided between the insulative substrate and the antenna conductor layer in the up-down direction. An insulator layer does not exist in the at least one insulative substrate non-forming region. When seen in the up-down direction, all of an outer boundary of at least one antenna conductor overlaps the at least one insulative substrate non-forming region and is not in contact with the insulative substrate. At least one of the at least one insulative substrate non-forming region includes a void.

The resin composition contains a curable resin and carbon particles, and the carbon particles satisfy at least one of the following (1) and (2). (1) The pH is 5.0 or less. (2) The average particle diameter is 80 nm or more.

Provided are an IC tag and a manufacturing method therefor which are capable of preventing an antenna from being damaged even when the IC tag is repeatedly subjected to external forces such as bending. The IC tag includes: an IC chip; an antenna that electrically transmits and receives information stored in the IC chip; a sheet-like substrate that supports the IC chip and the antenna; and a resin protective layer which is a dielectric covering the IC chip and the antenna between the resin protective layer and the substrate, in which a tensile modulus [GPa] of the substrate and a tensile modulus [GPa] of the protective layer are defined within an area surrounded by five lines represented by the following formulas (1), (2), (3), (4), and (5), with the tensile modulus of the substrate on an X-axis and the tensile modulus of the protective layer on a Y-axis.X=0.8(1)X=8(2)Y=0.03(3)Y=X0.4(4)Y=0.01×X2(5)