1458 results about "Ground plane" patented technology

A right-hand circularly-polarized patch antenna comprising a ground plane and a patch connected to each other with one or more wires for which the wire shape and location of the end points are selected such that they do not cause an antenna mismatch, and the electrical current carried in the wires produces an extra electromagnetic field subtracted from the patch field in the nadir direction.

The invention relates to the technical field of autonomous mobile robots, in particular to a freight robot autonomous navigation obstacle avoidance method based on multi-sensor fusion, which comprises the following steps of: identifying dynamic targets such as pedestrians and vehicles through data fusion of a depth camera and a laser radar, and predicting a future short-term movement track of the dynamic targets by utilizing a filtering algorithm; a risk corridor over time is generated, so that emergency braking or deadlock is avoided, and the operation efficiency and the traffic smoothness are greatly improved; a space-time consistency cross validation mechanism is established by utilizing the characteristics that the laser radar is insensitive to transparent objects and ultrasonic waves are sensitive to the transparent objects, so that false alarm and missing alarm are effectively eliminated, the robot can safely pass through a complex indoor environment, and the application boundary is greatly expanded; a depth camera is used for fitting a ground plane and analyzing point cloud height change in real time, so that obstacles which cannot be expressed by a two-dimensional navigation map can be identified; and an optimal track is generated by minimizing a multi-target cost function, so that the path is ensured to be safe and smooth.

The invention discloses a point cloud plane parameter optimization method based on IPOPT and residual combination. The method comprises the following steps: preprocessing point cloud data; obstacle target self-adaptive removal is carried out on the preprocessed point cloud data; a composite objective function is constructed, a maximum error constraint inequality is constructed, and calculation of plane parameters is realized by using an IPOPT optimization algorithm; a loss function containing a hard constraint penalty term is constructed, and it is ensured that the optimization direction conforms to the constraint through dynamic adjustment and parameter rollback; and a dual-path parameter updating strategy of a positive learning rate and a negative learning rate is adopted to generate a corresponding residual item, and ground plane parameter updating is carried out through parameter decoupling and recombination so as to realize further optimization of point cloud plane parameters. According to the method, accurate point cloud plane parameters can be better calculated, and the anti-interference capability and scene adaptability of plane parameter fitting are integrally improved.

Various embodiments provide an antenna assembly and associated systems, devices, and methods. The antenna assembly may include two or more antennas, including a first antenna and a second antenna, coupled to a ground plane. The antenna assembly may further include an isolation network coupled to the ground plane between the first and second antennas. The isolation network may include a conductive structure between conductive antenna portions of the first and second antennas, and an isolation circuit coupled between the conductive structure and the ground plane. The isolation circuit may include a resistor, an inductor, and / or a capacitor (e.g., coupled in parallel with one another). Other embodiments may be described and claimed.

Antenna elements and electronic devices are provided, including an antenna element includes a first radiator, a second radiator, and a radiator array. The first radiator is connected to a ground plane through a grounding component, the second radiator is spaced from the ground plane and disposed opposite to the ground plane, and the second radiator and the first radiator are spaced apart. The radiator array is spaced from the first radiator and disposed opposite to the first radiator, and is located on a side that is of the first radiator and that is further from the ground plane. The radiator array includes at least two sub-radiators, and the at least two sub-radiators are spaced from each other in an extension direction of a plane on which the radiator array is located. The first radiator includes a first hollow region, and the radiator array includes a second hollow region.

The invention discloses a compact millimeter wave dual-polarization filtering antenna and array, which comprises 11 layers of structures (a first metal layer to a sixth metal layer, three dielectric layers and two bonding layers) and three types of metalized via holes which are sequentially stacked from top to bottom, the feed through hole penetrates through the first dielectric layer to the third dielectric layer, the short-circuit through hole penetrates through the first dielectric layer to the third dielectric layer, and the shielding hole penetrates through the third dielectric layer. Wherein a cross-shaped radiation patch and a C-shaped parasitic metal strip line are arranged on the first metal layer; an annular driving patch is arranged on the second metal layer; the third metal layer is provided with a feed metal strip line and a parasitic metal strip line. The fourth metal layer is provided with a parasitic open-circuit branch. A first grounding plane is arranged on the fifth metal layer; the sixth metal layer is provided with a second grounding plane and an anti-pad. The working frequency band covers the n258 frequency band and the n257 frequency band of 5G millimeter waves, dual-polarization radiation and effective out-of-band rejection can be achieved, and meanwhile the antenna has the advantages of being compact in structure and light and handy in appearance.

The technology described herein is directed towards a reconfigurable surface device that reflects an impinging electromagnetic signal, with a phase profile determined by vertical positioning of a flexible metallic ground plane beneath metallic resonating elements of the reconfigurable surface. The vertical positioning forms different gaps between portions of the flexible ground plane and the respective metallic resonating elements above those portions, to determine the direction of the reflected beam. In one implementation, four individually linear actuators (vertical driving motors) are mechanically coupled to the corners of the ground plane of a metasurface (panel). These actuators and motors are independently controlled to establish the phase profile, by determining the amount of vertical positioning of each corner of the flexible ground plane to steer the reflected beam. The low-cost design can operate to steer millimeter wavelength beams in many wireless communication scenarios.

A vertically-polarized omnidirectional antenna, including: a body including: a host printed circuit board (PCB) including: first and second slots, and a metal flooded ground plane, first and second antenna PCBs forming four dipole pairs, the first and second antenna PCBs mounted to the host PCB, respective first to third ground connection fillet tabs, the first and second tabs being on an opposite side of the host PCB from the third tab, the first to third tabs being on a same side of its antenna PCB, an amplitude taper on each antenna PCB at transitions between the host and antenna PCBs, including: a first transmission line splitting off into a second transmission line and a third transmission line, the second transmission line feeding two antennas to form one dipole pair, the third transmission line stepping down using a quarter-wave transformer, and a radio frequency (RF) connector to receive a power supply.

The invention provides a common-caliber dual-polarization indoor distribution antenna and communication equipment, the common-caliber dual-polarization indoor distribution antenna comprises a vertical polarization antenna, a horizontal polarization antenna and a feed structure, the vertical polarization antenna comprises a metal floor, a triangular metal plate, a plurality of grounding metal columns and a first copper-clad layer, the triangular metal plate and the plurality of grounding metal columns are arranged between the metal floor and the first copper-clad layer; the horizontally polarized antenna comprises a double-layer dielectric plate and a slot array, the bottom of the double-layer dielectric plate is coated with copper to form a first copper-coated layer, and the slot array is arranged at the top of the double-layer dielectric plate; the horizontally-polarized antenna and the vertically-polarized antenna are arranged in a common-caliber mode, the structure is simple, and the size is small. The feed structure comprises a first feed structure and a second feed structure, the first feed structure is connected with the vertical polarized antenna, and the second feed structure is connected with the horizontal polarized antenna; the first feed structure and the second feed structure are arranged on the metal floor in a non-overlapping manner, so that coupling interference is avoided.

The invention discloses an image analysis method and system for quality control traceability of a satellite navigation board, and relates to the technical field of image processing. The method comprises the following steps: synchronously acquiring an image and three-dimensional point cloud data of a radio frequency transmission line area through a high-resolution area array CCD camera and a laser contourgraph; acquiring a transmission line contour based on image identification, and constructing a three-dimensional radio frequency line model through point cloud fitting; detecting the line width and the distance to the ground plane by using the model, and calculating the impedance prediction complexity in combination with a data acquisition error; dynamically calling a characteristic impedance prediction engine based on the complexity to obtain a predicted characteristic impedance sequence; and quality defect judgment is carried out, and traceability control is carried out on defective products. According to the method, a complete technical chain from geometric dimension detection to electrical performance evaluation is established, hidden defects which are difficult to find by a traditional method can be effectively identified, and the quality control precision and the product yield of the satellite navigation board are improved.

Example directional couplers and devices including one or more directional couplers are disclosed. In an example, a directional coupler comprises a first electrically conductive portion and a second electrically conductive portion, a first ground plane electrical conductor disposed in a plane between the first electrically conductive portion and the second electrically conductive portion, and a second ground plane electrical conductor and a third ground plane electrical conductor disposed such that the first and second electrically conductive portions and the first ground plane electrical conductor are between the second and third ground plane electrical conductors. The first ground plane electrical conductor includes at least one hole directly between the first electrically conductive portion and the second electrically conductive portion.

Described herein are unmanned aerial vehicles (UAVs) and antenna assemblies thereof for shaping radiation patterns in global positioning system applications. For example, an embodiment pertains to an antenna assembly onboard an aerial vehicle. The antenna assembly includes a radiating element coupled to a chassis of an aerial vehicle and positioned in parallel with the chassis, a substrate coupled to the radiating element, a ground plane coupled to the substrate, and a feed cable coupled to the radiating element through the substrate and the ground plane. The ground plane includes a center portion in parallel with the chassis and with the radiating element, and side portions positioned at an angle relative to the chassis and to the radiating element.

A vehicle includes a window with an antenna assembly. The window includes a glass surface and a metal frame along a perimeter of the glass surface. The antenna assembly is disposed on the glass surface and includes an antenna, a feed point and a ground plane. The antenna has a first end and a second end opposite the first end and is disposed in a visible region of the window. The feed point is located at the first end of the antenna. The ground plane is connected to the antenna at the first end. The metal frame is on top of at least part of the ground plane, and the ground plane is electrically coupled to the metal frame.

A reconfigurable metasurface sub reflector comprises an array of cell units. Each sub unit is formed of two sub-unit cells formed with at least two conducting layers separated by a dielectric substrate. One conducting layer has, in each of the sub-unit cells, two parallel strips connected by a varactor and the other conducting layer serves as a ground layer. Setting the reverse biasing for each of the varactors controls the azimuth and elevation of reflection from the reconfigurable metasurface sub reflector.

A semiconductor device has an amplifier and common mode suppression (CMS) circuit formed on a common substrate. The CMS circuit has a first input and second input coupled for receiving an input signal and further has a first output coupled to a first input of the amplifier and a second output coupled to a second input of the amplifier to reduce common mode. The CMS circuit further has a ground plane, a first conductive trace disposed over the ground plane and coupled between the first input and first output, second conductive trace disposed over the ground plane and coupled between the second input and second output, and third conductive trace disposed over the ground plane with a first end of the third conductive trace coupled to the ground plane and a second end of the third conductive trace open circuit to form a resonator.

A filter module is disclosed. The filter module includes a first ground layer, a second ground layer disposed so as to be spaced apart from the first ground layer, a first conductive pattern layer disposed between the first ground layer and the second ground layer, a second conductive pattern layer disposed on one side of the first ground layer or the second ground layer, and a via interconnecting at least two of the first ground layer, the second ground layer, the first conductive pattern layer, and the second conductive pattern layer.

In a magneto-electric dipole antenna, first to third substrates are stacked from top to bottom. A ground layer is disposed between the second and third substrates. Four sector patches and a first feed-out line are disposed on the first substrate. Four ground plates and first and second feed-in lines are disposed below the third substrate. Each of four vias penetrates the second and third substrates and the ground layer. A second feed-out line is disposed between the first and second substrates. Each of first and second feed-out probes penetrates the first to third substrates and the ground layer. The nth feed-out probe is connected to the nth feed-in line and the nth feed-out line, where 1≤n≤2. When two signals are fed to the feed-in lines, the signals are transmitted to the feed-out lines through the feed-out probes, and two electromagnetic waves are radiated.

A microstrip antenna which includes a substrate, a ground on a second side of the substrate, a first patch on a first side of the substrate, and a second patch on the first side of the substrate. The first patch is connected to a first port. The second patch is separated from the first patch and connected to a second port. Each of the first and second patches is further formed with a plurality of shorting vias connected to the ground. The radiation patterns of each element also feature the RPD characteristic, which is promising for large-scale MIMO or array antennas.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

The utility model relates to a feed antenna and electronic equipment, the feed antenna comprises a main branch, a parasitic branch and a floor, the main branch is provided with a feed branch, the feed branch is connected with the floor, the parasitic branch is provided with a grounding branch, the grounding branch is connected with the floor, and the main branch and the parasitic branch are at least partially overlapped. According to the feed antenna, the electromagnetic wave absorption ratio of the front end facing the user to the rear end back to the user is low, and the degree of harm to the user is smaller.

A monopole wideband antenna is provided. The monopole wideband antenna comprise a quartic monopole feed element connected to a center feed of a coaxial connector. A Vivaldi ground plane element is connected to a shield end of the coaxial connector, wherein the Vivaldi ground plane element comprises two vanes, each on opposite sides of the shield end of the coaxial connector. The quartic monopole feed element and Vivaldi ground plane element are in a common plane.

An antenna arrangement comprises a dielectric substrate with a first surface and second surface extending between a first edge and second edge of the substrate. A conductive pattern is arranged on the first surface that forms first, second, and third antenna elements. The first antenna element is arranged in the vicinity of the first edge and connected to a first antenna feed. The second antenna element is arranged in the vicinity of the second edge and connected to a second antenna feed. The third antenna element is arranged between the first and second antenna elements and connected to a third antenna feed. An intermediate element, at least partly functioning as a ground layer, is arranged between the first, second and third antenna elements. A non-conductive zone separates the first antenna element and the intermediate element. The second antenna element and the intermediate element are in conductive contact with each other.

An antenna assembly can include an internal ground plane, a base PCB, and a plurality of antennas. The base PCB can be positioned above the internal ground plane. The base PCB can include a plurality of individual ground planes spaced circumferentially about a center of the base PCB, with the plurality of individual ground planes being electrically connected to the internal ground plane. Each antenna of the plurality of antennas can be electrically connected to an individual ground plane of the plurality of individual ground planes. The plurality of antennas can include a plurality of multi-band antennas and one or more WiFi antennas.

A Butler matrix includes non-aperture couplers and phase shifters on a first substrate, non-aperture couplers and phase shifters on a second substrate, and a ground plane separating the first substrate from the second substrate. The non-aperture couplers and the phase shifters on the first substrate are connected to the non-aperture couplers and the phase shifters on the second substrate using vias extending from the first substrate to the second substrate and passing through the ground plane. The Butler matrix is a 2N×2N matrix, and N is an integer greater than or equal to 4.

A vehicular radar sensing system includes a radar sensor that includes (i) at least one transmitter that transmits radio signals, and (ii) at least one receiver that receive radio signals. The radar sensor includes a waveguide antenna and a printed circuit board (PCB) with a transmitter pad and a receiver pad. The transmitter transmits radio signals to the transmitter pad, and the receiver receives radio signals from the receiver pad. The PCB includes a ground plane layer and a plurality of conductive elements that at least partially surrounds at least the transmitter pad. The plurality of conductive elements electrically connects the waveguide antenna to the ground plane layer and attaches the PCB to the waveguide antenna. The waveguide antenna (i) guides the transmitted radio signals from the transmitter pad to the exterior environment and (ii) guides reflected radio signals from the exterior environment to the receiver pad.

The invention designs a broadband intermediate-frequency heterogeneous integrated communication transceiving micro module and a three-dimensional packaging method, and belongs to the technical field of advanced packaging. The micro module comprises a TSV silicon adapter plate, a Fan-out module, an HTCC ceramic substrate and a digital chip. The TSV silicon adapter plate adopts a high-resistance silicon substrate, and a coaxial shielding TSV structure is arranged on the TSV silicon adapter plate and comprises an inner layer signal through hole and an outer layer grounding layer. A frequency synthesizer chip and a radio frequency chip are embedded in the Fan-out module, and high-density horizontal interconnection is realized through a plurality of redistribution layers. The HTCC ceramic substrate is of a multi-layer laminated structure, and an impedance matching network is arranged in the HTCC ceramic substrate. The three-dimensional packaging method comprises the steps of TSV silicon adapter plate preparation, Fan-out module processing, digital chip stacking and system-level integration. High-density packaging of the radio frequency chip and the digital chip is achieved through the three-dimensional heterogeneous integrated architecture, and low-loss transmission of broadband signals is guaranteed through the coaxial shielding TSV structure and the impedance matching network.

A high gain multiple input, multiple output antenna which has a feeding board; a ground plane; a low band patch radiator; a first printed circuit board; a second printed circuit board; and a high band dipole patch radiator. The high band dipole patch radiator is a co-located stacked array on top of the low band patch radiator. The high band dipole patch radiator and the low band patch radiator are proximity coupled with the first printed circuit board and the second printed circuit board. The low band patch radiator covers low band frequencies in the range of 2.4 GHz to 2.5 GHZ and the high band dipole patch radiator cover high band frequencies in the range of 4.9 GHZ to 7.125 GHz. The antenna assembly has a gain of above 7.5 dBi and a well-directed radiation patten with no side lobes.

A Quantum Transceiver Antenna (QTA) is described which is a scalable, thin-film, bi-synchronous, multifrequency resonance antenna, made up of a layered matrix of antenna pixels of uniform size and shape, with voids and nulls in its pattern. On the QTA, electromagnetic signals gain coherence as toroidal geometries, that function as tunable, electromagnetic lenses, to simultaneously resolve and concentrate gain in the full spectrum of radio frequency signals. QTA transceives both particles and waves, and operates using quantum principles, including quantum tunneling whereby solid materials appear invisible, enabling non-line of sight communications, imaging, detection, Q-Tricity, immunity to multipath interference, and ground planes. One QTA replaces disparate antennas in a cell phone / electronic device and operates wirelessly with space-based platforms and terrestrial networks, plug and play, with low impedance, less power, at magnitudes of gain only possible using quantum principles. QTA is frequency dynamic providing mesh networks, IOT, Edge, AI connectivity, and emergency response interoperability solutions.

The invention discloses a liquid crystal-based Ka-band broadband circularly polarized phased-array antenna, and belongs to the technical field of microwave antennas. The antenna comprises a radiation structure and a feed structure. The radiation structure comprises a radiation unit, a liquid crystal layer, a grounding plate, a control circuit, a bias network and a radio frequency direct current isolation structure. The control circuit is realized by an FPGA (Field Programmable Gate Array) and is connected with the radiation unit through a bias network; the radio frequency direct current isolation structure is used for isolating direct current and radio frequency signals; the feed structure adopts a waveguide feed mode and forms a wave beam in a specified direction through phase compensation of the array units; the bandwidth of the antenna array is increased by using a sequential rotation feed mode, the offset line arrangement of the array is designed, and the radio frequency direct current isolation design is added, so that the technical problem that the circularly polarized bandwidth of the liquid crystal phased-array antenna is relatively narrow is solved.

An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate has first, second, and third levels including respective dielectric layers and conductive features, the first level including a first trace layer with an antenna and a first via layer with a portion of a ground wall laterally spaced outward from and surrounding the antenna, and the second level including a second trace layer having a ground plane connected to the ground wall, the semiconductor die attached to the first level of the multilevel package substrate, and the package structure including a molding compound enclosing the semiconductor die and extending on a side of the antenna, where the package structure mold compound maters and thickness can be tuned for improved performance.