840 results about "Ground plane" patented technology

A right-hand circularly-polarized patch antenna comprising a ground plane and a patch connected to each other with one or more wires for which the wire shape and location of the end points are selected such that they do not cause an antenna mismatch, and the electrical current carried in the wires produces an extra electromagnetic field subtracted from the patch field in the nadir direction.

Antenna elements and electronic devices are provided, including an antenna element includes a first radiator, a second radiator, and a radiator array. The first radiator is connected to a ground plane through a grounding component, the second radiator is spaced from the ground plane and disposed opposite to the ground plane, and the second radiator and the first radiator are spaced apart. The radiator array is spaced from the first radiator and disposed opposite to the first radiator, and is located on a side that is of the first radiator and that is further from the ground plane. The radiator array includes at least two sub-radiators, and the at least two sub-radiators are spaced from each other in an extension direction of a plane on which the radiator array is located. The first radiator includes a first hollow region, and the radiator array includes a second hollow region.

A vertically-polarized omnidirectional antenna, including: a body including: a host printed circuit board (PCB) including: first and second slots, and a metal flooded ground plane, first and second antenna PCBs forming four dipole pairs, the first and second antenna PCBs mounted to the host PCB, respective first to third ground connection fillet tabs, the first and second tabs being on an opposite side of the host PCB from the third tab, the first to third tabs being on a same side of its antenna PCB, an amplitude taper on each antenna PCB at transitions between the host and antenna PCBs, including: a first transmission line splitting off into a second transmission line and a third transmission line, the second transmission line feeding two antennas to form one dipole pair, the third transmission line stepping down using a quarter-wave transformer, and a radio frequency (RF) connector to receive a power supply.

The invention provides a common-caliber dual-polarization indoor distribution antenna and communication equipment, the common-caliber dual-polarization indoor distribution antenna comprises a vertical polarization antenna, a horizontal polarization antenna and a feed structure, the vertical polarization antenna comprises a metal floor, a triangular metal plate, a plurality of grounding metal columns and a first copper-clad layer, the triangular metal plate and the plurality of grounding metal columns are arranged between the metal floor and the first copper-clad layer; the horizontally polarized antenna comprises a double-layer dielectric plate and a slot array, the bottom of the double-layer dielectric plate is coated with copper to form a first copper-coated layer, and the slot array is arranged at the top of the double-layer dielectric plate; the horizontally-polarized antenna and the vertically-polarized antenna are arranged in a common-caliber mode, the structure is simple, and the size is small. The feed structure comprises a first feed structure and a second feed structure, the first feed structure is connected with the vertical polarized antenna, and the second feed structure is connected with the horizontal polarized antenna; the first feed structure and the second feed structure are arranged on the metal floor in a non-overlapping manner, so that coupling interference is avoided.

The invention discloses an image analysis method and system for quality control traceability of a satellite navigation board, and relates to the technical field of image processing. The method comprises the following steps: synchronously acquiring an image and three-dimensional point cloud data of a radio frequency transmission line area through a high-resolution area array CCD camera and a laser contourgraph; acquiring a transmission line contour based on image identification, and constructing a three-dimensional radio frequency line model through point cloud fitting; detecting the line width and the distance to the ground plane by using the model, and calculating the impedance prediction complexity in combination with a data acquisition error; dynamically calling a characteristic impedance prediction engine based on the complexity to obtain a predicted characteristic impedance sequence; and quality defect judgment is carried out, and traceability control is carried out on defective products. According to the method, a complete technical chain from geometric dimension detection to electrical performance evaluation is established, hidden defects which are difficult to find by a traditional method can be effectively identified, and the quality control precision and the product yield of the satellite navigation board are improved.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

A monopole wideband antenna is provided. The monopole wideband antenna comprise a quartic monopole feed element connected to a center feed of a coaxial connector. A Vivaldi ground plane element is connected to a shield end of the coaxial connector, wherein the Vivaldi ground plane element comprises two vanes, each on opposite sides of the shield end of the coaxial connector. The quartic monopole feed element and Vivaldi ground plane element are in a common plane.

An antenna assembly can include an internal ground plane, a base PCB, and a plurality of antennas. The base PCB can be positioned above the internal ground plane. The base PCB can include a plurality of individual ground planes spaced circumferentially about a center of the base PCB, with the plurality of individual ground planes being electrically connected to the internal ground plane. Each antenna of the plurality of antennas can be electrically connected to an individual ground plane of the plurality of individual ground planes. The plurality of antennas can include a plurality of multi-band antennas and one or more WiFi antennas.

A Butler matrix includes non-aperture couplers and phase shifters on a first substrate, non-aperture couplers and phase shifters on a second substrate, and a ground plane separating the first substrate from the second substrate. The non-aperture couplers and the phase shifters on the first substrate are connected to the non-aperture couplers and the phase shifters on the second substrate using vias extending from the first substrate to the second substrate and passing through the ground plane. The Butler matrix is a 2N×2N matrix, and N is an integer greater than or equal to 4.

The invention designs a broadband intermediate-frequency heterogeneous integrated communication transceiving micro module and a three-dimensional packaging method, and belongs to the technical field of advanced packaging. The micro module comprises a TSV silicon adapter plate, a Fan-out module, an HTCC ceramic substrate and a digital chip. The TSV silicon adapter plate adopts a high-resistance silicon substrate, and a coaxial shielding TSV structure is arranged on the TSV silicon adapter plate and comprises an inner layer signal through hole and an outer layer grounding layer. A frequency synthesizer chip and a radio frequency chip are embedded in the Fan-out module, and high-density horizontal interconnection is realized through a plurality of redistribution layers. The HTCC ceramic substrate is of a multi-layer laminated structure, and an impedance matching network is arranged in the HTCC ceramic substrate. The three-dimensional packaging method comprises the steps of TSV silicon adapter plate preparation, Fan-out module processing, digital chip stacking and system-level integration. High-density packaging of the radio frequency chip and the digital chip is achieved through the three-dimensional heterogeneous integrated architecture, and low-loss transmission of broadband signals is guaranteed through the coaxial shielding TSV structure and the impedance matching network.

A high gain multiple input, multiple output antenna which has a feeding board; a ground plane; a low band patch radiator; a first printed circuit board; a second printed circuit board; and a high band dipole patch radiator. The high band dipole patch radiator is a co-located stacked array on top of the low band patch radiator. The high band dipole patch radiator and the low band patch radiator are proximity coupled with the first printed circuit board and the second printed circuit board. The low band patch radiator covers low band frequencies in the range of 2.4 GHz to 2.5 GHZ and the high band dipole patch radiator cover high band frequencies in the range of 4.9 GHZ to 7.125 GHz. The antenna assembly has a gain of above 7.5 dBi and a well-directed radiation patten with no side lobes.

A microstrip patch log periodic antenna (MSPLPA) may include a ground plane, a dielectric material, a printed circuit board comprising a microstrip patches. Each of the microstrip patches may be configured to transmit and / or receive signals. The dielectric material may be disposed between the ground plane and the printed circuit board. Each of the microstrip patches may be frequency scaled.

Described herein is a stacked patch antenna, an array of stacked patch antennas, and a method of fabricating a stacked patch antenna. The stacked patch antenna comprises a ground plane, a first substrate on the ground plane, a first patch on the first substrate having a first diagonal non-radiating center slot from a side of the first patch, a second substrate on the first patch, a second patch on the second substrate having a second diagonal non-radiating center slot from a side of the second patch similar to the side of the first patch, and a feed connector having a first conductor directly connected to the ground plane and a second conductor capacitively connected to the first patch and directly connected to the second patch.

A horizontally-polarized omnidirectional antenna, including: a body including: a host printed circuit board (PCB) including: a metal-flooded ground plane, windows, and an interconnect providing a radio frequency (RF) signal splitting off into 2*Z0 transmission lines, a plurality of antenna elements, corresponding to respective windows, including: an antenna PCB including an antenna slot having a pullback region with the host PCB therein without directly contacting the pullback region, the window in the antenna slot, loops of conducting strips at top and bottom sides of the antenna PCB, slightly overlapping to form capacitive elements at overlap regions, a pair of input solder joints at respective input conducting strips on the top of the antenna PCB, on opposite sides of the window, a transmission feed solder joint directly between the pair of input solder joints across the window, connected to a Z0 feed line, and an RF connector receiving an antenna power supply.

A system for operating a radar device of a mobile machine is disclosed. The system includes an actuator operably coupled between the radar device and an exterior of the mobile machine. The system further includes a controller configured to receive an input indicative of a ground speed of the mobile machine. The controller is further configured to control the actuator to tilt the radar device with respect to a ground plane to alter a field of view of the radar device based on the input received by the controller.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

The invention discloses a non-intrusive voltage and current integrated monitoring device and method, and relates to the technical field of circuit measurement, the monitoring device comprises a probe circuit and a main control circuit, the probe circuit is integrated on a four-layer PCB, an operational amplifier, a Hall sensor and a peripheral circuit are placed on the uppermost layer of the four-layer PCB, the second layer is a grounding layer, and the main control circuit is connected with the probe circuit. The third layer is a negative electrode sensing plate, and the fourth layer is a positive electrode sensing plate; and the probe circuit acquires voltage by adopting a differential topological structure. When the monitoring device is used for measurement, the output voltage and current of the probe circuit are obtained according to the coupling capacitance of the three-phase cable, and the three-phase voltage and current are obtained by using the calibration matrix of the three-phase voltage and current. The device is small in size, a power system monitoring network is easy to establish, the method for monitoring the non-intrusive voltage and current through the device is easy to operate, and three-phase electricity can be monitored.

An antenna assembly can include a cover, a base, an internal ground plane, a PCB, and a multi-band antenna. The base can be coupled to the cover to define an internal volume, with the internal ground plane positioned there between. The PCB can include a base PCB portion and a first PCB portion. The multi-band antenna can comprise a radiating element formed on the first PCB portion, the radiating element comprising an upright radiating portion and a head radiating portion. The radiating element can be configured to move from a first configuration prior to engagement with the cover to a second configuration when the cover is coupled to the base. In the first configuration, the upright radiating portion can be coplanar to the head radiating portion, and in the second configuration, the upright radiating portion can be at an angle relative to the head radiating portion.

The embodiment of the application provides an antenna system and an electronic device, wherein the antenna system comprises a first antenna and a second antenna, the first antenna comprises a first radiator and a second radiator, and the second antenna comprises a first radiator and a third radiator; two ends of the first radiator are electrically connected to a ground plane respectively, a first end of the second radiator and a first end of the third radiator are relatively far away from each other and are connected or coupled to the first radiator respectively, a second end of the second radiator and a second end of the third radiator are oppositely arranged and form a gap, the antenna system feeds the first antenna through a first feeding connection point on the second radiator and feeds the second antenna through a second feeding connection point on the third radiator, a brand-new antenna system is constructed, high isolation between the first antenna and the second antenna can be realized, and meanwhile, miniaturization of an antenna aperture and a low SAR value can be realized.

The invention discloses a ground plane segmentation method and device for a hybrid PCB, and belongs to the field of PCB design, and the method comprises the steps: inputting the characteristic parameters of the hybrid PCB into a land division decision model, enabling the land division decision model to carry out the layer-by-layer judgment according to the characteristic parameters, and outputting a first land division strategy; constructing an electromagnetic simulation model based on the first land division strategy, executing predefined simulation analysis according to the electromagnetic simulation model, and optimizing the first land division strategy through a preset optimization rule base when a simulation analysis result does not meet a preset requirement to generate a second land division strategy; and based on the first land division strategy or the second land division strategy, automatically generating a segmentation line through PCB design software, and placing a connection bridge and a compensation element so as to complete the ground plane segmentation of the hybrid PCB. Therefore, by implementing the method, the targeted ground plane segmentation design can be performed according to the related parameters of the hybrid PCB, so as to ensure the signal integrity and electromagnetic compatibility of various hybrid PCBs.

The invention belongs to the crossing field of a microwave technology and a sensing technology, and particularly relates to a microwave dielectric parameter measurement sensor based on a micro-flow pipeline embedded in a substrate, and one surface of the substrate is provided with a microstrip transmission line and a resonant structure; the microstrip transmission line is used for exciting and transmitting microwave signals; the resonant structure is used for enhancing electromagnetic field distribution in a certain area of the substrate; a micro-flow pipeline is embedded in the substrate and is used for accurately conveying a substance to be detected to an area where electromagnetic energy is most concentrated; a grounding layer is arranged on one side of the substrate and used for restraining an electromagnetic field, and energy of the electromagnetic field is mainly concentrated in the substrate. The micro-flow pipeline is embedded in a strong electric field area in the substrate, so that a to-be-measured substance directly interacts with an electromagnetic energy concentration area, and dielectric parameter measurement which is compact in structure, high in sensitivity and high in precision is achieved. The sensor provided by the invention has wide application prospects in the fields of biomedical detection, chemical analysis, environmental monitoring, industrial process control and the like.

A microstrip antenna which includes a substrate, a microstrip patch configured on a first side of the substrate, a ground configured on a second side of the substrate which is opposite to the first side, and a first shorting wall extending from a side of the microstrip patch toward the ground. The first shorting wall substantially overlaps with the substrate on a direction that is perpendicular to the microstrip patch. The first shorting wall is located at a first non-radiating edge of the microstrip antenna. Dummy elements are no longer needed in this design, which makes it compact.

The present invention provides a dual board patch array antenna, comprising: a radio board; a first-layer antenna board and a second-layer antenna board; the ground plane of the radio board is in contact with the first radiation ground plane of the first-layer antenna board through a patch-type conductive pad to form an extended ground area of ground connection; the probes of the radio board pass through and contact the patch microwave transmission line of the first-layer antenna board to form an electrical connection; wherein the patch microwave transmission line is assigned to the antenna radiating element of the second-layer antenna board as a vertically polarized antenna and a horizontally polarized antenna; the antenna radiating element contacts the first radiation surface on the first-layer antenna board through the conductor pad on the first layer antenna board, so as to expand the radiation surface area of the dual board patch array antenna.

Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.

The invention discloses an ultra-wideband miniaturized band-pass filter based on slot lines and defected ground resonators, which belongs to the technical field of communication and comprises three metal layers, two dielectric layers and metal holes. The three metal layers comprise a top metal layer, a middle metal layer and a bottom metal layer from top to bottom, and the bottom metal layer is a ground plane; the metal holes penetrate through the three metal layers and the two dielectric layers; the two dielectric layers comprise a first dielectric layer and a second dielectric layer, the first dielectric layer is located between the top metal layer and the middle metal layer, and the second dielectric layer is located between the middle metal layer and the bottom metal layer; the top metal layer comprises a CPW feeder line and a slot line resonator, and LPUs are embedded in the CPW feeder line; the middle metal layer comprises a DGS resonator; and the slot line resonator and the DGS resonator are electromagnetically coupled to form a passband together. According to the invention, ultra wide band and miniaturization are realized through coupling of the slot line and the defected ground resonator.

According to various embodiments, an electronic device comprises: a housing; a first substrate disposed in the housing; a second substrate arranged to face the first substrate; a conductive patch disposed on the second substrate; at least one conductive post located near the conductive patch on the second substrate; and a wireless communication circuit disposed on the first substrate and configured to transmit and / or receive wireless signals via the conductive patch, wherein one end of the at least one conductive post is positioned to be couplable to the conductive patch, and the other end can be electromagnetically connected to a ground layer of the first substrate.

This application provides a dual-polarized differential base station antenna, relating to the field of communication technology. The dual-polarized differential base station antenna includes a dielectric substrate, a first resonant cavity, multiple second resonant cavity groups, a coupling component, and a coaxial feed conductor. The first resonant cavity is disposed inside the dielectric substrate and extends to the upper and lower surfaces of the substrate. A first radiation slot is provided on the upper surface of the first resonant cavity. Multiple second resonant cavity groups are symmetrically distributed around the first resonant cavity. Each second resonant cavity group includes at least one second resonant cavity, and a second radiation slot is provided on the upper surface of each second resonant cavity. The coupling component connects the first resonant cavity to each second resonant cavity group. The coaxial feed conductor is connected to a ground plane and penetrates the dielectric substrate to connect to the upper surface of the first resonant cavity. The dual-polarized differential base station antenna of this application achieves high gain, high isolation, and wide bandwidth performance while maintaining a low profile structure.

This invention belongs to the field of microwave communication technology, specifically relating to a PIFA antenna for 5G dual-band coverage. The invention includes a rectangular metal patch on a top surface, a substrate, and a metal ground plane stacked from top to bottom. A row of grounding vias is disposed through the substrate, and this array of grounding vias is located at the lower end of one side of the rectangular metal patch on the top surface. A coaxial feeding structure is disposed below the rectangular metal patch on the top surface. The antenna excites its fundamental mode TM through the coaxial feeding structure. 0.5,0 Mode and three higher-order modes TM 0.5,1 Pattern, TM 0.5,2 Pattern, and TM 0.5,3 The pattern includes a rectangular metal patch on the upper surface with a first slot along its vertical center line; the first slot has an opening on the side furthest from the grounding via for adjusting the TM. 0.5,1 Pattern and TM 0.5,3 The resonant frequency of the mode; a pair of second slits are orthogonally arranged on both sides of the first slit; the second slits are used to modulate the TM. 0.5,0 Pattern and TM 0.5,2 The resonant frequency of the mode. The antenna design proposed in this invention has advantages such as simple structure, relatively wide dual-band coverage, small size, and low profile.

This invention discloses a high-gain vehicle-mounted optically transparent antenna with improved radiation pattern, operating in the 0.74-0.87 GHz range. The invention includes a substrate, an antenna body, and a system ground plane. The substrate comprises a PET film layer, an OCA adhesive layer, and a PC dielectric substrate. The antenna body consists of two trapezoidal radiating patches, a reverse cancellation strip, a feed line, and a system ground plane located on the same layer as the antenna. The two trapezoidal radiating patches are connected by the reverse cancellation strip, which links their longer base edges. Its transparency is primarily achieved through the use of a transparent substrate material and a metal mesh structure composed of thin and fine metal wires. The cascaded trapezoidal radiating patches and the connected reverse radiation strip achieve performance improvements such as high gain, wide bandwidth, and improved horizontal radiation pattern nulls. This invention can achieve optical transparency of over 70%, radiation efficiency of over 65%, and radiation pattern null improvement of over 3 dB in the operating frequency band.

The invention discloses a beam forming antenna based on a holographic tensor impedance modulation metasurface and a design method thereof, and belongs to the technical field of microwave antennas. The antenna comprises a monopole feed source and a metasurface formed by a periodic array, wherein each tensor impedance unit adopts a three-layer structure comprising an upper slotted metal patch, a middle dielectric substrate and a lower metal grounding layer. A unit library of patch sizes and electromagnetic characteristics is constructed, tensor impedance distribution of each unit is calculated by adopting an iterative algorithm based on a holographic principle, and finally accurate matching with the unit library is realized. According to the invention, the surface wave can be efficiently converted into a specified target wave beam, high-gain and low-sidelobe dual-beam or flat-topped wave beam forming can be realized in a broadband, and meanwhile, the antenna has the advantages of low profile, easiness in integration and low cost, and can be widely applied to a modern wireless communication system.