The invention discloses an efficient and uniform
electroplating manufacturing method of a thick
copper plate. The efficient and uniform
electroplating manufacturing method comprises the following steps: step 1, carrying out chemical oil removal treatment and micro-
etching coarsening on a substrate; step 2, carrying out pre-impregnation treatment and manufacturing a
mask; 3, a
pulse electroplating device is adopted for carrying out edge auxiliary
electroplating on the plate edge, and 4, plating solution closed-loop regulation and control are carried out, specifically, a regulation and
control system is provided, the regulation and
control system comprises a plating solution regulation and control device and an automatic compensation module, and a PLC
control system controls the automatic compensation module to quantitatively supply additives according to the difference between a detection value and a required value. According to the method, the
electric field intensity of the edge and the center of the substrate is balanced, the thickness uniformity of the
copper layer is remarkably improved, and the thickness difference between the edge and the center is reduced; and the
deposition rate stability of
pulse electroplating is ensured. And meanwhile, the working efficiency is improved, the electroplating time is shortened, the
energy consumption is reduced, the dosage of an electroplating additive is reduced, the service life of an electroplating solution is prolonged, the
binding force of a
copper layer and a substrate is improved, practicability is high, and high popularization significance is achieved.