3425results about How to "Avoid deposition" patented technology

To provide a glass substrate-holding tool which is capable of avoiding scratching to the deposition surface of a glass substrate and dusting thereby caused as well as scratching and deposition of foreign substances at a center portion of the rear surface of the substrate and which is capable of suppressing dusting from the holding tool itself at the time of forming a multi-layered reflection film and an absorptive layer.

A glass substrate-holding tool having, formed on a surface of a flat base, a catching portion for catching and holding by van der Waals forces, wherein the catching portion is in contact with only the periphery of the glass substrate.

A gas distributor for use in a semiconductor process chamber comprises a body. The body includes a first channel formed within the body and adapted to pass a first fluid from a first fluid supply line through the first channel to a first opening. A second channel is formed within the body and adapted to pass a second fluid from a second fluid supply line through the second channel to a second opening. The first and second openings are arranged to mix the fluids outside the body after the fluids pass through the openings.

An apparatus and method to position a wafer onto a wafer holder and to maintain a uniform wafer temperature is disclosed. The wafer holder or susceptor comprises a recess or pocket whose surface includes a grid containing a plurality of grid grooves that separate protrusions. A plurality of gas passages is provided in the susceptor to enable an upward flow of gas toward the bottom surface of the substrate. During drop-off of the substrate, a cushion gas flow is provided to substantially slow the rate of descent of the substrate onto the susceptor and to gradually heat the substrate before it makes contact with the susceptor. Optionally, a trickle gas flow may be provided through the aforementioned passages during processing of the substrate to prevent deposition of reactant gases onto the bottom surface of the substrate. A liftoff gas flow may then be provided through the passages to help lift the substrate off of the susceptor after processing is completed and thus aid in removing the substrate from the process chamber. These features help to achieve temperature uniformity and thus quality of deposited films onto the substrate.

The a trench semiconductor device such as a power MOSFET the high electric field at the corner of the trench is diminished by increasing the thickness of the gate oxide layer at the bottom of the trench. Several processes for manufacturing such devices are described. In one group of processes a directional deposition of silicon oxide is performed after the trench has been etched, yielding a thick oxide layer at the bottom of the trench. Any oxide which deposits on the walls of the trench is removed before a thin gate oxide layer is grown on the walls. The trench is then filled with polysilicon in or more stages. In a variation of the process a small amount of photoresist is deposited on the oxide at the bottom of the trench before the walls of the trench are etched. Alternatively, polysilicon can be deposited in the trench and etched back until only a portion remains at the bottom of the trench. The polysilicon is then oxidized and the trench is refilled with polysilicon. The processes can be combined, with a directional deposition of oxide being followed by a filling and oxidation of polysilicon. A process of forming a "keyhole" shaped gate electrode includes depositing polysilicon at the bottom of the trench, oxidizing the top surface of the polysilicon, etching the oxidized polysilicon, and filling the trench with polysilicon.

A petroleum well having a well casing, a production tubing, a source of time-varying current, a downhole chemical injection device, and a downhole induction choke. The casing extends within a wellbore of the well. The tubing extends within the casing. The current source is located at the surface. The current source is electrically connected to, and adapted to output a time-varying current into, the tubing and/or the casing, which act as electrical conductors for providing downhole power and/or communications. The injection device having a communications and control module, a chemical container, and an electrically controllable chemical injector. The communications and control module is electrically connected to the tubing and/or the casing. The chemical injector is electrically connected to the communications and control module, and is in fluid communication with the chemical container. The downhole induction choke is located about a portion of the tubing and/or the casing. The chemical injector is electrically connected to the communications and control module, and is in fluid communication with the chemical container. The downhole induction choke is located about a portion of the tubing and/or the casing. The induction choke is adapted to route part of the electrical current through the communications and control module by creating a voltage potential between one side of the induction choke and another side of the induction choke. The communications and control module is electrically connected across the voltage potential. Also, a method is provided for controllably injecting a chemical into the well downhole, which may be used to: improve lift efficiency with a foaming agent, prevent deposition of solids with a paraffin solvent, improve a flow characteristic of the flow stream with a surfactant, prevent corrosion with a corrosion inhibitor, and/or prevent scaling with scale preventers.

A plasma processing method performs a desired plasma process on substrates by using a plasma generated in a processing space. A first and a second electrode are disposed in parallel in a processing vessel that is grounded, the substrate is supported on the second electrode to face the first electrode, the processing vessel is vacuum evacuated, a desired processing gas is supplied into the processing space formed between the first electrode, the second electrode and a sidewall of the processing vessel, and a first radio frequency power is supplied to the second electrode. The first electrode is connected to the processing vessel via an insulator or a space, and is electrically coupled to a ground potential via a capacitance varying unit whose electrostatic capacitance is varied based on a process condition of the plasma process performed on the substrate.

The present invention relates to no-phosphate corrosion and scale inhibitor and its application. The no-phosphate corrosion and scale inhibitor consists of polyaspartic acid and/or polyepoxy succinic acid 10-20 wt%, polymaleic anhydride 20-30 wt%, copolymer of acrylic acid and 2-acrylamido-2-methyl propenyl sulfonic acid 15-20 wt%, zinc salt 3-5 wt%, natural organic high molecular compound 5-12 wt%, molybdate 5-8 wt%, and other components 5-20 wt%. It has excellent corrosion retarding performance, high scale inhibiting performance and environment friendship.

An exhaust aftertreatment system comprises an injector for injecting urea water into an exhaust duct, and a denitration catalyst disposed downstream of the injector with respect to a flow of exhaust gas. The exhaust aftertreatment system reduces nitrogen oxides in the exhaust gas by the denitration catalyst while using ammonia produced from the urea water injected from the injector. The urea water is injected along a direction of the flow of the exhaust gas within the exhaust duct, and a porous plate is disposed in multiple stages in a space of the exhaust duct such that droplets of the injected urea water impinge against the porous plate before reaching a wall surface of the exhaust duct. A surface of the porous plate subjected to the impingement of the droplets is arranged to face downstream with respect to the flow of the exhaust gas. Deposition of the urea water is prevented by causing film boiling when the droplets impinge against the porous plate, and the urea water reflected by the porous plate is uniformly dispersed into the exhaust gas. Thus, the urea water is uniformly dispersed into the exhaust gas without increasing a pressure loss of the exhaust gas. The urea water is prevented from depositing on the wall surface and producing a precipitate in the form of a solid.

A process cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, includes a photosensitive drum; a developing roller rotatable in the drum-rotating direction when the cartridge is mounted to the apparatus; first and second separation members disposed at one and the other end of the roller so as to provide a gap between the roller and the drum and contacting the drum surface adjacent one and the other end thereof; a charging roller, contacting and charging the drum, which is rotatable with a peripheral speed difference relative to the drum; and a cleaning member contacting the drum adjacent one end thereof, the cleaning member having an effective area outside a developing-roller developing zone and inside a charging-roller-and drum contact region and which is in a region where the first separation member contacts the drum.

Methods are disclosed for selective deposition on desired materials. In particular, barrier materials are selectively formed on insulating surfaces, as compared to conductive surfaces. In the context of contact formation and trench fill, particularly damascene and dual damascene metallization, the method advantageously lines insulating surfaces with a barrier material. The selective formation allows the deposition to be “bottomless,” thus leaving the conductive material at a via bottom exposed for direct metal-to-metal contact when further conductive material is deposited into the opening after barrier formation on the insulating surfaces. Desirably, the selective deposition is accomplished by atomic layer deposition (ALD), resulting in highly conformal coverage of the insulating sidewalls in the opening.

The invention relates to a copolymer consisting of the following monomer components: a) 48-98 wt. % of compounds of formula (I), b) 2-30 wt. % of one or several oxygen-containing methacrylates of formula (II) and c) 0-30 wt. % of a methacrylate of formula (III) of styrol, the quantities a)-c) totalling 100 wt. %. The inventive copolymer is suitable as a an additive for diesel fuels and biodiesel.

Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.

The invention relates generally to processes for enhancing the deposition of noble metal thin films on a substrate by atomic layer deposition. Treatment with gaseous halides or metalorganic compounds reduces the incubation time for deposition of noble metals on particular surfaces. The methods may be utilized to facilitate selective deposition. For example, selective deposition of noble metals on high-k materials relative to insulators can be enhanced by pretreatment with halide reactants. In addition, halide treatment can be used to avoid deposition on the quartz walls of the reaction chamber.

A liquid heating module for use in a hot beverage machine, a beverage forming system that includes the module, and a process for heating liquid for forming beverages. The liquid heating module includes a hollow metal tube, a cylindrical insert which is disposed inside the hollow tube along its entire length and substantially along its axis of symmetry, at least one electrical resistor on a first outer part of the tube for preheating liquid flowing through the tube, and at least one additional electrical resistor on a second outer part of the tube for temperature adjustment of the liquid flowing through the tube.

Provided are an exhaust treatment catalyst and an exhaust article containing the catalyst. The catalyst comprises: (a) a carrier; (b) a first layer deposited on the carrier, said first layer comprising substantially only at least one refractive metal oxide; (c) a second layer deposited on the first layer, said second layer comprising substantially only at least one oxygen storage component and at least one binder therefor; and (d) a third layer deposited on the second layer, said third layer comprising at least one layer of one or more platinum group metal components supported on a refractory metal oxide support. Optionally, a fourth layer is deposited on the third layer wherein the fourth layer comprises one or more platinum group metal components supported on a refractory metal oxide support. As a further option, an overcoat layer may be deposited on the third or fourth layer wherein the overcoat layer comprises a catalyst poison sorbent. Also provided are methods for preparing the catalyst and methods for monitoring the exhaust storage capacity of an exhaust article containing the catalyst.

A fabric treatment composition that includes at least one zeta potential modifier and a hydrophobic agent with a melting point or glass transition temperature below 100° C. that imparts fabric protection benefits, including improved stain and soil resistance, oil repellency, water repellency, softness, wrinkle and damage resistance, and better handfeel to treated fabrics. Particularly preferred compositions include at least one zeta potential modifier in an amount sufficient to adjust the zeta potential of the composition to be positive and greater than zero millivolts. Particularly preferred compositions also include a fluoropolymer. The composition can be used as a pretreatment prior to washing, through soaking or direct spray application, or added to the treatment liquor, that is either the wash or rinse cycle of an automatic washing machine, or used prior to or during the drying cycle of an automatic drying machine or refresher machine, or used prior to or in conjunction with an ironing device. The fabric treatment is complete when the fabric is cured by drying and/or heating.

A shower head structure characterized by comprising a shower head section, opposed to the upper surface of a mounting table in an evacuable treating vessel, for injecting a processing gas into the treating vessel; a temperature observation through-hole which opens in the lower surface of the shower head so as to be opposed to the upper surface of the mounting table, a transparent observation window which hermetically seals the upper end of the temperature observation through-hole, a radiation thermometer disposed on the upper surface of the transparent observation window, an adhesion preventive gas supply path communicating with the temperature observation through-hole to prevent a film from adhering to the transparent observation window, wherein the adhesion preventive gas supply path communicates with the temperature observation through-hole through an injection nozzle for injecting the adhesion preventive gas to the transparent observation window.

A fuel injection valve includes a valve seat member, and an injector plate which is coupled to a front end face of the valve seat member and has a plurality of fuel injection orifices disposed about an axis of the valve seat member to communicate with a valve seat. Swirling means for swirling a fuel injected from each of the fuel injection orifices is provided in at least one of the valve seat member and the injector plate. The plurality of fuel injection orifices are disposed so that liquid membrane portions of adjoining hollow conical fuel spray forms formed by the fuel injected from the fuel injection orifices collide with one another. Thus, the atomization of the injected fuel can be further promoted, and a coalesced fuel spray form having a fuel particle density higher in a central zone and lower in an outer peripheral zone can be formed.

A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.