962 results about "Electroplating" patented technology

The invention discloses an intelligent detection and dynamic supplement regulation and control system for electroplating bath solution components, and belongs to the technical field of electroplating. The system comprises an electroplating bath body, a detection module, a data processing and control module and a regulation and control module. The detection module is used for detecting the metal ion concentration, the pH value, the temperature and the additive concentration of the bath solution on line in real time through a spectrum sensor, an electrochemical sensor and a physical parameter sensor; the data processing and control module adopts a PID and machine learning fused intelligent regulation and control model, predicts the component change trend according to the detection data and the process parameters, and generates a dynamic regulation and control instruction; the regulation and control module quantitatively supplements target components through a high-precision metering pump, and the closed-loop feedback correction module is combined to ensure that the components of the bath solution are stabilized within a preset threshold range. Multi-parameter synchronous detection and accurate regulation and control are achieved, the quality stability of the plating layer is improved, raw material consumption and labor cost are reduced, and the method can be widely applied to industrial scenes such as metal surface treatment.

The invention discloses a surface treatment process of a hydraulic rod and a coating monitoring system, relates to the technical field of electroplating, and aims to solve the problems that various complementary sensing technologies cannot be integrated, information such as thickness, uniformity and microstructure cannot be synchronously acquired in a lossless, in-situ and real-time manner, and closed-loop control cannot be formed based on the information in the background technology. According to the scheme, the method comprises the steps that PR electrolytic degreasing is conducted, a workpiece serves as an anode, an oil film is torn through the oxygen evolution effect, an extremely-thin oxidation film possibly existing on the surface of the workpiece is dissolved, base metal is completely activated, and an optimal combination basis is provided for a follow-up coating; and washing with hot water, namely removing residual alkaline degreasing fluid and emulsified oil stains by using hot water with the temperature higher than 60 DEG C in a stirring and spraying manner. According to the method, multi-dimensional information such as the thickness, the uniformity and the microstructure can be synchronously obtained in a lossless, in-situ and real-time mode in the surface treatment process, closed-loop control is formed based on the information, and it is ensured that plating growth is always located on the optimal track.

An article has a formed surface material. On at least a portion of the formed surface material is disposed an antimicrobial article having antimicrobial properties. This antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; and a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern. The antimicrobial article provides antimicrobial properties when applied to the formed surface material that may be frequently touched, such as a touch screen, door handle, or other frequently touched surface. The antimicrobial article can inhibit or reduce the transmission of various microorganisms from one person to another.

The invention discloses an electroplating process method for preparing a deep-etching thick metal mask, and belongs to the technical field of micro electro mechanical system electroplating processes. Comprising the following steps: firstly, carrying out photoetching and patterning on the surface of a wafer by using positive photoresist; then, carrying out seed layer sputtering on the wafer subjected to pattern photoetching, and forming a to-be-electroplated region with a preset pattern through a stripping process; then, photoetching is carried out on the to-be-electroplated area through negative photoresist, and a thick photoresist layer with the thickness larger than that of a preset metal coating is formed; and finally, the electroplating area is electroplated, and the metal coating with the preset thickness is obtained. According to the method, the negative photoresist process is adopted, so that the transverse growth of the metal coating is effectively inhibited, the perpendicularity of the side wall of the metal coating is improved, and meanwhile, the damage to the surface of the wafer when the seed layer in the non-electroplating area is removed is avoided. The problems that mushroom-shaped protrusions are easily formed on the edge of a plating layer, crystal grains are coarsened and the like in the electroplating process of an existing electroplating method are solved.

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

The invention relates to the technical field of electroplating process control, and discloses a vertical electroplating feeding control method and system.The method comprises the steps that anode current distribution and electrolyte parameters are monitored in real time, and the feeding rate matching degree is judged; the plating thickness uniformity risk level is evaluated based on a fuzzy control model, and the cumulative effect intensity of temperature fluctuation on anode passivation is quantified through multivariable regression analysis and a dynamic feedback mechanism; judging whether to trigger multi-stage feeding strategy recombination according to the risk level and the cumulative effect intensity; the current density and the electrolyte flow velocity are decoupled, a material consumption compensation coefficient is calculated, an adjustment instruction is generated, and iterative optimization can be carried out according to the execution effect. The system comprises a state monitoring module, a risk assessment module, an effect analysis module, a strategy decision module, a parameter decoupling module and a compensation execution module. According to the invention, the feeding control precision and the process stability are improved, and the method is suitable for precise control of the vertical electroplating process.

The invention discloses a preparation method of a composite current collector base film based on flame-retardant and aging-resistant modified PP and a composite current collector, the method comprises the following steps: 1) preparation of a modified PP master batch: mixing 100 parts by weight of PP resin, 0.5-1.8 parts by weight of a lubricant and 10-25 parts by weight of a flame-retardant and aging-resistant composite filler, and stirring at 100-135 DEG C for 0.5-2 h to obtain the modified PP master batch; (2) carrying out melt extrusion, tape casting and sheet casting to obtain an intermediate sheet; 3) biaxial stretching; and 4) carrying out heat setting, rolling and slitting to obtain the composite current collector base film. The invention provides the PP base film with excellent flame-retardant and aging-resistant performance and good mechanical strength; furthermore, based on the PP base film, the composite current collector is obtained after copper layers are formed on the two surfaces of the PP base film by adopting a conventional water electroplating process, and the copper layers and the PP base film in the composite current collector have high bonding strength, so that the service life of the composite current collector can be effectively prolonged.

The invention provides an electroplating solution and an electroplating method for preparing an antimony-containing tin-based alloy packaging bump structure. The content of antimony atoms in the bump structure is 0.1-8.0%; the electroplating liquid comprises tin (II), antimony (III), an inhibitor, methanesulfonic acid and an antioxidant; the concentrations of the tin (II), the antimony (III), the inhibitor, the methanesulfonic acid and the antioxidant in the electroplating solution are 15-60 g / L, 0.01-8.0 g / L, 0.5-15.0 g / L, 20-200 mL / L and 1.0-3.0 g / L in sequence. The electroplating solution can effectively realize co-deposition of tin ions and antimony ions, and the situation that the deposition rate is not matched in the deposition process due to the electrochemical characteristic difference of tin and antimony is overcome; the content of antimony atoms in the generated bump structure is 0.1-8.0%, and a small amount of metal antimony is added into a tin base, so that grains can be refined, the crystal face of a plating layer can be promoted to obtain excellent surface flatness, and the hardness of the plating layer can be effectively improved.

The invention is applicable to the technical field of trailer part treatment, and provides a trailer part surface coating treatment process which comprises the following steps: performing high-frequency induction quenching on a trailer ball base body; a copper bottom layer is electroplated on the trailer ball base body, and a bright nickel layer is electroplated on the copper layer; a microcrack nickel layer is electroplated on the bright nickel layer, and a trivalent chromium layer is electroplated on the microcrack nickel layer through a trivalent chromium plating solution; the trailer ball base body electroplated with the trivalent chromium layer is subjected to nanometer hole sealing treatment; applying a layer of polysiloxane or UV (ultraviolet) curing type super-hard transparent finish paint on the surface subjected to hole sealing treatment in a spraying manner; a layer of micro-crack nickel is electroplated on the bright nickel layer, and a micro-crack network of the micro-crack nickel provides a preset and uniform stress release channel for a subsequent chromium layer, so that the internal stress of the chromium layer is dispersed, the brittleness of the chromium layer is greatly reduced, and the impact resistance of the chromium layer is remarkably improved; and a trivalent chromium chromium plating process is adopted to replace traditional hexavalent chromium chromium plating, so that the environmental pollution and toxicity are greatly reduced, and the requirements of modern environmental protection regulations are better met.

The invention provides a treatment method for synergistically enhancing the comprehensive performance of a neodymium-iron-boron magnet, and belongs to the technical field of magnetic materials. According to the method, a heavy rare earth layer and a corrosion-resistant metal layer such as copper, nickel and cobalt for promoting grain boundary diffusion of heavy rare earth are respectively deposited on the surface of the neodymium-iron-boron magnet by adopting a multi-layer electroplating method, the coercivity of the neodymium-iron-boron magnet is enhanced through grain boundary diffusion, and the corrosion resistance of the magnet is enhanced through a nickel-cobalt coating. The treatment method comprises the following steps: carrying out electrochemical deposition on the neodymium-iron-boron magnet in a heavy rare earth metal plating solution, and then respectively electroplating a copper plating layer and a nickel-cobalt plating layer to obtain a heavy rare earth-containing plating layer with strong corrosion resistance and good plating film binding force; the neodymium-iron-boron magnet containing the heavy rare earth coating is subjected to heat treatment, and the coercive force of the magnet is improved through heavy rare earth grain boundary diffusion. The neodymium iron boron grain boundary diffusion process and the surface corrosion prevention process are subjected to integrated treatment, the technological process of high-performance neodymium iron boron industrial preparation is shortened, and the coercive force and the corrosion resistance of the magnet are comprehensively enhanced.

The invention provides a preparation method of a bidirectional pulse electrodeposition composite nickel-based electrode. The preparation method mainly comprises the following steps: (1) pretreating a nickel-based substrate; (2) in a nickel-based salt electroplating aqueous solution, carrying out electro-deposition on the treated nickel-based base material by adopting bidirectional pulse current to obtain a composite nickel-based electrode material; and (3) drying the obtained composite nickel-based electrode in a nitrogen oven to obtain the composite nickel-based electrode. Compared with the existing electro-deposition technology, the bidirectional pulse type electro-deposition method can effectively form a compact, wear-resistant and scouring-resistant load catalyst layer, can significantly improve the loading and dispersion of electrode active components, and at the same time, nickel-based metal and auxiliary active metal are mutually doped to form multi-element metal load, so that the performance of the electrode is improved. The electro-catalysis effect is greatly promoted through the electron action between different atoms, and the water electrolysis performance is effectively improved. Compared with constant-current electrodeposition, the method is simple in process condition, stable in performance, high in water electrolysis efficiency and easy to industrially expand, and has important industrial application prospects.

To extend the lifespan of plating baths used for forming metal oxide films and to enable more efficient use of the plating baths. [Solution] The method for forming a metal oxide film comprises the steps of forming a metal oxide film on the surface of a plated object using a plating bath containing a metal compound that forms the film and a boron compound that acts as a reducing agent, and regenerating the plating bath using an adsorption filter that adsorbs boric acid.

The invention discloses a zinc negative electrode plate with a three-dimensional copper foil substrate and a preparation method and application thereof, relates to the technical field of aqueous zinc ion batteries, and provides a preparation method of a three-dimensional copper foil substrate loaded zinc positive electrode aiming at the problems of short cycle life, low coulombic efficiency and the like caused by dendritic crystal growth and side reaction of an aqueous zinc ion battery zinc negative electrode. A three-dimensional porous structure is constructed on a zinc-loving copper foil substrate through a wet chemical method, and the method comprises the following specific steps: (1) immersing a copper foil into an acidic solution containing ferric trichloride hexahydrate for reaction to prepare a three-dimensional porous copper foil; and (2) taking a three-dimensional copper foil (3D Cu) as a substrate, and loading zinc metal through an electroplating process to obtain the three-dimensional copper foil substrate galvanized negative electrode (3D Cu-Zn). The three-dimensional porous structure can balance electric field distribution, induce uniform deposition of zinc ions, inhibit dendritic crystal growth and optimize current distribution.

The invention provides an electroplating solution, a nanocrystalline copper film and a preparation method and application of the nanocrystalline copper film. The electroplating solution comprises the following components: a basic component, an electroplating accelerant, an electroplating inhibitor and the balance of water, the basic components comprise CuSO4 with the concentration of 0.2 to 0.5 M and H2SO4 with the concentration of 1.5 to 2M according to the volume of the electroplating solution; the electroplating accelerant is prepared from sodium dithiodipropane sulfonate or 3-mercapto-1-sodium propane sulfonate with the concentration of 2 to 6 ppm; the electroplating inhibitor comprises PEG (polyethylene glycol) 4000 to 8000 with the concentration of 2 to 5g / L, and HCl with the concentration of 40 to 60ppm or NaCl with the concentration of 40 to 60ppm. The nanocrystalline copper film is prepared by electroplating the electroplating solution. The nanocrystalline copper film prepared by the electroplating solution can be quickly self-annealed at low temperature, and copper-copper bonding is realized in an air environment and under low-temperature and low-pressure conditions.

This application provides a substrate assembly and a method for fabricating the substrate assembly. The substrate assembly includes: a glass substrate, which includes: a through-hole, the inner diameter of which gradually decreases from its two openings towards the interior along its extension direction to create a necked structure; the inner wall of the through-hole is a smooth, continuous curved surface with a roughness Ra ≤ 100 nm; an electroplated metal layer disposed within the through-hole; and a circuit layer disposed on the surface of the glass substrate and electrically connected to the electroplated metal layer. The geometric relationship between the minimum inner diameter of the through-hole and the inner diameter at the opening of the through-hole satisfies the condition that vapor-phase sputtered particles incident at a preset tilt angle from one side of the opening edge of the through-hole can be deposited at the minimum inner diameter of the through-hole. The substrate assembly and its fabrication method disclosed in this application achieve effective particle delivery to the bottom of the hole, avoiding poor physical vapor deposition caused by hole wall obstruction.

Methods for processing metal components from the nuclear industry are described. In some embodiments, a method includes processing a component having a surface contaminated with radionuclides by dissolving at least a portion of the surface with an acid solution to produce a waste solution including the radionuclides, and separating the radionuclides from the waste solution. In some embodiments, a method includes processing a component including a target radionuclide by immersing at least a portion of the component in an electrolyte bath, applying an electric current to cause electrodissolution, and electroplating the target radionuclide from the solution onto a cathode. In some embodiments, a method includes processing a metal composite component by dissolving it to produce a solution including dissolved metal and particulate material, and separating the particulate material.

To provide an electrolytic gold plating solution having a long lifespan without toxicity, in which plating can be performed with the solution temperature of 35°C or lower and the plating film can uniformly be electrodeposited with excellent plating properties, and a production method of the solution.SOLUTION: An electrolytic gold plating solution includes a non-cyanide soluble gold salt (A) and a complexing agent (B) for complexing gold ions of the gold salt. The complexing agent (B) is a mercaptotetrazole compound expressed by the following general formula (1). The molar ratio (B / A) of the complexing agent (B) to the soluble gold salt (A) is between 10 and 260. The pH of the gold plating solution is less than 3.SELECTED DRAWING: Figure 1

The invention relates to a forming method for composite electroplating of an MEMS (Micro Electro Mechanical System) probe. Structural patterns of a needle tip or / and a needle body are / is photoetched through a micro-electro-mechanical process, the needle tip or / and the needle body is / are formed through electroplating of a composite plating solution after pretreatment, the composite plating solution is obtained by mixing a metal base solution and a turbid liquid, the metal base solution is a nickel base solution and / or a rhodium base solution, and the turbid liquid is a nickel base solution and / or a rhodium base solution. The suspension is formed by suspending nano-powder in water through a dispersing agent. Compared with the prior art, the technology provided by the invention has the following advantages that the MEMS process technology is combined with the composite plating solution to be used for various probe structures, and the performance of the prepared material is greatly improved compared with that of a pure metal coating; the composite plating solution prepared from the plating solution and the second-phase particles is high in stability, and the electroplating process is easy to operate; the nickel-based composite plating solution can be used for obtaining a main body material with higher hardness, better wear resistance and better flexural property; the rhodium-based composite plating solution is used for preparing a needle point material, has higher hardness and wear resistance, and improves the brittle fracture problem.

The invention discloses an electroplating method of a low-porosity nanoscale bright tin layer, which comprises the following steps: placing a clean metal substrate in an activating solution containing a surface modifier, and applying high pulse current for short-time impact to form a transition layer to obtain a target substrate; a target base material is placed in the nano-composite tin plating solution, electroplating is carried out under the cooperation of a continuous ultrasonic field and target waveform pulse current, and a low-porosity nano-scale bright tin layer is formed; the nanometer composite tin plating solution comprises stannous methanesulfonate, methanesulfonic acid, nanometer silicon carbide, nanometer silicon dioxide, a grain refiner, a dispersing agent, cinnamyl aldehyde, a vinyl pyrrolidone copolymer, ascorbic acid, a wetting agent and the balance deionized water. The binding force of a plating layer without a base coat is improved, the plating layer is strengthened, compact and bright, and the process is environmentally friendly.

In one embodiment of the present invention, an electrolytic plating apparatus and an electrolytic plating method are disclosed. The electrolytic plating apparatus includes a plurality of paddles arranged in parallel. The paddles move in a direction parallel to the substrate and are used to stir the electrolytic plating solution. In one cycle, the paddles perform a reciprocating motion with a set stroke, and the reversal point of the reciprocating motion is related to the width of the paddle and the narrowest width of the gap between the adjacent paddles. According to the present invention, by designing the size and operation mode of the paddles, the cumulative time that each corresponding point on the substrate is blocked by the paddle is equal, and the amount of electricity received is equal. This further improves the uniformity of the electrolytic plating height.

The present invention relates to a plating apparatus and a plating method for plating at least one main surface of a substrate. The plating apparatus includes: a processing tank for storing a plating solution; a holding unit that holds the substrate in a horizontal posture in which one main surface faces upward in the processing tank; a cathode electrode in contact with a peripheral edge portion of the one main surface of the substrate held by the holding portion; an anode electrode disposed above the substrate held by the holding unit, the lower surface of the anode electrode being disposed so as to face the one main surface; and a liquid supply unit that is provided with a discharge port that opens toward a gap space sandwiched between the anode electrode and the one main surface, and that supplies liquid from the discharge port toward the plating liquid that fills the gap space.

The invention discloses a preparation method of a difunctional electrode, the electrode and application, and the preparation method comprises the following steps: (1) preparing an electroplating solution: taking deionized water as a solvent, sequentially adding nickel sulfate, ammonium sulfate, ammonium chloride and sodium thiosulfate, uniformly stirring, and adjusting the pH value to 4.5-5.5; (2) electrode pretreatment: taking a nickel wire mesh subjected to double-sided sand blasting as a cathode, and then sequentially removing oil and an oxide layer; and (3) electrochemical deposition: putting the pretreated cathode and the nickel-based stretching net anode into an electroplating solution, respectively connecting the cathode and the anode with the cathode and the anode of a power supply, and performing constant-current deposition at room temperature at the current density of 5-20mA / cm < 2 > for 30-90 minutes to obtain the difunctional electrode. The NiS alloy is prepared by optimizing an electroplating co-deposition process, the unification of high electrochemical activity and anti-iron adsorption performance is realized by utilizing a dual anti-iron mechanism of a polysulfide protective layer, the energy consumption of an electrolytic bath is reduced, and the service life is prolonged.

The invention belongs to the technical field of microbial protection and functional metal coating preparation, and particularly relates to a preparation method of a metal-based graphene oxide and zirconium oxide composite antibacterial coating on a flexible metal foil through magnetic field assisted jet electrodeposition. According to the method, a metal ion electroplating solution containing graphene oxide and zirconium oxide serves as a raw material on a flexible metal substrate, ferromagnetic particles are introduced to serve as a carrier, one-time forming is carried out under the action of a magnetic field through the scanning jet electrodeposition technology, and efficient fixing and uniform distribution of graphene oxide and zirconium oxide in a metal coating are achieved. The prepared coating is compact in structure and high in binding force, after the coating is in contact culture with escherichia coli and staphylococcus aureus for half an hour, the antibacterial rate reaches 94% or above, the antibacterial rate reaches 97% or above, and the coating has excellent stability and reliability. The method disclosed by the invention is simple and convenient in process and high in adaptability, can form a high-performance antibacterial coating on a flexible substrate, is suitable for the antifouling and anticorrosion fields of public health facilities, marine protection and engineering equipment, and has a wide industrial application prospect.

The application discloses a nickel-plated steel strip lead processing method and belongs to the technical field of metal material surface treatment. The method aims to solve the problems of poor plating layer adhesion, large internal stress and easy peeling of the existing nickel-plated steel strip lead. The process steps include: S1, steel strip oil removal treatment; S2, composite activation treatment: the oil-removed steel strip is immersed in a composite activation solution containing sodium citrate to remove the surface oxide layer and form an active adsorption film; S3, nickel plating: the activated steel strip is immersed in a sulfate plating solution containing saccharin and 1,4-butynediol as composite additives for electroplating to form a low-stress and high-density nickel plating layer; S4, post-treatment: cleaning and drying; S5, slitting and packaging. The application cooperates sodium citrate activation with a plating solution system containing stress relieving agents, significantly improves the adhesion between the substrate and the plating layer, reduces the internal stress of the plating layer, and the obtained product has no peeling and falling of the plating layer after repeated bending, low porosity and excellent comprehensive performance, and is particularly suitable for the manufacturing of high-performance electronic component leads.

The application provides a copper plating method for superconducting tape, which comprises the following steps: firstly, carrying out bright copper plating treatment on the processed tape; and then, carrying out sand surface copper plating treatment on the tape. The bright copper plating treatment adopts third current electroplating treatment, and the sand surface copper plating treatment adopts second current electroplating treatment. The current density of the third current is 0.5-3.5 A / dm 2 , and the current density of the second current is 3-8 A / dm 2 . By means of the bright copper plating treatment and then the sand surface copper plating treatment, the outer surface of the tape forms a sand surface, which can effectively prevent the axial sliding deviation of the wound coil cake.

The invention discloses a method for composite etching of an electroplating gold plating layer, which comprises the following steps of: manufacturing a photoetching pattern on the front surface of gallium arsenide epitaxy, then evaporating a metal contact layer, depositing a SiNx protective mask layer, performing Mesa mesa etching on the gallium arsenide epitaxy, exposing a high-aluminum layer on the side surface of an epitaxial material, and forming an aluminum oxide limiting layer by adopting a wet oxidation process; a second SiNx protective mask layer continues to be deposited, and the metal contact layer is exposed through dry etching; forming a seed gold layer by adopting magnetron sputtering TiW / Au metal, and forming a photoresist mask with a target electrode pattern on the seed gold layer; electroplating thick gold on the photoresist mask pattern; the photoresist mask layer is removed after completion; the method of combining dry etching and wet etching is adopted to remove the gold plating layer in the non-electroplating area, so that the lateral corrosion of the metal layer is obviously reduced, the high-precision and high-fidelity electrode pattern transfer is realized, the lateral corrosion of the metal layer is reduced, and the passivation protection effect of the device is improved.

The utility model discloses an electroplating oven for preventing a copper surface area from being polluted and oxidized during tin electroplating, which comprises an oven body, placing components arranged on two sides of the inner wall of the oven body, a temperature control component arranged on the inner wall of the oven body, a processing component connected below the oven body, and a cleaning component arranged on one side of the processing component. According to the drying oven, the humidity in the drying oven can be effectively reduced, the risk of copper surface oxidation can be reduced, pollutants in air can be continuously removed, cyclic utilization of gas in the drying oven is achieved, the energy utilization efficiency is improved, meanwhile, the cleaning assembly is arranged on the treatment assembly, the air humidity can be reduced, dust, impurity particles and organic gas can be adsorbed, and the environment is protected. The environment in the oven is kept clean, the oxidation risk of a copper surface is reduced, the filter element plate can be regularly wiped and cleaned, the situation that the filter efficiency of the filter screen is reduced due to pollutant blockage is prevented, the workload and frequency of manual cleaning are reduced, and the maintenance cost and the failure rate are reduced.

The invention relates to the technical field of electrochemical analysis, in particular to a method and system for rapidly detecting the concentration of copper ions in electroplating liquid, and the method comprises the following steps: in an electroplating starting stage, eliminating the influence of bath liquid temperature on a copper ion interface supply rate acquired in real time by utilizing a temperature gain coefficient, and establishing a reference model of the rate with respect to current density; and in the subsequent electroplating process, the expansion ratio of the surface area of the electrode is calculated by comparing the real-time double-electric-layer discharge time constant with the reference time constant determined in the starting stage. And determining the effective mass transfer flux of the interface by combining the normalized ion supply rate and the surface area expansion ratio, comparing the effective mass transfer flux with the theoretical demand flux obtained by the reference model, and dynamically adjusting the output step length of the rectifier. The interference of temperature fluctuation and dendritic crystal growth is avoided, so that the comprehensive targets of accurate regulation and control, defect prevention and intelligent diagnosis are achieved, and the intelligent level of electrochemical analysis is remarkably improved.

The present application provides a sealing assembly and an electroplating device. The sealing assembly is used for sealing the electroplating device. The electroplating device comprises a cavity and a substrate clamping assembly, the cavity being provided with an opening. The sealing assembly comprises a cover body and a connecting apparatus. The cover is sleeved on the substrate clamping assembly to seal the opening after a chuck enters the cavity, causing the cavity to be in a closed state. The cover body and the substrate clamping assembly are configured to be movable relative to each other, so as to enable the chuck to move relative to the cover body inside the cavity after the cover body has sealed the opening. The connecting apparatus is connected to the substrate clamping assembly, and is used to drive the cover body to move and seal the opening when the chuck enters the cavity through the opening, and / or to drive the cover body to move and disengage from the opening when the chuck moves out of the cavity through the opening. Even if the substrate clamping assembly moves within the cavity, the cover body is not affected by the movement of the substrate clamping assembly and is still capable of sealing the opening, thereby protecting an electroplating solution in the cavity from being oxidized and improving the stability of the electroplating solution.

The invention relates to the technical field of electroplating pools, in particular to a device for improving electroplating uniformity of a VCP electroplating line, which comprises an electroplating pool, a metal mesh plate is fixed in the electroplating pool, a rotating handle is arranged below the metal mesh plate, the rotating handle is rotatably connected to a bottom plate of the electroplating pool, blades are fixed on the surface of the rotating handle, and a mounting frame is mounted at the top of the electroplating pool. A servo motor is mounted on the surface of the mounting frame, the power output end of the servo motor is in transmission connection with a driving shaft, and the bottom end of the driving shaft penetrates through the metal net plate and then is inserted into the top end of the rotating handle; the device has the beneficial effects that the rotating handle is driven to rotate through the servo motor, the blades are driven to forcibly stir electrolyte, metal ion diffusion is accelerated, and the concentration gradient is eliminated; electrolyte circulation is promoted in the stirring process, so that metal ions generated by anodic oxidation reaction are rapidly supplemented to a cathode area, the deposition rate of a plating layer is stabilized, and the phenomenon that the edge thickness of a workpiece is out of tolerance is reduced.