1723 results about "Electroplating" patented technology

The invention relates to the technical field of iron wire electrogalvanizing passivation monitoring, and discloses an iron wire electrogalvanizing passivation intelligent monitoring system with self-adaptive coating thickness control, and the system comprises a coating parameter analysis module which can analyze the matching degree of the coating thickness and the passivation effect according to the equipment operation state information, and generates a parameter analysis parameter set; based on the parameter set, the passivation feature extraction module extracts a space feature value and a distribution variable quantity of a passivation film on the surface of the iron wire to generate an optimized parameter set; the thickness correlation modeling module analyzes the correlation between the coating thickness and the passivation characteristics and generates a dynamic regulation and control result; the abnormal intervention adjustment module extracts a real-time feature matching rate and the like to generate an intervention adjustment data set; and the dynamic feedback regulation and control module analyzes the linkage demand and generates a feedback data table. The system can monitor the iron wire electrogalvanizing passivation process in a self-adaptive mode, the coating thickness is accurately regulated and controlled, and the passivation effect stability and the production efficiency are improved.

The invention discloses an intelligent detection and dynamic supplement regulation and control system for electroplating bath solution components, and belongs to the technical field of electroplating. The system comprises an electroplating bath body, a detection module, a data processing and control module and a regulation and control module. The detection module is used for detecting the metal ion concentration, the pH value, the temperature and the additive concentration of the bath solution on line in real time through a spectrum sensor, an electrochemical sensor and a physical parameter sensor; the data processing and control module adopts a PID and machine learning fused intelligent regulation and control model, predicts the component change trend according to the detection data and the process parameters, and generates a dynamic regulation and control instruction; the regulation and control module quantitatively supplements target components through a high-precision metering pump, and the closed-loop feedback correction module is combined to ensure that the components of the bath solution are stabilized within a preset threshold range. Multi-parameter synchronous detection and accurate regulation and control are achieved, the quality stability of the plating layer is improved, raw material consumption and labor cost are reduced, and the method can be widely applied to industrial scenes such as metal surface treatment.

The invention relates to the field of metal surface treatment, and discloses an efficient electroplating process for a cotton picker spindle and an electroplating liquid formula, the efficient electroplating process comprises the following steps: step 1, substrate pretreatment: sequentially carrying out alkali washing, acid washing and plasma activation on the spindle; step 2, preparing an electroplating solution: dissolving nickel sulfate, sodium hypophosphite, a composite nano additive and a complexing agent in water, and adjusting the pH value to 4.8-5.3; step 3, gradient pulse electroplating: carrying out pulse electroplating in three stages, including bottom layer deposition, transition layer deposition and composite layer deposition; 4, post-treatment is conducted, specifically, silane sealing and curing are conducted on the plating layer; the base body pretreatment in the first step comprises the following sub-steps of alkali washing and oil removal, wherein the picking ingot is soaked in a NaOH solution with the concentration being 45-55 g / L. According to the method, high-density hydroxyl active sites are constructed on the surface of the metal base material through a plasma activation process, strong chemical bonding is formed between a plating layer and the base material, and the interface bonding strength is remarkably improved.

The invention discloses a multi-layer plating process for optimizing surface characteristics of a base material, which is characterized by comprising the following steps of: pretreating the surface of a plated base material, improving the surface smoothness of the base material, and removing dirt on the surface of the base material; electroplating the base material by using the nickel pre-plating solution; chemical plating: the base material subjected to pre-plating treatment is placed in a chemical composite plating solution for chemical plating; the chemical composite plating solution comprises a basic plating solution and second-phase particles, the second-phase particles are nano niobium carbide, and the second-phase particles are wrapped and embedded into an alloy plating layer in the chemical plating process, so that the second-phase particles are distributed in plating layer matrix metal in a discrete mode to form a discontinuous phase. The hard particles niobium carbide are added and are dispersed and distributed in a coating substrate (Ni-P alloy), the hard particles can effectively refine the substrate metal, so that the hardness of the substrate metal is improved, and the niobium carbide hard phase particles are high in hardness, excellent in wear resistance, large in yield limit and high in pressure resistance.

The invention relates to the technical field of corrosion resistance, in particular to a corrosion-resistant and wear-resistant copper insert and a preparation method thereof.The copper insert is subjected to plating treatment in an ionic liquid electroplating mode, then the surface of a plating layer is subjected to hole sealing treatment, and a nickel-copper-composite halloysite nanotube layer is electrically deposited on the surface of the formed copper insert; the preparation method comprises the following steps: taking a halloysite nanotube as a nano loader of a corrosion inhibitor, and coating with dopamine to obtain a composite halloysite nanotube; in the hole sealing liquid, the composite halloysite nanotube is used as a filler, silane modified polyurethane is used as a base material, the silane modified polyurethane is a prepolymer synthesized by using isophorone diisocyanate and polytetramethylene ether glycol as raw materials, octylamine ring-opened 3-(2, 3-epoxypropoxy) propyltrimethoxysilane is used as a chain extender, and the silane modified polyurethane is used as the base material. And 2-(perfluorodecyl) ethanol and aminopropyltriethoxysilane are used as end-capping reagents, so as to prepare the high-temperature-resistant coating.

The invention relates to the technical field of liquid absorption cores of vapor chambers, in particular to a vapor chamber with a porous liquid absorption core of a secondary structure and a preparation method of the vapor chamber. The preparation method comprises the following steps that an upper cover plate and a lower cover plate are prepared; cutting the metal wire mesh to obtain a wire mesh structure, and fixing the wire mesh structure on the surface of one side of the lower cover plate; electroplating is carried out on the silk screen structure of the lower cover plate to deposit nano-copper; calcining and curing the secondary structure of the silk screen electroplated with the nano-copper; and packaging the upper cover plate and the calcined lower cover plate, and performing liquid injection, degassing, sealing welding and packaging treatment to obtain the vapor chamber. According to the vapor chamber, the liquid absorption core with a secondary structure is prepared on the silk screen of the lower cover plate through electro-deposition of nano copper, the nano copper structure on the silk screen serves as the liquid absorption core through calcination and solidification, the service life of the vapor chamber can be effectively prolonged, the secondary porous structure provides multi-stage hole distribution for the liquid absorption core, multiple liquid flowing channels are provided, and heat conduction is accelerated.

The invention belongs to the technical field of semiconductors, and relates to a method for electroplating metal on the back surface of a wafer, which comprises the following steps of: forming at least two positioning holes on the edge of the wafer, and forming an electroplating metal layer on the back surface of the wafer through the positioning holes, so that a groove pattern formed between the electroplating metal layer and the wafer is the same as a pattern of a cutting channel on the front surface of the wafer; therefore, the use of a double-sided photoetching machine can be avoided, the equipment cost is obviously reduced, the process flow is simple, the industrial production is easy, the fragment rate is obviously reduced, the production efficiency is obviously improved, and the application prospect is wide.

The invention relates to the technical field of electroplating, and discloses a ceramic substrate through hole electro-coppering hole filling process control method which comprises the following steps: acquiring structural parameters of a target ceramic substrate through hole, optimizing the proportion of a prefabricated electroplating solution to obtain a proportioned electroplating solution, analyzing a composite electroplating medium of the proportioned electroplating solution, and inquiring a pulse current waveform; the copper deposition morphology is monitored, polarization effect coefficients under different current densities are calculated, duty ratio indexes are optimized to score a shaped current sequence, a multi-order electric field is applied to obtain in-hole flow field data, and the copper deposition uniformity is calculated; and performing multi-cycle electroplating-annealing iteration to obtain a copper hole filling structure, testing residual stress, identifying a lattice distortion section, generating a crystallization-annealing curve, and formulating a process optimization scheme according to regulation and control data. According to the invention, the reliability of the through hole electro-coppering filling process can be improved.

The invention relates to the technical field of electroplating, and particularly discloses a nickel-tungsten-phosphorus plating layer electroplating process which comprises the following steps: S1, preparing a nano composite electroplating solution which comprises nickel salt, tungstate, hypophosphite, nano silicon carbide powder, ZIF-67 (at) MXene core-shell nanosheets, a composite complexing agent and water; s2, plasma mixed gas is adopted for conducting etching treatment on the surface of the workpiece to be plated; s3, electroplating the to-be-electroplated workpiece subjected to surface treatment under the action of pulse current and an alternating magnetic field, and performing ultrasonic stirring on the composite electroplating liquid in the electroplating process; and S4, under nitrogen protection, the workpiece is subjected to annealing treatment. According to the electroplating process, through the synergistic effect of the nano SiC and the ZIF-67 (at) MXene, the component uniformity and the structural compactness of the nickel-tungsten-phosphorus coating can be effectively improved, and then the corrosion resistance of the nickel-tungsten-phosphorus coating in the complex oil gas environment is effectively improved.

The invention discloses a surface treatment process of a hydraulic rod and a coating monitoring system, relates to the technical field of electroplating, and aims to solve the problems that various complementary sensing technologies cannot be integrated, information such as thickness, uniformity and microstructure cannot be synchronously acquired in a lossless, in-situ and real-time manner, and closed-loop control cannot be formed based on the information in the background technology. According to the scheme, the method comprises the steps that PR electrolytic degreasing is conducted, a workpiece serves as an anode, an oil film is torn through the oxygen evolution effect, an extremely-thin oxidation film possibly existing on the surface of the workpiece is dissolved, base metal is completely activated, and an optimal combination basis is provided for a follow-up coating; and washing with hot water, namely removing residual alkaline degreasing fluid and emulsified oil stains by using hot water with the temperature higher than 60 DEG C in a stirring and spraying manner. According to the method, multi-dimensional information such as the thickness, the uniformity and the microstructure can be synchronously obtained in a lossless, in-situ and real-time mode in the surface treatment process, closed-loop control is formed based on the information, and it is ensured that plating growth is always located on the optimal track.

The invention relates to the technical field of electroplating processing, in particular to slotting type annular roller reel-to-reel water electroplating treatment equipment which comprises a base plate, an electroplating treatment cabin is integrated on the top of the base plate, one side of the lower portion of the electroplating treatment cabin communicates with a liquid conveying pipe, a pump body is installed outside the input end of the liquid conveying pipe, and a positioning roller is rotationally arranged in the middle of the lower portion in the electroplating treatment cabin; and the lower part in the electroplating treatment cabin is close to two sides above the positioning rollers, and two sides of the upper part in the electroplating treatment cabin are communicated with spraying pipes. According to the invention, through the electroplating treatment cabin, cavity diversion and bottom eddy current are utilized to accelerate electrolyte circulation, an anode plate and an inner cavity of the electroplating treatment cabin are overlapped to enlarge the anode action area, and through cooperation with conductive roller spacing and annular groove chamfering polishing, the plating thickness standard deviation is reduced, the yield is improved, and the comprehensive energy consumption is reduced; the limiting rollers are used for restraining deviation of an electroplating film conveying path, and high-speed electroplating of ultra-thin materials is adapted; the double-electrode effect can be eliminated during electroplating through the electroplating bath, and the process stability is improved.

The utility model discloses matte electroplating tin thin copper foil production equipment which comprises a tin plating bracket and a plurality of tin plating devices arranged at the rear end of the tin plating bracket, the tin plating device comprises an upper tin plating mechanism, a lower tin plating mechanism, an electroplating liquid temporary storage tank and an electroplating liquid circulating mechanism; the upper electrotinning mechanism, the lower electrotinning mechanism and the electroplating liquid temporary storage tank are sequentially distributed from top to bottom; electroplating liquid in the upper electrotinning mechanism and the lower electrotinning mechanism flows into the electroplating liquid temporary storage tank from top to bottom; and the electroplating liquid circulating mechanism filters the electroplating liquid in the electroplating liquid temporary storage tank and then re-injects the electroplating liquid into the upper electrotinning mechanism and the lower electrotinning mechanism. The whole electroplating device is shortened by half, so that the moving distance of electroplating liquid is shortened, and driving parts such as a pump body are reduced.

The invention discloses a conductive paste, a metallized substrate and a metallization process for manufacturing the metallized substrate, the conductive paste comprises metal particles, the particle size of the metal particles is 0.1-10 [mu] m, and the mass ratio of the metal particles is 80-98%; in the metallization process, a copper layer is arranged on the hole wall of a through hole or a blind hole of a substrate, then conductive slurry is filled in the hole with the copper layer, heating sintering treatment is carried out, and after heating sintering is carried out in an inert gas atmosphere at the temperature of less than or equal to 300 DEG C, metal particles can be fused to form a connection structure or a eutectic structure. A reinforcing layer can be formed between the nano metal particles and the copper layer, and the reinforcing layer is a metal bonding layer or an intermetallic compound layer. The metallization mode is suitable for a through hole or a blind hole of a glass / silicon / ceramic substrate with a high aspect ratio and a micro aperture, and the technical problems that complete filling is difficult to achieve and filling defects exist in an existing electroplating process, the electrical resistivity of conductive paste is high, and the interface bonding force is insufficient can be solved.

Aiming at the limitation of the existing metal bump corrosion prevention technology, the invention provides an innovative process: pure silver electroplating is adopted to form a bump main body, a complete gold wrapping structure is formed on all exposed surfaces of the bump main body through secondary electroplating of pure gold, and the process can be used for accurately regulating and controlling the parameters of the secondary electroplating and the size of a secondary photoetching pattern. The exposed surface of the silver bump is uniformly wrapped by the thin gold layer, so that the problem that metal interconnection is easy to corrode in a severe environment in the traditional technology is effectively solved, and comprehensive breakthrough in corrosion resistance, electrical properties and cost effectiveness is realized through innovative silver core and gold shell layered structure design and precise process control.

The invention discloses a continuous metal electroplating device with uniform plating, which belongs to the technical field of continuous electroplating and comprises a feeding conveying mechanism, a sky rail conveying line, a carrier and a continuous electroplating mechanism. A plurality of lifting conveying modules are fixedly installed at the moving end of the sky rail conveying line, a floating material carrying module is installed on the lower side of each lifting conveying module, and a plurality of hooks used for supporting carriers are evenly and fixedly installed at the bottom of each floating material carrying module at equal intervals. The continuous electroplating mechanism comprises a pre-washing pool, a cleaning pool, a complete electroplating pool, a local electroplating pool and a self-adjusting type shielding module; the base station is fixedly provided with a plurality of pre-washing pools for pre-treating electroplated parts; a pre-washing pool, a cleaning pool, a complete electroplating pool, a cleaning pool, a local electroplating pool and a cleaning pool are sequentially and fixedly mounted on the base table in the moving direction of the sky rail conveying line; and a self-adjusting shielding module is mounted in the local electroplating tank. In this way, continuous electroplating is achieved, and it is ensured that the contact depth of the functional face of the electroplated part and electroplating liquid is consistent.

An article has a formed surface material. On at least a portion of the formed surface material is disposed an antimicrobial article having antimicrobial properties. This antimicrobial article has a non-electrically conductive substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; and a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern. The antimicrobial article provides antimicrobial properties when applied to the formed surface material that may be frequently touched, such as a touch screen, door handle, or other frequently touched surface. The antimicrobial article can inhibit or reduce the transmission of various microorganisms from one person to another.

The invention discloses a preparation method of an ABM ceramic substrate with a metal through hole, and particularly relates to the technical field of ceramic substrates, a Si3N4 ceramic substrate is prepared through tape casting and hot pressed sintering, a conical stepped through hole is processed by using ultrafast femtosecond laser, the aperture of the through hole is 100-300 [mu] m, and the smoothness of the wall of the through hole is Rat; 1 [mu] m; performing oxygen plasma activation on the inner wall of the through hole to generate a Si-O active group; sputtering a nano titanium transition layer to enhance metal-ceramic interface bonding; the through holes are filled layer by layer through pulse electrochemical deposition, the current density is controlled, and a compact non-porous structure is achieved; in-Sn-Ag low-temperature active brazing filler metal is used, and a surface copper layer is bonded under the assistance of plasma; a fine circuit is formed through photoetching and micro-electroplating, the line width and the spacing of the circuit are the same, and the line width and the spacing of the circuit are both smaller than 20 microns; etching a micro-channel network on the back surface of the substrate by using ultraviolet laser, and filling heat-conducting silicone grease; and finally, carrying out vacuum annealing for 2 hours in an environment with the temperature of 250 DEG C.

The invention discloses an electroplating process method for preparing a deep-etching thick metal mask, and belongs to the technical field of micro electro mechanical system electroplating processes. Comprising the following steps: firstly, carrying out photoetching and patterning on the surface of a wafer by using positive photoresist; then, carrying out seed layer sputtering on the wafer subjected to pattern photoetching, and forming a to-be-electroplated region with a preset pattern through a stripping process; then, photoetching is carried out on the to-be-electroplated area through negative photoresist, and a thick photoresist layer with the thickness larger than that of a preset metal coating is formed; and finally, the electroplating area is electroplated, and the metal coating with the preset thickness is obtained. According to the method, the negative photoresist process is adopted, so that the transverse growth of the metal coating is effectively inhibited, the perpendicularity of the side wall of the metal coating is improved, and meanwhile, the damage to the surface of the wafer when the seed layer in the non-electroplating area is removed is avoided. The problems that mushroom-shaped protrusions are easily formed on the edge of a plating layer, crystal grains are coarsened and the like in the electroplating process of an existing electroplating method are solved.

The invention discloses high-strength stainless steel for a wheel hub cover and a machining process of the high-strength stainless steel, and relates to the technical field of stainless steel machining. The specific processing technology comprises the following steps: weighing a stainless steel raw material, smelting under nitrogen pressurization, carrying out protective pouring to obtain a cast ingot, carrying out hot forging and hot rolling to obtain a hot-rolled plate, carrying out solution treatment and water quenching, sequentially carrying out multi-pass cold rolling and single-pass liquid nitrogen heat preservation cold rolling, annealing and aging treatment to obtain a stainless steel base material, and sequentially carrying out grinding, polishing, oil removal and acid activation to obtain the stainless steel plate. And then placing in an electroplating solution for electro-deposition of an alloy plating layer, cleaning after electro-deposition is finished, then carrying out laser cladding, finally carrying out heat treatment, and cutting a thin layer to obtain the high-strength stainless steel. Wherein cladding powder adopted for laser cladding comprises cobalt powder, chromium powder, nickel powder, aluminum powder, molybdenum powder, titanium powder, zirconium powder, nano carbon-nitrogen metal and tungsten carbide.

The invention belongs to the technical field of metal surface treatment, and discloses a high-uniformity metal surface silver plating process and a corrosion-resistant treatment method thereof.The high-uniformity metal surface silver plating process comprises the following steps that firstly, pretreatment is conducted; step 2, activating treatment; step 3, pre-plating a bottom layer; step 4, electrosilvering; step 5, post-processing; according to the method, pre-plating of the bottom layer and electroplating of silver are combined, a layer of thin nickel or copper is pre-plated firstly, and then electroplating of silver is performed, so that the binding force and uniformity of the silver plating layer are effectively improved, and in the electroplating process, the mode of stirring and circulating the electroplating liquid is adopted, so that silver ions in the electroplating liquid are uniformly distributed, and the uniformity of the plating layer is improved; and a thin aluminum oxide protective film is deposited on the surface of the silver plating layer by adopting a chemical vapor deposition technology, so that the corrosion resistance of the silver plating layer is further improved.

The invention discloses a huge transfer method for a pre-planted copper column substrate, which comprises the following steps: preparing a pre-planted plate, namely arranging a release agent on a stainless steel plate, and forming a plurality of groups of copper columns above the release agent; a release agent is coated on a stainless steel plate to form a pre-planting plate, and a plurality of groups of copper columns are formed by adopting a dry film electroplating process, so that the position, height and arrangement density of the copper columns can be accurately controlled, the process ensures that the positioning error of the copper columns in a welding pad area of a substrate is extremely small, and the problem of poor contact caused by pin deviation and non-uniform height in traditional mass transfer is solved; and the packaging yield is obviously improved. The invention belongs to the field of mass transfer methods for pre-planted copper column substrates, and particularly relates to a mass transfer method for pre-planted copper column substrates. According to the invention, the problem of low production efficiency caused by multiple complex procedures and tedious equipment debugging and operation is solved.

The invention relates to a method for plating aluminum on the surface of a neodymium-iron-boron magnetic material, which comprises the following steps: by taking ionic liquid as an electroplating medium, optionally adding manganese chloride, adding a proper amount of additive, controlling the current distribution in the electroplating process through pulse current, and electroplating at proper temperature and current conditions. And a corrosion-resistant aluminum coating with high binding force and high compactness is obtained on the surface of the neodymium iron boron magnetic material. According to the method, the hydrogen evolution reaction is avoided, the bright and uniform aluminum coating is obtained, and the method is environmentally friendly, stable in process and suitable for high-performance surface protection and functionalization of the neodymium iron boron magnetic material.

The invention belongs to the technical field of electroplating, and particularly discloses a real-time supplementing method for plating solution metal cations during electroplating. Aiming at the problems of large concentration fluctuation of metal cations and low supplementing efficiency in the traditional electroplating process, the method realizes dynamic balance of the metal cations through an electroplating synchronous electrolysis and anion exchange membrane technology. According to the technical key points, an electroplating liquid chamber and an electrolyte chamber are separated by adopting an anion exchange membrane; ions are supplemented by electrolyzing a soluble single-metal anode corresponding to metal to be plated, and meanwhile, an electrolytic cathode is arranged in an electrolyte chamber, so that metal deposition is avoided; the ion-selective electrode is used for monitoring the concentration of metal cations in real time, and the electrolytic current is automatically adjusted when the concentration deviation exceeds + / -5%. According to the method, ions are directionally supplemented through electrolysis, plating solution pollution and component fluctuation are avoided, and the uniformity and the qualification rate of a plating layer are improved. And the method is suitable for single-metal and multi-element alloy electroplating systems, can be integrated in processes such as jet electrodeposition and bath plating, is high in adaptability, and has industrial application potential.

The embodiment of the invention relates to the photovoltaic field, and provides a cyanide-free electroplating silver-coated copper conductive material, a preparation method thereof and a crystalline silicon solar cell. The silver-coated copper electrode provided by the embodiment of the invention comprises a copper core and a copper-tin alloy electroplated layer coated on the surface of the copper core, the surface of the pre-plating material is coated with the silver electroplating layer; the surface of the silver-coated copper material is coated with the self-repairing layer; wherein the self-repairing layer comprises a resin film and a pH response type microcapsule, the microcapsule is embedded in the resin film, and the microcapsule is filled with an ammonium molybdate corrosion inhibitor. The copper-silver interface bonding force can be improved through the copper-tin alloy electroplated layer, and the silver layer material does not contain cyanogen and is environmentally friendly; the corrosion inhibitor in the pH response type microcapsule in the self-repairing film layer on the surface of the silver layer is released under a specific pH condition to form a protection film on the silver layer again, so that the self-repairing purpose is achieved, and the dynamic protection effect is achieved.

The invention provides a production process of a high-low tooth screw, relates to the technical field of screw production, and solves the problems of poor skid resistance, low fastening efficiency, unbalanced mechanical properties, insufficient corrosion resistance and the like of a traditional screw through innovative design and process optimization. SCM435 alloy steel is selected, spaced anti-skid teeth are pressed within the range of 270 degrees in the circumferential direction of the head of the screw through a four-station cold header, high-low alternating tooth forms are twisted on the rod portion, the gradient hardness of the surface and the core portion is achieved through isothermal quenching, surface treatment is combined with zinc-nickel alloy electroplating and a polytetrafluoroethylene coating, and the corrosion resistance and the assembly smoothness are improved; full-process intelligent detection is realized through machine vision, three-coordinate measurement and torsion test. The local layout of the anti-skid teeth reduces material consumption and improves meshing efficiency, the high-low tooth form reduces assembly torque and stabilizes pre-tightening force, gradient heat treatment enhances fatigue resistance, the composite coating improves corrosion resistance, and intelligent detection guarantees product consistency.

The invention discloses an electroplated part, an electroplated part manufacturing method and a connector. The electroplated part comprises a base material; a nickel plating layer formed on the surface of the base material; the tin-graphite composite plating layer is formed on the nickel plating layer; the nickel plating layer is formed on the base material, the tin-graphite composite plating layer is formed on the nickel plating layer, the tin plating layer is formed on the tin-graphite composite plating layer, the nickel plating layer serves as a bottom plating layer of the base material, the tin plating layer serves as an outer plating layer of the base material, and the tin-graphite composite plating layer serves as a middle plating layer of the base material. According to the invention, the graphite particles exposed from the tin-graphite composite coating are partially or completely wrapped by the outermost tin coating, so that the graphite particles are not easy to fall off, the wear resistance and corrosion resistance of the electroplated part are improved, and the service life of the electroplated part is prolonged. In addition, the plating layer structure also has a relatively low friction coefficient, so that the insertion and extraction force of the electroplated part in the use process can be greatly reduced.

The invention belongs to the technical field of grinding materials and grinding tools, and particularly relates to a diamond electroplated grinding wheel directionally arranged in a magnetic field and a preparation method and application thereof. Firstly, electroplating liquid is added into an electroplating bath, then 30%-40% of magnetic diamond abrasive materials are added into the electroplating liquid, directional magnetic sanding is carried out with the grinding wheel base body A as a cathode and a nickel plate as an anode, the magnetic field intensity is controlled to be 0.1-1 T, the cathode current density is controlled to be 0.4 A / dm < 2 >-0.6 A / dm < 2 >, the electroplating time is 10-20 min, and a grinding wheel base body B is obtained; removing floating sand from the grinding wheel base body B to obtain a grinding wheel base body C; and the grinding wheel base body C is thickened to obtain a grinding wheel base body D, and the grinding wheel base body D is modified to obtain the grinding wheel. The grinding rate of the manufactured grinding wheel is reduced by 10%-25%, the service life is prolonged by 30%-50%, the machined surface roughness (Ra) can reach 0.3 micrometer or below, and the machined surface precision is reduced by 10%-25%. The grinding wheel is applied to nanoscale grinding of optical glass, sapphire and silicon carbide wafers and forming machining of turbine blade mortises and ceramic matrix composites, and the precision and roughness of the grinding wheel can be effectively guaranteed.

The invention relates to the technical field of corrosion prevention of oil field pipes, and particularly discloses electroplating liquid for a high-tungsten-content hydrogen sulfide corrosion resistant sleeve coating and a preparation process of the electroplating liquid. The invention discloses electroplating liquid for a high-tungsten-content hydrogen sulfide corrosion-resistant sleeve coating. The electroplating liquid comprises the following raw materials: 60-90 parts of a composite tungsten source; 40-70 parts of a nickel-cobalt main salt; 35-55 parts of a composite complexing agent; 1-5 parts of carboxylated graphene quantum dots; 1 to 5 parts of an aminated ZIF-8 derived carbon nanocage; 1-5 parts of a rare earth stabilizer; 1-4 parts of sodium hypophosphite; 1-4 parts of sodium citrate; 1-3 parts of a surfactant; 15 to 25 parts of a buffering agent; and 350 to 450 parts of deionized water. According to the single-layer electroplated layer, the interface stress of the multi-layer structure can be eliminated, so that other interface problems such as plating layer cracking caused by underground temperature fluctuation are avoided, it is guaranteed that the thickness of the plating layer reaches the standard, and then it is guaranteed that the plating layer has excellent corrosion resistance.

The invention discloses a manufacturing method of a small-spacing lamp panel. The manufacturing method comprises the following steps: pressing; drilling is conducted, specifically, through holes are mechanically drilled, and the hole diameter is 0.2-0.3 mm; copper deposition: the thickness of a hole wall copper plating layer is 0.3-0.5 [mu] m; electroplating through holes, wherein the copper thickness in the holes is greater than or equal to 18 microns; the through holes are filled with epoxy resin with the shrinkage rate smaller than 0.5%, and curing is conducted; ceramic board grinding is conducted, an aluminum oxide ceramic grinding wheel is adopted for board grinding, the resin surface in the hole is flush with the surface of the outer layer copper foil of the multi-layer circuit board, the surface roughness Ra is smaller than 0.1 micrometer, and board grinding technological parameters are as follows: the pressure is 5-8 N / cm < 2 >, the rotating speed is 200-300 rpm, and the linear speed is 1-2 m / min; secondary copper deposition: copper deposition is carried out on the surface of the hole plugging resin to form a copper plating layer, and the thickness of the copper plating layer is 0.3-0.5 [mu] m; the whole board is electroplated, and the copper thickness on the resin is larger than or equal to 12 micrometers; and manufacturing an outer-layer circuit. The manufacturing method of the small-spacing lamp panel has the advantages of being low in cost, high in yield, simple in process and the like.

The invention discloses a production method of a fingerprint-resistant electro-galvanized steel sheet, which comprises the following steps: in the process of producing a fingerprint-resistant product by an electro-galvanizing unit, controlling the running speed of strip steel to be 80-120mpm according to different steel types and specifications, and controlling the thickness of a fingerprint-resistant film of a finished product by controlling the rotating speed ratio of a lifting roller to a coating roller of a roller coater and the drying temperature. The rotating speed ratio of a lifting roller to a coating roller of the roller coater is controlled to be 60 / 120-70 / 140; according to the method, a complex treatment process is not needed, the steel plate which is good in fingerprint resistance and corrosion resistance and high in smoothness can be obtained, meanwhile, the chromium-free fingerprint-resistant liquid is adopted, and pollution to the environment is avoided; and stable and efficient production of the fingerprint-resistant electro-galvanized steel in the electro-galvanizing process can be guaranteed, and the fingerprint-resistant film is uniform in coating, consistent in thickness, consistent in surface brightness and good in application performance.