8154results about "Stacked capacitors" patented technology

The invention discloses a high-temperature-resistant, high-voltage-resistant and anti-breakdown capacitor base film and a preparation method thereof. The high-temperature-resistant, high-voltage-resistant and anti-breakdown capacitor base film is prepared from the following raw materials in parts by weight: 100 parts of polypropylene; 17 to 36 parts of polyvinylidene fluoride; 3-12 parts of enhanced and improved talcum powder; 1-6.5 parts of modified barium titanate; 1-6 parts of a cross-linking agent; 2-10 parts of a compatilizer; and 0.05-2 parts of an initiator. The capacitor base film is high in mechanical strength, and has excellent high temperature resistance, thermo-oxidative aging resistance, high voltage resistance and anti-breakdown performance; the enhanced and improved talcum powder is constructed by taking expanded layer modified talc as a carrier and titanium dioxide-carbon dot composite particles as a loading component and grafting and coating the organic matter, so that the defects of the talcum powder can be overcome, and the improvement effect of the talcum powder on heat resistance, high-voltage resistance and breakdown resistance can be fully exerted; meanwhile, the system can be endowed with excellent thermo-oxidative aging resistance.

The invention relates to the technical field of capacitor films, in particular to a high-temperature-resistant polypropylene capacitor film and a preparation method thereof.The high-temperature-resistant polypropylene capacitor film is prepared from, by weight, 94-98 parts of polypropylene resin, 1-3 parts of filler-doped modified balance adjusting agent, 0.5-2 parts of boron nitride-glass fiber combined agent, 0.05-0.4 part of nucleating agent, 0.2-0.4 part of antioxidant and 0.1-0.4 part of silane coupling agent; the high-temperature-resistant polypropylene capacitor film is obtained through the processes of melting extrusion molding, cooling shaping, preheating, two-way stretching, heat shaping, rolling and the like of the raw material composition. The polypropylene resin, the nucleating agent, the antioxidant and the silane coupling agent are blended, the filler-doped modified balance adjusting agent and the boron nitride-glass fiber coupling agent are added, and the raw materials are blended and coordinated, so that high feasibility of a two-way stretching process is guaranteed, breakdown resistance, mechanical strength and dielectric loss performance of the product are optimized, and the product has good mechanical properties. And meanwhile, the high-temperature-resistant and corrosion-resistant stability effects are remarkable.

To provide a multilayer electronic component having excellent reliability by preventing penetration of external moisture or plating solution.SOLUTION: According to one embodiment of the present invention, there is provided a multilayer electronic component which includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an external electrode including a base electrode layer connected to the internal electrode; and an interface layer disposed between an end of the dielectric layer and the base electrode layer. The interface layer includes a first glass containing Ba, Zn, and Si, and the base electrode layer includes a second glass containing Ba and Si. When an average molar ratio (Ba / Si) of Ba to Si contained in the first glass is M1 and an average molar ratio (Ba / Si) of Ba to Si contained in the second glass is M2, M1 and M2 satisfy M1 / M2≥1.5.SELECTED DRAWING: Figure 5

The embodiment of the invention provides an inverter, a motor controller and a vehicle, and the inverter comprises an integrated drive control board which comprises a drive part and a control part which are disposed on the same circuit board; the onboard current sensor is used for detecting direct current and converting the direct current into three-phase alternating current; the integrated liquid cooling heat dissipation capacitor comprises a high-voltage film capacitor and a liquid cooling heat dissipation device, and at least part of the high-voltage film capacitor is in contact with the liquid cooling heat dissipation device. At least part of the power semiconductor device is in contact with the liquid cooling radiator, the high-voltage film capacitor is connected with a positive electrode and a negative electrode of an upper bridge of the power semiconductor device through a positive electrode switching copper bar and a negative electrode switching copper bar respectively, and a lower bridge of the power semiconductor device is connected with the three-phase copper bar. The integrated liquid cooling heat dissipation capacitor and the liquid cooling heat dissipation device are arranged to dissipate heat of the power semiconductor device and the high-voltage thin film capacitor, and the high-voltage thin film capacitor and the power semiconductor device can be dissipated at the same time through one liquid cooling heat dissipation device.

A multilayer ceramic capacitor includes dielectric layers and internal electrode layers. Internal electrode layers adjacent to a first main surface define first main surface-side internal electrode layers, and internal electrode layers adjacent to the second main surface define second main surface-side internal electrode layers, first solid solution layers including a second metal as a solid solution is provided at interfaces between the first main surface-side internal electrode layers and the dielectric layers, the interfaces being in the first main surface-side internal electrode layers, and second solid solution layers including the second metal as a solid solution is provided at interfaces between the second main surface-side internal electrode layers and the dielectric layers, the interfaces being in the second main surface-side internal electrode layers. A concentration of the second metal in the second solid solution layer is higher than that of the second metal in the first solid solution layer.

To provide a multilayer ceramic electronic component capable of suppressing structural defects in a capacitance portion.SOLUTION: A multilayer ceramic electronic component includes a laminated structure in which a plurality of internal electrode layers and a plurality of dielectric layers are laminated, and a pair of cover layers provided outside an outermost internal electrode layer among the plurality of internal electrode layers, and the pair of cover layers has ceramic as a main component, and at least one of the pair of cover layers has an average grain number in the stacking direction in the laminated structure that is smaller than the average grain number in at least one dielectric layer among the plurality of dielectric layers.SELECTED DRAWING: Figure 5

The invention provides a thin-film capacitor and a preparation method thereof, and relates to the technical field of capacitors, in the invention, when a capacitor core is subjected to heat setting, inert gas is used as heat conduction gas, and the inert gas is used for filling a space between film layers of the thin-film capacitor, so that water vapor between the film layers of the thin-film capacitor can be removed; the inert gas is relatively stable and is not easy to ionize under the action of electric stress and thermal stress, so that the loss of the thin-film capacitor can be reduced. Besides, in the final stage of heat setting heating, multiple times of cooling-heating treatment are carried out in a certain temperature range, so that the metalized film in the capacitor core repeatedly expands with heat and contracts with cold, water vapor in the metalized film material can be removed, and the heat-insulating performance of the capacitor core is improved. Therefore, the loss of the thin-film capacitor is further reduced. In conclusion, the thin-film capacitor manufactured by the method is low in loss, and the service life of the capacitor is prolonged.

A multilayer structure including a plurality of interposers and a plurality of electronic components disposed between the plurality of interposers is provided. The plurality of interposers and the plurality of electronic components are arranged in at least two layers, each layer comprising at least one electronic component of the plurality of electronic components disposed between two interposers of the plurality of interposers. The at least two layers are stacked adjacent to one another such that one interposer of the plurality of interposers is common to adjacent layers of the at least two layers. A first external terminal and a second external terminal may electrically connect the multilayer structure with an additional electronic component and / or within an assembly. Microelectronic assemblies incorporating a multilayer structure are also provided.

The invention belongs to the technical field of thin film capacitors, and particularly relates to a chemical grafting modified polypropylene capacitor film material and a preparation method and application thereof. According to the preparation method of the chemical grafting modified polypropylene capacitor film material, provided by the invention, diethylenetriamine ethyl acrylate with a plurality of specific groups such as amino groups and carboxyl groups and unsaturated double bonds is synthesized through esterification reaction, and the diethylenetriamine ethyl acrylate is introduced into a polypropylene material through chemical grafting to obtain chemical grafting modified polypropylene; the prepared polypropylene capacitor film material has the excellent properties of good compatibility, difficulty in film breakage, capability of adsorbing and removing residual moisture, difficulty in oxidation corrosion, excellent breakdown resistance and the like, and the preparation method is a preparation method of the high-performance polypropylene capacitor film material; therefore, the technical problem that a polypropylene capacitor film material prepared in the prior art is low in performance is solved.

A multilayer ceramic capacitor includes first, second, third, and fourth regions each adjacent to a corresponding one of end surfaces, a first middle region between the first and second regions, located closer to an outside of a multilayer body, and having higher coverage, a second middle region between the third and fourth regions, located closer to the outside of the multilayer body, and having higher coverage, a first sloped portion coupling the first region and the first middle region, a second sloped portion coupling the second region and the first middle region, a third sloped portion coupling the third region and the second middle region, and a fourth sloped portion coupling the fourth region and the second middle region.

The invention provides a metallized film for a capacitor, a preparation method of the metallized film and the capacitor, and relates to the technical field of capacitor manufacturing. The preparation method of the metallized film comprises the following steps: preparing an inorganic reinforcing material from raw materials including 1, 4-phthalaldehyde, zirconium diboride and tetraethoxysilane; the preparation method comprises the following steps: preparing a modified polypropylene material from raw materials including 4, 4 '-diaminobiphenyl, triphenyl phosphate, an ethylene-1-octylene copolymer, polyethylene and polypropylene; raw materials including polyvinyl alcohol, a silane coupling agent, N-hydroxynaphthalimide trifluoromethanesulfonic acid, an inorganic reinforcing material and a modified polypropylene material are subjected to melt mixing, casting piece forming and two-way stretching, and a base film is obtained; applying a polyester coating on the base film, and carrying out irradiation treatment on the base film by adopting an electron beam and an ultraviolet light source to obtain a modified base film; a metal layer is formed on the modified base film through vacuum evaporation, and the metallized film is obtained. The metallized film obtained by the invention has good thermal stability and mechanical properties.

The invention belongs to the technical field of nickel electrode slurry preparation, discloses a preparation process of ultra-fine particle size roll-printed nickel electrode slurry for an ultra-high capacity MLCC, and aims to solve the problems that in the prior art, ultra-fine nickel powder is easy to oxidize, the cost of covering nickel nitride powder is high, a covering layer is easy to damage and agglomerate during dispersion, and the performance of the slurry is poor. The method comprises three steps of raw material pretreatment, synchronization of material dispersion and nitridation, post-treatment and nitrogen protection, wherein the pretreatment is used for removing impurities and preventing oxidation, dispersion and nitridation are carried out synergistically through a sand mill and an ultrahigh-pressure homogenizer in a graded regulation and control mode, the post-treatment comprises filtering, inspection and double-layer vacuum packaging, the raw materials are prepared according to a specific proportion, key parameters are precisely regulated and controlled, and finally the slurry is prepared. Roll printing adaptability and co-firing requirements are met, independent nitridation and reduction procedures are omitted, cost is reduced, slurry uniformity, dispersion stability and MLCC reliability are improved, and large-scale mass production can be achieved.

The invention relates to the technical field of polypropylene capacitance films and preparation methods thereof, in particular to a high-temperature-resistant polypropylene capacitance film and a preparation method thereof.The preparation method comprises the steps that a base film sheet comprising a first edge layer, a second edge layer and a heat-resistant layer is prepared through a three-layer co-extrusion extruder, and the heat-resistant layer is located between the first edge layer and the second edge layer; stretching the base film sheet to form a capacitance film base film; and plating a metal film on the surface of the capacitance film base film to obtain the capacitance film. According to the high-temperature-resistant polypropylene capacitor film prepared by the method, the heat-resistant layer can fundamentally improve the high-temperature-resistant performance of the base film of the capacitor film, so that the overall high-temperature-resistant performance of the capacitor film is improved, and the production is simple. Besides, metal ions and ash content are not introduced, the breakdown voltage of the capacitor film product is not reduced, the first edge layer and the second edge layer do not influence the processing performance of the high-temperature-resistant polypropylene capacitor film and the control of the surface roughness, and the subsequent process is not influenced.

Disclosed embodiments may include systems, devices and methods for fabricating high-density charge-storage devices and power conversion devices. In one embodiment, a device is disclosed, comprising an inductor. The inductor includes a first inductor surface and a second inductor surface opposite the first inductor surface. The inductor further includes a first inductor substrate including a cavity. A seed layer is formed on a bottom surface of the cavity, and a magnetic layer is formed on the seed layer. The magnetic layer includes a plurality of stacked magnetic layers separated from each other by an insulating material layer.

A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including Ni laminated in a thickness direction. In the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion. The element body portion includes first, second, and third regions in order from an inside to an outside in the width direction in each of a region from an end portion on one side of the lead-out portion in the width direction to the first side surface and a region from an end portion on another side of the lead-out portion to the second side surface. When grain sizes of dielectrics included in the first, second, and third regions are respectively defined as gr1, gr2, and gr3, a relationship of gr1<gr2<gr3 is satisfied.

The invention discloses a polypropylene film for a bidirectional asynchronous stretching high-temperature-resistant three-layer structure capacitor and a preparation method of the polypropylene film. The film comprises a first surface layer, a second surface layer and a middle layer clamped between the two surface layers, the middle layer is made of polypropylene, the first surface layer is made of a cycloolefin copolymer (COC), and the second surface layer is made of polypropylene; the mass of the middle layer accounts for 85wt%-88wt% of the total mass, the mass of the first surface layer accounts for 5wt%-7wt% of the total mass, and the mass of the second surface layer accounts for 7wt%-8wt% of the total mass. The temperature resistance can be effectively improved by utilizing the characteristics of the cycloolefin copolymer, the film-forming property is improved by controlling the proportion content of the cycloolefin copolymer, the temperature resistance of the film can be improved to 125 DEG C or above, and the temperature resistance of the film is greatly improved. When the COC content is controlled to be 5%-7%, the film-forming property and the temperature resistance can be both considered, and the temperature reaches 125 DEG C.

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a plurality of capacitance formation portions including first dielectric layers and internal electrodes alternately arranged in a first direction. An intermediate layer disposed is between the adjacent capacitance formation portions and includes a second dielectric layer. An external electrode is disposed on the body and connected to the internal electrode. The first and second dielectric layers may include a plurality of grains and pores. An average grain size of the first dielectric layer may be smaller than an average grain size of the second dielectric layer. A porosity of the first dielectric layer may be lower than a porosity of the second dielectric layer.

The invention discloses an interface covalently bonded core-shell structure boron nitride polypropylene composite dielectric material and a method. The interface covalently bonded core-shell structure boron nitride polypropylene composite dielectric material comprises a maleic anhydride grafted polypropylene matrix and a core-shell structure filler dispersed in the maleic anhydride grafted polypropylene matrix, the core-shell structure filler comprises hydroxylated boron nitride nanoparticles covalently grafted on a polymer shell layer on the surface of the core-shell structure filler; the polymer shell layer is polyglycidyl methacrylate; the epoxy group of the polymer shell layer reacts with the anhydride group of the maleic anhydride grafted polypropylene matrix to form a covalent bond. The invention has the characteristics of strong interface bonding force, uniform filler dispersion, and excellent comprehensive electrical properties and processability.

The invention discloses a polypropylene film for a film capacitor, the polypropylene film is composed of polypropylene and a cyclic olefin polymer, a plurality of gaps are distributed in the film, the gaps are approximately annular on the cross section of the film, and the inner diameter of the approximately annular gaps is 20-120nm. The invention also provides a preparation method of the polypropylene film, which comprises the following specific steps: putting the polypropylene and the cyclic olefin polymer into an extruder, heating and melting; the melt is extruded through a T-shaped die head and attached to a piece casting roller through an air knife for piece casting, and the temperature of the piece casting roller is 85-95 DEG C; the method comprises the following steps: preheating a cast sheet, longitudinally stretching at the stretching rate of 4-7 times and at the temperature of 135-150 DEG C, preheating the longitudinally stretched sheet at the temperature of 145-160 DEG C, transversely stretching at the stretching rate of 7-10 times and at the stretching temperature of 165-180 DEG C, and then entering a shaping area at the temperature of 168 DEG C; and carrying out corona treatment, rolling, curing and slitting on the heat-set film to obtain the product. The polypropylene film has good high temperature resistance and high pressure resistance, and is suitable for the field of capacitors.

An internal electrode layer includes therein a plurality of inner ceramic particles within an observation range of a cross-section intersecting the internal electrode layer. The position of the inner ceramic particles in the internal electrode layer relative to the center position of the internal electrode layer in the thickness direction is correlated with the position from the center position to the edge position, and the corresponding positions are indicated by the numbers 0-100. Such an index is referred to as Dsp. Inside the internal electrode layer, within a region of Dsp of 40 or less, preferably 30 or less, the inner ceramic particles are present in an area of at least 50% of the total area of the inner ceramic particles present within the observation range.

A multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers laminated in a thickness direction, and external electrodes respectively on first and second end surfaces and electrically connected to the internal electrode layers. Each of the internal electrode layers includes an opposing portion opposed to another internal electrode layer, and a lead-out portion connected to the opposing portion and extending to the first or second end surface, a width of the opposing portion is larger than a width of the lead-out portion in the width direction, and a relationship of C1>C2 is satisfied when a continuity of an end portion of the opposing portion in the width direction is defined as C1 and a continuity of an end portion of the lead-out portion in the width direction is defined as C2.

The vacuum heat treatment clamp applies a certain pressure to the capacitor core, the core is in an inert gas and negative pressure environment for staged heating, finally, a heat conduction box body is slowly deflated, and after the air pressure in the heat conduction box body is balanced with the atmospheric pressure, the heat conduction box body is opened, so that the capacitor core is subjected to vacuum heat treatment. And taking out the capacitor core. According to the process, the capacitor core is located in the negative pressure inert gas environment, the product is isolated from air and is not oxidized, gas in the product can be easily exhausted through the negative pressure environment, and an internal air gap is eliminated; the capacitor core is located in the middle of the heat treatment clamp, different portions of the capacitor core are evenly heated, product shrinkage is even and consistent, and the voltage resistance and the charging and discharging capacity of a capacitor are obviously improved.

A multilayer ceramic capacitor includes first and second counter portions. The first counter portion includes a first middle region and first and second regions. The second counter portion includes a second middle region, third and fourth regions. The first middle region has coverage higher than coverage of the first and second regions. The second middle region has coverage higher than coverage of the third and fourth regions. A dimension of each of the first and second middle regions is shorter than a distance between first and second external electrodes. A dimension at a center of an exposed portion in the length direction is longer that a maximum distance in a lamination direction between first and second covered portions, and shorter than a maximum distance in the lamination direction between both sides of the first and second external electrodes.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are alternately laminated, a base electrode, and an external electrode. The internal electrodes include a first internal electrode and a second internal electrode. The base electrode includes a first base electrode and a second base electrode. The external electrode includes a first external electrode and a second external electrode. Each of the first base electrode and the second base electrode contains a plurality of sintered bodies made of dielectric particles. At least a part of the plurality of sintered bodies is located at the interface between each base electrode and the laminate.

The invention relates to plasticity-enhanced lead lanthanum zirconium tin titanate-based antiferroelectric ceramic and a preparation method thereof. The chemical formula of the zirconium tin lead titanate lanthanum-based anti-ferroelectric ceramic is (Pb < 0.975-x > La < 0.02 > Sr < x >) (Zr < 0.5 > Sn < 0.37 > Ti < 0.13 >) < 0.9975 > O < 3 >, x is smaller than or equal to 0.10; and sintering by adopting a flash sintering technology to prepare the plasticity-enhanced lead lanthanum zirconate tin titanate-based antiferroelectric ceramic. Wherein the initial electric field intensity is set to be 100-300 V / cm, and the temperature rise rate of the flash sintering furnace body is 5-15 DEG C / min; when the reading of the current detector reaches the order of magnitude of [mu] A, the electric field intensity is increased to 200-500V / cm; after the current density value reaches 10-30 mA / mm < 2 >, the stable current density is kept for 90-200 s; preferably, the temperature rise rate of the flash burning furnace body is 8-12 DEG C / min.

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers of which a main component is ceramic and each of a plurality of internal electrode layers are alternately stacked. The plurality of internal electrode layers include Ni and Sn. Each of an upper section and a lower section of the plurality of internal electrode layers includes multiple internal electrode layers each having a Sn concentration higher than that of each internal electrode layer of a center section interposed between the upper and lower sections in a stacking direction, which are constituted by top 5% or more and bottom 5% or more of the plurality of internal electrode layers, respectively.

To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.

The invention relates to a flame-retardant breakdown-resistant metallized film and a capacitor, the flame-retardant breakdown-resistant metallized film comprises an aluminum shell, a capacitor core and an epoxy resin layer for packaging the capacitor core, and the capacitor core is formed by winding and metal spraying the flame-retardant breakdown-resistant metallized film; and preparing a metal coating on the surface of the flame-retardant modified insulating film through a vacuum coating process. According to the flame-retardant breakdown-resistant thin-film capacitor, through a manufacturing process of modifying an existing insulating base film, adding a flame retardant into polymer particles, and then spraying a corona auxiliary liquid on the thin film to be matched with corona treatment, the defects that the hot shrinkage rate of the thin film is too large and the impact strength is low due to the addition of the flame retardant can be overcome; and finally, the flame retardance and the breakdown resistance of the thin film capacitor are remarkably improved.

The invention relates to the technical field of dielectric materials, in particular to a diamine monomer crosslinking modified fluorine-containing ferroelectric polymer, a preparation method and a device. The diamine monomer cross-linked modified fluorine-containing ferroelectric polymer comprises the following components: a semi-crystalline thermoplastic fluorine-containing ferroelectric polymer and a diamine cross-linking agent, the semi-crystalline thermoplastic fluorine-containing ferroelectric polymer is polyvinylidene fluoride with ferroelectricity and a copolymer derivative thereof; the diamine cross-linking agent is short-chain diamine containing a rigid structure; the mass fraction of the diamine cross-linking agent is 0.25%-10% compared with the total mass fraction. The thin film prepared by the invention meets the application requirements of improvement of dielectric constant, reduction of dielectric loss, reduction of leakage current, improvement of breakdown field strength and the like in a high electric field.