68results about "Multiple fixed capacitors" patented technology

A capacitor assembly is assembled on a system substrate. The capacitor assembly includes a capacitor, a first conductive plate, an insulating plate, and a second conductive plate, which are stacked sequentially. The capacitor includes a first lead and a second lead, which are electrically connected to the first conductive plate and the second conductive plate, respectively. The first conductive plate includes a first insertion portion, and the second conductive plate includes a second insertion portion. The capacitor assembly is inserted into the system substrate through the first and second insertion portions, thereby electrically connecting the entire capacitor assembly to the system substrate. The material properties of the first and second conductive plates reduce conductivity and improve thermal conductivity, further enhancing the utilization rate of the capacitor within the capacitor assembly's area.

A device according to some embodiments includes a first IPD die including a first SiC substrate. The first IPD die has a first surface and a second surface on the first SiC substrate opposite the first surface and includes a first contact and at least one first metal portion on the respective surfaces of the first SiC substrate. The device further includes a second IPD die including a second SiC substrate. The second IPD die has a third surface and a fourth surface on the second SiC substrate opposite the third surface and includes a second contact and at least one second metal portion on the respective surfaces of the second SiC substrate. The device further includes an electrical interconnection structure between one of the first and second surfaces of the first IPD die and one of the third and fourth surfaces of the second IPD die.

The utility model discloses a new energy automobile battery swap station's PCB board 4 pin film capacitor, including plastic shell and the capacitor body of encapsulation in plastic shell, capacitor body includes the capacitor core that is composed of multiple single core and the laminated busbar that is connected with capacitor core through soldering tin, and the laminated busbar is connected with two outgoing terminals, and each outgoing terminal has two parallel interval opposite pins and the connecting portion of connecting two pins, and the connecting portion is integrally formed with two pins and is combined into U shape, and the pin stretches out plastic shell outside, and the connecting portion of each outgoing terminal is welded and connects the laminated busbar. Through setting laminated busbar, U type outgoing terminal, multiple core combination arrangement capacitor core in the inside of plastic shell, the soldering connection process that laminated busbar is used with electric core, makes capacitor presents high stable ESL, ESR parameter on high frequency resonance road, and the current capacity of capacitor improves self heating little, and circuit output high quality steady voltage waveform.

The present invention relates to a capacitor, in particular an intermediate circuit capacitor, comprising a first capacitive unit and a second capacitive unit, a first electrode with a first electrical conductor and a second electrical conductor, a second electrode with a third electrical conductor, wherein the first capacitive unit and the second capacitive unit are arranged side by side and separated from each other by a gap, wherein the first electrical conductor is configured to electrically contact the first capacitive unit at a first top surface, wherein the second electrical conductor is configured to electrically contact the second capacitive unit at a second top surface, and wherein the third electrical conductor is configured to electrically contact the first capacitive unit at a first bottom surface and the second capacitive unit at a second bottom surface.wherein the second electrical conductor is arranged in the gap between the first capacitive unit and the second capacitive unit in order to prevent the propagation of electromagnetic waves between the first capacitive unit and the second capacitive unit.

A trench capacitor includes a plurality of unit trench capacitors arranged in a 2D repetitive pattern in a substrate. The unit trench capacitors are separated by elongated trenches or elongated walls between the unit trench capacitors. The trench capacitor includes a plurality of stress compensation elements. Each unit trench capacitor has one or more closed trenches, with each trench further having a bottom electrode, a top electrode, and a dielectric between the bottom electrode and the top electrode. The unit trench capacitors are connected in parallel and the stress compensation elements are arranged between the unit trench capacitors such that they interrupt the elongated walls or trenches.

To provide a method for solving the problem of a low capacitance value at high voltage in a tunable multilayer capacitor.SOLUTION: A multilayer capacitor comprises a first active electrode 14 in electrical contact with a first active termination 16, and a second active electrode 20 in electrical contact with a second active termination 18. The capacitor comprises a first DC bias electrode 22 in electrical contact with a first DC bias termination 30, and a second DC bias electrode 26 in electrical contact with a second DC bias termination 32. Multiple dielectric layers 12 are disposed between the first and second active electrodes and between the first and second bias electrodes. At least a portion of the dielectric layers contains a tunable dielectric material that exhibits a variable dielectric constant upon application of an applied DC voltage across the first and second DC bias electrodes. The thickness of at least one of the multiple dielectric layers is greater than about 15 micrometers.SELECTED DRAWING: Figure 2A

This utility model discloses a multilayer ceramic capacitor and its assembly. The multilayer ceramic capacitor includes a ceramic body and multiple external electrodes. The ceramic body includes multiple dielectric layers and internal electrodes, and is used to form at least two sub-capacitors with different capacitance values. Each sub-capacitor contains an independent set of internal electrodes. Multiple external electrodes are disposed on the end face and / or side face of the ceramic body, and are electrically connected to corresponding internal electrodes. The external electrodes and electronic components are connected and coupled in different ways to allow the multilayer ceramic capacitor to selectively form multiple different capacitance values. The multilayer ceramic capacitor of this application can meet the requirements of various capacitance values ​​required by circuits, and can greatly reduce the number of multilayer ceramic capacitors used. This not only reduces manufacturing costs and production time, but also reduces the space occupied by electronic components, which is beneficial to the flexibility, compactness and miniaturization of electronic component design.

A capacitor includes a case that houses a capacitor element, a filling resin filled in the case, and a bus bar. The filling resin includes an exposed surface exposed to the outside. The bus bar includes a protruding part protruding from the inside of the filling resin to the outside, a flat surface part, and a first external connection terminal part. The flat surface part includes a first end and a second end that is connected to the protruding part and the first external connection terminal part. The protruding part is bent at the second end around a first axis to extend in a first direction, and the first external connection terminal part is bent at the second end around a second axis to extend in a second direction opposite to the first direction. Each of the first axis and the second axis is disposed in a plane facing the exposed surface.

The application provides a capacitor parallel type controllable lightning arrester device, and relates to the technical field of lightning control, which comprises an outer box, two groups of connecting electrodes are fixedly arranged in the middle of the outer box, a lightning arrester group is arranged at the top of the connecting electrodes, and a capacitor is connected to the outside of the connecting electrodes; two groups of positioning templates are arranged, and the two groups of positioning templates are fixedly arranged on the two sides of the inside of the outer box; a slope clamping block is arranged, an automatic on-off control function is provided, the pressure in the hollow electrode strip is gradually increased through the mode of extruding gas, the lowermost air expansion rod is first entered into the lowermost partition support to support the slope clamping block, the slope clamping block is further adhered to the slope clamping block, the sliding contact block is moved, the sliding contact block moves to the positioning template, the sliding contact block is adhered to the spring contact point, the connecting electrode, the capacitor and the hollow electrode strip are connected, rapid control is realized, and the problem that the existing device cannot be gradually automatically connected through integrated unified power is solved.

This utility model relates to the field of capacitor technology, specifically to a combined thin-film capacitor that can improve capacitor reliability. It includes a housing, within which capacitor cores are disposed. The capacitor cores are arranged side-by-side at intervals. The positive electrodes of the two capacitor cores are arranged facing each other and are respectively connected to positive electrode leads. The positive electrode leads are connected to an upper electrode plate, which has two positive electrode leads. The negative electrodes of the two capacitor cores are respectively connected to the two ends of a negative electrode lead, which has two negative electrode leads. An insulating pad is disposed between the upper electrode plate and the negative electrode lead.

To provide a capacitor prevented from abnormal heat generation and capable of realizing low ESL. A capacitor 1 includes: a plurality of capacitor elements 10A including a first end surface electrode 12A and a second end surface electrode 13A; a first conductor 20 in contact with and electrically connected to the first end surface electrode 12A; a second conductor 30 in contact with and electrically connected to the second end surface electrode 13A; a third conductor 40 adjacent to the first conductor 20, the third conductor 40 including an embedded part 41A positioned in a first section that overlaps with the first conductor 20 and an exposed part 42A positioned in a second section separate from the first section; and a sealing resin part 50 sealing the third conductor 40 to embed the embedded part 41A and expose the exposed part 42A.

A capacitor device comprises a semiconductor substrate with multiple metal layers above the substrate. a first metal layer has a first plurality of bottom terminals elongated in a first direction, and a first plurality of top terminals, electrically coupled to each other, elongated in the first direction and interleaved with the first plurality of bottom terminals. A second metal layer between the semiconductor substrate and the first metal layer has a second plurality of bottom terminals elongated in the first direction, and a second plurality of top terminals, electrically coupled to each other and the first plurality of top terminals, elongated in the first direction and interleaved with the second plurality of bottom terminals.

This component mounting method is for mounting and soldering a second chip component onto an upper surface of a first chip component that is disposed in advance on a substrate, the first chip component having first terminals on the upper surface thereof. The second chip component has a body portion having an upper surface, a lower surface, and side surfaces, and second terminals respectively solder-plated on both end portions of the body portion, wherein a central portion of the body portion sandwiched between both the end portions is thinner than both the end portions. The component mounting method includes a step of aligning the second terminals and the first terminals of the chip components to mount the second chip component onto the upper surface of the first chip component, and filling a space formed between the lower surface of the body portion of the second chip component and the upper surface of the first chip component with flux.

The invention relates to a device (100) for a current transformer (200), comprising: - at least one X-capacitor (10), - at least one first Y-capacitor (20), - at least one further Y-capacitor (30), wherein at least one first busbar (50) contacts the at least one X-capacitor (10) and the at least one first Y-capacitor (20), wherein at least one further busbar (60) contacts the at least one X-capacitor (10) and the at least one further Y-capacitor (30), wherein the first busbar (50) contacts the at least one X-capacitor (10) in a first contact plane (K1), wherein the further busbar (60) contacts the at least one X-capacitor (10) in a further contact plane (K2), wherein both the at least one X-capacitor (10) and the Y-capacitors (20, 30) are located in a space between are arranged in the first contact level (K1) and the further contact level (K2),wherein the at least one first Y-capacitor (20) and the at least one further Y-capacitor (30) are jointly connected to a terminal element (70), the terminal element (70) being designed for connection to a ground (M), as well as a current transformer (200) and a vehicle (300).

The present invention provides a motor control device that can easily achieve miniaturization while securing the insulation distance between a busbar and a substrate. The motor control device according to the present invention includes a printed circuit board 20 on which a switching element 22 is surface-mounted; busbars 31 and 32 that are surface-mounted on the printed circuit board 20 and are connected to the switching element 22; and an electrolytic capacitor 60 that is electrically connected to the switching element 22 via the busbars 31 and 32. The busbars 31 and 32 have main bodies 41 and 51 connected to the printed circuit board 20, and busbar terminals 42 and 52 that are linked to the main bodies 41 and 51 and are connected to the electrolytic capacitor 60. The busbar terminals 42 and 52 have rising portions that rise from a surface 20b of the printed circuit board 20, and capacitor connection portions 47 and 57 that are bent and extend from the tips of the rising portions toward the electrolytic capacitor 60 and are connected to the electrolytic capacitor 60.

Provided are a capacitor, a motor controller, and a vehicle. The capacitor includes: a capacitor core, located in a housing; a first external terminal, electrically connected to a first end of the capacitor core and including a first lead-out terminal located outside the housing; a second external terminal, electrically connected to a second end of the capacitor core and including a second lead-out terminal located outside the housing; a third external terminal, electrically connected to the first end of the capacitor core and including a third lead-out terminal located outside the housing; and a fourth external terminal, electrically connected to the second end of the capacitor core and including a fourth lead-out terminal located outside the housing. The first lead-out terminal extends out of the housing in a first direction. The second lead-out terminal and the first lead-out terminal are stacked in a second direction perpendicular to the first direction.

A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, and two electroplated terminals. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates and two second packaging plates. The two electroplated terminals are formed by electroplating. One of the two electroplated terminals is configured to cover one end of the casing to form an anode, and the other of the two electroplated terminals is configured to cover the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The electroplated terminals are integrally sealed with the casing.

The application discloses a parallel structure of power load capacitance, and solves the problem of fixed load capacitance mode in the prior art, which is inconvenient to disassemble and assemble. The application comprises a capacitance module, wherein the capacitance module is provided with an input end and an output end; the capacitance module comprises at least two groups of series-connected busbars, the busbars are provided with a plurality of evenly-distributed capacitance supports, and the capacitance supports are provided with a plurality of evenly-distributed and parallel-connected capacitors. The application has the advantages of simple and reliable structure, convenience in disassembly and assembly, small leakage inductance, parallel connection of multiple capacitors through the parallel structure of power resonance capacitance power capacitors, balanced alternating current and voltage among the capacitors, and reduction of induced inductance caused by the parallel capacitors.

A kind of capacitor structure, including capacitor core (1), copper plate (2), tinned braided copper wire (3), lead terminal (4), anti-torsion plate (5), stainless steel shell (6), insulating plate (7) and potting material (8), wherein: two electroplating surfaces of capacitor core (1) are connected with two copper plates (2) respectively, one side copper plate (2) is connected with the bottom of one lead terminal (4) by tinned braided copper wire (3), and the other side copper plate (2) is connected with another lead terminal (4);Anti-torsion plate (5) is installed in the lower part of lead terminal (4), and anti-torsion plate (5) is in the shape of waist circle;The bottom and periphery of capacitor core (1) are isolated from stainless steel shell (6) by insulating plate (7).The capacitor structure of the utility model is simple, and spare and accessory processing is simple, can be used in different combination of standard spare and accessory to process and use.

A compact power electronic system is presented, comprising a stacked arrangement of a capacitor device, a cooling device, a power switching device and a control switching device, wherein the cooling device has a first cooling contact surface which is in thermal contact with the capacitor device and a second cooling contact surface opposite the first, which is in thermal contact with the power switching device.

An integrated electrical device comprising an energy storage component, comprising: a support comprising a porous region (103) including a plurality of substantially straight pores (POR) that extend from a top surface of the porous region towards the bottom of the porous region, an insulating layer (104) having an opening (OP) delimiting a portion of the porous region, a bottom electrode layer (105), an intermediate region (106, 1061, 106T, 106T) comprising a dielectric or an ionic conductor, the intermediate region having an inner portion (1061) arranged on an inner portion of the bottom electrode layer and a top portion (106T, 106T') arranged on a top portion of the bottom electrode layer, the inner portion of the intermediate region having a first thickness (T1) and the top portion of the intermediate region having a second thickness (T2) greater than the first thickness, a top electrode layer (107) arranged on the intermediate region.

To provide a method to facilitate assembling of capacitive elements with different heights into a casing.SOLUTION: In electrical equipment 100, a capacitive element 12, instead of being laid on studs at a bottom of a casing 11, comes in abutment on a top of the casing 11. A filling material 16 ensures holding of the capacitive element 12. Furthermore, the filling material 16 enables the capacitive element 12 to be electrically insulated and the capacitive element 12 to be sealed. The electrical equipment 100 has, between an electrical assembly 1 forming a capacitive block and a cooling circuit 20 which can be assembled to a chassis and comprises a cooling block 30, a thermal interface 40 with a controlled thickness. The thermal interface 40 consists of a flexible material providing a high thermal conductivity.SELECTED DRAWING: Figure 2

To provide an electronic component whose performance can be improved and which includes a plurality of capacitor parts connected in series.SOLUTION: By connecting a plurality of capacitor parts 10A and 10B in series, short-circuit failure can be reduced. A third internal electrode 13 is connected to first external conductors 6A and 6B. Thus, by conducting inspection and measurement with terminal electrodes 3 and 4 and the external conductors 6A and 6B connected, the presence or absence of the short-circuit failure in the first capacitor part 10A and the second capacitor part 10B can be checked. In an electronic component 100, the internal electrode is stacked in a Y-axis direction orthogonal to a mount surface and the terminal electrodes 3 and 4 are formed on a first main surface 2a, which is the mount surface; therefore, ESL can be reduced. In addition, since there is no variation due to the stacking position of the internal electrode, ESR on the high frequency side can be stabilized.SELECTED DRAWING: Figure 3

The utility model discloses a combined capacitor, including a plurality of capacitor body and first conductive plate, first conductive plate includes first vertical section and first bending section, and the at least one end of first vertical section is provided with first bending section, be equipped with a plurality of first connecting portion on first conductive plate, a plurality of first connecting portion is distributed in the first direction symmetry, and first radiating interval is formed to interval up and down, and capacitor body is electrically connected with first connecting portion. When capacitor assembly, can be actual space, through interval's first connecting portion, install capacitor main part in first vertical section and first bending section. The interval between two first connecting portions can assist heat dissipation, and the heat dissipation effect is improved. The bending structure breaks the traditional plane limit, and makes different size capacitor vertical distribution or transverse distribution at bending section, utilizes three -dimensional space to reduce plane occupation, is applicable to the scene of strict volume requirement, and improves product use range.

At least one cylindrical electricity storage device, and an upper holder for holding an upper end side of the electricity storage device are included. A positive electrode terminal and a negative electrode terminal are disposed on an upper end part of the electricity storage device, and the negative electrode terminal is positioned in the outer side than the positive electrode terminal in a radial direction of the electricity storage device. A negative electrode lead connected to the negative electrode terminal from the outer side in the radial direction is further included. The upper holder includes a restriction part positioned in the inner side than at least a part of the negative electrode lead. A bottom surface of the restriction part protrudes toward the lower part than the surface facing an end part of one side of the electricity storage device in the upper holder.

The disclosure relates to a high capacitance embedded components package (100) comprising: at least two laminate layers (110a, 110b) stacked on top of each other, wherein each laminate layer (110a, 110b) comprises a plurality of capacitors (120) embedded therein, each capacitor (120) comprising a first terminal (121) and a second terminal (122); wherein each laminate layer (110a, 110b) comprises one or more metal layers (111, 112) electrically connecting the first terminals (121) and the second terminals (122) of the plurality of capacitors (120); and at least one connection metal layer (131, 132) electrically interconnecting the one or more metal layers (111, 112) of the at least two laminate layers (110a, 110b) with one another for an electrical interconnection of the plurality of capacitors (120) of the at least two laminate layers (110a, 110b) to a high capacitance embedded components package. The disclosure further relates to methods for producing such package.

A method for manufacturing an electronic component that includes: preparing an electronic component body having an internal electrode, the internal electrode being exposed on an outer surface of the electronic component body; and forming a first electrode layer by injecting fine metal particles to the outer surface of the electronic component body and causing the fine metal particles to collide with the outer surface at a pressure lower than atmospheric pressure.

The electronic component includes functional elements with electrodes and a busbar electrically and mechanically connected to the electrodes. The busbar includes a main body and a connecting conductor integrally formed with the main body. The connecting conductor has: a first arm and a second arm directly connected to the main body; and a first connecting portion and a second connecting portion, each corresponding one-to-one with the first and second arms, protruding from the distal ends of the first and second arms respectively, and connected to the electrodes by conductive members. When the center-to-center distance between the connection points of the main body and the first arm, and between the main body and the second arm is set as A, and the center-to-center distance between the first connecting portion and the second connecting portion is set as B, A > B holds when the linear expansion coefficient of the functional element is greater than that of the busbar.