323results about "Multiple fixed capacitors" patented technology

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal.

Power converter (1) with: a switching circuit (20); a capacitor module (3) which is electrically connected to the switching circuit; an auxiliary capacitor module (5) connected in parallel to the capacitor module; and a device housing (12) which contains the switching circuit, the capacitor module and the auxiliary capacitor module, wherein The capacitor module includes: a capacitor element (31), a capacitor housing (32) that contains the capacitor element, an encapsulation resin (33) that encapsulates the capacitor element in the capacitor housing, and a capacitor busbar (4) which connects the capacitor element to a power terminal of the switching circuit, wherein the capacitor busbar includes: an element connection section (41) that is connected to the capacitor element within the encapsulation resin, a connecting section (42) which is connected to the power connection outside the encapsulation resin, and a power supply connection section (43) which is connected to a power supply wiring (54) outside the encapsulation resin, wherein the power supply wiring is electrically connected to a DC power supply, wherein the capacitor busbar includes a DC path (44) which represents a current path between the terminal connection section and the power supply connection section, and the DC path is exposed to the outside of the encapsulation resin, the auxiliary capacitor module is connected to the power supply connection section of the capacitor busbar, the auxiliary capacitor module is detachably attached to the power supply connection section by means of a fastening element (11), and a fastening direction of a fastening element (135) that secures the auxiliary capacitor module and a fastening direction of the fixing element are the same.

Provided are: at least one cylindrical power storage device (20); and an upper holder (30) that holds an upper end side of the power storage device, a positive electrode terminal (26) and a negative electrode terminal (25C) being disposed at an upper end portion of the power storage device, the negative electrode terminal being disposed at a position that is more outward in a radial direction of the power storage device than the positive electrode terminal, and a negative electrode lead (50) that is connected to the negative electrode terminal from an outer side in the radial direction, the upper holder having a restriction portion (34) that is located at a position that is more inward in the radial direction than at least a portion of the negative electrode lead.

The utility model discloses a power capacitor device with an improved heat dissipation structure. The power capacitor device comprises a device shell, a plurality of power capacitor bodies and a gathering power shell. The utility model relates to the technical field of electrical auxiliary equipment, and the device realizes efficient heat dissipation management of a plurality of power capacitor main bodies running in the device shell through a split position adjusting blowing and pressing structure, and once the power capacitor main bodies are detected to be abnormal in heating, the power capacitor main bodies can be cooled. According to the device, a plurality of synchronous displacement modules and blowing air nozzles carried by the synchronous displacement modules can be rapidly adjusted to be gathered together, compressed air is blown downwards in a concentrated mode, heat diffusion is rapidly suppressed, meanwhile, a continuously-circulating horizontal air channel is constructed in the device through a pair of first fans which efficiently operate, and the heat dissipation efficiency is improved. The design ensures that a large amount of heat released by the power capacitor main body can be quickly and effectively taken away, so that the operation stability and safety of the power capacitor main body are greatly improved.

A capacitor assembly is assembled on a system substrate. The capacitor assembly includes a capacitor, a first conductive plate, an insulating plate, and a second conductive plate, which are stacked sequentially. The capacitor includes a first lead and a second lead, which are electrically connected to the first conductive plate and the second conductive plate, respectively. The first conductive plate includes a first insertion portion, and the second conductive plate includes a second insertion portion. The capacitor assembly is inserted into the system substrate through the first and second insertion portions, thereby electrically connecting the entire capacitor assembly to the system substrate. The material properties of the first and second conductive plates reduce conductivity and improve thermal conductivity, further enhancing the utilization rate of the capacitor within the capacitor assembly's area.

The invention relates to the technical field of thin-film capacitors, in particular to a standardized and modularized thin-film direct-current support capacitor which can reduce design complexity and cost budget, is convenient to combine and expand, can operate in a high-temperature environment and is high in applicability, and the standardized and modularized thin-film direct-current support capacitor comprises a capacitor unit and a busbar. Each capacitor unit comprises a capacitor shell and a core arranged in the capacitor shell, clamping groove structures matched with each other are arranged on two sides of the outer wall of the capacitor shell, a positioning groove is formed in the inner wall of the capacitor shell, and a lead-out pin of the capacitor unit penetrates through the positioning groove; the film base film of the core is formed by mixing and co-extruding 70%-80% of polypropylene and 20%-30% of cycloolefin copolymer.

A device according to some embodiments includes a first IPD die including a first SiC substrate. The first IPD die has a first surface and a second surface on the first SiC substrate opposite the first surface and includes a first contact and at least one first metal portion on the respective surfaces of the first SiC substrate. The device further includes a second IPD die including a second SiC substrate. The second IPD die has a third surface and a fourth surface on the second SiC substrate opposite the third surface and includes a second contact and at least one second metal portion on the respective surfaces of the second SiC substrate. The device further includes an electrical interconnection structure between one of the first and second surfaces of the first IPD die and one of the third and fourth surfaces of the second IPD die.

The utility model discloses a new energy automobile battery swap station's PCB board 4 pin film capacitor, including plastic shell and the capacitor body of encapsulation in plastic shell, capacitor body includes the capacitor core that is composed of multiple single core and the laminated busbar that is connected with capacitor core through soldering tin, and the laminated busbar is connected with two outgoing terminals, and each outgoing terminal has two parallel interval opposite pins and the connecting portion of connecting two pins, and the connecting portion is integrally formed with two pins and is combined into U shape, and the pin stretches out plastic shell outside, and the connecting portion of each outgoing terminal is welded and connects the laminated busbar. Through setting laminated busbar, U type outgoing terminal, multiple core combination arrangement capacitor core in the inside of plastic shell, the soldering connection process that laminated busbar is used with electric core, makes capacitor presents high stable ESL, ESR parameter on high frequency resonance road, and the current capacity of capacitor improves self heating little, and circuit output high quality steady voltage waveform.

The present invention relates to a capacitor, in particular an intermediate circuit capacitor, comprising a first capacitive unit and a second capacitive unit, a first electrode with a first electrical conductor and a second electrical conductor, a second electrode with a third electrical conductor, wherein the first capacitive unit and the second capacitive unit are arranged side by side and separated from each other by a gap, wherein the first electrical conductor is configured to electrically contact the first capacitive unit at a first top surface, wherein the second electrical conductor is configured to electrically contact the second capacitive unit at a second top surface, and wherein the third electrical conductor is configured to electrically contact the first capacitive unit at a first bottom surface and the second capacitive unit at a second bottom surface.wherein the second electrical conductor is arranged in the gap between the first capacitive unit and the second capacitive unit in order to prevent the propagation of electromagnetic waves between the first capacitive unit and the second capacitive unit.

One example discloses an electrical device comprising: a first capacitor comprising a conductive plate; wherein the conductive plate has a first edge radius and a second edge radius; and wherein the first edge radius is different than the second edge radius.

The utility model discloses a large-current large-capacity direct current support capacitor, which comprises a shell, a capacitor core module and a leading-out terminal, the capacitor core module comprises an absorption capacitor core group and a thin film capacitor core group, the absorption capacitor core group and the thin film capacitor core group are respectively provided with a plurality of capacitor core single groups which are respectively arranged in an array, and the leading-out terminal is connected with the absorption capacitor core group and the thin film capacitor core group. The absorption capacitor core group is positioned above the thin-film capacitor core group; electrodes at the two ends of the capacitor core module are respectively welded in parallel through a plurality of sub-copper plates, the upper ends of the sub-copper plates are connected with the laminated busbar, the leading-out terminal is arranged on the laminated busbar and extends out of the top of the shell, and the capacitor core module, the sub-copper plates and the laminated busbar are packaged in the shell through a potting material. According to the structure that the wire inlet end of the large-current large-capacity direct-current support capacitor is connected with the absorption capacitor in parallel to share high-frequency harmonic current, current impact can be borne under the condition that current distribution is not uniform, and heating breakdown failure is avoided.

A trench capacitor includes a plurality of unit trench capacitors arranged in a 2D repetitive pattern in a substrate. The unit trench capacitors are separated by elongated trenches or elongated walls between the unit trench capacitors. The trench capacitor includes a plurality of stress compensation elements. Each unit trench capacitor has one or more closed trenches, with each trench further having a bottom electrode, a top electrode, and a dielectric between the bottom electrode and the top electrode. The unit trench capacitors are connected in parallel and the stress compensation elements are arranged between the unit trench capacitors such that they interrupt the elongated walls or trenches.

The utility model discloses a film capacitor for flexible direct current power transmission, which belongs to the technical field of capacitors and comprises a shell, a plurality of capacitor cores and extraction electrodes, the shell is made of metal materials, the plurality of capacitor cores are grouped to form a plurality of capacitor core independent groups, and the extraction electrodes are arranged in the shell. Each capacitor core independent group is connected with a tinned copper plate, the lead-out electrode is provided with a laminated busbar and is connected with the tinned copper plate in a matched manner through the laminated busbar, and the plurality of capacitor core independent groups are packaged in the shell through a potting material. The thin-film capacitor can simultaneously meet the performance requirements of low self-inductance, low temperature rise, high energy density, light weight and long service life, thereby effectively improving the safety and reliability of the thin-film capacitor for flexible direct-current power transmission.

To provide a method for solving the problem of a low capacitance value at high voltage in a tunable multilayer capacitor.SOLUTION: A multilayer capacitor comprises a first active electrode 14 in electrical contact with a first active termination 16, and a second active electrode 20 in electrical contact with a second active termination 18. The capacitor comprises a first DC bias electrode 22 in electrical contact with a first DC bias termination 30, and a second DC bias electrode 26 in electrical contact with a second DC bias termination 32. Multiple dielectric layers 12 are disposed between the first and second active electrodes and between the first and second bias electrodes. At least a portion of the dielectric layers contains a tunable dielectric material that exhibits a variable dielectric constant upon application of an applied DC voltage across the first and second DC bias electrodes. The thickness of at least one of the multiple dielectric layers is greater than about 15 micrometers.SELECTED DRAWING: Figure 2A

The application relates to the technical field of capacitor assembly, and provides a conductive connection structure of a capacitor pole and a laminated busbar, which comprises a capacitor, a laminated busbar and a first connecting piece.The capacitor comprises a first pole and a second pole;the laminated busbar comprises a first busbar, a second busbar and at least one insulating layer; the at least one insulating layer is arranged between the first busbar and the second busbar, so that the first busbar and the second busbar are electrically isolated; the laminated busbar is provided with a first connecting hole and a second connecting hole; the first pole is arranged in the first connecting hole; and the second pole is arranged in the second connecting hole.The application effectively solves the problems of creep loosening and copper-aluminum electrochemical corrosion, improves the anti-vibration and anti-fatigue performance of the connection structure, maintains a stable conductive path, reduces contact resistance, and reduces power loss in the current transmission process.

This utility model discloses a multilayer ceramic capacitor and its assembly. The multilayer ceramic capacitor includes a ceramic body and multiple external electrodes. The ceramic body includes multiple dielectric layers and internal electrodes, and is used to form at least two sub-capacitors with different capacitance values. Each sub-capacitor contains an independent set of internal electrodes. Multiple external electrodes are disposed on the end face and / or side face of the ceramic body, and are electrically connected to corresponding internal electrodes. The external electrodes and electronic components are connected and coupled in different ways to allow the multilayer ceramic capacitor to selectively form multiple different capacitance values. The multilayer ceramic capacitor of this application can meet the requirements of various capacitance values ​​required by circuits, and can greatly reduce the number of multilayer ceramic capacitors used. This not only reduces manufacturing costs and production time, but also reduces the space occupied by electronic components, which is beneficial to the flexibility, compactness and miniaturization of electronic component design.

Provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. The ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. The first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. The horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

Each of a plurality of first internal electrode layers (120) is composed of a plurality of first internal electrode parts (121, 122) separated from each other within the same layer. Each of a plurality of second internal electrode layers (130) is integrally formed within the same layer. Each of the plurality of first internal electrode parts (121, 122) is electrically connected to a corresponding plurality of first via conductors (140) among a plurality of first via conductors (140). Each of a plurality of first external electrodes (20) is electrically connected to the plurality of first via conductors (140) that are electrically connected to the corresponding first internal electrode parts (121, 122) among the plurality of first internal electrode parts (121, 122). At least one second external electrode (30) is electrically connected to a corresponding plurality of second via conductors (150) among a plurality of second via conductors (150).

The utility model provides a laminated busbar adaptive to packaging of various power semiconductors, comprising a laminated busbar body which comprises an anode busbar and a cathode busbar which are arranged in a laminated manner; the connection terminal is connected with the laminated busbar body and the power semiconductor device; the capacitor is located on one side of the laminated busbar, the negative busbar is connected with a negative terminal of the capacitor, a receding hole is formed in the negative busbar, the positive busbar protrudes outwards in the direction close to the capacitor to form a protruding point, the protruding point is connected with a positive terminal of the capacitor through the receding hole, and the capacitor is connected with the negative busbar. The laminated busbar body is connected with the capacitor positive terminal through the structure of the laminated busbar body, no additional connecting structure is needed for connection, the connecting steps are simplified, and therefore the assembling efficiency is improved.

A capacitor includes a case that houses a capacitor element, a filling resin filled in the case, and a bus bar. The filling resin includes an exposed surface exposed to the outside. The bus bar includes a protruding part protruding from the inside of the filling resin to the outside, a flat surface part, and a first external connection terminal part. The flat surface part includes a first end and a second end that is connected to the protruding part and the first external connection terminal part. The protruding part is bent at the second end around a first axis to extend in a first direction, and the first external connection terminal part is bent at the second end around a second axis to extend in a second direction opposite to the first direction. Each of the first axis and the second axis is disposed in a plane facing the exposed surface.

A capacitor includes: a capacitor element that includes a first electrode disposed on one end surface of the capacitor element, a second electrode disposed on another end surface of the capacitor element, and a circumferential surface connecting the first electrode to the second electrode; a first bus bar and a second bus bar that are connected to the first electrode and the second electrode, respectively; a case that houses the capacitor element; and a filler resin in which the capacitor element, a part of the first bus bar, and a part of the second bus bar are embedded, the filler resin being filled inside the case. The circumferential surface includes a plane face. The first bus bar includes an opposing portion that has a flat-plate-shape and faces the plane face. The opposing portion includes a protrusion that protrudes toward the plane face and abuts the plane face.

A capacitor and an electronic device comprising same are disclosed. An electronic device according to the present disclosure may comprise: a substrate; a plurality of capacitors mounted on the substrate, each of the plurality of capacitors including a case extending to accommodate an electrolyte therein, and a cap coupled to one end of the case in the direction in which the case extends configured to restrict scattering of the electrolyte; and a fixing member comprising a protrusion and configured to press the perimeters of the caps in the radial direction of the caps to fix the plurality of capacitors to the substrate.

An integrated structure comprising: a substrate (100, 101), a conductive layer, the conductive layer having a first cavity, the first cavity (102C) being filled with a first insulating region (103F), the first insulating region having a top surface flush with a top surface of the conductive layer to form a first planar surface (F1), a protective liner (104) on the top surface of the conductive layer and the top surface of the first insulating region, an anodization barrier layer (105) on the protective liner, the protective liner and the anodization barrier layer having a second cavity (105_104C) passing through the protective liner and the anodization barrier layer and opening onto the first insulating region, the second cavity being filled with a second insulating region (106F), the second insulating region having a top surface flush with a top surface of the anodization barrier layer to form a second planar surface (F2).

In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

A capacitor module according to the present disclosure comprises: a case that has a bottom surface and lateral surfaces; a capacitor element that has a first electrode and a second electrode; a first bus bar that is connected to the first electrode; a second bus bar that is connected to the second electrode; a cooling plate that is placed between the first bus bar and the second bus bar, is in contact with the inner sides of lateral surfaces of the case, and is in contact with at least one of the first bus bar and the second bus bar; a sealing resin that fills the inside of the case; and a locking part that locks the cooling plate and the at least one of the first bus bar and the second bus bar.

A capacitor assembly is presented comprising a first to fourth individual capacitor, each with a first cover surface defining a respective normal direction of the individual capacitor, and a second cover surface on the opposite side, wherein the first cover surface of the first individual capacitor defines a main direction, with first connection elements arranged on the first cover surface and second connection elements arranged on the second cover surface, wherein the individual capacitors are arranged side by side in a 1x4 matrix, wherein the normals of the first and third individual capacitors point in the main direction and wherein the normals of the second and fourthsingle capacitors pointing in the opposite direction to the main direction, wherein all first connection elements are connected to each other by means of a first busbar, and wherein all second connection elements are connected to each other by means of a second busbar, and wherein a first intermediate section of the first busbar and a first intermediate section of the second busbar between the first and second single capacitors, and a second intermediate section of the first busbar and a second intermediate section of the second busbar between the third and fourth single capacitors are arranged one above the other and each separated by a second insulating device.

To equalize apportionment of a current at switching time among semiconductor modules connected in parallel to one another.SOLUTION: A laminated wiring 13 includes: a first conductor 13a which connects terminals 11a1-11d1 of capacitors 11a to 11d and each positive terminal 12a1-12f1 of a plurality of semiconductor modules 12a-12f; a second conductor 13b which connects terminals 11a2-11d2 of the capacitors 11a-11d and each negative terminal 12a2-12f2; and an insulator 13c. Slits 13a1-13a5, 13b1-13b5 are formed at least one of the first conductor 13a and the second conductor 13b (in both of them in the example of FIG. 1), and thereby among the semiconductor modules 12a-12f, a variation in a total of respective inductance values between the respective terminals 11a1-11d1 and one positive terminal 12a1-12f1 closest to the respective terminals and respective inductance values between the respective negative terminals 12a2-12f2 and one terminal 11a2-11d2 closest to the respective negative terminals is smaller than or equal to 10 nH.SELECTED DRAWING: Figure 1

The invention relates to a capacitor bank structure, a semiconductor package structure and a manufacturing method thereof. A capacitor bank structure includes: a capacitor including a plurality of first electrodes and a plurality of second electrodes opposite the plurality of first electrodes; a plurality of conductive pads electrically connected to the capacitor; a first protective material covering sidewalls of the capacitor and the plurality of conductive pads; and a second protective material covering the first protective material and a sidewall of the first electrode, in which a material of the first protective material is different from a material of the second protective material.

The application provides a capacitor parallel type controllable lightning arrester device, and relates to the technical field of lightning control, which comprises an outer box, two groups of connecting electrodes are fixedly arranged in the middle of the outer box, a lightning arrester group is arranged at the top of the connecting electrodes, and a capacitor is connected to the outside of the connecting electrodes; two groups of positioning templates are arranged, and the two groups of positioning templates are fixedly arranged on the two sides of the inside of the outer box; a slope clamping block is arranged, an automatic on-off control function is provided, the pressure in the hollow electrode strip is gradually increased through the mode of extruding gas, the lowermost air expansion rod is first entered into the lowermost partition support to support the slope clamping block, the slope clamping block is further adhered to the slope clamping block, the sliding contact block is moved, the sliding contact block moves to the positioning template, the sliding contact block is adhered to the spring contact point, the connecting electrode, the capacitor and the hollow electrode strip are connected, rapid control is realized, and the problem that the existing device cannot be gradually automatically connected through integrated unified power is solved.