66results about "Varistors" patented technology

By preventing burnt, cracked, or short-circuited electronic components from occurring in high-voltage environments, this invention provides multilayer electronic components with excellent voltage resistance and reliability. [Solution] The multilayer ceramic capacitor, which is a multilayer electronic component, includes a body containing a first dielectric layer 111a, a second dielectric layer 111b, and internal electrodes 121, 122, and external electrodes 131, 132 disposed on the body. The first dielectric layer mainly contains a BaTiO3-based material, and the second dielectric layer has a different main component from the first dielectric layer (α β Γ δ )Ti x O y The substance contains (β≧0, δ≧0, x>0, y>0) as its main component, where α is one or more of Ba, Er, Ca, and Sr, and Γ is one or more of Nb, Mg, Ta, In, Mn, Hf, Zr, and Al.

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

This multilayer electronic component comprises: a layered body in which an internal electrode and a dielectric layer are alternately layered; a base electrode; and an external electrode. The internal electrode has a first internal electrode and a second internal electrode. The base electrode has a first base electrode and a second base electrode. The external electrode has a first external electrode and a second external electrode. The first base electrode and the second base electrode each include a plurality of sintered bodies that are made of dielectric particles. At least some of the plurality of sintered bodies are positioned at an interface between a respective base electrode and the layered body.

The application provides an intelligent packaging equipment for a pressure-sensitive resistor, a packaging process and the pressure-sensitive resistor. The intelligent packaging equipment for the pressure-sensitive resistor comprises a man-machine interface, a plurality of clamps and, sequentially arranged along the transmission direction of the clamps, a feeding rack, an oven, a packaging device and a discharging rack. The feeding rack, the oven and the discharging rack accommodate the clamps in a layered manner. The oven is provided with a constant temperature device for constant temperature adjustment of the pressure-sensitive resistor on the clamp. The packaging device comprises a packaging mechanical arm, a heat preservation box, a heating assembly and a powder tank assembly. The powder tank assembly is filled with packaging powder. The heating assembly comprises a heating door, a leveling rack and a sliding seat. The leveling rack is provided with a scraper extending into the powder tank assembly. The heat preservation box, the heating assembly and the powder tank assembly are sequentially distributed from top to bottom to make the packaging process of the pressure-sensitive resistor continuous and orderly, improve the packaging efficiency and the packaging yield, and reduce the volume of the packaging equipment and improve the space utilization.

Provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. The ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. The first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. The horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

To provide a laminated electronic component excellent in reliability even in a high-voltage environment.SOLUTION: According to an aspect of the present disclosure, a multilayer electronic component may include a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, external electrodes disposed on the body and connected to the internal electrodes, and a support member disposed on at least one of opposing surfaces of the body in the first direction, wherein the support member has a first end portion contacting the external electrodes and a second end portion opposing the first end portion, and the second end portion has a thickness in the first direction smaller than that of the first end portion.SELECTED DRAWING: Figure 2

This utility model belongs to the field of electrical equipment technology and discloses a varistor and a surge protector. The varistor includes a varistor resistor, a first electrode, a second electrode, and a third electrode. The first electrode includes a first connecting portion and a first contact portion connected together. The second electrode includes a second connecting portion and a second contact portion connected together. The first and second contact portions are fixedly attached to opposite sides of the varistor resistor. The third electrode includes a third connecting portion disposed between the first and second connecting portions. The first connecting portion is provided with a positioning head for positioning the second and third connecting portions. The surge protector includes the aforementioned varistor. The varistor and surge protector provided by this utility model can achieve reliable positioning between multiple electrodes without the need for an external positioning structure, reducing production costs, improving production efficiency, ensuring accurate and reliable positioning after welding, and ensuring good conductivity.

The invention relates to the technical field of piezoresistors, in particular to a piezoresistor disc and a preparation method thereof.The piezoresistor disc comprises two electrodes and a ceramic substrate arranged between the two electrodes, and a plurality of transition layers are arranged at the contact positions of the ceramic substrate and the electrodes; the materials of the transition layers are obtained by doping silver powder with different mass fractions on the basis of ceramic base powder used for sintering the ceramic matrix, and the mass fractions of the silver powder in the multiple transition layers are gradually increased from the side close to the ceramic matrix to the side close to the electrode, so that gradient transition from the ceramic matrix material to the electrode material in component is formed. When the temperature changes, the thermal expansion difference between the adjacent transition layers can be obviously reduced, stress concentration generated at the interface due to the fact that the thermal expansion coefficient difference of two materials is too large in a traditional structure is avoided, and therefore the possibility that interface resistance changes after long-time use is reduced.

To provide dielectric material and a multilayer ceramic electronic component having a high dielectric constant and excellent withstanding voltage characteristics.SOLUTION: An dielectric according to one embodiment of the invention includes: a main component represented by (Ba1-XCaX)(Ti1-y(Zr,Sn,Hf)y)O3 (wherein 0≤X≤1, 0≤y≤0.5); a first subcomponent including one or more of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Nb, Tb, Eu, Tm, La, Lu and Yb; a second sub-component including Si and / or Al; and a third sub-component including Ba and / or Ca.SELECTED DRAWING: Figure 4

The flame-retardant piezoresistor assembly comprises a base, a fixed conducting strip, an elastic conducting strip and a piezoresistor chip, a first piezoresistor conducting electrode and a second piezoresistor conducting electrode are arranged at the two ends of the piezoresistor chip respectively, and the lower end of the fixed conducting strip is fixed to the base; the upper end of the fixed conducting strip is connected with the first piezoresistor conducting electrode, the lower end of the elastic conducting strip is fixed on the base, and the elastic conducting strip has outward elastic force, so that the upper end of the elastic conducting strip is not connected with the second piezoresistor conducting electrode in a natural state that the lower end of the elastic conducting strip is fixed on the base; the upper end of the elastic conducting strip is connected with the second piezoresistor conducting electrode through metal welding, so that when the piezoresistor chip is in thermal runaway, the welding metal is melted, the elastic conducting strip rebounds outwards and is separated from the second piezoresistor conducting electrode, the electric connection between the piezoresistor chip and the second piezoresistor conducting electrode is cut off, and the piezoresistor chip stops heating in a power-off state; and the fire risk caused by ignition of the potting glue is avoided.

To provide a laminated electronic component and a manufacturing method thereof that improve defects such as side margin gaps, occurrence of short circuits, and deterioration of moisture resistance reliability.SOLUTION: A method includes providing a ceramic green sheet 211 having a plurality of internal electrode patterns 221 and 222 spaced apart from each other, laminating ceramic green sheets to form a ceramic green sheet laminate, obtaining a laminate body 210 by cutting the ceramic green sheet laminate such that the ends of the internal electrode patterns have side surfaces exposed in the width direction, an adhesive layer adhering step of adhering an adhesive layer AD attached to a base film BF to the exposed side surface of the internal electrode pattern of the laminate, and an adhesive layer peeling step of removing foreign matter on the side surface by peeling the adhesive layer.SELECTED DRAWING: Figure 11

The utility model relates to the technical field of piezoresistors, and discloses an integrated double-layer structure piezoresistor which comprises a piezoresistor body, a cooling heat dissipation device is arranged on the outer surface of the piezoresistor body, and the cooling heat dissipation device comprises a semiconductor chilling plate. A semiconductor chilling plate is arranged on one side of the piezoresistor body, a device convenient to disassemble is arranged between one side of the semiconductor chilling plate and the outer surface of the piezoresistor body, and when the piezoresistor body is installed on a circuit board to be used, after the semiconductor chilling plate on one side is powered on, the semiconductor chilling plate on the other side of the piezoresistor body can be cooled. When surge current absorbed in the piezoresistor body is too large, one side of the piezoresistor body absorbs heat on the surfaces of the piezoresistor body and the aluminum frame to cool the piezoresistor body, then the aluminum frame increases surface contact with the piezoresistor body to enable the piezoresistor body to perform heat exchange, the temperature of the surface of the piezoresistor body is reduced, and the surge current absorbed in the piezoresistor body is too large. And the piezoresistor main body cannot be damaged due to overheating, so that the service life of the piezoresistor main body is prolonged.

A metal oxide varistor includes a metal oxide varistor chip, a first electrode disposed on a first side of the metal oxide varistor chip, and a second electrode disposed on a second side of the metal oxide varistor chip, wherein each of the first electrode and the second electrode includes a seed layer formed of a nickel alloy disposed directly on a surface of the metal oxide varistor chip and a capping layer formed of a metal disposed on the seed layer.

To provide an electronic component which suppresses the occurrence of cracks in an element body.SOLUTION: The internal electrode disposed in the element body includes an end exposed to the first side surface. The outer conductors disposed on the element body contain a glass composition containing SiO2 and Al2O3 and conductive metals. The external conductor includes a first region disposed on the first side surface and connected to the end included in the internal conductor, and a second region disposed on at least one of the pair of second side surfaces. The glass composition included in the first region has a total content of 23mol and Al2O3 of SiO2% or more. The glass composition contained in the second region has a total content of 5mol and 20mol of SiO2% or more and Al2O3% or less.SELECTED DRAWING: Figure 2

The utility model discloses an explosion-proof flame-retardant piezoresistor which comprises a shell and a piezoresistor, the shell is filled with a flame-retardant epoxy resin and quartz sand mixture, and the piezoresistor is wrapped in the flame-retardant epoxy resin and quartz sand mixture; the piezoresistor comprises a body and two pins, one pin comprises a first extension section, a second extension section and a low-temperature alloy wire section connected between the first extension section and the second extension section, the low-temperature alloy wire section is close to the body, and a fluxing agent layer is coated outside the low-temperature alloy wire section. A piezoresistor is attached to a low-temperature alloy wire, and the surface of the low-temperature alloy wire is coated with a fluxing agent layer; and a mixture of flame-retardant epoxy resin and quartz sand is filled in the shell to wrap the piezoresistor body. And when the piezoresistor is overheated due to abnormity, the low-temperature alloy wire is quickly melted to completely break the pin, so that the circuit is permanently cut off, and the piezoresistor is prevented from firing and burning.

The present application provides a circuit protection device, comprising: a patch type thermistor element including a first electrode and a second electrode; a first heat dissipation terminal connected with the first electrode; a second heat dissipation terminal connected with the second electrode; and a housing protecting the thermistor element, the first heat dissipation terminal and the second heat dissipation terminal. The circuit protection device according to the present application having an SMD (Surface Mount Device) structure can be applied to an ultra-thin wall-mounted television.

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are alternately laminated, a base electrode, and an external electrode. The internal electrodes include a first internal electrode and a second internal electrode. The base electrode includes a first base electrode and a second base electrode. The external electrode includes a first external electrode and a second external electrode. Each of the first base electrode and the second base electrode contains a plurality of sintered bodies made of dielectric particles. At least a part of the plurality of sintered bodies is located at the interface between each base electrode and the laminate.

Disclosed is a substrate comprising a ceramic main body (1) and an organic surface structure (2) on at least one outer face of the ceramic main body (1), outer redistribution layers (3) being integrated into the organic surface structure.

A multilayer electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, underlying electrodes, and outer electrodes. The inner electrodes include first inner electrodes and second inner electrodes. The underlying electrodes include a first underlying electrode and a second underlying electrode. The outer electrodes include a first outer electrode and a second outer electrode. The first underlying electrode and the second underlying electrode each include multiple sintered bodies composed of dielectric particles. At least part of the multiple sintered bodies are located on an interface between each underlying electrode and the multilayer body.

The utility model relates to a pressure sensitive resistor technical field especially thin arc extinguishing flame -retardant pressure sensitive resistor, including insulating casing, pressure sensitive resistor main part and pin, two the pin fixed connection is in the outer wall lower extreme of pressure sensitive resistor main part, pressure sensitive resistor main part fixedly placed in the inside of insulating casing, the inside of insulating casing is equipped with both sides even flame -retardant resistor structure. This thin arc extinguishing flame -retardant pressure sensitive resistor, the flame -retardant layer is equipped with one in the up and down, the flame -retardant layer adopts ultrathin mica piece to make, both sides mica piece will the pressure sensitive resistor main part in the middle clamped in the middle, the insulating particle layer also is equipped with the metal oxide filling of thin even, such both sides insulating particle layer will the flame -retardant layer to the pressure sensitive resistor main part both sides extrusion, therefore the thickness of pressure sensitive resistor main part both sides is more average, and both sides flame -retardant and mechanical performance also are more close, effectively in the guarantee thinness inconvenient case, reduce thin arc extinguishing flame -retardant pressure sensitive resistor explosion risk.

The utility model discloses an equipotential surge protector, and relates to the field of electronic components. The problems that due to limitation of the structure, energy tolerance and other aspects of an existing SPD, equipotential protection effectiveness, installation and maintenance of a resistance heating element and a protection copper net in an ice melting system are greatly difficult are solved. The device comprises an insulating tube, an insulating positioning sleeve, a pressure spring, a fixed electrode, a first separating electrode, an encircling electrode and an indicating electrode, the insulating positioning sleeve is used for arranging the piezoresistor chips, and each piezoresistor chip and one first electrode are concentrically arranged in the insulating positioning sleeve; the top end of the fixed electrode is positioned in the first limiting groove of the bracket, and the bottom end is positioned in the second limiting groove of the bracket; the two arc-shaped encircling electrodes are concentrically arranged with the bracket and are close to the inner wall of the bracket; the indicating electrode comprises a circular red end face and is driven by the second separating electrode to move to the position below the window of the support.

A multilayer ceramic electronic component includes a capacitor body including dielectric layers and internal electrode layers alternately laminated, and two external electrodes respectively on two end surfaces, connected to the internal electrode layers, and covering a portion of a main surface and a portion of a side surface, two spacers respectively on one end surface side and an other end surface side, with the external electrode covering the portion of the main surface or the portion of the side surface being sandwiched therebetween, at a main surface side or a side surface side of the capacitor body, and a reinforcement portion between the two spacers. The reinforcement portion covers about 50% or more of a center-side spacer end surface, where the two spacers face each other, and of two spacer end surfaces facing each other in a length direction in each of the two spacers.

The utility model relates to the technical field of thermosensitive and pressure-sensitive component installation, and discloses an installation structure of a thermosensitive and pressure-sensitive component module, which comprises a base, the front side and the rear side of the top wall of the base are both provided with moving grooves, the rear part of the side wall of the base is rotatably connected with one end of a two-way screw rod, and the front part and the rear part in two moving frames are both slidably connected with installation blocks. Clamping blocks are fixedly connected to the two side walls of the multiple mounting blocks, springs are fixedly connected to the front and rear sides of the bottom walls of the multiple mounting blocks, bottom plates are fixedly connected to the bottom ends of the multiple springs, connecting blocks are slidably connected into the multiple mounting blocks, and a thermal pressure sensitive module is fixedly connected to the top ends of the multiple connecting blocks. According to the utility model, under the combined action of the two-way screw rod I, the movable frame, the mounting block, the clamping block, the clamping groove, the bottom plate, the thermal pressure-sensitive module, the connecting block and the spring, the position of the mounting block can be flexibly adjusted so as to be suitable for the mounting of thermal-sensitive and pressure-sensitive component modules with different specifications.

To provide a multilayer electronic component which has improved reliability and electrical conductivity, which solves a problem of weak electrical conductivity in order to secure electrical connectivity by hopping conduction, which suppresses occurrence of lifting at an interface between a conductive resin layer and a sintered electrode layer in a high temperature environment, and which, also at other than the interface, suppresses that the inside of a conductive resin layer is torn and lifting occurs.SOLUTION: A multilayer electronic component includes a body including a dielectric layer and an internal electrode arranged alternately with the dielectric layer, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including: a conductive connection portion including a second intermetallic compound and a low-melting-point metal; a plurality of metal particles; and a resin. A ratio of a length of a first direction component of a region where the first intermetallic compound is formed, with respect to a length of a first direction component of the intermetallic compound layer is 20% or more.SELECTED DRAWING: Figure 4

To provide an electronic component capable of flexibly adjusting to a size change etc. of an internal ceramic element and ensuring suitable insulation properties.SOLUTION: An electronic component has: a case including an accommodation part having an opening; a ceramic element disposed in the accommodation part, having a first main surface and a second main surface facing each other, and having a first electrode part formed on the first main surface and a second electrode part formed on the second main surface; a first metal terminal having a first electrode connecting part connecting to the first electrode part, a first mounting part exposed from the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part with the first mounting part; a second metal terminal having a second electrode connecting part connecting to the second electrode part, a second mounting part exposed from the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part with the second mounting part; and an insulation member disposed between the first electrode part and the second terminal arm part.SELECTED DRAWING: Figure 4

A ceramic part (101) has a first surface (S1) and a second surface (S2), which are opposite surfaces in a thickness direction. A first electrode (210) has a first portion (211) lying on the first surface (S1). A second electrode (220) has a second portion (221) lying on the second surface (S2). Each of the first surface (S1) and second surface (S2) of the ceramic part has a width dimension in a width direction and a length dimension in a length direction, the length dimension being greater than the width dimension but not greater than 1 mm, and further has a surface profile along the length direction including a thickness-direction warpage of 2 μm or greater.

A multilayer ceramic capacitor includes a stack including an inner layer portion including dielectric layers and inner electrode layers alternately stacked, two main surfaces opposing each other in a stacking direction, two end surfaces opposing each other in a length direction, and two side surfaces opposing each other in a width direction, two external electrodes connected to the inner electrode layers on each of the two end surfaces, and covering the end surfaces and portions of the two main surfaces extending therefrom and opposing each other, and two spacers on one of the two main surfaces of the stack with the external electrodes interposed therebetween. The spacers each include first, second, and third regions that are continuous in the width direction, and of which two adjacent regions have different shapes.

A multilayer ceramic electronic component includes a laminate including an inner layer portion including dielectric layers and internal electrode layers, two main surfaces opposing each other in a lamination direction, and two end surfaces opposing each other in a length direction, two external electrodes connected to the internal electrode layers respectively at the two end surfaces and which cover the end surfaces and a portion of the two main surfaces continuous therefrom and opposing each other, and two spacers on one of the two main surfaces sandwiching the external electrodes between the main surface and the two spacers. One of the two surfaces of the spacers opposing each other in the lamination direction and not sandwiching the external electrode has an angle with respect to the main surface of the laminate on which the spacer is located that is about five degrees or less when viewed from the width direction.

To solve the problem that floating occurs in an interface between a sintered electrode layer and a conductive resin layer by outgas generated in a conductive resin layer at the time of reflow application, the problem that an excess Sn inside the conductive resin layer is eluted to the surface of an external electrode and degrades plating property of a laminated type electronic component, and the problem that metal particles exist in a state of being dispersed in the conductive resin layer, and electric connectivity between the sintered electrode layer and the conductive resin layer deteriorates.SOLUTION: A laminated type electronic component includes a body including a dielectric layer and a plurality of internal electrodes laminated so as to sandwich the dielectric layer therebetween, and an external electrode arranged on the body, wherein the external electrode includes a first electrode layer which is connected to the internal electrode, and a second electrode layer which is arranged on the first electrode layer and contains a conductive part containing an Ag-Sn alloy and a resin, and in at least a partial cross section of the second electrode layer, an area ratio of the Ag-Sn alloy to the area of the conductive part is 3-50%.SELECTED DRAWING: Figure 3

To provide a chip varistor whose varistor characteristics can be easily adjusted.SOLUTION: In the chip varistor 1, a third conductor 30C has an intersection 32, and the third conductor 30C forms superposed portions 40A and 40B that overlap a first conductor 30A and a second conductor 30B, respectively, at the intersection 32. Therefore, by adjusting a shape and dimension of the intersection 32 of the third conductor 30C, dimensions of functional areas of a first functional layer 42 and a second functional layer 44 can be easily adjusted, and thereby varistor characteristics can be easily adjusted.SELECTED DRAWING: Figure 3