117results about "Varistors" patented technology

The invention discloses a piezoresistor assembling device, and belongs to the technical field of electronic component manufacturing equipment. The problems that existing piezoresistor assembly mostly depends on manual or semi-automatic equipment, production efficiency is low, consistency is poor, all mechanisms are lack of effective cooperation and need manual intervention, resistor insertion deflection is prone to occurring, sand filling is uneven, and cover plate correction precision is low are solved. The device comprises a shell feeding mechanism, a resistor feeding mechanism, a cover plate feeding mechanism, a material inserting mechanism, a sand filling mechanism, a cover plate assembling mechanism, a driving mechanism, a supporting mechanism and a control system. The supporting mechanism supports all the mechanisms, the driving mechanism drives the shell to move at the stations of the material inserting mechanism, the sand filling mechanism and the cover plate assembling mechanism, the control system coordinates all the mechanisms to act, and all the mechanisms sequentially complete feeding of the shell, the resistor and the cover plate, insertion of the resistor into the shell, sand filling and cover plate assembling. The device is mainly used for automatically completing full-process assembly of the piezoresistor, continuous automatic production is achieved, and the assembly efficiency and the product consistency are improved.

The invention belongs to the technical field of functional ceramic materials, and particularly relates to luminous multifunctional ZnO-Bi2O3-based voltage-sensitive ceramic as well as a preparation method and application thereof. The luminous multifunctional ZnO-Bi2O3-based voltage-sensitive ceramic provided by the invention has up-conversion luminescence performance, can detect red emitted light under the excitation of 980nm laser, has a high nonlinear coefficient, is adjustable between 34 and 40.3, has excellent comprehensive performance, and can be used for ensuring the nonlinear coefficient alphagt; when the voltage is 30, the voltage-sensitive voltage is as low as 424.2 V / mm, the leakage current IL is as low as 1.8 [mu] A / cm < 2 >, the energy consumption is low, the cost is low, and the method is green and environment-friendly.

By preventing burnt, cracked, or short-circuited electronic components from occurring in high-voltage environments, this invention provides multilayer electronic components with excellent voltage resistance and reliability. [Solution] The multilayer ceramic capacitor, which is a multilayer electronic component, includes a body containing a first dielectric layer 111a, a second dielectric layer 111b, and internal electrodes 121, 122, and external electrodes 131, 132 disposed on the body. The first dielectric layer mainly contains a BaTiO3-based material, and the second dielectric layer has a different main component from the first dielectric layer (α β Γ δ )Ti x O y The substance contains (β≧0, δ≧0, x>0, y>0) as its main component, where α is one or more of Ba, Er, Ca, and Sr, and Γ is one or more of Nb, Mg, Ta, In, Mn, Hf, Zr, and Al.

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

This multilayer electronic component comprises: a layered body in which an internal electrode and a dielectric layer are alternately layered; a base electrode; and an external electrode. The internal electrode has a first internal electrode and a second internal electrode. The base electrode has a first base electrode and a second base electrode. The external electrode has a first external electrode and a second external electrode. The first base electrode and the second base electrode each include a plurality of sintered bodies that are made of dielectric particles. At least some of the plurality of sintered bodies are positioned at an interface between a respective base electrode and the layered body.

The application provides an intelligent packaging equipment for a pressure-sensitive resistor, a packaging process and the pressure-sensitive resistor. The intelligent packaging equipment for the pressure-sensitive resistor comprises a man-machine interface, a plurality of clamps and, sequentially arranged along the transmission direction of the clamps, a feeding rack, an oven, a packaging device and a discharging rack. The feeding rack, the oven and the discharging rack accommodate the clamps in a layered manner. The oven is provided with a constant temperature device for constant temperature adjustment of the pressure-sensitive resistor on the clamp. The packaging device comprises a packaging mechanical arm, a heat preservation box, a heating assembly and a powder tank assembly. The powder tank assembly is filled with packaging powder. The heating assembly comprises a heating door, a leveling rack and a sliding seat. The leveling rack is provided with a scraper extending into the powder tank assembly. The heat preservation box, the heating assembly and the powder tank assembly are sequentially distributed from top to bottom to make the packaging process of the pressure-sensitive resistor continuous and orderly, improve the packaging efficiency and the packaging yield, and reduce the volume of the packaging equipment and improve the space utilization.

The present invention relates to a hybrid ground protection device for a modular voltage power converter for converting a primary AC voltage having one or more phases into a secondary AC voltage. The hybrid ground protection device includes input and output contacts connected to the voltage input and voltage output of a single module of the converter. The input and output contacts connected to the same single module are connected to varistors that are energized when the voltage drop across the varistor exceeds a first threshold. A non-conductive switch bar having a bridging contact can be moved from an operating position to a grounding position. In the grounding position, the bridging contact connects the input and output contacts of the single module to each other and to a ground terminal. In the operating position, the input and output contacts are not connected by the bridging contact and are not connected to the ground terminal (FIG. 2).

Provided is a multilayer ceramic capacitor that can be reliably mounted on a wiring board and that can suppress the occurrence of squeal. A laminated ceramic electronic component is provided with: a laminated body (2) including an inner layer section (11) in which dielectric layers (14) and internal electrode layers (15) are alternately laminated, the laminated body (2) having two main surfaces (A) facing each other in a lamination direction (T) and two end surfaces (C) facing each other in a longitudinal direction (L); two external electrodes (3) which are respectively connected to the internal electrode layer (15) at the two end surfaces (C), and which cover the end surfaces (C) and a part of the two main surfaces (A) which are connected to the end surfaces and face each other; and two spacers (4) disposed on one of the two main surfaces (A) so as to sandwich the external electrode (3), the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A), and the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A), and the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A) and the second main surface (SA2) when the surface that does not sandwich the external electrode is defined as the second main surface (SA2). The angle of the second main surface (SA2) of the spacer with respect to the main surface of the laminate (2) on which the spacer (4) is disposed is 5 degrees or less when viewed from the width direction.

Provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. The ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. The first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. The horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).

The present invention provides a multilayer ceramic capacitor which has high adhesion strength between an external electrode and a spacer and exhibits excellent durability when mounted. A multilayer ceramic electronic component 1 according to the present invention is provided with: a capacitor main body 1A that is provided with a multilayer body 2 and two external electrodes 3 which are disposed on two end surfaces of the multilayer body 2, are connected to an internal electrode layer 15, and extend to two main surfaces of the multilayer body 2 so as to partially cover the main surfaces; and two spacers 4 that are disposed on both end surface sides of one main surface side of the capacitor main body 1A, sandwiching the external electrodes 3 partially covering the main surfaces. The spacers 4 are longer than the external electrodes 3 covering the main surfaces, in the length direction, and each contain an intermetallic compound which contains at least one of Cu and Ni as a high melting point metal and Sn as a low melting point metal, and a protective material 6. If each of the spacers 4 is divided into two parts in the length direction along a line extending in a stacking direction, the content ratio of the protective material 6 is higher in a region that is closer to a central part of the capacitor main body 1A in the length direction than in a region that is farther from the central part of the capacitor main body 1A.

A multilayer ceramic electronic component includes a ceramic element in which dielectric layers and internal electrodes are alternately laminated along a first axis direction, and a pair of external electrodes provided at end portions of the ceramic element in a third axis direction so as to be electrically connected to the internal electrodes led out to a different end surface of the ceramic element in the third axis direction. Each of the pair of external electrodes includes a first region and a second region in this order from the ceramic element. An average crystal grain size of crystal grains forming the first region is smaller than an average crystal grain size of crystal grains forming the second region.

To provide a laminated electronic component excellent in reliability even in a high-voltage environment.SOLUTION: According to an aspect of the present disclosure, a multilayer electronic component may include a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, external electrodes disposed on the body and connected to the internal electrodes, and a support member disposed on at least one of opposing surfaces of the body in the first direction, wherein the support member has a first end portion contacting the external electrodes and a second end portion opposing the first end portion, and the second end portion has a thickness in the first direction smaller than that of the first end portion.SELECTED DRAWING: Figure 2

This utility model belongs to the field of electrical equipment technology and discloses a varistor and a surge protector. The varistor includes a varistor resistor, a first electrode, a second electrode, and a third electrode. The first electrode includes a first connecting portion and a first contact portion connected together. The second electrode includes a second connecting portion and a second contact portion connected together. The first and second contact portions are fixedly attached to opposite sides of the varistor resistor. The third electrode includes a third connecting portion disposed between the first and second connecting portions. The first connecting portion is provided with a positioning head for positioning the second and third connecting portions. The surge protector includes the aforementioned varistor. The varistor and surge protector provided by this utility model can achieve reliable positioning between multiple electrodes without the need for an external positioning structure, reducing production costs, improving production efficiency, ensuring accurate and reliable positioning after welding, and ensuring good conductivity.

The invention relates to the technical field of piezoresistors, in particular to a piezoresistor disc and a preparation method thereof.The piezoresistor disc comprises two electrodes and a ceramic substrate arranged between the two electrodes, and a plurality of transition layers are arranged at the contact positions of the ceramic substrate and the electrodes; the materials of the transition layers are obtained by doping silver powder with different mass fractions on the basis of ceramic base powder used for sintering the ceramic matrix, and the mass fractions of the silver powder in the multiple transition layers are gradually increased from the side close to the ceramic matrix to the side close to the electrode, so that gradient transition from the ceramic matrix material to the electrode material in component is formed. When the temperature changes, the thermal expansion difference between the adjacent transition layers can be obviously reduced, stress concentration generated at the interface due to the fact that the thermal expansion coefficient difference of two materials is too large in a traditional structure is avoided, and therefore the possibility that interface resistance changes after long-time use is reduced.

To provide dielectric material and a multilayer ceramic electronic component having a high dielectric constant and excellent withstanding voltage characteristics.SOLUTION: An dielectric according to one embodiment of the invention includes: a main component represented by (Ba1-XCaX)(Ti1-y(Zr,Sn,Hf)y)O3 (wherein 0≤X≤1, 0≤y≤0.5); a first subcomponent including one or more of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Nb, Tb, Eu, Tm, La, Lu and Yb; a second sub-component including Si and / or Al; and a third sub-component including Ba and / or Ca.SELECTED DRAWING: Figure 4

The utility model discloses a piezoresistor which comprises a resistor body and electrodes, the resistor body is a multilayer piezoresistor, the electrodes comprise a first electrode and a second electrode, a shell is sleeved on the outer side of the resistor body, the first electrode and the second electrode are both exposed out of the shell, an expansion machine shell is arranged on the outer wall of the shell, and a temperature control switch is installed on the expansion machine shell. A first temperature control switch is arranged on the expansion casing close to the first electrode, and a second temperature control switch is arranged on the expansion casing close to the second electrode. According to the piezoresistor, the temperature control switches are arranged, the first temperature control switch is used for warning that the temperature is close to a set value, the second temperature control switch is used for warning that the temperature exceeds the set value, the voltage on a circuit is detected in real time through the voltage detectors, and the two voltage detectors detect low voltage and high voltage respectively and can give out a warning; by arranging the buzzer and the indicator lamp, the circuit abnormity is reminded, and by means of the signal sending device, a worker can be remotely reminded of the circuit abnormity, and leakage current is prevented.

The flame-retardant piezoresistor assembly comprises a base, a fixed conducting strip, an elastic conducting strip and a piezoresistor chip, a first piezoresistor conducting electrode and a second piezoresistor conducting electrode are arranged at the two ends of the piezoresistor chip respectively, and the lower end of the fixed conducting strip is fixed to the base; the upper end of the fixed conducting strip is connected with the first piezoresistor conducting electrode, the lower end of the elastic conducting strip is fixed on the base, and the elastic conducting strip has outward elastic force, so that the upper end of the elastic conducting strip is not connected with the second piezoresistor conducting electrode in a natural state that the lower end of the elastic conducting strip is fixed on the base; the upper end of the elastic conducting strip is connected with the second piezoresistor conducting electrode through metal welding, so that when the piezoresistor chip is in thermal runaway, the welding metal is melted, the elastic conducting strip rebounds outwards and is separated from the second piezoresistor conducting electrode, the electric connection between the piezoresistor chip and the second piezoresistor conducting electrode is cut off, and the piezoresistor chip stops heating in a power-off state; and the fire risk caused by ignition of the potting glue is avoided.

In some embodiments, the packaged device may include an electronic device having a first electrode and a second electrode implemented on opposite sides of a body. An electronic device may be sandwiched between a first terminal assembly and a second terminal assembly, where the first terminal assembly and the second terminal assembly are configured to provide a surface mount device (SMD) format for a package device, allowing the electronic device to be easily mounted on a surface of a circuit board.

To provide a fabrication method that allows sintering solderable base metal and alloy elements under air.SOLUTION: A solderable electrode can be manufactured by heat treatment instead of electroplating. This method directly adds a large amount of metal powder to the electrode, and also adds metallic aluminum powder with a high oxidation enthalpy to protect the tin from oxidation. Adding other metals, such as metallic copper powder, produces a copper-tin alloy to increase its melting point. This method also directly uses a tin-based electrode, and covers the tin electrode with an aluminum film to prevent it from oxidizing during heat treatment. Adding a suitable metal, such as copper, to the tin film produces a tin-copper alloy, thereby increasing the melting point of the electrode. This invention thus uses a heat treatment process instead of electroplating to produce electrodes for an electronic device without the need for a tin electroplating process, resulting in solderable electrodes with excellent solderability and high performance properties.SELECTED DRAWING: Figure 6

To provide a laminated electronic component and a manufacturing method thereof that improve defects such as side margin gaps, occurrence of short circuits, and deterioration of moisture resistance reliability.SOLUTION: A method includes providing a ceramic green sheet 211 having a plurality of internal electrode patterns 221 and 222 spaced apart from each other, laminating ceramic green sheets to form a ceramic green sheet laminate, obtaining a laminate body 210 by cutting the ceramic green sheet laminate such that the ends of the internal electrode patterns have side surfaces exposed in the width direction, an adhesive layer adhering step of adhering an adhesive layer AD attached to a base film BF to the exposed side surface of the internal electrode pattern of the laminate, and an adhesive layer peeling step of removing foreign matter on the side surface by peeling the adhesive layer.SELECTED DRAWING: Figure 11

In the chip varistor of the present invention, ESD tolerance is improved by increasing the width of the functional portion of the third conductor. The width of the end portion of the third conductor is shorter than the width of the third electrode and shorter than the width of the functional portion of the third conductor. Therefore, for example, when forming the third electrode, even if the relative position of the third electrode and the third conductor in the direction of the end faces is offset, it is unlikely that a portion of the third conductor will be uncovered by the third electrode. In other words, the size of the connection area between the third conductor and the third electrode remains unchanged, achieving a good connection.

The utility model relates to the technical field of piezoresistors, and discloses an integrated double-layer structure piezoresistor which comprises a piezoresistor body, a cooling heat dissipation device is arranged on the outer surface of the piezoresistor body, and the cooling heat dissipation device comprises a semiconductor chilling plate. A semiconductor chilling plate is arranged on one side of the piezoresistor body, a device convenient to disassemble is arranged between one side of the semiconductor chilling plate and the outer surface of the piezoresistor body, and when the piezoresistor body is installed on a circuit board to be used, after the semiconductor chilling plate on one side is powered on, the semiconductor chilling plate on the other side of the piezoresistor body can be cooled. When surge current absorbed in the piezoresistor body is too large, one side of the piezoresistor body absorbs heat on the surfaces of the piezoresistor body and the aluminum frame to cool the piezoresistor body, then the aluminum frame increases surface contact with the piezoresistor body to enable the piezoresistor body to perform heat exchange, the temperature of the surface of the piezoresistor body is reduced, and the surge current absorbed in the piezoresistor body is too large. And the piezoresistor main body cannot be damaged due to overheating, so that the service life of the piezoresistor main body is prolonged.

A metal oxide varistor includes a metal oxide varistor chip, a first electrode disposed on a first side of the metal oxide varistor chip, and a second electrode disposed on a second side of the metal oxide varistor chip, wherein each of the first electrode and the second electrode includes a seed layer formed of a nickel alloy disposed directly on a surface of the metal oxide varistor chip and a capping layer formed of a metal disposed on the seed layer.

To provide an electronic component which suppresses the occurrence of cracks in an element body.SOLUTION: The internal electrode disposed in the element body includes an end exposed to the first side surface. The outer conductors disposed on the element body contain a glass composition containing SiO2 and Al2O3 and conductive metals. The external conductor includes a first region disposed on the first side surface and connected to the end included in the internal conductor, and a second region disposed on at least one of the pair of second side surfaces. The glass composition included in the first region has a total content of 23mol and Al2O3 of SiO2% or more. The glass composition contained in the second region has a total content of 5mol and 20mol of SiO2% or more and Al2O3% or less.SELECTED DRAWING: Figure 2

The utility model discloses an explosion-proof flame-retardant piezoresistor which comprises a shell and a piezoresistor, the shell is filled with a flame-retardant epoxy resin and quartz sand mixture, and the piezoresistor is wrapped in the flame-retardant epoxy resin and quartz sand mixture; the piezoresistor comprises a body and two pins, one pin comprises a first extension section, a second extension section and a low-temperature alloy wire section connected between the first extension section and the second extension section, the low-temperature alloy wire section is close to the body, and a fluxing agent layer is coated outside the low-temperature alloy wire section. A piezoresistor is attached to a low-temperature alloy wire, and the surface of the low-temperature alloy wire is coated with a fluxing agent layer; and a mixture of flame-retardant epoxy resin and quartz sand is filled in the shell to wrap the piezoresistor body. And when the piezoresistor is overheated due to abnormity, the low-temperature alloy wire is quickly melted to completely break the pin, so that the circuit is permanently cut off, and the piezoresistor is prevented from firing and burning.

The present application provides a circuit protection device, comprising: a patch type thermistor element including a first electrode and a second electrode; a first heat dissipation terminal connected with the first electrode; a second heat dissipation terminal connected with the second electrode; and a housing protecting the thermistor element, the first heat dissipation terminal and the second heat dissipation terminal. The circuit protection device according to the present application having an SMD (Surface Mount Device) structure can be applied to an ultra-thin wall-mounted television.

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are alternately laminated, a base electrode, and an external electrode. The internal electrodes include a first internal electrode and a second internal electrode. The base electrode includes a first base electrode and a second base electrode. The external electrode includes a first external electrode and a second external electrode. Each of the first base electrode and the second base electrode contains a plurality of sintered bodies made of dielectric particles. At least a part of the plurality of sintered bodies is located at the interface between each base electrode and the laminate.

Disclosed is a substrate comprising a ceramic main body (1) and an organic surface structure (2) on at least one outer face of the ceramic main body (1), outer redistribution layers (3) being integrated into the organic surface structure.

An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.