171results about "Varistors" patented technology

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are alternately laminated, a base electrode, and an external electrode. The internal electrodes include a first internal electrode and a second internal electrode. The base electrode includes a first base electrode and a second base electrode. The external electrode includes a first external electrode and a second external electrode. Each of the first base electrode and the second base electrode contains a plurality of sintered bodies made of dielectric particles. At least a part of the plurality of sintered bodies is located at the interface between each base electrode and the laminate.

The invention discloses a piezoresistor assembling device, and belongs to the technical field of electronic component manufacturing equipment. The problems that existing piezoresistor assembly mostly depends on manual or semi-automatic equipment, production efficiency is low, consistency is poor, all mechanisms are lack of effective cooperation and need manual intervention, resistor insertion deflection is prone to occurring, sand filling is uneven, and cover plate correction precision is low are solved. The device comprises a shell feeding mechanism, a resistor feeding mechanism, a cover plate feeding mechanism, a material inserting mechanism, a sand filling mechanism, a cover plate assembling mechanism, a driving mechanism, a supporting mechanism and a control system. The supporting mechanism supports all the mechanisms, the driving mechanism drives the shell to move at the stations of the material inserting mechanism, the sand filling mechanism and the cover plate assembling mechanism, the control system coordinates all the mechanisms to act, and all the mechanisms sequentially complete feeding of the shell, the resistor and the cover plate, insertion of the resistor into the shell, sand filling and cover plate assembling. The device is mainly used for automatically completing full-process assembly of the piezoresistor, continuous automatic production is achieved, and the assembly efficiency and the product consistency are improved.

To provide a fabrication method that allows sintering solderable base metal and alloy elements under air.SOLUTION: A solderable electrode can be manufactured by heat treatment instead of electroplating. This method directly adds a large amount of metal powder to the electrode, and also adds metallic aluminum powder with a high oxidation enthalpy to protect the tin from oxidation. Adding other metals, such as metallic copper powder, produces a copper-tin alloy to increase its melting point. This method also directly uses a tin-based electrode, and covers the tin electrode with an aluminum film to prevent it from oxidizing during heat treatment. Adding a suitable metal, such as copper, to the tin film produces a tin-copper alloy, thereby increasing the melting point of the electrode. This invention thus uses a heat treatment process instead of electroplating to produce electrodes for an electronic device without the need for a tin electroplating process, resulting in solderable electrodes with excellent solderability and high performance properties.SELECTED DRAWING: Figure 6

The invention belongs to the technical field of functional ceramic materials, and particularly relates to luminous multifunctional ZnO-Bi2O3-based voltage-sensitive ceramic as well as a preparation method and application thereof. The luminous multifunctional ZnO-Bi2O3-based voltage-sensitive ceramic provided by the invention has up-conversion luminescence performance, can detect red emitted light under the excitation of 980nm laser, has a high nonlinear coefficient, is adjustable between 34 and 40.3, has excellent comprehensive performance, and can be used for ensuring the nonlinear coefficient alphagt; when the voltage is 30, the voltage-sensitive voltage is as low as 424.2 V / mm, the leakage current IL is as low as 1.8 [mu] A / cm < 2 >, the energy consumption is low, the cost is low, and the method is green and environment-friendly.

The invention relates to the field of resistor materials, and particularly discloses a piezoresistor and a preparation process thereof.The piezoresistor comprises a ceramic substrate and copper-based electrodes formed on the two sides of the ceramic substrate, and each copper-based electrode comprises a nickel bottom layer sputtered on the ceramic substrate through a magnetron sputtering vacuum plating process and a copper surface layer sputtered on the nickel bottom layer; the preparation process comprises the following steps: S1, placing a to-be-treated zinc oxide-based ceramic substrate in a vacuum coating chamber, vacuumizing, and carrying out magnetron sputtering by using a nickel target until the thickness of a nickel bottom layer is 100-200nm; and S2, after the air pressure is adjusted, copper and palladium are replaced for copper plating till the thickness of a copper surface layer is 3-5 microns. According to the invention, the production cost of the piezoresistor is reduced, and the obtained piezoresistor has good stability and electrical properties.

In some embodiments, a packaged device can include an electrical device having first and second electrodes implemented on opposite sides of a body. The electrical device can be sandwiched between first and second terminal assemblies, with the first and second terminal assemblies being configured to provide the packaged device with a surface mount device (SMD) format, thereby allowing the electrical device to be easily mounted on a surface of a circuit board.

The present invention provides an improved plastic-sealed patch thermal varistor, comprising a thermistor chip, a varistor chip is arranged on one side of the thermistor chip, and a connecting piece is electrically connected to the lower part of the varistor chip and the thermistor chip, wherein the middle part of the right part of the connecting piece is integrally connected with a first pin; the upper part of the thermistor chip is electrically connected with a second pin; the upper part of the varistor chip is electrically connected with a third pin; and the outer sides of the thermistor chip and the varistor chip are provided with a plastic sealing layer. The present invention can inject solder paste into a paste storage conductive box through a tin injection port, so that the solder paste can be individually isolated through the paste storage conductive box, thereby avoiding the problem of bridging of the solder paste, and then avoiding the problem of short circuit after the thermal varistor is welded, and achieving the effect of paste storage welding.

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are laminated, a base electrode, and an external electrode. The internal electrodes have a first internal electrode and a second internal electrode, the base electrode has a first base electrode and a second base electrode, and the external electrode has a first external electrode and a second external electrode. Each of the first external electrode and the second external electrode has a first portion connected to the first internal electrode or the second internal electrode and a second portion connected to any of the base electrodes. The average particle diameter of the metal particles contained in the first portion is smaller than the average particle diameter of the metal particles M contained in the second portion.

By preventing burnt, cracked, or short-circuited electronic components from occurring in high-voltage environments, this invention provides multilayer electronic components with excellent voltage resistance and reliability. [Solution] The multilayer ceramic capacitor, which is a multilayer electronic component, includes a body containing a first dielectric layer 111a, a second dielectric layer 111b, and internal electrodes 121, 122, and external electrodes 131, 132 disposed on the body. The first dielectric layer mainly contains a BaTiO3-based material, and the second dielectric layer has a different main component from the first dielectric layer (α β Γ δ )Ti x O y The substance contains (β≧0, δ≧0, x>0, y>0) as its main component, where α is one or more of Ba, Er, Ca, and Sr, and Γ is one or more of Nb, Mg, Ta, In, Mn, Hf, Zr, and Al.

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

This multilayer electronic component comprises: a layered body in which an internal electrode and a dielectric layer are alternately layered; a base electrode; and an external electrode. The internal electrode has a first internal electrode and a second internal electrode. The base electrode has a first base electrode and a second base electrode. The external electrode has a first external electrode and a second external electrode. The first base electrode and the second base electrode each include a plurality of sintered bodies that are made of dielectric particles. At least some of the plurality of sintered bodies are positioned at an interface between a respective base electrode and the layered body.

The invention relates to the technical field of electronic materials, and particularly discloses copper electrode paste for an annular strontium titanate varistor and application of the copper electrode paste, and the copper electrode paste for the annular strontium titanate varistor is prepared from the following components in percentage by mass: 82%-88% of copper conductive powder, 0.3%-0.5% of an inorganic glass binder, 11%-18% of an organic carrier and 0-0.3% of a dispersing agent. The copper electrode slurry for the annular strontium titanate piezoresistor can be stacked and sintered in nitrogen at 800-900 DEG C, the sintered copper electrode slurry is good in appearance and excellent in welding performance, the adhesive force between a copper layer and strontium titanate piezoresistor ceramic is high, ohmic contact is good, and the electrostatic capacity is high.

The application provides an intelligent packaging equipment for a pressure-sensitive resistor, a packaging process and the pressure-sensitive resistor. The intelligent packaging equipment for the pressure-sensitive resistor comprises a man-machine interface, a plurality of clamps and, sequentially arranged along the transmission direction of the clamps, a feeding rack, an oven, a packaging device and a discharging rack. The feeding rack, the oven and the discharging rack accommodate the clamps in a layered manner. The oven is provided with a constant temperature device for constant temperature adjustment of the pressure-sensitive resistor on the clamp. The packaging device comprises a packaging mechanical arm, a heat preservation box, a heating assembly and a powder tank assembly. The powder tank assembly is filled with packaging powder. The heating assembly comprises a heating door, a leveling rack and a sliding seat. The leveling rack is provided with a scraper extending into the powder tank assembly. The heat preservation box, the heating assembly and the powder tank assembly are sequentially distributed from top to bottom to make the packaging process of the pressure-sensitive resistor continuous and orderly, improve the packaging efficiency and the packaging yield, and reduce the volume of the packaging equipment and improve the space utilization.

The present invention relates to a hybrid ground protection device for a modular voltage power converter for converting a primary AC voltage having one or more phases into a secondary AC voltage. The hybrid ground protection device includes input and output contacts connected to the voltage input and voltage output of a single module of the converter. The input and output contacts connected to the same single module are connected to varistors that are energized when the voltage drop across the varistor exceeds a first threshold. A non-conductive switch bar having a bridging contact can be moved from an operating position to a grounding position. In the grounding position, the bridging contact connects the input and output contacts of the single module to each other and to a ground terminal. In the operating position, the input and output contacts are not connected by the bridging contact and are not connected to the ground terminal (FIG. 2).

A ceramic multilayer electronic component comprises a body 10 including a multilayer portion in which a plurality of dielectric layers 11 and a plurality of internal electrode layers 12 are stacked one on top of the other, each of the internal electrode layers 12 being arranged to be exposed from one of the two opposite end surfaces of the body 10, the body 10 having side edges 16 which are provided in a third direction orthogonal to a first direction in which the internal electrode layers 12 face each other and to a second direction in which the two end surfaces face each other, outside a capacitance portion 14 as a region in which the dielectric layers 11 and the internal electrode layers 12 face each other, and which vanadium concentration to ceramic as a main component is higher than the capacitance portion 14.

Provided is a multilayer ceramic capacitor that can be reliably mounted on a wiring board and that can suppress the occurrence of squeal. A laminated ceramic electronic component is provided with: a laminated body (2) including an inner layer section (11) in which dielectric layers (14) and internal electrode layers (15) are alternately laminated, the laminated body (2) having two main surfaces (A) facing each other in a lamination direction (T) and two end surfaces (C) facing each other in a longitudinal direction (L); two external electrodes (3) which are respectively connected to the internal electrode layer (15) at the two end surfaces (C), and which cover the end surfaces (C) and a part of the two main surfaces (A) which are connected to the end surfaces and face each other; and two spacers (4) disposed on one of the two main surfaces (A) so as to sandwich the external electrode (3), the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A), and the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A), and the spacers (4) being disposed so as to sandwich the external electrode (3) between the two main surfaces (A) and the second main surface (SA2) when the surface that does not sandwich the external electrode is defined as the second main surface (SA2). The angle of the second main surface (SA2) of the spacer with respect to the main surface of the laminate (2) on which the spacer (4) is disposed is 5 degrees or less when viewed from the width direction.

Provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. The ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. The first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. The horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).

The utility model discloses a pin assembly structure of a piezoresistor, and relates to the technical field of piezoresistors. The pin assembly structure comprises a resistor main body, four groups of positioning pins are fixedly connected to the bottom of the resistor main body, the positioning pins are arranged in a rectangular array, positioning grooves are formed in the positions, away from fixing balls, outside the positioning pins, and the fixing balls are embedded in the positioning grooves. The three sets of fixing balls are arranged in the positioning groove in a circumferential array mode, the mounting holes are pushed through the lifting springs, the fixing balls slide along the inner wall of the positioning sleeve, the fixing balls slide into the mounting holes along the sliding holes, the fixing balls are embedded in the positioning groove, and therefore the positioning pins are fixed. The lifting shell can slide downwards along the positioning sleeve by rotating the positioning sleeve, so that the effects of positioning installation and quick disassembly are achieved, the problem that a circuit board is not subjected to suction welding frequently when a resistor main body is replaced due to previous welding is solved, and the disassembly convenience is improved.

The present invention provides a multilayer ceramic capacitor which has high adhesion strength between an external electrode and a spacer and exhibits excellent durability when mounted. A multilayer ceramic electronic component 1 according to the present invention is provided with: a capacitor main body 1A that is provided with a multilayer body 2 and two external electrodes 3 which are disposed on two end surfaces of the multilayer body 2, are connected to an internal electrode layer 15, and extend to two main surfaces of the multilayer body 2 so as to partially cover the main surfaces; and two spacers 4 that are disposed on both end surface sides of one main surface side of the capacitor main body 1A, sandwiching the external electrodes 3 partially covering the main surfaces. The spacers 4 are longer than the external electrodes 3 covering the main surfaces, in the length direction, and each contain an intermetallic compound which contains at least one of Cu and Ni as a high melting point metal and Sn as a low melting point metal, and a protective material 6. If each of the spacers 4 is divided into two parts in the length direction along a line extending in a stacking direction, the content ratio of the protective material 6 is higher in a region that is closer to a central part of the capacitor main body 1A in the length direction than in a region that is farther from the central part of the capacitor main body 1A.

A multilayer ceramic electronic component includes a ceramic element in which dielectric layers and internal electrodes are alternately laminated along a first axis direction, and a pair of external electrodes provided at end portions of the ceramic element in a third axis direction so as to be electrically connected to the internal electrodes led out to a different end surface of the ceramic element in the third axis direction. Each of the pair of external electrodes includes a first region and a second region in this order from the ceramic element. An average crystal grain size of crystal grains forming the first region is smaller than an average crystal grain size of crystal grains forming the second region.

The present invention provides a multilayer ceramic electronic component capable of being reliably mounted on a mounting substrate, suppressing the upward wetting of molten solder, and suppressing the occurrence of squeal.　In a multilayer ceramic electronic component 1, on a main surface or a side surface serving as a mounting surface to a mounting substrate, two spacers 4 connected to an external electrode 3 are each composed of two regions facing each other in the length direction L, namely an inner region 41 and an outer region 42, which is the portion of the spacer 4 other than the inner region 41. When a line V perpendicular to the mounting surface is drawn from a tip Pt of a base electrode layer 30 constituting the external electrode 3, the inner region 41 is positioned further inward in the length direction L than the line V perpendicular to the mounting surface. The inner region 41 and the outer region 42 have different Sn contents.

To provide a laminated electronic component excellent in reliability even in a high-voltage environment.SOLUTION: According to an aspect of the present disclosure, a multilayer electronic component may include a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, external electrodes disposed on the body and connected to the internal electrodes, and a support member disposed on at least one of opposing surfaces of the body in the first direction, wherein the support member has a first end portion contacting the external electrodes and a second end portion opposing the first end portion, and the second end portion has a thickness in the first direction smaller than that of the first end portion.SELECTED DRAWING: Figure 2

The invention relates to the technical field of piezoresistor welding tools, in particular to a piezoresistor welding tool based on an electromagnetic stable adsorption structure, which comprises a base, a rotating seat is rotatably connected above the base, an electromagnetic adsorption seat is fixedly connected to the middle of the rotating seat, and a top frame is fixedly connected to the rotating seat. A laser welding device is installed on the top frame, a moving ring is arranged on the top frame, a plurality of centering mechanisms are arranged on the top frame in a rotating connection mode, a wiping plate is arranged above one end of the rotating base in a sliding fit mode, and a transmission mechanism is arranged below one end of the rotating base in a sliding fit mode. According to the annular piezoresistor welding device, accurate adjustment can be conducted according to annular piezoresistors of different sizes, so that electromagnetic stable adsorption welding is conducted on the annular piezoresistors, and compared with a traditional clamping mode, physical contact with elements is reduced, production efficiency is improved, element damage is reduced, and welding quality is improved.

This utility model belongs to the field of electrical equipment technology and discloses a varistor and a surge protector. The varistor includes a varistor resistor, a first electrode, a second electrode, and a third electrode. The first electrode includes a first connecting portion and a first contact portion connected together. The second electrode includes a second connecting portion and a second contact portion connected together. The first and second contact portions are fixedly attached to opposite sides of the varistor resistor. The third electrode includes a third connecting portion disposed between the first and second connecting portions. The first connecting portion is provided with a positioning head for positioning the second and third connecting portions. The surge protector includes the aforementioned varistor. The varistor and surge protector provided by this utility model can achieve reliable positioning between multiple electrodes without the need for an external positioning structure, reducing production costs, improving production efficiency, ensuring accurate and reliable positioning after welding, and ensuring good conductivity.

The invention relates to the technical field of piezoresistors, in particular to a piezoresistor disc and a preparation method thereof.The piezoresistor disc comprises two electrodes and a ceramic substrate arranged between the two electrodes, and a plurality of transition layers are arranged at the contact positions of the ceramic substrate and the electrodes; the materials of the transition layers are obtained by doping silver powder with different mass fractions on the basis of ceramic base powder used for sintering the ceramic matrix, and the mass fractions of the silver powder in the multiple transition layers are gradually increased from the side close to the ceramic matrix to the side close to the electrode, so that gradient transition from the ceramic matrix material to the electrode material in component is formed. When the temperature changes, the thermal expansion difference between the adjacent transition layers can be obviously reduced, stress concentration generated at the interface due to the fact that the thermal expansion coefficient difference of two materials is too large in a traditional structure is avoided, and therefore the possibility that interface resistance changes after long-time use is reduced.

To provide dielectric material and a multilayer ceramic electronic component having a high dielectric constant and excellent withstanding voltage characteristics.SOLUTION: An dielectric according to one embodiment of the invention includes: a main component represented by (Ba1-XCaX)(Ti1-y(Zr,Sn,Hf)y)O3 (wherein 0≤X≤1, 0≤y≤0.5); a first subcomponent including one or more of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Nb, Tb, Eu, Tm, La, Lu and Yb; a second sub-component including Si and / or Al; and a third sub-component including Ba and / or Ca.SELECTED DRAWING: Figure 4

The utility model discloses a piezoresistor which comprises a resistor body and electrodes, the resistor body is a multilayer piezoresistor, the electrodes comprise a first electrode and a second electrode, a shell is sleeved on the outer side of the resistor body, the first electrode and the second electrode are both exposed out of the shell, an expansion machine shell is arranged on the outer wall of the shell, and a temperature control switch is installed on the expansion machine shell. A first temperature control switch is arranged on the expansion casing close to the first electrode, and a second temperature control switch is arranged on the expansion casing close to the second electrode. According to the piezoresistor, the temperature control switches are arranged, the first temperature control switch is used for warning that the temperature is close to a set value, the second temperature control switch is used for warning that the temperature exceeds the set value, the voltage on a circuit is detected in real time through the voltage detectors, and the two voltage detectors detect low voltage and high voltage respectively and can give out a warning; by arranging the buzzer and the indicator lamp, the circuit abnormity is reminded, and by means of the signal sending device, a worker can be remotely reminded of the circuit abnormity, and leakage current is prevented.

A chip electronic component includes a multilayer ceramic capacitor and spacers. The multilayer ceramic capacitor includes a multilayer body including inner electrode layers and dielectric layers that are alternately arranged, and outer electrodes. The multilayer body includes capacitor principal surfaces opposite to each other in a lamination direction, capacitor side surfaces opposite to each other in a width direction, and capacitor end surfaces opposite to each other in a length direction. Outer electrodes are provided on respective ones of capacitor end surfaces. The spacers are provided at both ends of one of the capacitor principal surfaces adjacent to a mounting board for the multilayer ceramic capacitor. Each spacer includes spacer principal surfaces opposite to each other in the lamination direction. At least one recess is provided in a surface of one of the spacer principal surfaces adjacent to the mounting board.