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390 results about "Thermal diffusivity" patented technology

In heat transfer analysis, thermal diffusivity is the thermal conductivity divided by density and specific heat capacity at constant pressure. It measures the rate of transfer of heat of a material from the hot end to the cold end. It has the SI derived unit of m²/s. Thermal diffusivity is usually denoted α but a,h,κ, K, and D are also used. The formula is: α=k/ρcₚ where k is thermal conductivity (W/(m·K)) cₚ is specific heat capacity (J/(kg·K)) ρ is density (kg/m³) Together, ρcₚ can be considered the volumetric heat capacity (J/(m³·K)).

Device for measuring thermal diffusivity

InactiveCN101929968AMonitor strength in real timeCorrect response timeMaterial thermal conductivityMaterial heat developmentSample MeasureMeasurement device
The invention provides a device for measuring a thermal diffusivity. The device comprises an excitation light source, an optical control device, a vacuum heating furnace, a temperature controlling device, a temperature measuring device and a data acquiring and processing device, wherein the excitation light source generates excitation light beams; the optical control device is provided with an optical component group, a light beam mass spectrometer and an energy meter and regulates the energy of the excitation light beams through a replaceable optical element in the optical component group; a heating element for heating a sample is arranged in the vacuum heating furnace; the temperature controlling device is used for controlling the heating temperature of the vacuum heating furnace; the temperature measuring device amplifies a temperature rise signal of the sample measured by a detector through a pre-amplifier and transmits the amplified signal to the data acquiring and processing device; the data acquiring and processing device comprises a data acquiring system and a data processing system; the data acquiring system transmits all acquired data signals to the data processing system; and the data processing system analyzes and repeatedly and theoretically corrects the data signals. The device for measuring the thermal diffusivity designed by the invention has the advantages of reducing the measuring repeatability of the thermal diffusivity of a material to be less than 1 percent, lowering uncertainty of measurement, improving the level of thermal diffusivity measurement and laying foundations for the establishment of a standard thermal diffusivity device in China, the preparation of a standard thermal diffusivity substance and the establishment of a standard thermal diffusivity database.
Owner:NAT INST OF METROLOGY CHINA +1

Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof

The invention discloses a halogen-free high heat-resistant and heat-conducting resin film and a manufacturing method thereof. The halogen-free high heat-resistant and heat-conducting resin film is prepared by semi-curing of a heat-conducting resin liquid, wherein the heat-conducting resin liquid is prepared from 70 to 100 parts of a halogen-free epoxy resin, 0 to 30 parts of one or more flexibilizers, 80 to 120 parts of one or more solvents, 1 to 20 parts of one or more curing agents, 0.01 to 1 part of one or more promoters, 0.5 to 5.0 parts of a coupling agent and 80 to 600 parts of one or more high heat-conducting filling materials. The halogen-free high heat-resistant and heat-conducting resin film has a thermal conductivity great than or equal to 2.5W / m.K and heat resistance (at a temperature of 300 DEG C) great than or equal to 300s. The halogen-free high heat-resistant and heat-conducting resin film has flexibility so that the problem of brittleness of the traditional heat-conducting materials is solved. An aluminum substrate prepared from the halogen-free high heat-resistant and heat-conducting resin film is suitable for electronic products such as LED, vehicle systems and variable-frequency power sources needing good heat conductivity, can greatly improve the thermal diffusivity of the electronic products, and has high reliability and energy-saving and environmental-protection effects.
Owner:ZHEJIANG WAZAM NEW MATERIAL CO LTD

LED module road lamp cap with adjustable irradiation angle and high radiation capability.

A lamp cap of an LED module street lamp with high thermal diffusivity and adjustable lighting angle belongs to the technical field of semi-conductor illumination. The lamp cap comprises a lamp cap upper cover, a lamp cap lower cover, a supporting framework, a lamp cap trim cover, a junction box, a plurality of LED light source drive, a power supply and at least one LED light source module; the LED light source module is connected and fixed with the supporting framework by an end cover, the lamp cap trim cover is fixed at the head of the supporting framework, and the upper cover and the lower cover of the lamp cap are appositioned face to face and are fixedly connected at the tail of the supporting framework. By adopting LED light source and scientific and reasonable design, the invention has the advantages of high light efficiency, stability, energy saving, and environmental protection, etc. By making use of the design of modularization combination, the LED light source module can satisfy the requirements of diverse heights and lighting angles by adding or reducing LED light source modules according to application condition, thus one lamp has various usages. The invention has wide application range, low cost and convenient assembly. The lighting angle of the LED light source module can be adjusted to realize optimal light distribution requirements of different roads.
Owner:史杰

Method and device for testing thermal physical property of solid material with independent probe by using harmonic method

ActiveCN101782541AGuaranteed NDTReal-time display of torque valueMaterial thermal conductivityMaterial heat developmentElectricityThermal diffusivity
The invention relates to a method and a device for testing the thermal physical property of a solid material with an independent probe by using a harmonic method. The device comprises the independent probe, a pressure adjusting part, a torque measuring part and a harmonic measuring unit, wherein the independent probe is positioned between two identical samples to be tested to form a sandwich structure and is arranged parallel to a sample fixing table; the pressure adjusting part is positioned and pressed on the upper end face of the first sample to be tested; the sandwich structure is arranged on the sample fixing table; the torque measuring part is sleeved on one end of the pressure adjusting part; the harmonic measuring unit is electrically connected with the independent probe; and a torsion value and contact thermal resistance between the independent probe and the two samples to be tested are fitted and calculated according to a harmonic measurement principle. In the test, the sandwich structure is arranged on a lug boss of the sample fixing table, the pressure adjusting part is adjusted until the torsion value is displayed to be the optimal torsion value, and then the thermal conductivity coefficient and the thermal diffusivity of the sample to be tested are tested by the harmonic method. Differences among thermal conductivity values of the samples to be tested under the condition of a plurality of torsion values smaller than the optimal torsion value are measured and calculated for obtaining the contact thermal resistances between the samples to be tested and the independent probe under the condition of the plurality of torsion values.
Owner:INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI

Ultrahigh heat-conduction diamond/aluminum composite material and preparation method of ultrahigh heat-conduction diamond/aluminum composite material

ActiveCN104313385ASolve the strength problemSolve the problem of forming special-shaped componentsMaterials preparationThermal diffusivity
The invention relates to a composite material and a preparation method of the composite material, in particular to an ultrahigh heat-conduction diamond/aluminum composite material and a preparation method of the ultrahigh heat-conduction diamond/aluminum composite material. In order to solve the technical problems that a diamond/aluminum composite material prepared with the existing method is low in heat conductivity and poor in interface combination strength, the ultrahigh heat-conduction diamond/aluminum composite material is composed of a reinforcement body and matrix alloy. The preparation method includes the steps that monocrystal diamond particles are contained in a cavity of a graphite die for preheating, and melted aluminum or aluminum alloy is poured to the interior of the graphite die; pressure impregnation is carried out, cooling is carried out, die releasing is carried out, and then the ultrahigh heat-conduction diamond/aluminum composite material is obtained. The diamond/aluminum composite material is good in interface combination and has the advantages of being light, high in thermal conductivity, devisable in coefficient of thermal expansion and the like. According to the ultrahigh heat-conduction diamond/aluminum composite material prepared with the method, the size fraction of the reinforcement body can range from 55% to 70%, the heat conductivity can reach 670 W/(m K), and the thermal diffusivity can reach 3.0 cm<2>/s. The ultrahigh heat-conduction diamond/aluminum composite material and the preparation method belong to the field of composite material preparation.
Owner:HARBIN INST OF TECH

Experimental device for testing heat conductivity coefficient of building material based on quasi steady state and unsteady state methods

The invention provides an experimental device for testing a heat conductivity coefficient of a building material based on quasi steady state and unsteady state methods, relates to the field of a testing technology of thermophysical parameters of a building material, and solves the problems that an existing thermophysical parameter experimental device can not simultaneously load the measurement processes by using three methods including a quasi steady state method, a normal power method and a heat pulse method, and one-time testing time is long and a measurement maximum relative error is large. An anode and a cathode of a low-potential potentiometer are correspondingly connected with a switch control interface of an oil immersed key conversion switch; thermoelectromotive force signals output by thermocouples are respectively connected into a thermoelectromotive force signal output end of the oil immersed key conversion switch; cold ends of the thermocouples are respectively inserted into an ice bottle containing an ice-water mixture; measuring ends of the thermocouples are respectively contacted with a testing piece to be tested; a heating resistor is used for heating the testing piece to be tested. The theoretical error analysis and the actual measurement prove that the measurement maximum relative errors are as follows: the heat conductivity coefficient is less than or equal to 5.1%, the thermal diffusivity is less than or equal to 9.2% and the specific heat value is less than or equal to 7.7%; the requirement on precision by engineering is met.
Owner:HARBIN INST OF TECH
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