The invention provides an
epoxy resin adhesive for RGB-LED (Red Green Blue-
Light Emitting Diode) packaging and a preparation method of the
epoxy resin adhesive. The
epoxy resin adhesive is prepared from the following raw materials in parts by
mass: 40 to 50 parts of
bisphenol A epoxy resin, 20 to 30 parts of epoxy modified phenyl organic
silicon resin, 10 to 15 parts of
sulfur-containing epoxy resin, 4 to 6 parts of modified branched aluminum
oxide, 10 to 14 parts of modified
hexagonal boron nitride, 30 to 40 parts of compound curing agent, 1 to 2 parts of compound
accelerant and 0.5 to 1 part of modified
nano zinc oxide ultraviolet absorbent. The epoxy resin
adhesive for packaging the RGB-LED, provided by the invention, has relatively high bonding stability on a PPA (Phenyl-Phenylic Acid) base material, has a slight shrinkage degree in a curing process, can effectively avoid the
structural failure problems of packaging body
cracking,
chip offset and the like, guarantees the
structural stability of the RGB-LED in long-term operation, and improves the service life of the RGB-LED. And moreover, high reliability, high
weather resistance, matte high-brightness balance and low hygroscopicity are realized.