The invention relates to the technical field of
silicon wafer cleaning, in particular to an ultrasonic cleaner capable of reducing co-frequency
resonance, which comprises a cleaning box, an elastic hoisting structure is assembled between two lifting plates, a transverse connecting rod in the elastic hoisting structure is used for supporting a lifting structure, the lifting structure is used for supporting and lifting a
wafer boat, and the elastic hoisting structure is used for supporting and lifting the
wafer boat. Rigid bearing of a wafer boat is converted into elastic bearing, a first damping head and a second damping head are arranged in an elastic hoisting structure, the first damping head and the second damping head are made of
nitrile rubber materials, and the materials can finely adjust the
formant position; through three-in-one cooperation of elastic hoisting,
buoyancy rigidity adjustment and frequency sweeping
ultrasound, rigid connection between a wafer boat and a cleaning box is changed into an elastic link with continuously changing rigidity, so that the inherent frequency of a
system dynamically drifts in the whole cleaning process, the same-frequency
resonance residence time is almost eliminated, the damage risk of a
silicon wafer is remarkably reduced, and the service life of the
silicon wafer is prolonged. And meanwhile, the cleaning uniformity and the
impurity stripping efficiency are improved through up-down
slow movement of the wafer boat.