102152results about How to "Small footprint" patented technology

A transistor device (10), the transistor device (10) comprising a substrate (11, 14), a fin (3, 3A) aligned along a horizontal direction on the substrate (11, 14), a first source/drain region (4) of a first type of conductivity in the fin (3, 3A), a second source/drain region (5) of a second type of conductivity in the fin (3, 3A), wherein the first type of conductivity differs from the second type of conductivity, a channel region (33) in the fin (3, 3A) between the first source/drain region (4) and the second source/drain region (5), a gate insulator (6) on the channel region (33), and a gate structure (7, 8) on the gate insulator (6), wherein the sequence of the first source/drain region (4), the channel region (33) and the second source/drain region (5) is aligned along the horizontal direction.

Semiconductor processing equipment that has increased efficiency, throughput, and stability, as well as reduced operating cost, footprint, and faceprint is provided. Other than during deposition, the atmosphere of both the reaction chamber and the transfer chamber are evacuated using the transfer chamber exhaust port, which is located below the surface of the semiconductor wafer. This configuration prevents particles generated during wafer transfer or during deposition from adhering to the surface of the semiconductor wafer. Additionally, by introducing a purge gas into the transfer chamber during deposition, and by using an insulation separating plate 34, the atmospheres of the transfer and reaction chambers can be effectively isolated from each other, thereby preventing deposition on the walls and components of the transfer chamber. Finally, the configuration described herein permits a wafer buffer mechanism to be used with the semiconductor processing equipment, thereby further increasing throughput and efficiency.

The invention relates to a catalysis and micro-electrolysis combined technology for high-concentration refractory organic wastewater; the organic wastewater is collected to an adjusting tank and enters an air floatation tank for air floatation treatment to remove part of the organic matters after the adjustment of water volume and water quality; the scruff is collected or recovered; the wastewatergoes through Ph adjustment and then enters a catalytic iron-carbon and micro-electrolysis unit to improve the biochemical quality; the effluent goes through Ph adjustment and then enters a sedimentation tank; the effluent of the sedimentation tank adopts anoxic-aerobic biochemistry treatment to remove the organic matters and ammonia nitrogen and then is emitted after reaching the standard; and the filler of the catalytic iron-carbon and micro-electrolysis unit comprises iron, carbon and a catalyst, wherein the mass ratio of the iron, carbon and catalyst is 1: (0.3-1.5): (0.01-0.5). The invention can effectively improve the micro-electrolysis electrochemical reaction efficiency and the degrading capability to the organic matters, and reduce the wastewater treatment cost with convenient technological operation.

A method of making a microelectronic package includes providing a sacrificial layer having a first surface and providing an optoelectronic element having a front face including one or more contacts and a rear surface and securing the rear surface of the optoelectronic element over the first surface of the sacrificial layer. The one or more contacts are then electrically interconnected with one or more conductive pads on the sacrificial layer and a curable and at least partially transparent encapsulant is provided over the first surface of the sacrificial layer so as to encapsulate the optoelectronic element and the conductive pads. The encapsulant is then cured the sacrificial layer is at least partially removed so as to leave said one or more conductive pads on a bottom surface of the encapsulant, the bottom surface of the encapsulant defining the bottom of the package. The optoelectronic element may include a light sensitive chip such as an ultraviolet-erasable programmable read-only memory (UV EPROM) or a light emitting chip, such as a light emitting diode (LED).

A switched resonant power amplifier system for ultrasonic transducers is disclosed. The system includes an amplifier that receives and processes a driver output signal for generating a drive signal that is provided to an ultrasonic device for controlling output of the ultrasonic device. An output control circuit receives and processes a signal related to a feedback signal generated by the ultrasonic device and a divider reference signal, and generates a compensated clock signal that is adjusted for at least one of phase and frequency differences between the received feedback signal and the divider reference signal. A compensated drive circuit receives and processes the compensated clock signal for generating the divider reference signal, and for generating the driver output signal.

Cassette (50) performs assays, e.g. multiplexed protein biomarker assays. Wide, bubble-free, slow flows are produced from liquids stored on cassette (50), flowing over wide array (20) of ligand receptors on a capture surface. Flows of Reynolds Number less than about 1, preferably 1×10⁻¹ to 5×10⁻³, are heated in region (34) preceding and including bubble removal system (128). Analyte is introduced through compressed septum (32). External actuations of displacement pumps (30, 37) and valves (137 A, B, and C) produce flows in response to flow-front optical sensors (150, 152). Elastic sheet provides pump and valve diaphragms and resilient expansion of mixing volume (131). Break-away cover portions are pistons. Heating is by conduction through cassette from external contact heater. Planar cassette body, when tilted from horizontal, enables upward flow from pumped storage (134, 135) to reaction (133) to waste (139), with buoyancy bubble removal before reaction. Reading of fluorescence is by external reader, employing calibration, control and reference features on capture surface. Extensive set of calibration features of differing intensities enables self-calibration.

The Unmanned Aircraft Systems ground support platform is a portable, multifunctional apparatus to accommodate UAS (Drone, UAV) landings, takeoffs, idle time, maintenance, retail merchandise product display and package delivery support within the UAS recreational and business industry. The Unmanned Aircraft Systems ground support platform will provide stability and cleanliness of a Unmanned Aerial Vehicle. Ownership identification is intergraded into the base platform.

A wireless Mobile Executive Assistant (MEA) in the form of a PDA/Phone having multiple, independently oriented screens configured to provide data, video independently or in combined fashion. Formed in the opposing first and second edges adjacent to a body having main display screen formed thereon are first and second slots, respectively, the first and second slots formed to receive first and second, slidingly engaging ancillary display screens. Each of the first and second display screens provide independent video or data information from the MEA, or video or other data transmission via the MEA, and can accordingly be used to conference simultaneously with three independent parties on three separate screens. The first and second screens each slidingly engage from a stored position fully with their respective first and second slots, wherein the screens are not discernable to the observer, and the MEA has the appearance of an ordinary cellular-type phone; alternatively, the first and second screens may emanate so that the phone has a first screen emanating from one side, and a second screen emanating generally from the opposite side of the unit, with the main screen situated therebetween. In addition to independent transmissions, all three screens can be deployed to form a single wide screen transmission.

A non-contact wound treatment device suitable for releasable attachment to a patient's skin surface over a selected wound area in a non-contact position relative to the selected wound area, the wound treatment device comprising an attachment portion suitable for releasable attachment with the patient's skin surface, having an inner perimeter for defining the selected wound area, a wound treatment portion with a wound cover and a support member supporting the wound cover, and a transition portion with a joint connecting the wound treatment portion to the attachment portion.

A transient-voltage suppressing (TVS) device disposed on a semiconductor substrate including a low-side steering diode, a high-side steering diode integrated with a main Zener diode for suppressing a transient voltage. The low-side steering diode and the high-side steering diode integrated with the Zener diode are disposed in the semiconductor substrate and each constituting a vertical PN junction as vertical diodes in the semiconductor substrate whereby reducing a lateral area occupied by the TVS device. In an exemplary embodiment, the high-side steering diode and the Zener diode are vertically overlapped with each other for further reducing lateral areas occupied by the TVS device.

A surgical instrument for creating and preparing a cavity in a bony intervertebral body is provided with asymmetrical cutting structures. These asymmetrical cutting structures selectively open a cavity which has a relatively large surface area in the vertical direction. In one embodiment, the cutting structure includes a shearing element that sweeps out a cutting arc that is larger than the instrument delivery area.