13903results about "Charge manipulation" patented technology

When a two-division structure heat treatment jig for semiconductor substrate that includes a silicon first jig that comes into direct contact with a semiconductor substrate that is heat treated and supports the semiconductor substrate, and a second jig (holder) that holds the first jig and is mounted on a heat treatment boat is adopted as a heat treatment boat of a vertical heat treatment furnace, the stress concentrated during the heat treatment on a particular portion of the semiconductor substrate can be reduced; in the case of a semiconductor substrate large in the tare stress and having an outer shape of 300 mm being heat treated, or even in the case of the heat treatment being carried out under very high temperature conditions, the slips can be suppressed from occurring. The present invention can be widely applied as a stable heat treatment method of semiconductor substrates.

The present invention comprises a distal rest pad for supporting a portion of a wafer seated on an end effector. In one embodiment, the rest pad includes a bottom support pad and an edge stop. Each element is mounted separately to the distal end of a support plate. The bottom support pad includes an inclined surface that transitions to a substantially horizontal surface at its distal end. The edge stop has a substantially vertical wafer contact surface that the peripheral edge of a wafer eventually contacts as the wafer is urged towards the distal rest pad. In another embodiment, the bottom support pad comprises an inclined surface. In yet another embodiment, the distal rest pad comprises a single structure. This distal rest pad includes a backstop portion and a bottom support separated by a particle collection groove. The bottom support may include an inclined lead-in surface that transitions into a flat contact surface or only comprise an inclined lead-in surface.

A work holding mechanism for horizontally holding a flat work is incorporated in work transport equipment. The holding mechanism includes a base member for supporting the work and a plurality of guide members provided at the base member. Each guide member includes a shaft, a contact portion and a limit portion. The shaft is pivotally supported by the base member. The contact portion comes into contact with part of the lower surface of the perimeter of the work and is pushed down, with the shaft as a fulcrum, when the work is placed on the base member. The limit portion is raised, with the shaft as a fulcrum, to face part of the side surface of the perimeter of the work when the contact portion is lowered.

A substrate transfer apparatus for loading and unloading substrates in a reaction chamber, includes: an arm having a distal end which is laterally movable in a straight line direction; and end-effectors for loading and unloading substrates in a reaction chamber, which include a lower end-effector and an upper end-effector. One of the lower end-effector or the upper end-effector is movably coupled to the arm at a distal end of the arm, and the other end-effector is fixed to the movably coupled end-effector. The fixed end-effector is fixed to the movably coupled end-effector.

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.

A semiconductor substrate processing apparatus (1), comprising a substrate support assembly (30), including a substrate support (32) defining an outer support surface (34) for supporting a substrate or substrate carrier (24) thereon, and a heater (50) comprising a heat dissipating portion (54) that is disposed within the substrate support (32) and that extends underneath and substantially parallel to the support surface (34), said substrate support (32) being rotatably mounted around a rotation axis (L) that extends through said support surface (34), such that the support surface (34) is rotatable relative to the heat dissipating portion (54) of the heater (50).

There is provided compact load storage equipment that can store a large number of loads. The storage equipment comprises a rotary rack 21, a transferrer 51, one or more fixed racks 101, an inlet port 111a and an outlet port 111b. The rotary rack 21 is supported rotatably about a first vertical axis and includes a number of vertically arranged stages of turning load supports 32. The transferrer 51 adjoins the rotary rack 21 and includes a carrier 81, which can vertically move and rotate about a second vertical axis. The fixed racks 101 are positioned around the transferrer 51 and each includes a number of vertically arranged stages of fixed load supports 103. In plan view, the ports 111a and 111b each overlap with one of the rotary and fixed racks 21 and 101. The transferrer 51 can transfer loads between the carrier 81 and any one of the turning and fixed load supports 32 and 103, and between the carrier 81 and each of the ports 111a and 111b, by the turning and vertical movement of the carrier 81, or by the combination of the turning and vertical movement of the carrier 81 and the turning of the turning load supports 32.

A thermal processing furnace, comprising:a generally bell jar-shaped outer reaction tube having a central axis; andan open-ended inner reaction tube for accommodating a wafer boat holding a plurality of substrates, which inner reaction tube is substantially coaxially disposed within the outer reaction tube, thereby defining a gas passage between an outer wall of the inner reaction tube and an inner wall of the outer reaction tube,wherein at least one of the outer wall of the inner reaction tube and the inner wall of the outer reaction tube is provided with a flow deflector that protrudes radially from the respective wall into the gas passage.

Load storage equipment according to the present invention includes rotary racks 21, each of which is supported independently on a story 1 or 2, and which may not extend vertically through the slab 4 between the stories 1 and 2. The storage equipment also includes a transferrer 51 common to the rotary racks 21. Each of the rotary racks 21 can turn on a vertical axis 22 and includes load supports 32 arranged circumferentially around the vertical axis 22 and vertically. The transferrer 51 extends vertically near the sides of the rotary racks 21 and through the slab 4. The transferrer 51 includes a carrier 81, which can vertically move to carry loads to and from the load supports 32.

A system for processing semiconductor substrates includes a front-end with at least two vertical levels of input / output ports for transferring substrate cassettes into or out of the housing of the processing system. The front-end also includes at least one level of storage positions, e.g., two levels of storage positions, which can be disposed between the two vertical levels of the input / output ports. The two vertical levels of storage positions can each be provided with two storage positions and each of two levels of input / output ports can be provided with accommodations for two cassettes, allowing for a total of eight cassettes to be accommodated at the front-end of the processing system. Inside the housing of the processing system, interior storage positions can be provided adjacent a wafer handling chamber and spaced apart from a cassette store having rotary platforms for housing cassettes. A single cassette handler can be used to access cassettes at each of the input / output ports and the interior storage positions.

An article transport device comprises an endless revolving body that is configured to move along a cyclic path in a substantially horizontal direction; a plurality of article supports each of which supports an article, wherein the article supports move together with the endless revolving body with the supports spaced apart from each other in a traveling direction; a support mechanism for supporting the article supports to the endless revolving body such that the article supports can move between a transport position adjacent the endless revolving body and an away position spaced apart from the transport position; and a guide mechanism for causing at least some of the article supports to move from the transport position to the away position and to move from the away position to the transport position, at an article delivering location or an article receiving location along the cyclic path of the endless revolving body.

A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each first reactor. A first group of wafers are subjected to the first process within the first reactor, and are then transferred into a second reactor as isolated from the outside air. The first group of wafers is subjected to the second process within the second reactor. At the same time, a second group of wafers are subjected to the first process within the first reactor. After the first process is completed, the second group of wafers is transferred into an unoccupied one of the second reactors as isolated from the outside air. There, the second group of wafers is subjected to the second process. Accordingly, process failures otherwise due to the exposure of the wafers are minimized, and productivity is high despite the difference in the processing times.