The utility model relates to a
semiconductor wafer box transfer device which has high precision, high stability and high
automation level and is suitable for
wafer box transfer in the
semiconductor production process. The device comprises a
connection table arranged in a bottom area, the
connection table is provided with a power
assembly and a groove transmission structure which are used for lifting and transmitting a
wafer box, and the periphery of the
connection table is provided with an anti-vibration device made of a flexible material. And the crown block is positioned at the upper part of the device and moves along the guide
system track so as to ensure smooth transfer of the wafer box among different areas. A
manipulator is arranged on one side of the connection table, the
tail end of the
manipulator is provided with a grabbing device of an
open type U-shaped structure, and a positioning column is arranged to be matched with a positioning hole in the bottom of the wafer box, so that the positioning accuracy of the wafer box is guaranteed. An automatic induction device is installed above the grabbing device and cooperates with an
inductor to monitor the position of the wafer box in real time. The power
assembly adopts a belt
transmission system to ensure stable transmission of the wafer box.