22534 results about "Electrical connection" patented technology

An electrosurgical system includes a generator for generating radio frequency (RF) power, and an electrosurgical instrument including at least three electrodes. The generator comprises an RF output stage having at least a pair of RF output lines, a power supply coupled to the output stage for supplying power to the output stage, and a controller capable of varying the RF power signal supplied to the output lines. The system also includes a selection circuit having at least three output connections each in electrical connection with a respective one of the at least three electrodes. This selection circuit operates to vary the coupling between the RF output stage and the three or more output connections. A switching device operable by the user causes the selection circuit to vary the electrode or electrodes to which RF power is supplied, and also causes the RF power signal supplied to at least one of the at least three output connections to vary depending on the electrode or electrodes to which RF power is supplied. In one arrangement of the selection circuit, one of the electrodes has no direct connection to the output stage of the generator and is connected via a capacitor to another of the electrodes.

An electrically heated smoking system includes a shell and a replaceable mouthpiece. The shell includes an electric power supply and electric circuitry. The mouthpiece includes a liquid storage portion and a capillary wick having a first end and a second end. The first end of the wick extends into the liquid storage portion for contact with liquid therein. The mouthpiece also includes a heating element for heating the second end of the capillary wick, an air outlet, and an aerosol forming chamber between the second end of the capillary wick and the air outlet. When the shell and mouthpiece are engaged or connected, the heating element is in electrical connection with the power supply via the circuitry, and a flowpath for air is defined from at least one air inlet to the air outlet via the aerosol forming chamber. In use, liquid is transferred from the liquid storage portion towards the heating element by capillary action in the wick. Liquid at the second end of the capillary wick is vaporized by the heating element. The supersaturated vapor created, is mixed and carried in the air flow from the at least one air inlet to the aerosol forming chamber. In the aerosol forming chamber, the vapor condenses to form an aerosol, which is carried towards the air outlet.

A medical diagnostic instrument includes a housing containing at least one battery and a light source, such as a lamp, for illuminating a medical target. A switch includes a movable member that selectively moves at least one of the battery and the lamp into and out of electrical connection with the other. The instrument is preferably fabricated from a diecast or an extrusion process wherein a thin plastic sleeve member having text and/or graphic materials can be shrink fitted onto an extruded handle.

A portable intra-oral capture and display system, designed for use by a dental practitioner in connection with a patient seated in a dental chair, includes: a handpiece elongated for insertion into an oral cavity of the patient, where the handpiece includes a light emitter on a distal end thereof for illuminating an object in the cavity and an image sensor for capturing an image of the object and generating an image signal therefrom; a monitor interconnected with the handpiece, where the monitor contains electronics for processing the image for display and a display element for displaying the image, where the interconnection between the monitor and the handpiece includes an electrical connection for communicating the image signal from the image sensor in the camera to the electronics in the monitor; and a receptacle on the dental chair for receiving the monitor, wherein the receptacle conforms to the monitor such that the monitor may be withdrawn from the receptacle in order to allow the display element to be seen by the dental practitioner or the patient.

A noninvasive optical probe has an electrical connector for connecting the optical probe to a cable connector. According to one embodiment, the electrical connector includes a durable flexible tab suspended between the housing of the optical probe and a protective cover. The electrical connector also advantageously forms, according to various embodiments, a flexible, plugable, lockable, removable, and sealable electrical connection.

An improved electrosurgical instrument is disclosed and claims which includes a reusable electrode shaft, a disposable tip and a novel, insulated coupling for removably connecting the disposable tip to the electrode shaft. The present invention provides several advantages and features. The coupling provides ease in connecting the disposable tip to the reusable electrode shaft in an operating room environment. Once the tip is connected to the shaft, the coupling ensures a rigid and secure connection between the tip and the shaft, such that the coupled tip/shaft assembly feels to the surgeon like a single, unitary instrument. In addition, the coupling ensures a good electrical connection between the tip and the shaft, prevents the tip from inadvertently or accidentally becoming separated from the reusable electrode shaft, and maintains the position of the tip relative to the shaft by preventing the tip from rotating relative to the holder. The coupling also includes an insulating sheath that eliminates any conduction paths between the patient and the electrosurgical instrument other than the surgical tip.

A chip stack package is manufactured at a wafer level by forming connection vias in the scribe lanes adjacent the chips and connecting the device chip pads to the connection vias using rerouting lines. A lower chip is then attached and connected to a substrate, which may be a test wafer, and an upper chip is attached and connected to the lower chip, the electrical connections being achieved through their respective connection vias. In addition to the connection vias, the chip stack package may include connection bumps formed between vertically adjacent chips and/or the lower chip and the substrate. The preferred substrate is a test wafer that allows the attached chips to be tested, and replaced if faulty, thereby ensuring that each layer of stacked chips includes only “known-good die” before the next layer of chips is attached thereby increasing the production rate and improving the yield.

A protective membrane is disclosed for an electronic device that has a touch screen. The touch screen is protected with a membrane adapted to the specific contour and profile of the electronic device and allows the user to use the touch screen interface with no shortcomings. The protective case is further adapted to allow infrared and other communication signals while the device is secured inside the case. Further, electrical connections can be made through the case without affecting the protection afforded the electronic device inside.

A stacked package structure and a method for manufacturing the same are disclosed. The package structure comprises: a substrate having a first surface and a second surface in opposition to each other; at least one chip deposed on and electrically connected to the first surface of the substrate; a plurality of electrical connection devices deposed on the first surface and periphery of the substrate, wherein each electrical connection device is higher than the at least one chip in altitude; and an encapsulant covering the first surface of the substrate, the at least one chip and the electrical connection devices, wherein a top end of each electrical connection device is exposed at a surface of the encapsulant.

The present invention provides a stretch-resistant light-emitting or heat-emitting structure. The wirelessly-chargeable stretch-resistant light-emitting structure includes a woven member, conductive twisted cables, a light-emitting element, and a receiver circuit. The woven member is mounted to the article. Each conductive twisted cable includes a stretch-resistant wire and a conductive wire twisted together. The conductive twisted cables are woven in the woven member. The light-emitting element, which is arranged inside the woven member, includes a light emission section and two conductive pins. The conductive pins are respectively and electrically connected to the conductive wires of the conductive twisted cables. The wirelessly-chargeable stretch-resistant heat-emitting structure includes a carrying member, an electrical heating element mounted to the carrying member, conductive twisted cables that are in electrical connection with the electrical heating element, and a receiver circuit that is in electrical connection with the conductive twisted cables. The carrying member is woven in the article.

An apparatus and packaging method for stacking a plurality of integrated circuit substrates, i.e., substrates having integrated circuits formed as integral portions of the substrates, which provides interconnection paths through the substrates to simplify electrical connections between the integrated circuits while facilitating minimization of the volume and customization of the three dimensional package size to conform to the available internal space within a housing, e.g., one used in an implantabie device where package volume is at a premium. Furthermore, an internal cavity can be created by the stacked formation that is suitable for mounting of a surface mount device, e.g., a crystal or the like.

The circuitry of a programmable logic device (for example, an FPGA) includes a configurable logic portion and a configuration memory. The configuration memory stores configuration data that configures the configurable logic portion to realize a user-defined circuit. The configurable logic portion is disposed on a first die whereas the configuration memory is disposed on a second die. The second die is bonded to the first die in stacked relation. Each bit of configuration data passes from the second die to the first die through a pair of micropads. One micropad of the pair is disposed on the first die and the other micropad of the pair is disposed on the second die. When the first die and second die are brought together in face-to-face relation, the two micropads form an electrical connection through which the configuration data bit passes from the second die to the first die.

A capacitive position sensor for determining the position of an object along first and second directions is described. The sensor comprises a substrate having an arrangement of electrodes mounted on a single surface thereof. The electrodes are arranged so as to define an array of sensing cells arranged in columns and rows to form a sensing area. Each of the sensing cell including a column sensing electrode and a row sensing electrode with the column sensing electrodes of sensing cells in the same column being electrically coupled together and the row sensing electrodes of sensing cells in the same row also being electrically coupled together. Row sensing electrodes of sensing cells at opposing ends of at least one of the rows are connected together by an electrical connection made outside of the sensing area so that there is no requirement for electrical connections to cross within the sensing area, thus providing a capacitive position sensor having a sensing area with electrodes on only one side of a substrate.

A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.

A method for pay-per-use, self-service charging of electric storage power systems of electric automobiles, said automobiles charged via electrical connections to a provided curbside charging station, said charging station automatically modifying grid electricity to be suitable for charging an array of said automobiles, said charging station also automatically securing electricity at off-peak rates when available and storing same for subsequent use.

A cam-actuated connection device joins rail mounting members of a photovoltaic panel array. The connection device slides within channels of mounting members until the members are in a properly positioned grid. When in position, the connection device is rotated to lock the mounting members in a rigid grid network. The connecting device can be subsequently loosened, repositioned and locked into position. The rail-mounting members create a grid for installation of multiple PV panels. The mounting rail allows the unit to remain relatively compact in nature but still covers a wide range of PV panel thicknesses. The rail system has a hinged connection with the mounting rail that allows an installer to assemble the module in a near perpendicular fashion to the mounting rail, make the required electrical connections and then lower the PV module into its working position. The unit is then locked into its working position.

A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal interconnect layers in those processes, by virtue of its materials of composition, processing steps, and temperature of fabrication is presented. The MEMS resonator or filter incorporates a lower metal level, which forms the electrodes of the MEMS resonator or filter, that may be shared with any or none of the existing metal interconnect levels on the IC. It further incorporates a resonating member that is comprised of at least one metal layer for electrical connection and electrostatic actuation, and at least one dielectric layer for structural purposes. The gap between the electrodes and the resonating member is created by the deposition and subsequent removal of a sacrificial layer comprised of a carbon-based material. The method of removal of the sacrificial material is by an oxygen plasma or an anneal in an oxygen containing ambient. A method of vacuum encapsulation of the MEMS resonator or filter is provided through means of a cavity containing the MEMS device, filled with additional sacrificial material, and sealed. Access vias are created through the membrane sealing the cavity; the sacrificial material is removed as stated previously, and the vias are re-sealed in a vacuum coating process.

The present invention relates to an electronic cigarette case, includes a case body, a charging device disposed in the case body for charging electronic cigarettes. The charging device includes a charging base, a rechargeable battery, and a control circuit board integrated with a circuit processing unit. The charging base has an electrode support where first and second electrode elements, and a trigger element spaced apart from the second electrode element are all disposed on the electrode support. The second electrode element is flexibly deformable when one of the electronic cigarettes is inserted into the case body to create a charging circuit. The circuit processing unit automatically controls the rechargeable battery for charging the electronic cigarette being inserted until it is full of power, whereby the electronic cigarette case is readily to be assembled and to sue, and has a reliable electrical connection with an outer power source.

A method for providing a through wafer connection to an integrated circuit silicon package. A hole is first created in the silicon package with an inner surface area extending from the bottom surface of the silicon package to the top surface of the silicon package. The hole is created by one of two methods. The first involves mechanical drilling with a diamond bit rotated at a high rate of speed. The second involves ultrasonically milling utilizing a slurry and steel fingers. The inner surface area of the hole is covered with an insulating material to insulate the conductive material which is later deposited and to serve as a diffusion barrier, then a seed material is placed in the hole. Finally, the hole is filled with a conductive material which is utilized to provide large power inputs or signaling connections to the integrated circuit chips.

Neurostimulation assemblies, systems, and methods make possible the providing of short-term therapy or diagnostic testing by providing electrical connections between muscles or nerves inside the body and stimulus generators or recording instruments mounted on the surface of -the skin or carried outside the body. Neurostimulation assemblies, systems, and methods may include a carrier and a removable electronics pod, the electronics pod including stimulation generation circuitry, a power input bay to hold a disposable power source, and user interface components. The assemblies, systems, and methods are adapted to provide coordinated neurostimulation to multiple regions of the body.

A luminous structure includes at least one light-emitting diode emitting radiation within the ultraviolet or the visible spectrum, a substantially planar glass element having main faces and an edge around a periphery of the main faces. The glass element includes a hole housing the diode, and a metallic element connected to the diode and coupled with said glass element for removing heat. The metallic element is chosen from an electrical connection element or a holding element for keeping the diode in said hole. The invention also relates to the manufacture of this luminous structure and to its applications.

A handheld device with a compact integrated touch panel is disclosed. A handheld device incorporating a touch panel display requiring electrical connections is reduced in size by incorporating electrical pathways within the support structure of the touch panel display, obviating the need for a flex circuit extension from the touch panel display for connection to the handheld device. A further reduction in size is obtained by providing an inherent visually homogeneous perimeter for the touch panel display by matching the colors of the conductive and dielectric materials, thereby eliminating the need for a bezel.

A semiconductor device includes a plurality of repeatable circuit cells connectable to one or more conductors providing at least electrical connection to the circuit cells and/or electrical connection between one or more circuit elements in the cells. Each of the circuit cells are configured having gates and active regions forming a grating, wherein, for a given active layer in the device, a width of each active region is substantially the same relative to one another, a spacing between any two adjacent active regions is substantially the same, a width of each gate is substantially the same relative to one another, and a spacing between any two adjacent gates is substantially the same.

An LED lamp may be made with a heat sink optic. The lamp has a base having a first electrical contact and a second electrical contact for receiving current. At least one LED is mounted on a thermally conductive support; that supports electrical connections for the LED and provides thermal conduction of heat from the LED to the optic. The LED support mounted in the base and electrically coupled through the first electrical contact to electrical current. The light transmissive, and heat diffusing optic has an external an internal wall defining a cavity with the LED positioned in the cavity. The optic is in thermal contact with the LED support and mechanically coupled to the base. The snap together structure enables rapid manufacture while allowing numerous variations.

An improvement is described to disposable devices for performing chemical or biological tests on a sample of fluid, and the method by which such devices perform tests. The power for the device comes from an electrochemical battery, where a portion of the fluid sample itself provides the electrolyte for the battery. Furthermore, the time of diffusion of the fluid into the battery provides the timing signal for activation of the system. Communication between the improved device and an information system is provided by a transponder system built into the device which requires no direct electrical connection. Rather, the device is placed in proximity with a reader which can interrogate the device, obtain the results of the test and if necessary provide power for the device to perform the test, and/or communicate the information. The improvements and methods are particularly applicable to devices for performing in vitro diagnostic tests on a sample of body fluid.

A resuscitation system for use by a rescuer for resuscitating a patient, comprising at least two high-voltage defibrillation electrodes, a first electrical unit comprising circuitry for providing resuscitation prompts to the rescuer, a second electrical unit separate from the first unit and comprising circuitry for providing defibrillation pulses to the electrodes, and circuitry for providing at least one electrical connection between the first and second units. In another aspect, at least two electrical therapy electrodes adapted to be worn by the patient for extended periods of time, circuitry for monitoring the ECG of the patient, an activity sensor adapted to be worn by the patient and capable of providing an output from which the patient's current activity can be estimated, and at least one processor configured for estimating the patient's current activity by analyzing the output of the activity sensor, analyzing the ECG of the patient, and determining whether electrical therapy should be delivered to the electrodes.

A reduced size and complexity multi-mode electric vehicle charging station is provided which allows a user to select AC and DC powerform output and may provide those outputs to connectors for charging electric vehicles. A voltage source is provided to a DC converter that then outputs to a DC bus or electrical connection. The DC bus may be accessed by DC charging equipment or a DC-AC inverter that is connected to AC charging equipment, thereby providing DC and AC charging ability. In one aspect, the multi-mode electric vehicle charging station is used in a rescue vehicle for charging stranded EVs via multiple charging standards without requiring the rescue vehicle to carry independent charging systems for each charging standard. In another aspect, the charging station is used in a stationary charging station to reduce cost and complexity of using multiple independent charging systems.

A multidie semiconductor device (MDSCD) package includes a generally planar interposer comprising a substrate with a central receptacle, upper surface conductors, and outer connectors on the lower surface of the interposer. Conductive vias connect upper surface conductors with outer connectors. One or more semiconductor devices may be mounted in the receptacle and one or more other semiconductor devices mounted above and/or below the interposer and attached thereto. The package may be configured to have a footprint not significantly larger than the footprint of the largest device and/or a thickness not significantly greater than the combined thickness of included devices. Methods for assembling and encapsulating packages from multidie wafers and multi-interposer sheets or strips are disclosed. Methods for combining a plurality of packages into a single stacked package are disclosed. The methods may include use of somewhat laterally extending intermediate conductive elements, flip-chip style electrical connection, or both within the same package.

A wearable therapeutic device is provided. The wearable therapeutic device includes a garment, and the garment includes an electrode and a conductive thread. A control unit is coupled to the conductive thread and identifies an electrical connection between a conductive surface of the electrode and the conductive thread, and an alarm module can provide information about the positioning of the electrode in the garment based on the electrical connection.