706 results about "Contact pad" patented technology

This disclosure generally relates to medical devices that include a sensor transmitter assembly that includes a sensor assembly including a sensor module where a first sensor including a first sensor head having at least one first sensor contact pad is combined with a second sensor including a second sensor head having at least one second sensor contact pad. The sensor transmitter assembly also includes a transmitter assembly positioned on a top of the sensor assembly to form a single unit, the transmitter assembly having at least one transmitter contact disposed on a base of the transmitter assembly, where the first sensor contact pad(s) and the second sensor form a connection path with the transmitter contact(s).

A probe card mounted in an of electronic device testing apparatus is described, having a probe head housing a plurality of contact probes, each having a first end portion which abuts onto contact pads of a device under test, a main board and a connected intermediate board which provides a distance spatial transformation between contact pads made on opposite faces thereof. The intermediate board is a space transformer which includes a plurality of modules that are plate-shaped and coplanar, and structurally and functionally independent from each other. Each module has a first face facing towards the probe head and a first plurality of contact pads whereonto respective second end portions of the contact probes abut and an opposite second face facing towards the main board. The second face has a second plurality of contact pads connected to the first plurality of contact pads.

Methods for fabricating branched substrates having conductive contact pads and hybrid dielectric bonding surfaces for directly bonding dies and electrically connecting them to the contact pads. A branched substrate can include a main portion and one or more branch portions hybrid bonded to the main portion. Some sections of the branched substrate can be flexible to allow deformable electrical connection between components that are hybrid bonded to different regions of the branched substrate. A flexible branch portion may provide electrical connection between vertically separated layers of two components. The method includes directly bonding a branch portion of the branched substrate to the main portion of the branched substrate via a hybrid bonding interface comprising a conductive interface between contact pads of the main and branch portions and a hybrid bonded dielectric interface between dielectric surfaces of the of the main and branch portions.

Methods for fabrication dielectric layers having conductive contact pads, and directly bonding the dielectric and conductive bonding surfaces of the dielectric layers. In some aspects, the method includes disposing a polish stop layer on dielectric bonding surfaces on top of a dielectric layer. A conductive layer is disposed on top of the polish stop layer and then polished to form conductive contact pads having polished conducting bonding surfaces. During the polishing process, the polish stop layer reduces rounding of dielectric edges and erosion of the dielectric bonding surfaces between closely spaced conductive bonding surfaces. The resulting polished dielectric and conductive bonding surfaces are directly bonded to dielectric and conductive bonding surfaces of another dielectric layer to form conductive interconnects.

The invention relates to a clamping device and method for deburring of solar new energy vehicle plate stamping parts, and belongs to the technical field of deburring machining and clamping of solar new energy vehicle plate stamping parts. The global contour scanning mechanism is fixedly mounted on the base and is used for acquiring global contour data of the stamping part; the reference positioning mechanism is fixedly mounted on the mounting plane and is used for initially positioning the stamping part; the multiple cooperative supporting and clamping units are distributed on the mounting plane in an array mode, each cooperative supporting and clamping unit comprises an electric linear actuator and a sensing head fixed to the top end of the electric linear actuator, and a pressure sensor and a micro accelerometer are integrated in each sensing head; the flexible contact pad at the top of the sensing head is made of elastic materials such as nylon or polyurethane, so that the surface of a workpiece can be prevented from being scratched or indented, and supporting force is uniformly transmitted.

An information handling system peripheral display presents visual images with a display panel. A timing controller board has an edge connector that interfaces with a scalar board edge connector when the scalar board couples with slots at posts of the back side. The scalar board couples display cable ports to accept display information from an information handling system and extends the display cable ports out of openings of the midplane. The scalar board communicates visual information to the adjacent timing controller board through the edge connector without the use of a cable. A power board couples with posts and slots adjacent the scalar board to engage a power connector with power pins into a socket of the power board. Power communicates from the power board through the scalar board to the timing controller board and then to a backlight through a pogo pin and contact pad interface.

A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and / or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.

A set of audio headphones operatively coupled to an information handling system includes a digital signal processor (DSP), a headphone power management unit (PMU) to provide power to the DSP, a first ear cup with a first speaker and a second ear cup with a second speaker operatively coupled to each other via a headband, and a mouth privacy cover operatively coupled to the first ear cup at a first end of the mouth privacy cover and operatively coupled to the second ear cup at a second end of the mouth privacy cover, the mouth privacy cover having a microphone built into the mouth privacy cover and operatively coupled to the DSP via a cover receiver with electrical contacts formed on the mouth privacy cover and interfacing with ear cup contact pads formed on at least one of the first ear cup and second ear cup.

A method for fabricating an optoelectronic arrangement is described, comprising the following steps: - Providing a carrier (1) with a top surface (1a) and a bottom surface (1b), - Forming a plurality of contact pads (2) on the carrier (1) on the upper surface (1a), wherein each contact pad (2) is free of ferromagnetic materials, - Forming a shield (3) on the carrier (1), wherein the shield (3) at least partially surrounds each contact pad (2) in the lateral direction (L) and comprises a first ferromagnetic material, - Providing a plurality of optoelectronic components (4), each component comprising a second ferromagnetic material on a side facing the upper surface (1a) of the support (1), - Providing a magnet (5) on the lower surface (1b) of the support (1), wherein the magnet exerts a magnetic force (F), - Bringing the majority of optoelectronic components (4) closer to the upper surface (1a) and - Attaching the majority of optoelectronic components (4) to the carrier (1) on the upper surface (1a). The optoelectronic components (4) may, for example, be micro-LEDs.

A bonded structure is disclosed. The bonded structure can comprise a first semiconductor element having a first contact pad. An interposer can include a second contact pad on a first side of the interposer and a third contact pad and a fourth contact pad on a second side of the interposer opposite the first side, the second contact pad bonded to the first contact pad; a second semiconductor element having a fifth contact pad bonded to the third contact pad and a sixth contact pad bonded to the fourth contact pad. A switching circuitry can be configured to switch between a first electrical connection between the second and third contact pads and a second electrical connection between the second and fourth contact pads.

An implantable probe apparatus includes: a flexible substrate, which includes a first part and a plurality of second parts separated from each other; a probe pad array, which includes a plurality of contact pads that are formed in the first part; a plurality of electrodes, which are formed in respective tail end sections of the plurality of second parts away from the first part; and a plurality of leads, which are formed in the plurality of second parts to electrically connect the plurality of electrodes to the corresponding contact pads respectively; where each second part in the plurality of second parts includes N stages of segments, the Nth stage of segments include the respective tail end sections of the plurality of second parts, a plurality of branches are branched from each segment in the nth stage of segments to serve as the (n+1)th stage of segments.

An LED includes first / second doped layers with active region(s) therebetween emitting a first wavelength. A wavelength converter on a first LED surface absorbs the first wavelength and emits a second, longer wavelength. A second LED surface is against a substrate surface. A first electrical contact on the first LED surface extends along LED sidewalls, separated from the active region(s) and second doped layer by an insulating layer, connecting the first doped layer to a first contact pad. In some instances, contact pads are on the substrate surface; a second electrical contact extends onto LED sidewalls, connecting the second doped layer to a second contact pad. In some other instances contact pads are on laterally-extending portions of the second doped layer. The insulating layer separates the first contact pad from the second doped layer; a second contact pad is in direct electrical contact with the second doped layer.

The present invention relates to a TSV electrical interconnect structure having a high aspect ratio and method of manufacturing it. In the method, a backside via and a backside contact pad connected to the backside via are formed on a backside of the semiconductor base. A front-side via connected to the backside via is then formed in the front side of the semiconductor base, obtaining a TSV which electrically connects the front side and backside of the semiconductor base that has a thickness greater than or equal to 150 μm. The TSV has an aspect ratio higher than 20, which can meet the requirements of package-level matching. The TSV electrical interconnect structure having a high aspect ratio can be connected to a package substrate or a PCB board through the backside contact pad. A rewiring layer on the front side of the semiconductor base is connected to the front-side via, and the TSV electrical interconnect structure having a high aspect ratio can provide an interconnection through the rewiring layer. Moreover, one or more other semiconductor bases may be stacked on the front side.

A semiconductor device has a double-sided bridge die. The bridge die has a first contact pad on a first surface of the bridge die and a second contact pad on a second surface of the bridge die opposite the first surface. The bridge die is disposed over a carrier. A first conductive layer is formed on the carrier. A first insulating layer is formed over the first conductive layer and bridge die. An opening is formed through the first insulating layer to expose the first conductive layer. A second conductive layer is formed over the first insulating layer. The second conductive layer electrically couples the first conductive layer to the first contact pad of the bridge die. The carrier is removed. A first semiconductor die is electrically coupled to the first conductive layer and the second contact pad of the bridge die.

An information handling system peripheral display has plural display assemblies coupled to stand supports of a display stand to present visual images a display panel included in each display assembly. Sensors, such as an eye tracker sensor or a mouse cursor presentation location, are applied to analyze end user interaction at each display panel and selectively dim and / or turn off brightness at each display panel. A contact pad at the rear of each display assembly interfaces with a contact pins of each display support to determine the location of the display assembly at the display stand and the rotational orientation of the display assembly.

A first and a second locking element are movable to an extended position and a retracted position. A first actuator assembly is supported by a first end of a printed circuit board (PCB) and has a first actuator body connected to the first locking element. A second actuator assembly is supported by a second end of the PCB and has a second actuator connected to the second locking element. Each actuator body is in electrical contact with an electrical contact pad on a first side of the PCB and with an electrical contact pad on a second side of the PCB. The first and second FGL actuators extend between the first and second actuator bodies. Each actuator moves the corresponding first or second locking element to the retracted position in response to an electrical input signal.

Examples include a functionalized compressible nonwoven material (CNM) cushion with a three-dimensional (3D) pressure-varying electrical conductance (PVEC) region. Integrated with the PVEC surface area is a conductive ink printed on thermoplastic film (CPT) single-sided conductance measurement coupling. The CPT single-sided conductance measurement coupling includes, on the thermoplastic film, N pairs of contact pads and N pairs of pad connection traces. The N pairs of contact pads are maintained, by thermoplastic adhesion, in direct electrical contact with the PVEC surface areas. The N pairs of connection traces extend from the N pairs of contact pads to trace terminals. A conductance measuring circuit selectively applies, via the N pairs of connection traces, voltage and a path to ground to the pairs of contact pads, and measures the resulting current.

A semiconductor device has a bridge die comprising a contact pad. An electrical component is mounted to the bridge die to form a bridge module. The bridge module is disposed over a carrier. A first conductive layer is formed on the carrier. A first insulating layer is formed over the first conductive layer and bridge module. An opening is formed through the first insulating layer to expose the first conductive layer. A second conductive layer is formed over the first insulating layer. The carrier is removed. A first semiconductor die is electrically coupled to the electrical component and bridge die.

A bridge structure extending between a PCB contact pad and a component contact pad is provided. The bridge structure has a first polymer layer extending from a top surface of the PCB contact pad along with a second polymer layer extending from the first UV curable layer opposite the PCB contact pad. The bridge structure has a third polymer layer extending from the second layer opposite the first UV curable polymer layer to the component contact pad. A conductive interconnect is formed on the polymer layers and contacts the PCB contact pad and the component contact pad. Each of the polymer layers are ultraviolet (UV) curable and are illuminated with a UV light source that is spot focused. The polymer layers are formed to have a stepwise configuration where each polymer layer is cured prior to formation of the next polymer layer.

The present invention discloses an acupressure device. The device comprises a pair of arms, each with a first end portion, a second end portion, and an arm portion comprising concave and convex portions. A fulcrum pivotally connects the arms at their convex portions, enabling outward and inward movement. A spring, positioned between the second end portions, maintains the arms in a closed position when relaxed and allows outward movement to an open position when activated. A pressure band encircles the arms to apply inward pressure. The band's position adjusts to increase pressure when fixed over the concave portion, decrease pressure when fixed over the convex portion, or maintain neutral pressure at intermediate positions. The first end portion incorporates a contact pad assembly, and the second end forms a handle for activating the spring. The pressure band is adjustable after placement to regulate consistent therapeutic pressure on a target acupressure point.

An information handling system peripheral display has plural display assemblies coupled to stand supports of a display stand to present visual images a display panel included in each display assembly. Sensors, such as an eye tracker sensor or a mouse cursor presentation location, are applied to analyze end user interaction at each display panel and selectively dim and / or turn off brightness at each display panel. A contact pad at the rear of each display assembly interfaces with a contact pins of each display support to determine the location of the display assembly at the display stand and the rotational orientation of the display assembly.

An information handling system keyboard has a circuit board with snap openings to couple individual modular keys over input contact pads. The modular keys have a base with snaps to couple to the circuit board, a key cap to accept an end user input, a scissors coupled to the base and key cap to define a vertical travel of the key and rubber dome that biases the key cap away from the circuit board and includes a conductive bottom surface to contact the conductive pad when an end user presses down on the key cap as an input.

A semiconductor device with first and second portions of a redistribution layer with arrays of through via elements carrying electrical ground connections that includes one or more contact pads that have one or more extensions projecting therefrom into a null space between through via elements carrying electrical signals. A method of manufacturing the semiconductor device is also disclosed.

Embodiments of methods and semiconductor devices are described that are configured to determine a negative resistance margin (NRM) of an oscillator circuit. The semiconductor device may include an integrated circuit including an amplifier circuit coupled between a first node and a second node and NRM test circuitry including a resistor circuit selectively coupled between a first contact pad and the first node. The integrated circuit may receive an oscillating signal from an oscillator circuit coupled to the first contact pad and a second contact pad of the integrated circuit. In an NRM test mode, a resistance of the resistor circuit is selectively varied from an initial resistance value to one or more second resistance values and the oscillating signal is monitored at the second node to determine the NRM based on the one or more second resistance values when an amplitude of the oscillating signal falls below a threshold amplitude.

This present invention relates generally to devices, systems, and methods for performing optical and electrochemical assays and, more particularly, to devices and systems having universal channel circuitry configured to perform optical and electrochemical assays, and methods of performing the optical and electrochemical assays using the universal channel circuitry. The universal channel circuitry is circuitry that has electronic switching capabilities such that any contact pin, and thus any sensor contact pad in a testing device, can be connected to one or more channels capable of taking on one or more measurement modes or configurations (e.g., an amperometric measurement mode or a current drive mode).

The invention relates to detection of structural defects in integrated circuits. An electronic system includes: an integrated circuit including a semiconductor substrate, an interconnect portion over the substrate and having a metal level embedded in an electrically insulating region, a via, and a contact level, and a contact pad at the last metal level of the interconnect portion; and a detection system configured to detect a possible presence of at least one type of structural defect within at least one region of the interconnect portion located at least below the contact pad.

The utility model discloses an inner-cooling drill coating curing machine, which relates to the technical field of coating curing equipment and comprises a drying oven structure, a clamping structure, a sealing structure and a separating structure. According to the drying oven structure, air is heated through a resistance heater, and hot air is driven by centrifugal fan blades to circulate to a first cavity and a second cavity through an air duct; the clamping structure adopts a three-jaw chuck type design, and a rotating pin drives a clamping roller to fix the inner-cooling drill bit; the sealing structure enables the contact pad to be automatically attached to the bottom of the drill bit through elastic stretching of an air guide groove of an air guide conical barrel and an adjusting barrel, and it is ensured that hot air flow is guided into an inner cooling channel through an air guide hole. The separation structure adjusts airflow distribution between the cavities through a sliding type separation plate. According to the device, efficient directional curing of the coating of the inner cooling channel is achieved, and the problem that traditional equipment is insufficient in hot air permeation is solved.

A semiconductor test structure includes a substrate, a plurality of gate structures on the substrate, a plurality of thin-film resistive layers, each of the thin-film resistive layers being respectively over one of the plurality of gate structures, and a plurality of gate structures on the substrate, each of the plurality of thin-film resistive layers being respectively over the other one of the plurality of gate structures, each of the plurality of thin-film resistive layers being respectively over the other one of the plurality of gate structures. The plurality of thin film resistor layers are arranged in a dielectric layer, the test circuit layer is arranged on the dielectric layer and is in a square waveform pattern from a top view, and the two contact pads are respectively connected with two ends of the test circuit layer.

In a general aspect, a method includes forming a panel including a heat spreader disposed in a non-conductive material. The heat spreader is exposed on opposite sides of the panel. The method further includes coupling a semiconductor die to a surface of the heat spreader with a conductive bonding material, and applying an underfill material to encapsulate the conductive bonding material. The method also includes plating a contact pad of the semiconductor die, embedding the semiconductor die and the underfill material in a lamination material, and disposing a metal layer on the lamination material. The method further includes forming an opening through the metal layer and the lamination material to expose at least a portion of the plating of the contact pad, and forming a conductive via in the opening. The conductive via electrically couples the metal layer with the plating of the contact pad.