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508 results about "Contact pad" patented technology
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Contact pads or bond pads are designated surface areas of a printed circuit board or die of an integrated circuit. Possibilities to contact to pads include soldering, wirebonding, flip chip mounting, or probe needles.
Composite hybrid structures
PendingUS20250391794A1Semiconductor/solid-state device detailsSolid-state devicesContact padDielectric layer
Methods for fabrication dielectric layers having conductive contact pads, and directly bonding the dielectric and conductive bonding surfaces of the dielectric layers. In some aspects, the method includes disposing a polish stop layer on dielectric bonding surfaces on top of a dielectric layer. A conductive layer is disposed on top of the polish stop layer and then polished to form conductive contact pads having polished conducting bonding surfaces. During the polishing process, the polish stop layer reduces rounding of dielectric edges and erosion of the dielectric bonding surfaces between closely spaced conductive bonding surfaces. The resulting polished dielectric and conductive bonding surfaces are directly bonded to dielectric and conductive bonding surfaces of another dielectric layer to form conductive interconnects.
Owner:ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC
Clamping device and method for burr removal of solar new energy vehicle plate stamping part
The invention relates to a clamping device and method for deburring of solar new energy vehicle plate stamping parts, and belongs to the technical field of deburring machining and clamping of solar new energy vehicle plate stamping parts. The global contour scanning mechanism is fixedly mounted on the base and is used for acquiring global contour data of the stamping part; the reference positioning mechanism is fixedly mounted on the mounting plane and is used for initially positioning the stamping part; the multiple cooperative supporting and clamping units are distributed on the mounting plane in an array mode, each cooperative supporting and clamping unit comprises an electric linear actuator and a sensing head fixed to the top end of the electric linear actuator, and a pressure sensor and a micro accelerometer are integrated in each sensing head; the flexible contact pad at the top of the sensing head is made of elastic materials such as nylon or polyurethane, so that the surface of a workpiece can be prevented from being scratched or indented, and supporting force is uniformly transmitted.
Owner:WUHU QINHUI TECH
Modular peripheral display assembly sustainable power board architecture
PendingUS20260037032A1Details for portable computersGenerating/distributing signalsContact padDisplay device
An information handling system peripheral display presents visual images with a display panel. A timing controller board has an edge connector that interfaces with a scalar board edge connector when the scalar board couples with slots at posts of the back side. The scalar board couples display cable ports to accept display information from an information handling system and extends the display cable ports out of openings of the midplane. The scalar board communicates visual information to the adjacent timing controller board through the edge connector without the use of a cable. A power board couples with posts and slots adjacent the scalar board to engage a power connector with power pins into a socket of the power board. Power communicates from the power board through the scalar board to the timing controller board and then to a backlight through a pogo pin and contact pad interface.
Owner:DELL PROD LP
METHOD FOR MANUFACTURING AN OPTOELECTRONIC ARRANGEMENT, OPTOELECTRONIC ARRANGEMENT AND OPTOELECTRONIC COMPONENT
PendingDE102024118032A1Semiconductor/solid-state device detailsSolid-state devicesContact padFerromagnetism
A method for fabricating an optoelectronic arrangement is described, comprising the following steps: - Providing a carrier (1) with a top surface (1a) and a bottom surface (1b), - Forming a plurality of contact pads (2) on the carrier (1) on the upper surface (1a), wherein each contact pad (2) is free of ferromagnetic materials, - Forming a shield (3) on the carrier (1), wherein the shield (3) at least partially surrounds each contact pad (2) in the lateral direction (L) and comprises a first ferromagnetic material, - Providing a plurality of optoelectronic components (4), each component comprising a second ferromagnetic material on a side facing the upper surface (1a) of the support (1), - Providing a magnet (5) on the lower surface (1b) of the support (1), wherein the magnet exerts a magnetic force (F), - Bringing the majority of optoelectronic components (4) closer to the upper surface (1a) and - Attaching the majority of optoelectronic components (4) to the carrier (1) on the upper surface (1a). The optoelectronic components (4) may, for example, be micro-LEDs.
Owner:AMS OSRAM INT GMBH
Bonded structure with active interposer
A bonded structure is disclosed. The bonded structure can comprise a first semiconductor element having a first contact pad. An interposer can include a second contact pad on a first side of the interposer and a third contact pad and a fourth contact pad on a second side of the interposer opposite the first side, the second contact pad bonded to the first contact pad; a second semiconductor element having a fifth contact pad bonded to the third contact pad and a sixth contact pad bonded to the fourth contact pad. A switching circuitry can be configured to switch between a first electrical connection between the second and third contact pads and a second electrical connection between the second and fourth contact pads.
Owner:ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC
Wavelength-converted light-emitting diodes with lateral contact geometry
An LED includes first / second doped layers with active region(s) therebetween emitting a first wavelength. A wavelength converter on a first LED surface absorbs the first wavelength and emits a second, longer wavelength. A second LED surface is against a substrate surface. A first electrical contact on the first LED surface extends along LED sidewalls, separated from the active region(s) and second doped layer by an insulating layer, connecting the first doped layer to a first contact pad. In some instances, contact pads are on the substrate surface; a second electrical contact extends onto LED sidewalls, connecting the second doped layer to a second contact pad. In some other instances contact pads are on laterally-extending portions of the second doped layer. The insulating layer separates the first contact pad from the second doped layer; a second contact pad is in direct electrical contact with the second doped layer.
Owner:LUMILEDS LLC
Display stand supporting plural display assemblies with position detection on the display stand
ActiveUS12541224B1Input/output for user-computer interactionStatic indicating devicesContact padComputer graphics (images)
An information handling system peripheral display has plural display assemblies coupled to stand supports of a display stand to present visual images a display panel included in each display assembly. Sensors, such as an eye tracker sensor or a mouse cursor presentation location, are applied to analyze end user interaction at each display panel and selectively dim and / or turn off brightness at each display panel. A contact pad at the rear of each display assembly interfaces with a contact pins of each display support to determine the location of the display assembly at the display stand and the rotational orientation of the display assembly.
Owner:DELL PROD LP
Semiconductor Devices and Methods of Making Bridge Modules and Chiplet Structures Having the Bridge Modules
PendingUS20260123472A1Semiconductor/solid-state device detailsSolid-state devicesContact padDevice material
A semiconductor device has a bridge die comprising a contact pad. An electrical component is mounted to the bridge die to form a bridge module. The bridge module is disposed over a carrier. A first conductive layer is formed on the carrier. A first insulating layer is formed over the first conductive layer and bridge module. An opening is formed through the first insulating layer to expose the first conductive layer. A second conductive layer is formed over the first insulating layer. The carrier is removed. A first semiconductor die is electrically coupled to the electrical component and bridge die.
Owner:STATS CHIPPAC MANAGEMENT PTE LTD
Acupressure device
The present invention discloses an acupressure device. The device comprises a pair of arms, each with a first end portion, a second end portion, and an arm portion comprising concave and convex portions. A fulcrum pivotally connects the arms at their convex portions, enabling outward and inward movement. A spring, positioned between the second end portions, maintains the arms in a closed position when relaxed and allows outward movement to an open position when activated. A pressure band encircles the arms to apply inward pressure. The band's position adjusts to increase pressure when fixed over the concave portion, decrease pressure when fixed over the convex portion, or maintain neutral pressure at intermediate positions. The first end portion incorporates a contact pad assembly, and the second end forms a handle for activating the spring. The pressure band is adjustable after placement to regulate consistent therapeutic pressure on a target acupressure point.
Owner:JOHNSON GARY D +1
Display stand supporting plural display assemblies that each track their position on the display stand
PendingUS20260037023A1Generating/distributing signalsHousing of computer displaysContact padComputer graphics (images)
An information handling system peripheral display has plural display assemblies coupled to stand supports of a display stand to present visual images a display panel included in each display assembly. Sensors, such as an eye tracker sensor or a mouse cursor presentation location, are applied to analyze end user interaction at each display panel and selectively dim and / or turn off brightness at each display panel. A contact pad at the rear of each display assembly interfaces with a contact pins of each display support to determine the location of the display assembly at the display stand and the rotational orientation of the display assembly.
Owner:DELL PROD LP
Information handling system keyboard with replaceable modular keys
An information handling system keyboard has a circuit board with snap openings to couple individual modular keys over input contact pads. The modular keys have a base with snaps to couple to the circuit board, a key cap to accept an end user input, a scissors coupled to the base and key cap to define a vertical travel of the key and rubber dome that biases the key cap away from the circuit board and includes a conductive bottom surface to contact the conductive pad when an end user presses down on the key cap as an input.
Owner:DELL PROD LP
Detection of structural defects in integrated circuits
PendingCN121693095AElectronic circuit testingMaterial analysis by electric/magnetic meansContact padElectronic systems
The invention relates to detection of structural defects in integrated circuits. An electronic system includes: an integrated circuit including a semiconductor substrate, an interconnect portion over the substrate and having a metal level embedded in an electrically insulating region, a via, and a contact level, and a contact pad at the last metal level of the interconnect portion; and a detection system configured to detect a possible presence of at least one type of structural defect within at least one region of the interconnect portion located at least below the contact pad.
Owner:STMICROELECTRONICS INT NV
Inner-cooling drill coating curing machine
ActiveCN224195178Ufit tightlyStable airflow conductionPretreated surfacesCoatingsContact padLaboratory oven
The utility model discloses an inner-cooling drill coating curing machine, which relates to the technical field of coating curing equipment and comprises a drying oven structure, a clamping structure, a sealing structure and a separating structure. According to the drying oven structure, air is heated through a resistance heater, and hot air is driven by centrifugal fan blades to circulate to a first cavity and a second cavity through an air duct; the clamping structure adopts a three-jaw chuck type design, and a rotating pin drives a clamping roller to fix the inner-cooling drill bit; the sealing structure enables the contact pad to be automatically attached to the bottom of the drill bit through elastic stretching of an air guide groove of an air guide conical barrel and an adjusting barrel, and it is ensured that hot air flow is guided into an inner cooling channel through an air guide hole. The separation structure adjusts airflow distribution between the cavities through a sliding type separation plate. According to the device, efficient directional curing of the coating of the inner cooling channel is achieved, and the problem that traditional equipment is insufficient in hot air permeation is solved.
Owner:HANCHUANGINNOVATIVECOATING(WUHAN) CO LTD
Embedded semiconductor device packages and methods of manufacture
PendingUS20260182440A1Semiconductor/solid-state device detailsSolid-state devicesContact padDevice material
In a general aspect, a method includes forming a panel including a heat spreader disposed in a non-conductive material. The heat spreader is exposed on opposite sides of the panel. The method further includes coupling a semiconductor die to a surface of the heat spreader with a conductive bonding material, and applying an underfill material to encapsulate the conductive bonding material. The method also includes plating a contact pad of the semiconductor die, embedding the semiconductor die and the underfill material in a lamination material, and disposing a metal layer on the lamination material. The method further includes forming an opening through the metal layer and the lamination material to expose at least a portion of the plating of the contact pad, and forming a conductive via in the opening. The conductive via electrically couples the metal layer with the plating of the contact pad.
Owner:SEMICON COMPONENTS IND LLC
Microfabricated implantable probes
The disclosure features a microfabricated implantable probe, the probe comprising (a) a semiconductor substrate microprobe body including a handling portion and an elongated shaft extending from the handling portion to a tip, the tip being configured for insertion into a target area of a subject mammal, (b) at least one pair of enzyme-functionalized sensing electrodes disposed on the shaft, (c) individually addressable conductive metallic leads extending for a specified distance from each sensing electrode to contact pads disposed on the handling portion, and (d) a polymeric separating layer configured to separate each sensing electrode in the pair of electrodes from the other sensing electrode. The disclosure also features methods of using the probe to detect neurochemicals.
Owner:ALCORIX CO
Probe head with improved configuration
PendingJP2026516794AElectrical measurement instrument detailsElectrical testingContact padMechanical engineering
Owner:TECHNOPROBE
Probe and test pin card
The application discloses a probe and a test needle card, wherein the probe comprises a first coupling needle core and a second coupling needle core, and further comprises an adjusting assembly for adjusting the relative position of the first coupling needle core and the second coupling needle core in the axial direction. In the embodiment of the application, the probe adopts a split needle core design, and the distance between the first coupling needle core and the second coupling needle core can be adjusted through the adjusting assembly, so that the orientation adaptation of the core circle and the control plate is realized, and the compatibility of the probe is improved. In the aging test process, the probe contact pads corresponding to the pad positions on the core circle are enabled to perform the aging test through the adjustment of the axial distance between the first coupling needle core and the second coupling needle core, while the axial length of the probe not corresponding to the pad positions on the core circle is shortened to be separated from the core circle, so that the core circles with different chip layouts are compatible, and the manufacturing cost of the test needle card is effectively reduced.
Owner:GUANGDONG XINYUENENG SEMICON CO LTD
Array substrate, display apparatus, and connection pad
An array substrate having a connection pad in a connection pad area is provided. The connection pad includes a plurality of first probe contact pads, a plurality of second probe contact pads, a plurality of first connection lines coupled to the plurality of first probe contact pads, respectively, and a plurality of second connection lines coupled to the plurality of second probe contact pads, respectively; the plurality of first connection lines and the plurality of second connection lines being in two different layers. A total number of conductive layers electrically connected to a respective first connection line of the plurality of first connection lines is different from a total number of conductive layers electrically connected to a respective second connection line of the plurality of second connection lines.
Owner:BOE TECHNOLOGY GROUP CO LTD
Interposer Assembly for System-Level Failure Analysis
PendingUS20260092968A1Electronic circuit testingElectrical measurement instrument detailsContact padDevice material
This document describes systems and techniques directed at an interposer assembly for system-level failure analysis. In aspects, the interposer assembly may include a main body with a central aperture configured to provide optical access to an exposed surface of a semiconductor device. A plurality of probe pins may be arranged on the main body surrounding the central aperture, the plurality of probe pins configured to make electrical contact with a corresponding plurality of fine-pitch contact pads on the semiconductor device. The interposer assembly may further include at least one connector disposed on the main body and physically offset from the central aperture configured to receive a memory module. Circuitry within the main body electrically couples the plurality of probe pins to the at least one connector. In such a configuration, accurate optical imaging and fault isolation analysis can be enabled while a semiconductor device is fully operational.
Owner:GOOGLE LLC
Light emitting diode filament including FLIP chip light emitting diodes to reduce the amount of phosphor that is integrated into the filament
A light emitting diode (LED) structure that includes a stent substrate; and a circuit having a plurality of contact pads arranged along a length of the stent substrate. The structure further includes a plurality of light emitting diode (LED) chips, wherein each light emitting diode chip in the plurality of chips is engaged to a set of contact pads along the length of the metal stent substrate. A continuous phosphor layer is present overlying the plurality of light emitting diode (LED) chips, the continuous phosphor layer including first portions that are in direct contact with at least a light transmission surface of the light emitting diode (LED) chips and second portions that bridge across the space separating adjacently positioned light emitting diode. An encapsulant present over the continuous phosphor layer that is covering at least the light emitting diode chips.
Owner:LEDVANCE LLC
Circuit interface assembly and electronic device
The utility model belongs to the technical field of electronic circuits, and particularly discloses a circuit interface assembly and an electronic device.The circuit interface assembly comprises an elastic probe contact pad with conductivity and a hard gold piece with conductivity; the elastic probe contact pad can be fixed in an electronic device in an embedded manner, and the hard gold sheet can be fixed on the surface of the electronic device; the first contact surface of the hard gold sheet is used for contacting the elastic probe connector, the second contact surface of the hard gold sheet is used for contacting the first contact surface of the elastic probe contact pad, and the second contact surface of the elastic probe contact pad is used for connecting a circuit in an electronic device. According to the invention, the hard gold piece is in compression joint with the elastic probe connector, the wear resistance of the hard gold piece can be fully utilized, the elastic probe contact pad can be prevented from being worn, and compared with a mode that the elastic probe contact pad is in direct compression joint with the elastic probe connector, the service life of the circuit interface can be effectively prolonged.
Owner:SHENZHEN JINGCE OPTOELECTRONICS CO LTD
Hall effect device with trench about a micron or greater in depth
In one aspect, a Hall effect device includes an implantation layer; an epitaxial layer located above the implantation layer; a trench filled with a dielectric material and extending from a top surface of the epitaxial layer into the implantation layer and defining an enclosed region; a buried layer the epitaxial layer from the implantation layer within the enclosed region; and a contact pad located on the epitaxial layer. The trench reduces a current from the contact pad from traveling in a lateral direction orthogonal to a vertical direction and enables the current to travel in the vertical direction.
Owner:ALLEGRO MICROSYSTEMS LLC
Electronic device
An electronic device includes a substrate, a first circuit layer, a first semiconductor die, a second circuit layer, and a plurality of first conductive elements. The first circuit layer is disposed on the substrate and includes a plurality of first contact pads. The first semiconductor die is disposed on the first circuit layer. The second circuit layer is electrically connected with the first semiconductor tube core and comprises a plurality of second contact pads. The first conductive component is arranged between the first circuit layer and the second circuit layer and is electrically connected with the first contact pad and the second contact pad; the first conductive component includes a first portion adjacent to the first contact pad, a second portion adjacent to the second contact pad, and a middle portion between the first portion and the second portion. Furthermore, the first conductive components comprise a plurality of first type conductive components and a plurality of second type conductive components, the first type conductive components have the maximum width in the middle part, and the second type conductive components have the maximum width in the first part.
Owner:INNOLUX CORP
Probe head with improved contact probe
PendingJP2026516792AElectrical measurement instrument detailsElectrical testingContact padMechanical engineering
Owner:TECHNOPROBE
Multi-finger ESD protection device with synchronous trigger
A semiconductor device comprises a first row of doped wells formed in a semiconductor body, the first row comprising wells of a first conductivity type arranged alternately with wells of a second conductivity type in a first direction of the semiconductor body, first and second contact pads arranged above the top surface of the semiconductor body, a primary electrical interconnection network electrically coupling semiconductor device structures formed by groups of wells of the first conductivity type and wells of the second conductivity type from the first row between the first and second contact pads, and a secondary electrical interconnection network forming a node independent of the primary electrical interconnection network and electrically connecting each of the wells of the first conductivity type in the first row.
Owner:INFINEON TECHNOLOGIES AG
Multi-finger ESD protection device with synchronous triggering
A semiconductor device includes a first row of doped wells formed in a semiconductor body, the first row including first conductivity type wells arranged alternatingly with second conductivity type wells in a first direction of the semiconductor body, first and second contact pads disposed over the upper surface of the semiconductor body, a primary electrical interconnect network that electrically couples semiconductor device structures formed by groups of the first conductivity type wells and the second conductivity type wells from the first row between the first and second contact pads, and a secondary electrical interconnect network that forms a node that is independent from the primary electrical interconnect network and electrically connects each of the first conductivity type wells in the first row together.
Owner:INFINEON TECHNOLOGIES AG
Debondable test wafer / probe card
PCT designated stageWO2026035527A1Electronic circuit testingElectrical measurement instrument detailsProbe cardWafering
A probe card for probing a semiconductor substrate is disclosed. The probe card can include a probing element having a hybrid bonding surface that is configured to removably hybrid bond to a semiconductor element. The hybrid bonding surface of the probing element can include a nonconductive layer and contact pads at least partially embedded in the nonconductive layer. The contact pads of the probing element can be bonded to probe pads of the semiconductor element. Additionally, the nonconductive layer of the probing element can be bonded to a nonconductive layer of the semiconductor element. A conductive material can be deposited over the contact pads. The conductive material can comprise a lower melting point than the contact pads. The conductive material can comprise at least one of a low melting point metal and conductive polymer.
Owner:ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC