271 results about "Ball grid array" patented technology

The invention relates to the technical field of solder ball array optimization, in particular to a low-warpage solder ball array optimization method and system in FC-BGA packaging of a glass substrate, and the method comprises the steps: determining the glass substrate and a plurality of solder balls, designing a preliminary array layout, creating a three-dimensional geometric model, carrying out the thermal loading simulation of the three-dimensional geometric model, and obtaining a plurality of thermal stress distribution nephograms; and executing the following operations on each thermal stress distribution cloud picture in the plurality of thermal stress distribution cloud pictures: obtaining a maximum thermal stress region from the thermal stress distribution cloud picture, obtaining a region position and a maximum thermal stress value according to the maximum thermal stress region, obtaining an optimal array layout, summarizing the optimal array layout, and obtaining the thermal stress distribution cloud picture. A plurality of thermal stress distribution cloud pictures are obtained, a plurality of optimal array layouts corresponding to the thermal stress distribution cloud pictures are obtained, the optimal array layout is obtained, the voidage of the welding spots is calculated based on the optimal array layout, and optimization of the low-warpage welding ball array in FC-BGA packaging of the glass substrate is completed based on the voidage of the welding spots. According to the invention, the optimization precision and efficiency of the solder ball layout can be improved.

The invention discloses a packaging structure and a packaging method of a SiP module based on a ceramic material, the packaging structure takes the ceramic material as a packaging shell, the position of a substrate part of the shell is designed to be a concave staggered layer structure, so that the assembly of chips and passive devices with different sizes and different heights is facilitated, and because the internal circuit of the SiP module is complicated and the number of interface pins is large, the packaging cost is low. Therefore, a ball grid array pin mode is adopted outside the shell, a metallization layout design is carried out on the ceramic substrate to realize chip assembly bonding pad and partial circuit wiring, and meanwhile, through hole metallization slurry filling is designed between substrates to realize connection of an internal metallization bonding pad and an external ball grid array pin. And a specific chip and a passive device are assembled at different positions, and lead bonding interconnection is assisted, so that a complete packaging process of a specific circuit SiP module is realized. The power distribution cabinet has the advantages of being good in insulation performance, ultrahigh in integration level, ultra-light in weight, fast in heat dissipation, high in reliability and the like, and has very high popularization value.

The invention provides an improved YOLOv10-based solder ball defect detection method for a BGA packaged chip, and the method comprises the steps: collecting a solder ball image of the BGA packaged chip, carrying out the morphological preprocessing, and carrying out the analysis and classification of defects; carrying out defect generation on solder ball burr defects with less data; performing similarity measurement on the generated defects and the real defects, and selecting defect data with relatively high similarity to construct a pre-training data set; a YOLOv10 deep learning network is improved, a C2f module in the network is improved, an up-sampling module is replaced with a lightweight dynamic up-sampling operator DySample, an original loss function is replaced with a Focal-EIoU loss function, the improved network is used for pre-training, and a defect detection model is obtained; performing real-time defect detection on the solder ball of the BGA packaging chip by using the defect detection model to obtain defect information; according to the invention, the detection precision and speed of the solder ball defect of the BGA packaging chip are effectively improved.

A chip package includes a ball-grid-array (BGA) substrate; a first metal bump at a bottom of the ball-grid-array (BGA) substrate, wherein the first metal bump comprises tin; a field programmable chip package over and coupling to the ball-grid-array (BGA) substrate, wherein the field programmable chip package comprises a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip therein and a second metal bump at a bottom of the field programmable chip package and bonded to a top of the ball-grid-array (BGA) substrate; and a memory chip package under and coupling to the ball-grid-array (BGA) substrate, wherein the memory chip package comprises a first non-volatile memory (NVM) integrated-circuit (IC) chip therein and a third metal bump at a top of the memory chip package and bonded to the bottom of the ball-grid-array (BGA) substrate.

The invention relates to the technical field of communication, and relates to a high-integration airtight packaging phased-array antenna and a preparation method thereof. Comprising an HTCC antenna, a kovar enclosure frame, an HTCC control panel and a heat dissipation enclosure frame, the HTCC antenna is connected with the HTCC control panel through the metal ball grid array; the radio frequency chip is installed on the HTCC antenna through the metal ball grid array and is connected with the HTCC control board through the metal ball grid array. A low-frequency connector is integrated on the HTCC control board; the radio frequency chip is in contact with the HTCC control panel through a fuzz button spring needle; the fuzz button spring needle is welded on the heat dissipation enclosure frame; the HTCC antenna, the HTCC control panel and the kovar enclosure frame are welded through a first soldering lug; and the HTCC antenna is welded with the heat dissipation enclosure frame through a second soldering lug. According to the invention, high integration level, miniaturization and high reliability of the antenna are realized, and the antenna can stably work for a long time in severe environments such as salt mist, damp and hot environments and the like.

The invention discloses a ball grid array package solder ball injection device and an application method, which belongs to the field of microelectronic packaging, solder ball preparation and circuit printing, and includes a power system, a heat dissipation bracket, a crucible mechanism, a heating device, a nozzle, an inert gas supply system and a signal generating unit; the power system is used to drive the nozzle to reciprocate up and down, including a piezoelectric ceramic stack and a striker, the striker is fixedly connected to the nozzle, the signal generating unit includes a signal generator and a power amplifier, which is used to drive the piezoelectric ceramic stack to expand and contract, and then drive the nozzle to move up and down quickly; the crucible mechanism and the heating device are used to heat and melt the solder wire in the crucible; the heat dissipation bracket is used to reduce the heat transferred to the power system; the inert gas supply system is used to make the high-temperature liquid solder droplets ejected from the nozzle in an inert gas environment to prevent the high-temperature liquid solder droplets from oxidizing. The invention has various functions, is easy to use, has low cost and high reliability.

The invention discloses BGA (Ball Grid Array) packaging intelligent wobble plate equipment, which comprises a rack, and is characterized in that the rack is provided with a loading station, a feeding station, a loading station, an overturning station, a stacking station and a discharging station; the feeding frame is arranged on the feeding station, and a feeding driving mechanism is arranged on the feeding frame; the stacking box is arranged at the discharging station, and a discharging driving mechanism is arranged on the rack; the clamping and transferring mechanism is used for clamping and transferring a loading template from a stacking box to the loading station or clamping and transferring a packaged finished product from the loading station to the stacking box for stacking treatment, and the overturning station is located on a transferring path of the clamping and transferring mechanism; the loading mechanism is arranged at the loading station; and the turnover mechanism is arranged at the turnover station, a turnover space is formed between the turnover mechanism and the clamping and transferring mechanism, and a jacking driving mechanism is arranged on the rack. According to the automatic tray placing and overturning device, automatic tray placing and overturning operation is achieved, and the production efficiency is effectively improved.

The differential via hole structure comprises at least one differential group, the differential group comprises a first differential pair and a second differential pair, a first connecting line of two differential via holes in the first differential pair is perpendicular to a second connecting line of two differential via holes in the second differential pair, and one differential via hole in the first differential pair is located on the second connecting line; according to the embodiment of the invention, the two differential pairs in one differential group are vertically arranged, and one differential pair is located on the vertical line, passing through one differential via hole, of the other differential pair, so that the differential crosstalk can be reduced, the system margin can be improved, and the signal integrity of a link can be improved on the premise of not influencing the straight-through bandwidth. The invention further provides a solder ball array packaging assembly, a printed circuit board and communication equipment.

The invention discloses a BGA packaging defect detection method and system based on deep learning. The method comprises the steps that a to-be-detected image of a to-be-detected ball grid array chip is acquired; reasoning the to-be-detected image by adopting a first deep learning model so as to identify and position key components on each to-be-detected ball grid array chip; carrying out anomaly detection on the geometric parameters of the key component to obtain a geometric parameter detection result; carrying out surface defect detection on the to-be-detected image in parallel by adopting a second deep learning model group so as to identify various surface defects on the surface of the substrate of the to-be-detected ball grid array chip, and obtaining a surface defect detection result; and determining a defect detection result of the to-be-detected ball grid array chip based on the geometric parameter detection result and the surface defect detection result, thereby realizing a self-adaptive, high-beat and comprehensive BGA packaging defect detection method.

Example implementations described herein involve a media adaptor configured to provide electrical / optical and optical / electrical conversion for a multi-mode waveguide (MMWG) interconnect, the media adaptor involving one or more ball grid arrays; and a tail-cut fiber array block (tcFAB) connected to a first array of photodiodes and a second array of laser diodes from direct optical wire (DOW) bonding.

An electronic device including an IC having a package interconnect including a pillar and a solder cap coupled to a bottom surface of the pillar to reduce the height of the IC package. The IC package includes a substrate comprising an outer metallization layer having a metal pad and a package mold layer adjacent to the outer metallization layer. The pillar has a top surface and a bottom surface. The pillar extends through the package mold layer with the top surface coupled to the metal pad and the bottom surface coupled to the solder cap. In contrast to conventional package interconnects, such as ball grid arrays (BGA), for example, deploying the solder cap on the bottom surface of the pillar advantageously results in using less solder and tighter pitch between adjacent package interconnects because the width of the pillar is less than a solder ball in a BGA.

The invention discloses a W-band airtight multistage transition structure based on an HTCC. The W-band airtight multistage transition structure comprises a WR-10 waveguide, an FR-4 substrate, a ball grid array, a multistage vertical SIW, a quarter-wave short road surface and a planar transmission structure. An FR-4 substrate is arranged above the WR-10 waveguide, an FR-4 substrate air cavity is formed after cavity digging and side wall metallization are carried out in the FR-4 substrate, and the size of the WR-10 waveguide is the same as that of the FR-4 substrate air cavity. A ball grid array is distributed above the FR-4 substrate, and the ball grid array is distributed around the air cavity of the FR-4 substrate. The multi-stage vertical SIW is arranged above the ball grid array, and the impedance matching effect is achieved through multi-stage gradual change. The quarter-wave short road surface and the planar transmission structure are placed on the multi-stage vertical SIW, and electromagnetic energy is coupled to the microstrip line.

The invention discloses a semiconductor packaging structure and a manufacturing method thereof. The semiconductor package structure includes a substrate having a top side and a bottom side; the first ball grid array is arranged on the bottom side of the substrate, the first ball grid array is provided with a plurality of first balls, and the first ball grid array has a signal connection function between the substrate and an external printed circuit board; and the second ball grid array is arranged on the bottom side of the substrate, the second ball grid array is provided with a plurality of second balls, and the second balls are arranged in transverse gaps among the first balls on the bottom side.

An integrated device includes one or more dies and a substrate. The substrate includes on-package contacts coupled to the one or more dies and off-package contacts configured to be coupled to a printed circuit board (PCB). The integrated device also includes a first set of electrical interconnects electrically coupled to a first subset of the off-package contacts and that form a ball grid array (BGA). The integrated device also includes a second set of electrical interconnects electrically coupled to a second subset of the off-package contacts and that form a land grid array (LGA).

A method of manufacturing a printed circuit board (PCB) includes arranging a first trace segment of a trace on a substrate of the PCB, the substrate being composed of fiber glass strands that define a fiber glass weave pattern, and arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along an axis by a distance that is less than a ball grid array (BGA) pitch of a BGA based on the fiber glass weave pattern. The BGA pitch is a separation distance along the axis between a center of a first via of the BGA of the PCB and a center of a second via of the BGA.

Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semiconductor package is formed with one or more of: (i) metal pillars having an ultra-fine pitch (e.g., a pitch that is greater than or equal to 150 μm, etc.); (ii) a large die-to-package ratio (e.g., a ratio that is equal to or greater than 0.85, etc.); and (iii) a thin pitch translation interposer. Another exemplary semiconductor package is formed using coreless substrate technology, die back metallization, and low temperature solder technology for ball grid array (BGA) metallurgy. Other embodiments are described.

Provided is a laminate having high adhesion to a metal layer. Further provided are a laminated board, a printed wiring board, a semiconductor package, an interposer, and a ball grid array (BGA) substrate that are obtained using the laminate. The laminate includes a glass substrate having a through-hole, and has a layer of a resin composition on a surface of the glass substrate and a side wall of the through-hole. The resin composition contains (A) an epoxy resin having a biphenyl-diyl group and (B) an ester-based curing agent. The content of the component (A) is 10-80 mass% with respect to the total amount of the resin component.

To improve signal loss in ball grid array (BGA) waveguide interfaces.SOLUTION: A package-waveguide interface 300 includes a package substrate 320 that encapsulates solder balls 314, 318 and an integrated circuit die 305 and that includes signal transmitters 325, 330 that transmit or receive signals on the surface of the package substrate. A BGA includes a set of grounded solder balls arranged as a boundary around the signal transmitters. The interface further includes a printed circuit board (PCB) 310 having a waveguide interface side opposite a secondary waveguide side (3D antenna 360 side), and PCB through-holes 345, 350 that extend from the waveguide interface side to the secondary waveguide side and are perpendicular to the plane of the PCB. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the PCB through-holes and the signal transmitters and the PCB through-holes are substantially aligned.SELECTED DRAWING: Figure 3

A method of manufacturing an electronic assembly (100, 400) includes: forming a support member (130, 430) by applying a first adhesive layer (133, 433) to an inner surface of a support frame (131, 431) and applying a second adhesive layer (134, 434) to a bottom surface of the support frame (131, 431) (S501); attaching the support member (130, 430) to a component (110, 410) of the ball grid array comprising solder balls (111, 411) by a first adhesive layer (133, 433) (S502) such that an inner surface of the support frame (131, 431) covers a portion of a first side surface of the component (110, 410) and a portion of a bottom surface of the component (110, 410); mounting the support member (130, 430) to a substrate (120, 420) comprising an array of contact pads (121, 421) through a second adhesive layer (134, 434), the pattern of the array of contact pads (121, 421) matching the ball grid array (S503); and curing the first adhesive layer (133, 433) and the second adhesive layer (134, 434), and connecting the solder ball (111, 411) to the contact pad (121, 421) by reflow soldering at a temperature higher than the melting point of the solder ball (111, 411) (S504).

The invention belongs to the technical field of integrated circuit packaging, and particularly relates to a high-density and high-reliability system-on-chip structure and an assembling method thereof. Comprising a glass wafer, the front surface of which is sequentially provided with a front surface rewiring layer and a high-density bonding pad; a back surface rewiring layer and a BGA solder ball are sequentially arranged on the back surface of the substrate; a TGV through hole is vertically formed in the base; a chip is arranged in the wafer-level plastic package body; high-density bumps in one-to-one correspondence with the high-density bonding pads are arranged on the surface of the chip, and the wafer-level plastic package body is subjected to plastic package on the front surface of the glass wafer through bonding of the high-density bumps and the high-density bonding pads; the wafer-level heat dissipation system is assembled with the front surface of the wafer-level plastic package body through high-thermal-conductivity glue; the wafer-level heat dissipation system comprises a micro-channel wafer and a cover plate wafer, and a liquid inlet and a liquid outlet are formed in the cover plate wafer; the wafer level configuration system is bonded with the back surface of the glass wafer through a BGA (Ball Grid Array) solder ball; the technical problems of large integration warping, low integration density, low reliability and the like of the on-chip system can be effectively solved.

Aspects of the present disclosure are directed to systems and methods to reduce inductance on an integrated circuit package of a memory sub-system. A memory sub-system is also hereinafter referred to as a “memory device.” An example of a memory sub-system is a storage system, such as a SSD, and can be embodied as an integrated circuit package, including but not limited to a pin grid array (PGA), and ball grid array (BGA).

Apparatuses may include a device substrate including a microelectronic device and bond pads proximate to an active surface of the device substrate. A package substrate may be secured to the device substrate, the package substrate configured to route signals to and from the bond pads. A ball grid array may be supported on, and electrically connected to, the package substrate. Each ball of the ball grid array positioned and configured to carry one of a high-bandwidth data signal or a high-frequency clock signal is located laterally or longitudinally adjacent to no more than two other balls of the ball grid array configured to carry another of a high-bandwidth data signal or a high-frequency clock signal.

A ball grid array package according to an embodiment of the present invention comprises: a first circuit board; the second circuit board is arranged above the first circuit board; a first solder ball and a second solder ball disposed between the first circuit board and the second circuit board so as to be spaced apart from each other; a first adhesive disposed between the first circuit board and the second circuit board so as to extend from an upper surface of the first circuit board to a lower surface of the second circuit board along a first side surface of the first solder ball; and a second adhesive disposed between the first circuit board and the second circuit board so as to extend from an upper surface of the first circuit board to a lower surface of the second circuit board along a second side surface of the second solder ball. A first side surface of the first solder ball and a second side surface of the second solder ball are disposed to face each other. The first binder and the second binder form a channel region between the first circuit board and the second circuit board. An area of the channel region corresponds to 30%-70% of an area of a gap between a first side surface of the first solder ball and a second side surface of the second solder ball.

The application discloses a quantum device and an electronic device and a preparation method thereof, and belongs to the field of quantum information. The quantum device comprises a quantum chip, a signal transmission element formed on the quantum chip, and a connecting part electrically connected with the signal transmission element; a packaging substrate, a lead-out part formed on the packaging substrate, and a lead-out signal line for electrically connecting with a signal connector, the lead-out signal line being electrically connected with the lead-out part; and a ball grid array electrically connecting the corresponding connecting part and the lead-out part. The ball grid array electrically connects the connecting part and the lead-out part corresponding to the signal transmission attribute, thereby realizing the electrical connection between the quantum chip and the transmission line, and further leading out the connecting part to the external signal connector. In the application, the ball grid array does not generate a complex field effect, and the electrical connection of the corresponding connecting part and the lead-out part by the ball grid array can avoid the interference caused by the bonded aluminum wire.

The invention discloses a Ka wave band four-channel transceiving SiP module based on silicon-based packaging and a manufacturing method thereof, the SiP module adopts a silicon-based packaging material and comprises an upper layer sub-packaging and a lower layer sub-packaging, and the upper layer sub-packaging and the lower layer sub-packaging are vertically interconnected through a ball grid array (BGA); the lower-layer sub-package comprises three layers of silicon adapter plates with a first thickness, a cavity for mounting a three-port transceiver chip is etched on the middle-layer silicon adapter plate, and a TSV with a first diameter is manufactured on each layer of silicon adapter plate; the upper layer sub-package comprises three layers of silicon adapter plates, the upper layer silicon adapter plate and the lower layer silicon adapter plate have a first thickness and are provided with TSVs with a first diameter, the middle layer silicon adapter plate is etched with a cavity used for mounting a silicon-based amplitude-phase multifunctional chip and a power supply modulation chip, the middle layer silicon adapter plate has a second thickness and is provided with TSVs with a second diameter, and the middle layer silicon adapter plate is etched with a cavity used for mounting a silicon-based amplitude-phase multifunctional chip and a power supply modulation chip. Wherein the second thickness is greater than the first thickness and the second diameter is greater than the first diameter. According to the invention, the requirements of miniaturization, integration and high performance of a radar system can be met.

The application discloses a kind of ball grid array package chip solder ball bubble defect automatic detection method and system, it is related to chip intelligent detection technical field, the method is guided by designing semantic cross-layer fusion framework, realizes multi-scale feature balanced fusion in neck network by introducing feature alignment and redistribution module, strengthens small target details and semantic information using local semantic enhancement module, and the positioning accuracy of bubble is optimized in combination with smooth geometry positioning loss function.The application significantly improves the detection capability of small, fuzzy and occluded bubbles, has strong robustness and generalization, and can be widely used in solder ball bubble, material porosity and surface defect industrial vision detection scene.

The invention discloses a water-soluble soldering flux capable of being used for high-temperature ball mounting, which belongs to the technical field of electronic packaging, and comprises the following components in percentage by mass: 70-95% of ionic liquid, 5-30% of organic acid, 5-30% of cosolvent and 0.1-10% of other functional components, and the sum of the mass percentages of the components is 100%. The water-soluble soldering flux is prepared by heating, mixing, stirring and cooling. The soldering flux can be applied to electronic soldering tin welding processes such as a surface mounting process and a ball grid array (BGA) ball mounting process. The high-temperature-resistant ionic liquid and the high-temperature-resistant organic acid are used for manufacturing the high-temperature-resistant scaling powder, meanwhile, the high decomposition temperature of the high-temperature-resistant ionic liquid and the high-temperature-resistant organic acid is used for increasing the active window of the scaling powder, the situation that the active temperature window is too low due to use of a traditional solvent is avoided, and the high-temperature-resistant scaling powder can be used for high-temperature or high-

Embodiments of the present disclosure relate to a heat sink design for a flip chip ball grid array. A flip chip ball grid array (FCBGA) includes a substrate, a cavity-forming annular stiffener, an external heat sink, and a thermal interface material. The cavity-forming annular stiffener is disposed on the substrate. The cavity-forming annular stiffener has a portion that forms a cavity with the substrate and exposes the top of the silicon chip. The external heat sink is disposed on the silicon chip and on a section of the cavity-forming annular stiffener. The thermal interface material separates the section of the cavity-forming annular stiffener and the top of the silicon chip from the external heat sink and conducts heat from the silicon chip to the external heat sink.

The invention provides a packaging structure, an integrated circuit, a memory and electronic equipment, and belongs to the technical field of semiconductors. The packaging structure comprises: a packaging substrate; the first ball grid array is located on the first surface of the packaging substrate, the first ball grid array comprises first metal balls and second metal balls adjacent to the first metal balls, the first metal balls are electrically coupled to the first surface through first bonding pads, and the second metal balls are electrically coupled to the first surface through second bonding pads; a connection part electrically coupled with the first pad; the functional part is connected with the first metal ball through a connecting part, the functional part comprises a plurality of metal discs and a plurality of metal wires which are located above the second bonding pad, and every two adjacent metal discs are connected through one metal wire. According to the invention, when an electric signal is transmitted through the first metal ball, far-end crosstalk and impedance discontinuity between the first metal ball and the second metal ball can be reduced.

A semiconductor package structure includes: an interposer board, including a top side and a bottom side; a first ball grid array located on the bottom side of the interposer board, the first ball grid array including plural first soldering balls, wherein the first ball grid array provides a signal connection function between the interposer board and an external printed circuit board; and a second ball grid array located on the bottom side of the interposer board, the second ball grid array including plural second soldering balls, which are positioned within gaps between the first soldering balls on the bottom side.