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397 results about "Land grid array" patented technology
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The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
High performance, low cost microelectronic circuit package with interposer
InactiveUS6888240B2Semiconductor/solid-state device detailsSolid-state devicesPin grid arrayInterposer
A low cost technique for packaging microelectronic circuit chips fixes a die within an opening in a package core. At least one metallic build up layer is then formed on the die / core assembly and a grid array interposer unit is laminated to the build up layer. The grid array interposer unit can then be mounted within an external circuit using any of a plurality of mounting technologies (e.g., ball grid array (BGA), land grid array (LGA), pin grid array (PGA), surface mount technology (SMT), and / or others). In one embodiment, a single build up layer is formed on the die / core assembly before lamination of the interposer.
Owner:INTEL CORP
Land grid array socket
InactiveUS7001197B2High strengthDurableEngagement/disengagement of coupling partsElectric discharge tubesLand grid arrayElectrical and Electronics engineering
A land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts. A lever is pivotally mounted on a second end of the insulative housing. The lever has a locking portion for locking the cover member in the closed position. A metallic reinforcing plate is positioned on a bottom surface of the housing. The metallic reinforcing plate extends between the first end and the second end of the insulative housing.
Owner:TYCO ELECTRONICS JAPAN GK
BGA/LGA with built in heat slug/spreader
A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.
Owner:STMICROELECTRONICS SRL
Flip chip shielded RF I/O land grid array package
InactiveUS20080150094A1Semiconductor/solid-state device detailsSolid-state devicesEngineeringRadio frequency
A novel apparatus and method for providing a radio frequency (“RF”) input / output (“I / O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings surrounding free-standing RF I / O interconnects. The free-standing RF I / O interconnects eliminate long leads and the shield rings provide ground protection thereby minimizing losses, inductance, leakage, and crosstalk, and improving performance.
Owner:COBHAM DEFENSE ELECTRONICS SYST CORP
Land grid array connector assembly with sliding lever
InactiveUS6758691B1Engagement/disengagement of coupling partsComponent plug-in assemblagesEngineeringElectrical connector
An electrical connector assembly (1) for electrically connecting an electronic package (2) with a circuit substrate (4). The connector assembly includes a socket (11), and a fastening device (10) surrounding the socket. The fastening device includes an insulative frame (13), and a lever (12) and a metal clip (14) respectively pivotably mounted to a first side (131) and a second side (132) of the frame. The first side of the frame defines a pair of guiding grooves (161). Each guiding groove is bounded in part by a lower arcuate wall (162) and an upper arcuate wall (163). The lever includes a pair of acting portions (123) movably received in the guiding grooves. When the lever is rotated from a vertical position down toward the clip, the acting portions of the lever slide from the lower walls to the upper walls.
Owner:HON HAI PRECISION IND CO LTD
Land grid array connector assembly with pick up cap
InactiveUS6877990B2Avoid damagePrinted circuit assemblingElectric discharge tubesLand grid arrayMechanical engineering
An LGA connector assembly (1) includes an LGA connector (2) and a generally rectangular pick up cap (3). The connector includes an insulative housing (21), a plurality of contacts (22) received in the housing, and a metal clip (25). The housing defines a cavity (210) for receiving an LGA central processing unit (CPU) therein. The clip is disposed on the housing to press the CPU upon the contacts. The pick up cap is generally rectangular, and has a plurality of clasps (307, 308) at two opposite ends thereof. The clasps snappingly clasp edges of the clip of the connector, thereby securely mounting the pick up cap onto the connector. The pick up cap has a flat top surface (300) to be engaged by a vacuum suction device. The LGA connector assembly thus can be moved to a desire location on a printed circuit board (PCB).
Owner:HON HAI PRECISION IND CO LTD
Land grid array connector including heterogeneous contact elements
ActiveUS7070419B2Printed circuit assemblingContact member assembly/disassemblyElectrical connectionElectrical connector
An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.
Owner:NEOCONIX INC
LGA socket contact
InactiveUS6976888B2Arrangement pitch can be reducedMinimize connection resistanceElectric discharge tubesSecuring/insulating coupling contact membersContact padEngineering
A land grid array socket contact has a resilient contact that extends parallel to a base plate and is attached to at least one side walls of the base plate by a curved section angled approximately 180 degrees from the at least one side wall. The resilient contact has a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board. In another embodiment, the land grid array socket contact has a resilient contact extending from an upper end of a base plate. The resilient contact has an elongated slit substantially in a center of the resilient contact with respect to a direction of width and a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board.
Owner:TYCO ELECTRONICS JAPAN GK
Land grid array packaged device and method of forming same
InactiveUS7205178B2Semiconductor/solid-state device detailsSolid-state devicesShell moldingElectrical connection
Owner:TAIWAN SEMICON MFG CO LTD
Solderless electronics packaging
InactiveUS6840777B2Printed circuit assemblingSemiconductor/solid-state device detailsData processing systemElectronic systems
To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive elements, such as compressible button contacts, and an apertured support that aligns the button contacts with corresponding lands on the IC package and substrate. In another embodiment, the connector includes electrically conductive pins embedded in a thin plastic sheet. In a further embodiment, the connector includes a microcrystalline film having electrically conductive crystals. In a further embodiment, the compression connector is used within an IC package to couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.
Owner:INTEL CORP
DC-DC converter implemented in a land grid array package
InactiveUS6940724B2Improve heat dissipation characteristicsHigh densityEfficient power electronics conversionSemiconductor/solid-state device detailsMOSFETSemiconductor chip
A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC—DC converter is conducted out of the LGA package through the plurality of pads.
Owner:PWER BRIDGE
Method of fabricating a molded package for micromechanical devices
InactiveUS6858910B2Flat surfaceHigh glossAcceleration measurement using interia forcesSemiconductor/solid-state device detailsSpatial light modulatorShell molding
A plastic land-grid array package, a ball-grid array package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by lining the cavity surfaces of the top and bottom mold halves with a protective plastic film, which also protects the surfaces of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate.It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
Owner:TEXAS INSTR INC
Land grid array socket having terminals with spring arms
InactiveUS7074048B2Improve securityHigh densityCoupling contact membersTwo-part coupling devicesMechanical engineeringLand grid array
A land grid array socket is provided which includes an insulative housing (22) having a plurality of passageways (24) each accommodating an electrical terminal (1) therein. Contacting ends (134) of the terminal in a same row of the passageways all extend along a predetermined lateral direction, and because of bend of a bending portion (132) in the terminal, the contacting end of the terminal in one passageway does not overlap with another terminal in an adjacent passageway along a vertical direction so as to avoid short circuit risk therebetween.
Owner:HON HAI PRECISION IND CO LTD
Chip-last embedded interconnect structures and methods of making the same
The various embodiments of the present invention provide a novel chip-last embedded structure, wherein an IC is embedded within a one to two metal layer substrate. The various embodiments of the present invention are comparable to other two-dimensional and three-dimensional WLFO packages of the prior art as the embodiments have similar package thicknesses and X-Y form factors, short interconnect lengths, fine-pitch interconnects to chip I / Os, a reduced layer count for re-distribution of chip I / O pads to ball grid arrays (BGA) or land grid arrays (LGA), and improved thermal management options.
Owner:GEORGIA TECH RES CORP
Circuitized connector for land grid array
InactiveUS6869290B2Printed circuit assemblingContact member assembly/disassemblyElectrical connectionEngineering
A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.
Owner:NEOCONIX INC
Secure digital memory card using land grid array structure
ActiveUS7293716B1Complex signalEliminate needSemiconductor/solid-state device detailsSolid-state devicesDigital storageElectronic component
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD
Molded package for micromechanical devices and method of fabrication
InactiveUS7026710B2Low costIncrease productionSemiconductor/solid-state device detailsSolid-state devicesSpatial light modulatorMicromachinery
Owner:TEXAS INSTR INC
Land grid array socket
InactiveUS20070042615A1Ensure electrical connection reliabilityFirmly connectedSecuring/insulating coupling contact membersElectrical apparatus contructional detailsElectrical connectionEngineering
A land grid array socket (10) includes a dielectric housing (20) defining a number of passages (204) between an upper surface (202) and a lower surface (206) thereof and a number of terminals (30) residing in corresponding passages, respectively. Each terminal includes a base portion (300) secured in the passage and a flexible arm (302) successively sticking out of the upper surface and the lower surface of the housing to define an upper contacting portion (3022) and a lower contacting portion (3026). The upper contacting portion defines multiple contacting areas, so as to establish reliable electrical connection between the terminal and a land grid array package (40) seated thereon.
Owner:HON HAI PRECISION IND CO LTD
Land grid array socket with reinforcing plate
InactiveUS6848929B2Resists deformation and warpageImprove rigidityEngagement/disengagement of coupling partsComponent plug-in assemblagesPull forceContact pad
A land grid array socket (1) includes an insulative base (2) mounted on a printed circuit board, a metal clip (3) pivotably engaged on the base, and a lever (4) for fastening the clip onto the base. The clip (3) and the lever are respectively mounted on two opposite ends of the base to fasten an LGA package. A reinforcing plate (5) made of rigid material is insert molded into the base. The reinforcing plate is generally a rectangular frame, and it includes four integrated sides (51). A substantially rectangular opening (52) is defined among the sides. Therefore, the rigidity of the base is improved, and the deformation or warpage under the pulling forces on two opposite ends of the base is diminished, thereby ensuring steady electrical connection between the contacts pads of the LGA package and respective contacts of the base.
Owner:HON HAI PRECISION IND CO LTD
Method and Apparatus for Electrically Connecting Two Substrates Using a Land Grid Array Connector Provided with a Frame Structure Having Power Distribution Elements
InactiveUS20080239683A1Line/current collector detailsElectrically conductive connectionsPower cableInterposer
A method and apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and / or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and / or adjacent to a peripheral edge of one or more quadrants in the form of stacked and / or parallel bus bars each defining a power domain.
Owner:IBM CORP
Flexible land grid array connector
InactiveUS7021941B1Ensure electrical connection reliabilityIncreased durabilityElectrically conductive connectionsCoupling device detailsElastomerChemical plating
An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.
Owner:SPEED TECH
Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
ActiveUS20060044735A1Easy to makeFacilitates layer configurationSemiconductor/solid-state device detailsPrinted electric component incorporationSolder ballBall grid array
A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
Owner:DENSO CORP +1
Electrical contact having asymmetric dual-contact-engaging-arm
InactiveUS7563105B2Avoid contactReliable electrical connectionEngagement/disengagement of coupling partsPrinted circuitsEngineeringLand grid array
A contact (1) is provided for use in a land grid array (LGA) socket (300). The contact (1) of the present invention comprises a support body (12), a first contact arm (13) and a second contact arm (14) respectively extend from the same lengthwise side of the supporting body (12) through a first curved arm (131) and a second curved arm (141), a plurality of barb (111) configured in the support body (12) are adapted to securely hold the contact (1) in a hole (202) of a insulative housing. The two contact arms (13), (14) with different length are parallel one another and not aligned in the same plane for preventing contacts from undesired short caused by touching of adjoining contacts while an integrated circuit is mounted in the socket.
Owner:HON HAI PRECISION IND CO LTD
Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member
InactiveUS20070227769A1High retention rateLine/current collector detailsCoupling device detailsInterposerLand grid array
A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).
Owner:BRODSKY WILLIAM LOUIS +4
DC-DC converter implemented in a land grid array package
InactiveUS7026664B2Improve power densityImprove heat dissipation characteristicsTransistorThyristorElectricityDc dc converter
A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array. The land grid array includes external pads that are separated into an interior region and a peripheral region. Each external pad located in the interior region of the land grid array is electrically and thermally coupled a via array.
Owner:BEL POWER SOLUTIONS INC
Land grid array connector with canted electrical terminals
InactiveUS20040002234A1Coupling contact membersElectrical connection printed elementsElectricityCoil spring
An electrical connector (3) for electrical interconnection of a pair of circuit substrates (5, 6) includes a carrier plate (7) defining a plurality of openings (71) retaining electrical terminals (4) therein. The openings correspond to circuit pads (51, 61) on the circuit substrates. Each terminal generally has a canted coil spring configuration. Each loop of the canted coil spring configuration has curved contact portions (41, 42) for bearing against corresponding circuit pads, engaging portions (43) for engaging side walls of the carrier plate at a corresponding opening, and connection portions interconnecting the curved contact portions and the engaging portions. Radiuses of curvature of the curved contact portions are less than radiuses of curvature of the connection portions of each loop. Each loop closely abuts an adjacent loop of the terminal. Relatively large contact normal force is thus attained when the curved contact portions bear against the corresponding circuit pads.
Owner:HON HAI PRECISION IND CO LTD
Components, methods and assemblies for multi-chip packages
ActiveUS7061122B2Reduce the overall heightImprove repair capabilityPrinted circuit assemblingSemiconductor/solid-state device detailsSemiconductor chipSystem in package
Owner:TESSERA INC
Contact for land grid array socket
InactiveUS6905377B2Engagement/disengagement of coupling partsCoupling contact membersSurface mountingEngineering
A contact is provided for use in a land grid array (LGA) socket. The contact includes a support body defining a support body plane. The support body is configured to be held in a hole in an LGA socket and has opposed side edges. The contact also includes a contact beam having a base portion projecting from one of the side edges. The base portion extends along a base axis and has an upper end joined at a deflectable bend with an outer portion of the contact beam. The outer portion is configured to have surface mounted thereon an adjoining contact, and the outer portion projects from the bend at a first angle with respect to the base axis and at a second angle with respect to the support body plane.
Owner:TYCO ELECTRONICS LOGISTICS AG (CH)
Folded package camera module and method of manufacture
InactiveUS20080170141A1Television system detailsTelevision system scanning detailsFlexible circuitsComputer module
An image-capture-device / processor package includes a flexible circuit substrate, an image capture device mounted on the flexible circuit substrate, a second device (e.g., processor) mounted on the flexible substrate, and a stiffener for at least partially supporting the second device. The ICD and the second device may be flip-chip mounted to the same surface of the flexible circuit substrate. The flexible circuit substrate may be folded so that the ICD is positioned back-to-back with the second device. The flexible circuit substrate may further include Land Grid Array (LGA) pads formed thereon to facilitate electrical connection with a host device.
Owner:FLEXTRONICS AP LLC
Lead frame land grid array
ActiveUS20090209064A1Reliable structure for handlingIncrease speedSemiconductor/solid-state device detailsSolid-state devicesEngineeringLead frame
A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
Owner:UTAC HEADQUARTERS PTE LTD
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