381 results about "Chemical plating" patented technology

The invention belongs to the technical field of conductive microsphere preparation, and particularly relates to a surface-roughened nickel-plated conductive microsphere and a preparation method and application thereof. The preparation method comprises the following steps: carrying out pretreatment to enable the surfaces of the polymer microspheres to contain nickel ions, reducing the nickel ions into nickel nanoparticles, activating the microspheres and carrying out chemical plating. According to the invention, the specific surface area of the conductive microspheres is increased by reducing the nickel nanoparticles on the surfaces of the microspheres, a large amount of impurities cannot be generated among the microspheres, and adhesion among the microspheres can be effectively prevented. According to the prepared conductive microspheres, the plating layer and the polystyrene microspheres are firmly combined, and the risk that the conductivity is reduced due to the fact that the surface of the plating layer falls off is reduced. The preparation method is safe, environment-friendly, simple, convenient and suitable for industrial production requirements.

The invention discloses a protruding conductive microsphere and a pretreatment method thereof. The pretreatment method specifically comprises the steps of roughening treatment, protruding and interface activity treatment, sensitization treatment, activating treatment and chemical plating. In the protruding and interfacial activity treatment, by adding an interfacial agent, the electronegativity of the surfaces of the microspheres is enhanced, electrostatic adsorption with positively charged nickel nanoparticles is generated, and meanwhile, agglomeration of the nickel nanoparticles on the surfaces of the polymer microspheres is effectively prevented through the steric hindrance effect; therefore, a nickel nanoparticle bulge structure which is high in density, uniform in distribution and firm in combination is formed on the surface of the polymer microsphere. The method effectively solves the problems that a traditional conductive microsphere coating is prone to cracking and falling off, poor in dispersity and the like, the prepared protruding conductive microspheres have the outstanding advantages of being high in coating binding force, excellent in conductivity, good in dispersity, not prone to agglomeration and the like, the technological process is simple, mass production is easily expanded, and the method is suitable for large-scale production. The anisotropic conductive adhesive film has a wide commercial application prospect in the field of electronic packaging such as anisotropic conductive adhesive films.

The invention belongs to the field of hard alloy materials, and provides a modified high-performance non-magnetic hard alloy and a preparation process thereof. The surface of a WC particle is chemically plated with a Ni-P-B-Cr-Cu amorphous shell layer, and a binding phase is converted into Ni3P and Ni3B nanophase through two-stage sintering. The WC alloy comprises the following components in parts by weight: 85-95 parts of WC, 12-25 parts of a binding phase and 0.5-1.4 parts of a grain growth inhibitor, the nanophase accounts for 35-50% of the volume of the binding phase and 35-50% of the total volume of the binding phase, and the grain size is 80-125 nm; the average grain size of WC is 0.6-1.0 [mu] m; and the thickness of an interface P enrichment layer is 8-15 nm (the coverage rate is 85-95%). Through interface engineering and controlled crystallization from amorphous to nanocrystalline, the relative magnetic conductivity is 1.001-1.015, the hardness HRA is 90.5-93.0, the strength TRS is 2.2-3.0 GPa, the toughness KWP is 300-450 N / mm, and the magnetic saturation strength is 0.02-0.15 T. The problem of decoupling of the magnetic property and the mechanical property of a traditional non-magnetic hard alloy is solved, and the non-magnetic hard alloy is suitable for magnetic sensitive environments such as semiconductor equipment, precise measurement, MRI tools and oil service logging.

The invention relates to the technical field of photovoltaics, and discloses photovoltaic conductive silver-coated copper micro powder and a preparation method thereof, and the preparation method aims to solve the problem that performance and cost of existing silver-coated copper micro powder in photovoltaic application are difficult to consider at the same time. Through pH adjustment, organic pre-bonding treatment and gradient ammonification, the activity of the copper powder is reserved, and a uniform copper-ammonia complexing layer is constructed; in the chemical silver plating stage, the pretreatment liquid is added into a composite base solution containing a complexing agent, organic amine, a dispersing agent and a combined reducing agent, and a silver-ammonia solution is dropwise added for reaction under ultrasonic dispersion and nitrogen introduction protection; and in the post-treatment stage, a finished product is obtained through ethanol reflux desorption, antioxidant treatment, vacuum drying, low-temperature plasma activation and screening, uniform and complete coating of a silver layer can be achieved under the low silver content, and a feasible path is provided for replacing photovoltaic pure silver powder with silver-coated copper micro powder on a large scale.

The invention relates to a preparation method of a ceramic-based composite material, in particular to a preparation method of a ceramic-based composite material with a pyrolytic carbon-carbon nanotube interface, which is used for solving the problem that in the aspect of improving the thermal conductivity of an interface layer, metals such as Fe, Co, Ni and the like are widely used as catalysts for growing carbon nanotubes at present, so that the thermal conductivity of the interface layer is improved. Carbon nanotubes obtained through a traditional preparation method are prone to agglomeration and uneven in distribution, the risk of the preparation process is high, the carbon nanotubes are not suitable for large-scale production, although metal particles can be reduced through a chemical plating method, the particle sizes of the metal particles are not controlled, the distribution of the metal particles is uneven, and the requirement of a chemical vapor reduction method for distribution of an earlier-stage metal salt solution is high. And the defect is difficult to realize easily. According to the preparation method of the ceramic-based composite material with the pyrolytic carbon-carbon nanotube interface, the ceramic-based composite material with the pyrolytic carbon-carbon nanotube interface is finally obtained through pretreatment, solution A preparation, metal salt solution in-situ reduction and chemical vapor deposition in sequence.

The invention discloses a composite material with a shielding function, a preparation method thereof and an interphone shell. The composite material comprises a polycarbonate-acrylonitrile-butadiene-styrene copolymer, a modified conductive filler, maleic anhydride grafted polyethylene, polyaryletherketone, a flame retardant, an antioxidant, glass microfibers and a compatilizer, wherein the modified conductive filler is aluminum oxide ceramic particles subjected to chemical copper plating and graft polymerization treatment. The preparation method comprises the steps of modified conductive filler preparation, step-by-step raw material mixing, twin-screw extrusion granulation and drying. The interphone shell is prepared from the composite material through injection molding, and the injection molding process comprises the steps of raw material drying, injection molding machine preheating, charging and injection molding, and demolding and finishing. The composite material is stable in electromagnetic shielding performance and has good mechanical strength and heat resistance; the preparation method can improve the dispersity of the components and is adaptive to conventional equipment; the interphone shell can block electromagnetic wave interference, is suitable for being used in multiple environments, and meets the requirements of an electronic equipment shell for shielding and structural performance.

The invention relates to the technical field of composite metal materials, in particular to a silver-coated graphene copper composite material and a preparation method thereof, and aims at solving the problems that traditional silver-coated copper powder is high in silver consumption, copper is oxidized due to the fact that a silver layer is prone to being damaged, and conductivity is insufficient. The method comprises the steps that a graphene coating layer is formed on a copper powder substrate in situ through chemical vapor deposition, and graphene copper powder is obtained; performing etching treatment on the graphene copper powder to controllably expose part of the copper substrate so as to form anchoring points for silver ion deposition; carrying out reduction treatment on the etched graphene copper powder so as to ensure that an anchoring site has chemical activity; in a reductive liquid phase environment, enabling a chemical silver plating solution to react with the graphene copper powder subjected to reduction treatment, and guiding silver ion deposition by utilizing an anchoring point, so as to form a silver coating layer on the surface of the graphene coating layer; and separating and drying the reacted system to obtain the silver-coated graphene copper composite material. The material is better in oxidation resistance and conductivity, and the process is free of waste liquid.

The invention provides a copper etching solution and application thereof. The copper etching liquid comprises an inorganic acid, hydrogen peroxide, an azole compound, a halogen ion source and an amine compound, wherein the amine compound is selected from a compound shown in a formula 1 or an ammonium salt with a structural fragment shown in a formula 2. When the copper etching solution is applied to etching treatment on a chemical copper plating seed layer by a semi-additive method, the copper etching solution shows excellent differential etching capability, and has no obvious etching on the side wall of electroplating copper and the seed layer at the bottom of a copper circuit on the basis of effectively removing the seed layer between the copper circuits, so that the etching quality of the copper plating seed layer is improved. The undercut phenomenon can be prevented, the line width reduction amount is small, and the reliability degree of micronized line wiring can be obviously improved.

The invention discloses a coating for a chemical plating process and a preparation method of the coating, and belongs to the field of three-dimensional precision machining. The coating is arranged on the surface of a base material, and based on the mass percentage of the coating, the coating comprises 55%-85% of a cross-linked product of an epoxy resin AB agent, 1%-5% of nano metal particles and 10%-40% of water-soluble polymers. The coating is adopted for a chemical plating process, the process steps are few, and the binding force between a metal circuit and a base material in the prepared three-dimensional interconnection molding device is excellent.

A metal interconnect structure is doped with zinc, indium, or gallium using top-down doping processes to improve diffusion barrier properties with minimal impact on line resistance. Dopant is introduced prior to metallization or after metallization. Dopant may be introduced by chemical vapor deposition on a liner layer at an elevated temperature prior to metallization, by chemical vapor deposition on a metal feature at an elevated temperature after metallization, or by electroless deposition on a copper feature after metallization. Application of elevated temperatures causes the metal interconnect structure to be doped and form a self-formed barrier layer or strengthen an existing diffusion barrier layer.

The present application relates to a modified diamond micro-powder and a preparation method and application thereof. The preparation method of the modified diamond micro-powder comprises the following steps: performing hydroxylation treatment on diamond micro-powder to obtain surface hydroxylated diamond micro-powder; performing pretreatment on the surface hydroxylated diamond micro-powder in a mixed solution of a silane coupling agent and an organic solvent under ultrasonic conditions with a frequency of 25KHz-40KHz and an intensity of 1W / cm 2 -3W / cm 2 to obtain pretreated diamond micro-powder; and performing vacuum heat treatment on the pretreated diamond micro-powder to obtain modified diamond micro-powder. The preparation method greatly improves the bonding force between the modified layer and the diamond and improves the micro-powder agglomeration, so that the pretreatment link before chemical plating has the feasibility of batch processing, which not only doubles the production efficiency, but also reduces the production cost to one third of the traditional method.

The invention discloses a micro-through-hole structure polymer metallization method for guided wave transmission, and belongs to the technical field of photoelectric device processing, a polymer substrate is used for replacing a traditional all-metal material, and the micro-through-hole structure polymer metallization method for guided wave transmission is achieved through the multi-stage processes of plasma activation, chemical coarsening, sensitization, chemical plating, electroplating and the like. And forming a compact and high-adhesion metal layer on the inner surface of the through hole of the polymer substrate. In the process, a microfluid pump or a peristaltic pump is adopted to drive the solution to circularly flow in the through hole and the microcavity. According to the micro-through-hole structure polymer metallization method for guided wave transmission, dynamic flowing of a chemical plating solution in a micro-through hole and an internal cavity is achieved by introducing a micro-fluid pump or a peristaltic pump, and therefore a uniform, compact and firmly-attached metal layer is obtained.

The invention provides a high-entropy rare earth doped WC hard alloy and a preparation method and application thereof, and belongs to the technical field of alloys. The precursor is prepared through wet codeposition, compared with ball-milling mixing, atomic-scale dispersion can be achieved, rare earth segregation can be avoided, high-entropy rare earth nano-particles are distributed in WC crystals and pinned in WC crystal boundaries, dislocation movement is hindered, meanwhile, WC is doped with high-entropy rare earth, all elements in the high-entropy rare earth act synergistically, the hardness and strength of the alloy are improved, and the performance of the alloy is improved. And compared with chemical plating, Co is plated through magnetron sputtering, the interface bonding strength can be improved, introduction of impurities is avoided, and the hardness and strength of the alloy are further improved. The result of the embodiment shows that the hardness of the prepared high-entropy rare earth doped WC hard alloy is 93.9 HRA or above, and the bending strength is 2980 MPa or above.

The invention discloses a wear-resistant hybrid core-shell electric contact material and a preparation method, and relates to the technical field of electric contact materials, the electric contact material is prepared by taking copper as a matrix, adding SiC (at) Cu composite powder, CNT (at) Cu composite powder, Ti3SiC2 powder and a rare earth oxide dopant, and preparing the composite powder, mixing the powder, forming, sintering and the like. The composite powder with the core-shell structure is prepared through chemical plating, magnetron sputtering, chemical vapor deposition and other technologies, the interface wettability of a reinforcing phase and a copper matrix is effectively improved, through the multi-element hybrid reinforcing design, the hardness, abrasion resistance and heat conduction performance of the material are synergistically improved, the thermal expansion coefficient and the friction factor are reduced, and the service life of the material is prolonged. The prepared electric contact material has excellent comprehensive performance, can be widely applied to the fields of electric locomotive pantograph slide plates, electronic packaging and the like, and is stable and controllable in preparation process and suitable for industrial production.

This invention relates to the field of photovoltaic technology and discloses a conductive silver-coated copper micropowder for photovoltaic applications and its preparation method. This preparation method aims to solve the problem of balancing performance and cost in existing silver-coated copper micropowders for photovoltaic applications. In this invention, during the pretreatment stage, the base copper powder is acid-washed but not water-washed. It undergoes pH adjustment, organic pre-bonding treatment, and gradient ammoniation to retain the activity of the copper powder and construct a uniform copper-ammonia complex layer. In the chemical silver plating stage, the pretreatment solution is added to a composite base liquid containing a complexing agent, organic amine, dispersant, and combined reducing agent. A silver-ammonia solution is then added dropwise under ultrasonic dispersion and nitrogen protection. In the post-treatment stage, the product undergoes ethanol reflux desorption, antioxidant treatment, vacuum drying, and low-temperature plasma activation, followed by sieving to obtain the final product. This method can achieve uniform and complete silver coating even with low silver content, providing a feasible path for the large-scale replacement of pure silver powder for photovoltaic applications with silver-coated copper micropowder.

The invention discloses a weaving machine metal part with a low-friction coating and a manufacturing method of the weaving machine metal part, and belongs to the technical field of textile machinery. A body is subjected to heat treatment, magnetic flow grinding, alkaline degreasing, acid activation, ultrasonic cleaning and plasma activation, then a chromium electroplating transition layer or a chemical plating Ni-P transition layer is applied, suspension liquid spraying or powder spraying or dipping is used, sintering curing is cooperated, a PTFE self-lubricating layer is applied, and the self-lubricating composite material is obtained. And finally, the compact Ni / Cr-PTFE-based composite coating is formed on the metal part of the weaving machine. The PTFE self-lubricating layer provides an extremely low friction coefficient, and yarn abrasion and part temperature rise are remarkably reduced; and the Ni / Cr transition layer greatly enhances the bonding strength of the PTFE layer and the steel substrate, and effectively prevents stripping and micro-cracking of the coating in high-speed weaving, so that effective protection of high-performance fibers is synchronously realized, and the service life of parts is remarkably prolonged.

The invention discloses silver-coated copper powder and a preparation method thereof, and the preparation method comprises the following steps: etching copper powder by using a composite alkaline reagent to obtain pretreated copper powder; the composite alkaline reagent is a mixed solution containing a surfactant and aliphatic polyamine; preparing a copper solution by using the pretreated copper powder; and dropwise adding the silver plating solution into the copper solution, and carrying out chemical silver plating reaction to obtain the silver-coated copper powder. Compared with the prior art, the method has the advantages that the chemical silvering reaction is a one-step method and can be achieved in a single container, the chemical silvering reaction is short in time and can be completed within 60 min, the prepared silver layer is compact under the resolution ratio of 5 nm, the silver content in the silver-coated copper powder is adjustable within the range of 15 wt%-60 wt%, the silver ion utilization rate is close to 100%, and the temperature process window is wide.

The invention discloses a PPS and glass fiber composite material surface metallization pretreatment process and a product and application thereof, and belongs to the technical field of surface treatment.The PPS and glass fiber composite material surface metallization pretreatment process comprises the following steps that after being subjected to acid treatment, a base material is sequentially placed in a first organic compound and a second organic compound to be soaked, and finally, activating the surface of the base material through a palladium activation process to form a high-activity catalyst layer, carrying out tin removal treatment through an accelerant to remove redundant tin on the surface, and carrying out chemical plating to form a metal layer, thereby completing the surface metallization pretreatment of the base material. The base material is a composite material of PPS and glass fibers, and the mass fraction of the glass fibers in the composite material is 30-50%. The invention provides the surface metallization pretreatment process for the PPS and glass fiber composite material, and the bonding performance of the material surface and the metal layer is excellent. The composite material treated by the method can be widely applied to chemical plating or electroplating, and has definite industrial operability.

The invention relates to the technical field of metal composite materials, in particular to high-conductivity low-cost copper-iron composite powder and a full-coating preparation method thereof.The two steps of chemical copper plating and 450-600 DEG C heat treatment are combined, micro-pores in an initial copper layer are diffused and healed by atoms, a compact copper shell is formed, the surface of the composite powder is free of red rust after a test, and the copper-iron composite powder is high in conductivity and low in cost. The corrosion resistance is improved compared with that of a non-heat-treated sample; a 0.5-3 m mutual diffusion layer is formed on the copper-iron interface through heat treatment, metallurgical bonding is achieved, the interface shear strength is improved to be larger than or equal to 25 MPa from less than 10 MPa of traditional physical bonding, and the problem that a coating layer is prone to stripping in the subsequent pressing, sintering or using process is solved.

The invention discloses a scheme for realizing strain sensor performance modulation based on laser-induced programming, and belongs to the technical field of flexible electronic device preparation. According to the method, different laser etching schemes are used according to the actual requirements of different application scenes, a substrate is induced to generate a specific microstructure morphology, and the thickness gradient of a surface metal film grown through subsequent chemical plating is influenced through the microstructure morphology. And finally, the stress distribution of the metal film in the stretching process is influenced by the thickness gradient to generate different crack morphologies, and the characteristic adjustment of the resistance change of the sensor is realized through the regulation and control of the crack morphologies. According to the scheme for realizing strain sensor performance modulation based on laser-induced programming provided by the invention, the effect of regulating and controlling the performance of the sensor as required is realized by using different laser etching modes and material proportions.

This invention belongs to the field of metal powder preparation technology, and discloses a porous nickel powder, its preparation method, and its applications. The method includes: preparing nickel oxalate powder as a precursor; forming a nickel coating layer on the surface of the nickel oxalate powder by chemical plating to obtain nickel oxalate@nickel core-shell structured composite particles; subjecting the composite particles to pyrolysis annealing treatment, causing the internal nickel oxalate to decompose and generate gas, and the external nickel coating layer to transform into a porous metal framework, thereby obtaining porous nickel powder. This method is simple, low-cost, and produces nickel powder particles with uniform size, stable pore structure, good connectivity, and large specific surface area, making it suitable as a precursor for electrocatalytic active materials or porous electrode materials.

The application discloses a surface strengthening method suitable for low-temperature steel friction pairs of polar ship with complex configuration, and aims at solving the problems of insufficient surface wear resistance of the friction pairs and difficulty in surface strengthening in the existing polar ship with complex configuration.The surface strengthening method of the low-temperature steel friction pairs comprises the following steps: firstly, polishing and ultrasonic cleaning are conducted on the low-temperature steel friction pair materials; secondly, nano-diamond particle powder and spherical hard ceramic particles are mixed by ball milling; thirdly, a nickel-based plating solution is prepared; fourthly, supersonic particle bombardment treatment is conducted on the surface of the clean friction pair materials; fifthly, a nickel-based plating layer is prepared by adopting a chemical plating or brush plating process; sixthly, the step four and the step five are repeated for multiple times; seventhly, a composite plating solution is prepared; and eighthly, a self-lubricating coating is prepared.The application prepares a multilayer composite structure coating comprising a hardening layer, an alloy layer and a self-lubricating layer, the coating has good combination performance, high hardness and wear resistance, and is suitable for the low-temperature steel friction pairs of the polar ship with complex configuration.

The invention belongs to the technical field of chemical tin plating, and particularly relates to a micro-nano powder surface tin plating method which comprises the following steps: pretreating powder, adding main salt, a reducing agent, a coordination agent and an antioxidant into water, and stirring until the main salt, the reducing agent, the coordination agent and the antioxidant are completely dissolved; and the pretreated powder is added into the cylinder opening liquid to be subjected to a reaction, when the surface of the solution is subjected to the reaction, the supplementing liquid is added, stirring continues to be conducted till the reaction is completed, and the micro-nano powder with the tin-plated surface is obtained. According to the method for plating tin on the surface of the micro-nano powder, tin is plated on the surface of the micro-nano split body, so that the surface energy of the material can be effectively reduced, the material can be more easily infiltrated and combined with welding flux in the welding process, the welding performance of the material is remarkably improved, and the material is high in oxidation resistance, high in conductivity, high in dispersity and high in corrosion resistance. The whole process is simple, stable and suitable for large-scale production and application.

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

The invention belongs to the technical field of conductive materials, and particularly relates to a method for preparing and activating pyridine functionalized swelling polymer microspheres and a method for preparing core-shell structure polymer conductive microspheres. The preparation method comprises the following steps: by taking polystyrene microspheres as seeds, preparing pyridine functionalized polymer microspheres through an emulsion swelling method, then introducing Pd < 2 + > ions through coordination, preparing activated microspheres with palladium nanoparticles uniformly coated on the surfaces of the polymer microspheres through in-situ reduction, preparing nickel-plated microspheres with uniform metal coatings through chemical plating, and finally preparing the polymer microspheres with uniform metal coatings. And finally, preparing the core-shell structure gold-plated polymer conductive microspheres through in-situ reduction, and applying the core-shell structure gold-plated polymer conductive microspheres to preparation of anisotropic conductive films. Through an emulsion swelling method, not only can the polymer microspheres with adjustable sizes be prepared, but also the polymer microspheres with different morphologies can be prepared. The preparation method of the conductive microspheres has the advantages of being wide in raw material source, easy and convenient to operate and adjustable in metal coating thickness, and is suitable for high-precision packaging in the microelectronic industry.

The invention relates to a foam metal growing on a polymer substrate and a preparation method thereof. Comprising the following steps: 1) a base material preparation stage: mixing a polymer combination and / or an auxiliary agent to obtain a base material; 2) a metal growth stage: performing pretreatment on the surface of the base material obtained in the step 1), and then growing metal in pores of the base material through chemical plating or water electroplating to obtain a polymer base material; (3) a base material dissolving stage: dissolving the polymer base material deposited with the metal obtained in the step (2) to obtain foam metal without the polymer base material; and 4) a post-treatment stage: carrying out anti-oxidation and drying treatment on the foam metal without the polymer base material obtained in the step 3) to obtain the foam metal. According to the preparation method, the high-porosity polymer base material is introduced, so that the metal uniformly grows in pores in the high-porosity polymer base material, and finally, the polymer base material is completely removed to obtain the foam metal.

The application discloses a constant-temperature platform surface flat processing technology, which is suitable for semiconductor carrier processing. The steps include substrate pretreatment, precision milling forming, composite coating preparation, flat-top laser-assisted precision polishing and constant-temperature curing. The substrate pretreatment removes stress and performs roughening cleaning; the precision milling ensures initial flatness; the composite coating sequentially prepares a nickel-phosphorus chemical plating bottom layer, a TiN transition layer and a DLC functional top layer; the flat-top laser precision polishing improves surface precision; and the constant-temperature curing eliminates internal stress. The application aims to overcome the defects of the prior art, such as insufficient precision, poor plating layer adhesion and low product qualification rate, by optimizing process steps, precisely controlling parameters, improving plating layer structure and solution formula, realizing high-precision flat processing of the semiconductor carrier surface, improving product performance and qualification rate, and meeting the harsh requirements of semiconductor chip processing.

The invention discloses a continuous flexible conductive material preparation device and method.The device comprises a continuous flexible material, a guide roller and a conductive coating assembly, the assembly is sequentially provided with a tackifying unit, a powdering unit, a curing unit, a chemical plating unit and a post-processing unit in the material conveying direction, the center lines of conveying channels of all the units are collinear, and the interface gap is smaller than or equal to 2 mm. The micro-nano metal powder seed source is planted through the powdering device, rapid growth and closing of the micro-nano metal powder seed source are achieved through chemical plating after solidification, a compact conductive network is constructed, and a finished product is obtained.The short-process, rapid, efficient and environment-friendly preparation of the continuous flexible high-conductivity material can be achieved, the prepared material is low in cost, good in conductivity and high in durability, material transmission deviation is avoided, and the continuous flexible high-conductivity material can be obtained. The method improves the compactness of the coating and the consistency of products, recovers redundant adhesion liquid and catalyst particles, reduces the production cost, and is suitable for preparation of continuous flexible conductive materials such as conductive yarns, fabrics and films.

The invention relates to the technical field of semiconductor lead frames, in particular to a high-stability semiconductor lead frame and a preparation method thereof.The preparation method comprises the following steps that 1, copper, nickel, silicon, chromium, phosphorus and modified titanium boride are subjected to ball milling together to obtain mixed powder; 2, the mixed powder is put into a mold for cold press molding, and a green body is obtained; 3, the green body is subjected to sintering treatment and solution treatment, and a composite block is obtained; 4, cold-rolling the composite block into a strip, and performing aging treatment to obtain a composite material; step 5, performing punch forming on the composite material to obtain a semi-finished product of the high-stability semiconductor lead frame; 6, carrying out alkali washing on the semi-finished product, then putting the semi-finished product into a hydrochloric acid solution for derusting, and finally carrying out acid pickling activation to obtain an activated semi-finished product of the high-stability semiconductor lead frame; and 7, putting the activated semi-finished lead frame product into a chemical plating solution composed of nickel, tungsten, phosphorus and a graphene composite material for electroplating, and then drying to obtain the finished high-stability semiconductor lead frame.

The invention provides an electrolytic hydrogen production solid repelling cathode and a modification method and application thereof, and the modification method comprises the following steps: pretreating an HER electrode, and removing organic matters and an oxide layer on the surface of the HER electrode to obtain the pretreated HER electrode; and the pretreated HER electrode is soaked in an electroplating solution or a chemical plating solution containing silver ions for electroplating or chemical plating, silver particles are deposited on the surface of the HER electrode, and the modified electrolysis hydrogen production solid repelling cathode is obtained.