728 results about "Chemical plating" patented technology

The invention discloses a composite three-dimensional current collector prepared based on chemical plating, a metal negative electrode and a metal secondary battery, and belongs to the technical field of metal secondary batteries. The composite three-dimensional current collector comprises a nonmetal three-dimensional skeleton matrix and a metal coating which is uniformly distributed on the surface of the matrix through chemical plating. When the metal battery works, Mg, Li, Na, Ca, Zn and other metals are induced to be subjected to uniform electro-deposition and stripping on the surface of the composite three-dimensional current collector by virtue of affinity among metals, and the three-dimensional porous structure of the matrix provides a buffer space for metal deposition, so that metal ions are subjected to rapid and uniform electro-deposition; the stability of an electrode interface can be enhanced, dendritic crystal growth is reduced, the electrodeposition overpotential of metal is reduced, and the service life of a metal negative electrode is prolonged. The composite three-dimensional current collector prepared on the basis of chemical plating solves the problem of non-uniform growth of a metal negative electrode, and is an effective way for commercialized production of a metal secondary battery.

The invention relates to the field of composite materials, and discloses an unmanned aerial vehicle carbon fiber shell preparation method, which comprises: carbon fiber surface modification treatment: carrying out surface cleaning, activation, chemical plating and surface functional modification on carbon fibers; preparing a resin matrix: mixing epoxy resin with a flexible toughening agent, a nano filler and a curing agent, and carrying out vacuum defoaming; carbon fiber laying: laying the modified carbon fiber cloth according to a set angle and sequence; vacuum bag forming: performing vacuum sealing on the laid carbon fiber composite material; and hot-pressing and curing: curing the composite material in an autoclave under the process conditions of set temperature, pressure and time. Through collaborative design of interface modification, matrix enhancement and process optimization, the comprehensive performance of the composite material is improved, so that the requirements of the unmanned aerial vehicle shell for high strength, fatigue resistance and impact resistance are met.

The invention belongs to the field of new materials, and particularly relates to preparation and application of chemical copper plating cellulose composite fibers. The preparation method of the composite fiber comprises the following steps: (1) mixing absolute ethyl alcohol, ammonia water and water in proportion, adding cellulose fiber, heating, stirring and uniformly mixing, adding a dopamine hydrochloride solution, washing and drying to obtain a polydopamine coating / cellulose composite fiber; (2) adding the composite fiber prepared in the step (1) into an alkaline solution, adding a silver nitrate solution, stirring, washing and drying to obtain a polydopamine reduced nano-silver / cellulose composite fiber; and (3) adding the composite fiber obtained in the step (2) into a chemical plating solution containing copper ions for plating to obtain the chemical copper-plated cellulose composite fiber. The electroless copper-plated cellulose composite fiber shows outstanding electric heating and photo-thermal properties, can accurately capture electrocardiosignals of a human body before and after movement at the same time, and provides a new thought for development of wearable electronic fabrics and intelligent sensors.

The invention relates to the field of ultrasonic sensors, provides an ultrasonic sensor and a preparation method thereof, an ultrasonic fingerprint module and electronic equipment, and at least facilitates improvement of the performance of the ultrasonic sensor. The preparation method comprises the following steps: forming a bottom electrode layer on a substrate; forming a piezoelectric layer on the bottom electrode layer; a top electrode is formed on the piezoelectric layer, and the top electrode layer is prepared through the steps that the surface of the piezoelectric layer is treated, so that the surface of the piezoelectric layer has hydrophilicity; carrying out silanization treatment on the piezoelectric layer to form a self-assembled molecular layer; soaking the substrate subjected to silanization treatment in a pre-polymerization solution, so that the self-assembled molecular layer and monomers in the pre-polymerization solution are polymerized to form an adhesion layer; forming a catalyst layer on the adhesion layer; the substrate with the catalyst layer is placed in a chemical plating tank, so that a catalyst in the catalyst layer catalyzes metal ions in the chemical plating tank to form a metal layer, and the adhesion layer and the metal layer form a top electrode layer; and forming a protection layer on the top electrode layer.

The invention provides a silver-coated copper material and a preparation method and application thereof. The silver-coated copper material comprises a base body and a silver layer coated on the surface of the base body, the base body comprises copper particles and a silver framework, the silver framework is provided with holes, the copper particles are distributed in the holes of the silver framework, and the silver layer is prepared by adopting a chemical plating method. The pore structure of the silver skeleton and the distribution of the copper particles are utilized, the separation of nucleation and growth of the silver coating is realized, the uniformity and compactness of the growth of the silver coating are ensured, the oxidation resistance and the conductivity of the silver-coated copper material are further improved, the use amount of precious metal silver is greatly reduced while the performance of the material is ensured, and the production cost is reduced. Cost control is realized; when the silver-coated copper material is applied to the fields of photovoltaic and electronic industry, the cost of raw materials can be remarkably reduced, the service life of the raw materials is prolonged, and large-scale use is facilitated.

The invention discloses a post-pressing multilayer high-frequency metal-based carbon oil circuit board production method, and relates to the field of circuit board production, and the method comprises the steps: carrying out the engineering design, carrying out the pretreatment preparation after the engineering design is completed, and carrying out the hole metallization control of a high-frequency microwave board after the pretreatment preparation is completed. And after hole metallization control of the high-frequency microwave plate is completed, copper plating processing is carried out, and after copper plating processing is completed, metal-based chemical gold plating processing is carried out. According to the post-pressing multilayer high-frequency metal-based carbon oil circuit board production method, a dielectric layer of a multilayer high-frequency metal-based board is generally made of a high-frequency material, a multilayer high-frequency microwave board is firstly manufactured, then pressed together with a metal-based board and then subjected to surface treatment and forming, a carbon oil board is generally used on an FR4 board and is subjected to screen printing through common gauze, the resistance value and thickness error are large, and the resistance value and thickness error are large. And the produced post-pressed high-frequency metal-based carbon oil circuit board is good in heat dissipation and good in signal transmission performance, and the thickness and resistance of the carbon oil meet the requirements of customers.

The invention relates to a construction method and system of a chemical plating solution preparation model based on RNAS, and belongs to the technical field of artificial intelligence control and chemical plating reduction fusion. The method comprises the following steps: acquiring formula data of a chemical plating solution to be prepared; obtaining a size data set of a plating layer area of a to-be-processed plating piece and electrode potential data of oxidation reduction strength of to-be-chemically plated metal, and calculating the modeling film thickness of the plating piece; actual chemical plating operation is carried out, and the actually measured film thickness of a plated part is measured; the plating piece modeling film thickness and the plating piece actual measurement film thickness which meet the preset relation are used for training of an RNAS model system so as to classify chemical plating solution formula data; according to the method, the formula data of the chemical plating solution is classified into an available formula or an unavailable formula by constructing the RNAS model, the use quantity of a reducing agent in the preparation of the chemical plating solution is strictly managed according to the standard, and the effect of accurately and rapidly screening the formula data of the chemical plating solution is achieved.

The invention discloses an application of a thiazole thioketone compound in chemical copper plating and a chemical copper plating solution, and belongs to the technical field of chemical plating. The thiazole thioketone compound with the structure shown in the formula I and the nitrogen-containing heterocyclic compound are combined to be used for chemical copper plating, the deposition speed of the chemical copper plating solution can be increased, the chemical copper plating solution has excellent stability, meanwhile, the electroplating hole filling effect after chemical copper plating can be improved, and correspondingly, the prepared chemical copper plating solution has good bath solution stability, and the chemical copper plating solution can be applied to chemical copper plating. When the copper plating solution is applied to a chemical copper plating method, the deposition rate of chemical copper plating and the compactness of a plating layer can be effectively improved. # imgabs0 #

The invention belongs to the technical field of conductive microsphere preparation, and particularly relates to a surface-roughened nickel-plated conductive microsphere and a preparation method and application thereof. The preparation method comprises the following steps: carrying out pretreatment to enable the surfaces of the polymer microspheres to contain nickel ions, reducing the nickel ions into nickel nanoparticles, activating the microspheres and carrying out chemical plating. According to the invention, the specific surface area of the conductive microspheres is increased by reducing the nickel nanoparticles on the surfaces of the microspheres, a large amount of impurities cannot be generated among the microspheres, and adhesion among the microspheres can be effectively prevented. According to the prepared conductive microspheres, the plating layer and the polystyrene microspheres are firmly combined, and the risk that the conductivity is reduced due to the fact that the surface of the plating layer falls off is reduced. The preparation method is safe, environment-friendly, simple, convenient and suitable for industrial production requirements.

The present invention provides a method for metallizing graphene oxide holes in a flexible copper-clad laminate, wherein the flexible copper-clad laminate with through holes is immersed in a graphene oxide aqueous solution and then subjected to chemical copper plating. The hole wall produced by the hole metallization method is smooth and flat, has no defects, and does not cause the problem of missed plating.

The invention belongs to the technical field of PET copper foil preparation, and particularly relates to a PET copper foil, a chemical plating preparation method and application of the PET copper foil, and the preparation method comprises the following specific steps: S1, pretreatment: firstly, cleaning a PET film, and in the cleaning process, sequentially carrying out weak base washing, primary water washing, acid washing and secondary water washing; s2, activating treatment: carrying out palladium deposition treatment on the cleaned PET film by adopting a copper oxide copper dissolving mode; s3, chemical copper deposition: transferring the PET film into a chemical copper plating tank for chemical copper deposition, wherein the copper plating tank is filled with a copper plating solution; the surface of the PET film is subjected to wetting treatment to remove loose particles on the surface, then the surface of the PET film is subjected to spraying cleaning, the electrolyte adopts a specific additive to be matched with an existing solution, growth of copper crystal grains can be effectively controlled, and therefore a compact plating layer is obtained. The copper foil has high tensile strength, high elongation and excellent mechanical properties.

The invention relates to the technical field of electroplating, in particular to a chemical plating tool and a chemical plating method. The cleaning device comprises a cleaning basket and a small basket frame arranged in the cleaning basket, a groove body structure with a V-shaped cross section is formed in the upper portion of the small basket frame, and the groove body structure serves as a storage groove for storing shaft-shaped plating parts; the cleaning device further comprises a swing mechanism, the two side walls, located in the groove length direction of the storage groove, of the cleaning basket serve as connecting side walls, the swing mechanism comprises two connecting parts movably connected with the two connecting side walls of the cleaning basket respectively, the two connecting parts can do reciprocating lifting motion, and the moving directions of the two connecting parts are opposite. Therefore, the cleaning basket swings up and down on the vertical plane where the groove length direction of the storage groove is located. According to the invention, oil removal, acid washing, water washing and electroplating procedures of chemical plating can be efficiently carried out on a large number of small plating parts with high quality.

The invention discloses a protruding conductive microsphere and a pretreatment method thereof. The pretreatment method specifically comprises the steps of roughening treatment, protruding and interface activity treatment, sensitization treatment, activating treatment and chemical plating. In the protruding and interfacial activity treatment, by adding an interfacial agent, the electronegativity of the surfaces of the microspheres is enhanced, electrostatic adsorption with positively charged nickel nanoparticles is generated, and meanwhile, agglomeration of the nickel nanoparticles on the surfaces of the polymer microspheres is effectively prevented through the steric hindrance effect; therefore, a nickel nanoparticle bulge structure which is high in density, uniform in distribution and firm in combination is formed on the surface of the polymer microsphere. The method effectively solves the problems that a traditional conductive microsphere coating is prone to cracking and falling off, poor in dispersity and the like, the prepared protruding conductive microspheres have the outstanding advantages of being high in coating binding force, excellent in conductivity, good in dispersity, not prone to agglomeration and the like, the technological process is simple, mass production is easily expanded, and the method is suitable for large-scale production. The anisotropic conductive adhesive film has a wide commercial application prospect in the field of electronic packaging such as anisotropic conductive adhesive films.

The invention belongs to the field of micro-nano manufacturing technology and microelectronic manufacturing, and particularly relates to a method for manufacturing a complex curved surface conformal high-resolution embedded circuit, which comprises the following steps of: firstly, processing a nano groove structure with a specific pattern on a hard curved surface substrate according to a preset path; a metal seed layer is deposited in the groove, then the groove is filled with a conductive material by adopting filling technologies such as precise electroplating / chemical plating, fusion strengthening is generated among various metals by adopting a laser heating mode, and the adhesive force with the hard curved surface substrate groove structure can be further enhanced after the metals are cooled. And the requirements of extremely severe service environments are met. A new solution is provided for low-cost manufacturing of the embedded curved surface circuit which is high in resolution, adjustable in height-width ratio, high in electrical performance, high in adhesive force and capable of combining multiple materials.

The invention discloses a preparation method of a PCB, and the method comprises the steps: preparing a high polymer material into a solution, and adding a nanoscale pore-forming agent to form a mixture; coating the mixture on the surface of a PCB substrate; grinding the surface of the PCB substrate; etching is carried out on the PCB substrate; carrying out chemical plating on the etched PCB substrate; performing electrochemical deposition of a metal layer on the PCB substrate subjected to chemical plating treatment to obtain a metal-clad plate; and performing outer-layer circuit manufacturing on the metal-clad plate to obtain the PCB. According to the PCB prepared by the preparation method disclosed by the invention, the surface roughness is reduced, the surface flatness of the PCB is improved, the binding force between the substrate and the metal layer is improved, and the signal loss of the PCB can be greatly reduced; and meanwhile, the production process flow is shortened, the production cost is reduced, and the production efficiency is improved.

The invention relates to hot baking type selective ink and a preparation method thereof. The hot baking type selective ink comprises the following components in parts by mass: 10-20 parts of acrylic resin, 10-20 parts of fluorine-containing polyacrylate, 20-40 parts of an active monomer, 3-10 parts of a photoinitiator, 5-20 parts of modified boron nitride and 1-10 parts of an auxiliary agent, wherein the modified boron nitride is obtained by reacting boron nitride with a silane coupling agent and polypropylene glycol diglycidyl ether. The fluorine-containing polyacrylate is obtained by reacting fluorine-containing acrylate, acrylate and maleic anhydride. According to the invention, not only are the film-forming property and the stability of the ink improved, but also the corrosion resistance, the strength and other properties are enhanced, the protective effect can be more effectively exerted, the stable operation of the PCB is ensured, the problems in the prior art are solved, the requirements of the industry on multiple properties of products are met, and the application prospect is good.

The invention belongs to the field of hard alloy materials, and provides a modified high-performance non-magnetic hard alloy and a preparation process thereof. The surface of a WC particle is chemically plated with a Ni-P-B-Cr-Cu amorphous shell layer, and a binding phase is converted into Ni3P and Ni3B nanophase through two-stage sintering. The WC alloy comprises the following components in parts by weight: 85-95 parts of WC, 12-25 parts of a binding phase and 0.5-1.4 parts of a grain growth inhibitor, the nanophase accounts for 35-50% of the volume of the binding phase and 35-50% of the total volume of the binding phase, and the grain size is 80-125 nm; the average grain size of WC is 0.6-1.0 [mu] m; and the thickness of an interface P enrichment layer is 8-15 nm (the coverage rate is 85-95%). Through interface engineering and controlled crystallization from amorphous to nanocrystalline, the relative magnetic conductivity is 1.001-1.015, the hardness HRA is 90.5-93.0, the strength TRS is 2.2-3.0 GPa, the toughness KWP is 300-450 N / mm, and the magnetic saturation strength is 0.02-0.15 T. The problem of decoupling of the magnetic property and the mechanical property of a traditional non-magnetic hard alloy is solved, and the non-magnetic hard alloy is suitable for magnetic sensitive environments such as semiconductor equipment, precise measurement, MRI tools and oil service logging.

The invention relates to the technical field of photovoltaics, and discloses photovoltaic conductive silver-coated copper micro powder and a preparation method thereof, and the preparation method aims to solve the problem that performance and cost of existing silver-coated copper micro powder in photovoltaic application are difficult to consider at the same time. Through pH adjustment, organic pre-bonding treatment and gradient ammonification, the activity of the copper powder is reserved, and a uniform copper-ammonia complexing layer is constructed; in the chemical silver plating stage, the pretreatment liquid is added into a composite base solution containing a complexing agent, organic amine, a dispersing agent and a combined reducing agent, and a silver-ammonia solution is dropwise added for reaction under ultrasonic dispersion and nitrogen introduction protection; and in the post-treatment stage, a finished product is obtained through ethanol reflux desorption, antioxidant treatment, vacuum drying, low-temperature plasma activation and screening, uniform and complete coating of a silver layer can be achieved under the low silver content, and a feasible path is provided for replacing photovoltaic pure silver powder with silver-coated copper micro powder on a large scale.

The invention discloses a preparation method of a chemical composite plating solution based on nano niobium carbide. The preparation method comprises the following steps: step 1, pretreating niobium carbide (NbC) powder; step 2, preparing a chemical plating solution, wherein every 1L of the chemical plating solution contains 30g of nickel chloride, 20g of sodium hypophosphite, 10g of sodium citrate, 5g of glycine, 10g of sodium acetate, 0.3 g of sodium dodecyl benzene sulfonate and 80mg of zinc molybdate; fixing the volume to 1L by using distilled water; 3, measuring the niobium carbide suspension liquid, mixing the niobium carbide suspension liquid with the chemical plating solution, and fixing the volume, so that the content of niobium carbide in the chemical composite plating solution is 0.01-0.3 g / L; adjusting the pH value of the solution to 5.8; according to the method, niobium carbide nanoparticles are added into the chemical composite plating solution, so that the surface of a plated part and metal gold are combined with the particles, and the hardness and wear resistance of a base material are effectively improved; the effect on a 60-80-micron nickel-phosphorus coating in the industry is achieved through the ultrathin chemical composite coating (8-10 microns), so that the corrosion resistance and the wear resistance of the product are enhanced.

The invention provides a chemical plating solution, a preparation method of the chemical plating solution, a Ni-P-Gr chemical plating layer and a preparation method and application of the Ni-P-Gr chemical plating layer, and relates to the technical field of chemical plating. The preparation method comprises the following steps: adjusting the pH value of nickel sulfate, sodium citrate, sodium acetate, sodium hypophosphite and graphene oxide to 4-4.5, mixing with sodium dodecyl benzene sulfonate, homogenizing, and ultrasonically dispersing to obtain the chemical plating solution. Homogenization treatment and ultrasonic dispersion are used in the process of preparing the chemical plating solution, the addition amount of the graphene oxide is controlled to be 0.1-0.4 g / L, and the ultrasonic dispersion conditions are 100-180 W and 35-55 min, so that the graphene oxide in the prepared chemical plating solution is good in dispersion uniformity, and the chemical plating solution is uniform in dispersion. The graphene oxide in a Ni-P-Gr chemical plating layer formed by adopting the chemical plating solution prepared by the invention is good in dispersity, and the Ni-P-Gr chemical plating layer is high in hardness, good in wear resistance and strong in binding force with a matrix.

The invention relates to a ceramic and metal heterogeneous connection method, which is characterized by comprising the following steps of: 1, covering a metal surface with a metal plating layer; secondly, tungsten slurry or pure molybdenum powder or molybdenum-manganese composite powder is adopted, and a primary metallization layer is formed on the to-be-brazed surface of the ceramic in a high-temperature sintering mode; 3, forming a nickel layer, a nickel-phosphorus layer or a nickel-boron layer, which is called as a secondary metallization layer, with the thickness of less than 20 microns on the surface of the primary metallization layer in a manner of electroplating, evaporation, chemical plating or sintering; 4, attaching a tertiary metallization layer to the surface of the secondary metallization layer in an electroplating manner; fifthly, a ceramic side brazing filler metal layer is formed, and a metal side brazing filler metal layer is formed; and 6, placing a metal middle buffer layer structure in a gap between the ceramic side brazing filler metal layer and the metal side brazing filler metal layer, wherein the main body of the metal middle buffer layer structure is pure nickel, pure copper, pure silver or pure aluminum. According to the method, cracks can be prevented from being generated on the brazing interface, and the sealing performance and the mechanical connection strength of the brazing interface are improved.

The invention relates to a preparation method of a ceramic-based composite material, in particular to a preparation method of a ceramic-based composite material with a pyrolytic carbon-carbon nanotube interface, which is used for solving the problem that in the aspect of improving the thermal conductivity of an interface layer, metals such as Fe, Co, Ni and the like are widely used as catalysts for growing carbon nanotubes at present, so that the thermal conductivity of the interface layer is improved. Carbon nanotubes obtained through a traditional preparation method are prone to agglomeration and uneven in distribution, the risk of the preparation process is high, the carbon nanotubes are not suitable for large-scale production, although metal particles can be reduced through a chemical plating method, the particle sizes of the metal particles are not controlled, the distribution of the metal particles is uneven, and the requirement of a chemical vapor reduction method for distribution of an earlier-stage metal salt solution is high. And the defect is difficult to realize easily. According to the preparation method of the ceramic-based composite material with the pyrolytic carbon-carbon nanotube interface, the ceramic-based composite material with the pyrolytic carbon-carbon nanotube interface is finally obtained through pretreatment, solution A preparation, metal salt solution in-situ reduction and chemical vapor deposition in sequence.

The invention discloses a platinum chemical plating solution and a preparation method and application thereof in semiconductors, the platinum chemical plating solution comprises the following raw materials: 0.5-10.0 g / L of platinum salt PEP, 2.1-10.0 g / L of ethylenediamine sulfate, 1.2-8.9 g / L of malonic acid, 5-50 g / L of ammonium acetate, 1.2-9.2 g / L of thiourea dioxide, and the balance of ultrapure water and ammonia water; and the pH value of the solution is adjusted to 7.0 by ammonia water. The platinum chemical plating solution disclosed by the invention is suitable for nano precision manufacturing and processing on the surface of an electronic element product of a semiconductor device, and a formed platinum metal film has excellent uniform distribution, compactness and high wear resistance; a semiconductor electronic component product with excellent plugging performance, corrosion resistance, high-precision conductivity and high-quality electronic signal transmission performance is obtained.

The invention discloses a method for chemically plating silver on the surface of a nickel-plated ceramic copper-clad substrate, and relates to the technical field of metal surface treatment. The preparation method comprises the following steps: S1, sequentially adding nitric acid, imidazole and a surfactant into deionized water, and uniformly mixing to obtain an activating agent; s2, after the ceramic copper-clad substrate is pretreated, chemical nickel plating treatment is carried out, cleaning and drying are carried out, and a nickel-plated ceramic substrate is obtained; and S3, the nickel-plated ceramic substrate is immersed in an activating agent for activating treatment, chemical silver plating treatment and post-treatment are conducted, and a product is obtained. According to the method provided by the invention, the problem of copper ion migration in the later silver welding process of chemical silver plating on the surface of the ceramic copper-clad substrate can be solved, and the performance of the packaging module is improved.

The invention discloses an electromagnetic shielding cable for a radio altimeter and a preparation method thereof, and relates to the technical field of cables. The preparation method comprises the following steps: treating ethylene-tetrafluoroethylene copolymer particles, a mixed compatilizer, a chemical foaming agent and a nano nucleating agent by using mixed gas low-temperature plasma containing acrylic acid, performing melt blending by using a double-screw extruder, injecting supercritical carbon dioxide, and performing slow cooling and shock cooling to obtain a three-dimensional porous matrix containing micro-nano cells; the preparation method comprises the following steps: synthesizing ferroferric oxide particles by a solvothermal method, coating a silicon dioxide dielectric layer, and then chemically silvering to prepare ternary core-shell composite particles; modifying the particles with aminopropyltriethoxysilane and a block copolymer to obtain modified composite particles; melting, mixing and granulating the porous matrix and the modified composite particles to obtain the electromagnetic shielding composite material. And performing extrusion molding on a conductor to form an insulation shielding layer, thereby obtaining the cable. The cable has an excellent electromagnetic shielding effect.

The invention discloses a modified FeSiCr soft magnetic material, a preparation method thereof and application of the modified FeSiCr soft magnetic material in marine environment devices, and belongs to the technical field of soft magnetic materials. Comprising flaky FeSiCr soft magnetic powder, and a Ni-P alloy layer, a dopamine-quaternary ammonium salt copolymer grafting layer, a tannic acid-metal ion layer, a nano SiO2-Al2O3 layer and a polysiloxane resin-boron nitride layer which sequentially coat the FeSiCr soft magnetic powder from inside to outside, and the preparation method comprises the steps of chemical plating, grafting modification, sol-gel sintering and hot press molding. Through the synergistic effect of the five coating layers, the modified FeSiCr soft magnetic material achieves comprehensive improvement of corrosion resistance, antibacterial property, insulativity and magnetic performance in the marine environment, is suitable for marine anti-corrosion wave-absorbing coatings, high-frequency electromagnetic elements and other scenes, and has the advantages of being long-acting in service, high in environmental adaptability and the like.

The invention discloses a surface mechanical alloying coated zinc carbonyl iron powder absorbent and a preparation method thereof, a ball-milling mechanical alloying process is adopted, and a uniform and compact zinc coating layer is generated on the surface of carbonyl iron powder to serve as the absorbent of an electromagnetic wave absorbing material. Compared with a traditional chemical zinc plating method, the method has the advantages that the thickness and uniformity of a plating layer can be more accurately controlled, high bonding strength between the zinc plating layer and a carbonyl iron powder matrix is achieved, highly-uniform zinc layer coverage is achieved by adjusting ball milling parameters, excellent cathode protection is provided by using high electronegativity of zinc, and the service life of the carbonyl iron powder is prolonged. The corrosion resistance of the carbonyl iron powder in a high-salinity environment is remarkably enhanced, and meanwhile, the influence on the electromagnetic wave absorption characteristic of the carbonyl iron powder is minimized. The method is simple in technological process and low in cost, the problem that the seawater corrosion resistance of a traditional method is insufficient is solved, the electromagnetic wave absorption efficiency is improved, and a novel electromagnetic wave absorption material solution with economical efficiency and high performance is provided.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention discloses a composite material with a shielding function, a preparation method thereof and an interphone shell. The composite material comprises a polycarbonate-acrylonitrile-butadiene-styrene copolymer, a modified conductive filler, maleic anhydride grafted polyethylene, polyaryletherketone, a flame retardant, an antioxidant, glass microfibers and a compatilizer, wherein the modified conductive filler is aluminum oxide ceramic particles subjected to chemical copper plating and graft polymerization treatment. The preparation method comprises the steps of modified conductive filler preparation, step-by-step raw material mixing, twin-screw extrusion granulation and drying. The interphone shell is prepared from the composite material through injection molding, and the injection molding process comprises the steps of raw material drying, injection molding machine preheating, charging and injection molding, and demolding and finishing. The composite material is stable in electromagnetic shielding performance and has good mechanical strength and heat resistance; the preparation method can improve the dispersity of the components and is adaptive to conventional equipment; the interphone shell can block electromagnetic wave interference, is suitable for being used in multiple environments, and meets the requirements of an electronic equipment shell for shielding and structural performance.

The invention provides a silicon carbide MOS device chemical plating grid electrode protection method and a process structure, and the protection method comprises the steps: enabling a contact surface of a printing net to be pasted on a target wafer, enabling the position of a mesh to correspond to the position of a grid electrode bonding pad, enabling a net body to accurately cover a region of a source electrode bonding pad, enabling a protection glue to be accurately coated on a designated region instead of the whole surface of the target wafer, and enabling the surface of the target wafer to be protected. Therefore, the use amount of the protective glue is effectively saved and cost is reduced. After gluing is completed, a protective glue layer with a stable structure is formed on the surface of the grid bonding pad through a light curing process, and the protective layer has the peelable characteristic while keeping good adhesive force. And after the chemical plating treatment of the source electrode bonding pad is completed, the protection glue layer can be completely removed without residual pollutants, so that the reliable protection of the grid electrode bonding pad is realized. According to the chemical plating grid protection method for the silicon carbide MOS device, the protection effect and the process stability of the grid region in the chemical plating process are improved by optimizing the selection of the protection material and the coating process.