1374 results about "Chemical plating" patented technology

The invention relates to hydrogen production and hydrogen storage technologies and materials, in particular to a catalyst for catalytic hydrolysis of borane for the hydrogen production and a preparation method thereof, thereby solving the problems that the direct application of powder catalyst in a catalytic hydrolysis solid-liquid reaction system can cause the loss of the catalyst, the catalytic hydrolysis reaction is difficult to control and the hydrolysis by-products are difficult to be recovered, etc. The catalyst is composed of an active component and a carrier; the active component is a binary, ternary or multinary alloy or a single precious metal or the combination thereof which is composed of one or more transition metals, rare earth metals or precious metals and metalloids; the active component is deposited on the carrier through the improved chemical plating technology, the surface thereof is rough and porous, and the structure of the prepared catalyst is the amorphous or the nanocrystalline structure. The preparation method has simple preparation process, high preparation efficiency and convenient large-scale preparation; the sources of the used raw materials are rich; the catalytic activity of the prepared supported catalyst is high, the real-time control of the catalytic hydrolysis reaction of the borane can be realized, the catalytic performance is stable, and the catalyst can be repeatedly used for a plurality of times.

A copper filled damascene structure and method for forming the same the method including providing a substrate comprising a semiconductor substrate; forming an insulator layer on the substrate; forming a damascene opening through a thickness portion of the insulator layer; forming a diffusion barrier layer to line the damascene opening; forming a first seed layer overlying the diffusion barrier; plasma treating the first seed layer in-situ with a first treatment plasma comprising plasma source gases selected from the group consisting of argon, nitrogen, hydrogen, and NH₃; forming a second seed layer overlying the first seed layer; forming a copper layer overlying the second seed layer according to an electro-chemical plating (ECP) process to fill the damascene opening; and, planarizing the copper layer to form a metal interconnect structure.

The invention provides a plastic composition and a surface selective metallization process thereof. The plastic composition comprises a high molecular polymer and a photocatalyst, wherein the mass ratio of the polymer to the photocatalyst is 1 to 100. The surface selective metallization process of the plastic composition comprises the following steps: performing laser etching on the surface of theplastic composition; putting the plastic composition after the laser etching into an aqueous solution containing a metal ion salt and a cavity sacrificial agent to perform photocatalysis reduction reaction so as to obtain a plastic composition with nanometer metal particles on the surface; and finally performing metal chemical plating. By adopting the plastic composition and the surface selectivemetallization process of the plastic composition, the bonding force of a plating layer and the chemical plating precision are very high.

In one embodiment, a method for forming a material on a substrate is provided which includes positioning a substrate containing a dielectric material having vias formed therein within a process chamber, forming a barrier layer within the vias and on the dielectric material during a barrier deposition process, forming a ruthenium layer on the barrier layer during a ruthenium deposition process, and filling the vias with a copper material during a copper deposition process. The copper material may be formed by depositing a copper bulk layer over a copper seed layer. The method further provides that the ruthenium layer may be formed by an atomic layer deposition process (ALD) or a physical vapor deposition (PVD) process and the copper material may be formed by an electroless chemical plating process, an electroplating process, a chemical vapor deposition process, an ALD process and/or a PVD process.

The invention relates to a method for preparing a conductive ultrahigh molecular weight polyethylene fiber. The conventional method is complicated in process and causes environmental pollution. The method comprises the following steps of: firstly, immersing the ultrahigh molecular weight polyethylene fiber into acetone, ethanol or a tetrahydrofuran solution, performing ultrasonic washing on the fiber and airing; secondly, dissolving a dopamine substance into a buffer solution to prepare an activation solution, placing the ultrahigh molecular weight polyethylene fiber into the activation solution and activating the ultrahigh molecular weight polyethylene fiber under stirring; and finally, immersing the activated ultrahigh molecular weight polyethylene fiber in a plating solution at temperature of 10 to 60 DEG C for 0.5 to 10 hours so as to finish silver plating. By the method, the surface of the ultrahigh molecular weight polyethylene fiber is activated by using dopamine polymer and metallized by using chemical plating, so that the ultrahigh molecular weight polyethylene fiber with extremely high conductivity can be obtained; and the whole process is environment-friendly and pollution-free.

The invention discloses a chemical silver plating preparing conducting resin method on the graphite powder surface in the chemical silver plating and micro-electronics connection material technique domain, which comprises the following steps: oxidizing the graphite powder in the air at 600-650DEG C; putting the dispersant, reducer and stabilizing agent in de-ionized water for reduced liquid; adding in graphite powder to stir; putting the silver nitrate in the de-ionized water; adding in ammonia and sodium hydroxide to get argentamine; putting the reduced liquid in the argentamine liquid to finish chemical silver plating on the graphite powder surface; filtering; separating and washing; drying in vacuum to get silver coated graphite powder.

An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.

This invention discloses a surface treatment method for Mg-based material. The method comprises: (1) performing micro-arc oxidation treatment on Mg or Mg alloy work piece as the anode in a Cl--free alkaline micro-arc oxidation electrolyte; (2) activating; (3) performing preliminary chemical plating of Ni; (4) performing chemical plating of Ni; (5) performing thermal treatment. The micro-arc oxidation treatment comprises: (1) applying a positive pulse with an average current density of 5-20 A/dm2 until the voltage is automatically elevated to a critical value, and applying a constant working voltage of 50-80 V (total time = 5-30 min); (2) applying a positive pulse of 30-300 V and a negative pulse of 0-200 V with an average current density of 0.5-15 A/dm2 (total time = 10-60 min). The activation comprises: (1) performing anode alkaline coarsening treatment for 3-10 min; (2) performing surface activation treatment; (3) performing cathode alkaline electrification reduction activation treatment; (4) performing cathode acidic electrification dispergation activation treatment. The treated Mg alloy work piece has high corrosion resistance of ceramic materials and the properties and touch sense of metal materials.

The present invention discloses hydrogenating catalyst of foam metal and its preparation process and application. The hydrogenating catalyst includes foamed metal carrier and active noble metal component in effective amount supported onto the carrier, the carrier is prepared through powder metallurgical process, and the active component is supported via chemical plating process and distributed homogeneously on the port surfaces of the foamed carrier. The catalyst has the advantages of high catalytic activity, firm combination between the active component and the carrier, high stability, simple preparation process, high porosity of the carrier, great specific surface area, etc. in addition, the catalyst provides sufficient gas-liquid contact area, is favorable to mass transfer between gas phase and liquid phase, may be used in catalytic rectification and possesses both reaction and separation effects.

The invention relates to a surface treatment method of aluminum alloy, which comprises the following steps of: pre-treating: removing oil stains on the aluminum alloy surface by adopting an alkali degreasing solution; alkali washing: purifying the aluminum alloy surface at 50-60 DEG C by adopting alkali wash to remove a natural oxide film on the aluminum alloy surface; acid pickling: treating the aluminum alloy surface at room temperature for 1-5 minutes by adopting a pickling solution to further remove residual spots left on the aluminum alloy surface after alkali washing; and chemically plating Ni-P: forming a Ni-P plating layer on the aluminum alloy surface by adopting a pre-prepared chemical plating Ni solution with pH value of 5-6.5 at 85-90 DEG C for 90-240 minutes. By adopting a chemical plating Ni-P layer process to form a uniform favorable plating layer with good acid resistance, alkali resistance and salt resistance outside an aluminum alloy shell, the invention avoids the phenomena of uneven thickness of a protective layer and spraying missing on a complex structure part, and remarkably improves the anticorrosion performance of the aluminum alloy.

The present invention discloses new activating process and activating solution with non-noble metal for chemical plating of metal onto the surface of non-metal base material. The activating solution is alkaline organic metal complex solution comprising water soluble salt of bivalent Ni, Cu or Co ion, organic alkane complexing agent and pH regulator. The new activating process and activating solution of the present invention may be used to replace available process and solution with noble metal for wide use in the chemical plating of metal material onto the surface of non-metal base material, such as chemically plating nickel, chemically plating copper, chemically plating cobalt, etc. The activating solution of the present invention is stable, simple in technological process and low in cost, and the present invention makes it possible to save noble metal resource effectively and is ideal technology to replace available one.

The invention discloses a cyanogen-free plating method of a zinc alloy die casting. The method is a plating method in which cyanogen-free copper-zinc alloy, copper-stannum alloy or ormolu is subjected to barrel plating or rack plating in a cyanogen-free copper-zinc alloy solution, copper-stannum alloy solution or ormolu solution as grounding layers so as to provide a pre-plating layer with good bonding force for subsequent plating or chemical plating. The method comprises the following steps: (1) carrying out ultrasonic wax removal or tumbling wax removal on a zinc alloy die casting blank; (2) washing; (3) chemically removing oil; (4) washing; (5) activating with 0.5% sulfuric acid; (6) washing; (7) carrying out barrel plating or rack plating on the alloys in the cyanogen-free copper-zinc alloy solution, copper-stannum alloy solution or ormolu solution; (8) washing; and (9) carrying out the subsequent plating or chemical plating. By using the method provided by the invention, cyanogen-free barrel plating or rack plating alloy is carried out on the zinc alloy die casting so that the obtained plating layer is semi-bright and has good bonding force.

The invention relates to a piece of surface enhanced raman detection test paper and the application thereof, which belong to the technical field of ultra-sensitive test analysis, in particular to the piece of surface enhanced raman detection test paper and the application of the paper to detection of biological or chemical probe molecules with raman signals. The surface enhanced raman detection test paper is obtained by covering a precious metal layer on the surface of paper with a natural fiber micro nano multi-grade structure through the physical vapor deposition or chemical plating technology, the paper can be filter paper, parchment paper, napkin, newspaper or printing paper and the like, the precious metal film is gold or silver and the like, and the thickness of the precious metal film is 5 nanometers to 90 nanometers. Combined action of size, period and roughness enables incident light to generate a local electric field on the surface of a multi-stage structure and enables the electric field to be enhanced, and the detection limit can reach 10-10mol/L. The test paper has the advantages of being good in flexibility, low in cost, free of environment pollution, capable of being prepared in batch and the like, thereby being capable of being used in detection of probe molecules such as rhodamine 6G, p-aminothiophenol, riboflavin or ethanol and the like.

The invention discloses a method for manufacturing and repairing a three-dimensional molding interconnection device conductive line. The method comprises the following steps: (1) depositing a 0.1-50 micrometer thick prearranged sizing agent layer of a conductive sizing agent on the surface of a molding structural element according to the design configuration of a conductive line; (2) baking or airing the prearranged layer of the conductive sizing agent, and removing an organic solvent thereof; (3) utilizing a laser beam to irradiate the prearranged sizing agent layer so as to enable metal conductive particles in the sizing agent to be melted and mixed with a 5-500mum thin layer of the surface of a plastic matrix, and the metal conductive particles in the sizing agent to be embedded in the surface of the matrix, thereby obtaining a conductive pattern; and (4) conducting chemical plating of 2-10mum copper on the surface of the conductive pattern, and then conducting chemical plating of 1-3mum anticorrosion metal. By the method, various complex conductive lines can be quickly and directly manufactured or repaired on the surface of three-dimensional molding structural member of various plastic matrix. No platability is required for base materials or no special requirement is needed for the molding technical. The invention has the advantages of simple process, environment-friendliness, low cost and high flexibility.

The invention provides chemical copper-plating solution. The chemical copper-plating solution is the aqueous solution containing copper salt, N-methylmorpholine, formaldehyde, complexing agent, stabilizer and pH regulator and the pH value of the chemical copper-plating solution is 12-13. The invention also provides a chemical copper-plating method. The method comprises the following steps: directly contacting a part to perform chemical copper plating with the chemical copper-plating solution, cleaning and drying to obtain the plated part. By adopting the chemical copper-plating solution, the stability of the copper-plating solution can be greatly increased and the plating speed can be increased. By adopting the chemical copper-plating method provided by the invention to plate copper on the part to be plated, the yield of the copper-plating product can be increased largely and the work efficiency of chemical plating can be increased, thus the method is good for industrialized mass production.

The invention discloses a carbon fiber surface modification method, and relates to a carbon fiber modification method. The invention solves the problem of the uncontrollability of the distribution and arrangement of a carbon fiber surface functional group, which is not propitious to the study of the mechanism of a carbon fiber interface. The carbon fiber is plated with silver after surface pre-processing, then the carbon fiber with the silver-plated surface is infused in the dilute solution of thiol molecule containing sulfur element; depending on the coactions of the bonding reaction of sulfur atoms and metb and the force among self-assembly molecules, the thiol molecule has chemical absorption on the fiber surface and forms a closely arranged and ordered two-dimensional self-assembly single molecule membrane; two procedures are as follows: 1. the chemical plating of silver on the carbon fiber surface; and 2. the self assembly of molecules of organic sulfide on the silver-plating carbon fiber. The carbon fiber surface modification method has the advantages of realizing controllable, directional and ordered arrangement on the carbon fiber surface functional group from the molecule level, thus being beneficial to the study of the mechanism of the carbon fiber composite material interface.

The invention discloses an ammonia-free chemical nickel plating bath which adopts an ammonia-free pH modifying agent to regulate the pH value of the bath. Each liter of the bath contains the components that nickel salt is 24 to 30g, reducing agent is 24 to 33g, buffering agent is 10 to 18g, complexing agent is 20 to 30g, stabilizing agent is 0.5 to 1.5mL, brightener is 1.5 to 3.0mL, and others are water. In the ammonia-free chemical nickel plating bath, the ammonia-free pH modifying agent is selected from one or the mixture of sodium hydroxide, and potassium hydroxide or potassium carbonate. All materials in the ammonia-free chemical nickel plating bath do not contain heavy metal, ammonia water is not utilized to regulate the pH value, the problems of environment pollution, invalidation caused by overlong storing time of the bath, etc. are not caused, and the obtained chemical plating bath is friendly to the environment, in addition, the luminance brightness of the made plating layer can be full-bright. The bath has wide application prospect.

The invention provides a surface chemical metal plating carbon nanotube field-emission cathode preparation method, which belongs to a carbon nanotube field emission cathode technology, solves the shortcomings of the existing technology, improves the electronic conduction and emission capabilities of the carbon nanotube and enhances the contact between a carbon nanotube film and a substrate electrode. The preparation method comprises the following steps: the carbon nanotube is processed through purification, cutting, scattering, and then through sensitization and activation, the carbon nanotubesurface forms a noble metal catalytic center; then the carbon nanotube surface forms a metal layer through a chemical plating method, the surface chemical metal plating carbon nanotube is prepared into evenly and stably dispersed carbon nanotube electrophoresis liquid, and finally pulse electrophoresis deposition is used for preparing the cathode of the carbon nanotube. The surface chemical metalplating carbon nanotube has good electronic conduction and emission capabilities, the carbon nanotube field-emission cathode and a substrate electrode can form good attachment, and the invention canrealize large-area, imaging and uniform preparation for the carbon nanotube field-emission cathode.

The invention relates to the technical filed of vacuum plating, in particular to a preparation method for conducting vacuum compound plating on the surface of a neodymium iron boron magnet, which is characterized in that the preparation method comprises the following steps: A. pre-treatment, the mixed liquor of washing liquid and purified water is used for conducting oil removal and parting medium washing to the magnet surface in an ultrasonic wave cleaner; B. ion cleaning and activation, the pre-treated neodymium iron boron magnet which is dried at 80-100 DEG C for 5-10 minutes undergoes bombardment activation of a glow plasma in vacuum environment, so as to increase surface activation energy; and C. vacuum plating, vacuum plating treatment is conducted to the neodymium iron boron magnet washed by ions in a vacuum chamber, and a metal plating is prepared on the surface. The deposited metal film on the surface of the neodymium iron boron magnet has the advantages of good stability, high bonding force and tightness, stronger anti-corrosion performance in cold and hot alternation environment. Furthermore, in the physical vapor deposition plating process, the plating thickness is affected much less by the magnet workpiece corner than in electroplating and chemical plating, and the pollution problem is avoided in the preparation process.

The invention discloses a magnesium alloy with zinc and nickel compound plating layers and a preparation method thereof. A zinc plating layer of the magnesium alloy is taken as a bottom layer with the width between 20 microns and 25 microns, a nickel plating layer is taken as a surface layer, and the total width of the zinc plating layer and the nickel plating layer is less than or equal to 40 microns. The method comprises the following steps: firstly, plating preliminary treatment, i.e. zinc is activated in an acid solution and then soaked in sulphate; secondly, zinc electrodeposition, i.e. after the zinc is soaked in the sulphate in the first step, the zinc layer of the magnesium alloy is electrodeposited; thirdly, nickel bright plating, i.e. the magnesium alloy which is nicely processed in the second step is brightly plated with nickel in a nickel plating solution; fourthly, sodium silicate water solution sealing. With the method, the obtained zinc plating layer is nicely combined with a base body, has uniform width and high corrosion resistance, can be taken as a protective plating layer to be singly used and can be also taken as a transition layer to carry out plating or chemical plating or other protective or decorative platings, and the nickel plating layer obtained from the zinc plating layer by plating is nicely combined with the zinc plating layer and is uniform, exquisite, bright and beautiful.

The present invention relates to a structure and a method for selectively forming a compact and precise metal pattern on a plastic substrate surface. The structure comprises three layers of materials such as a plastic substrate, nickel or zinc or an indium tin oxide material, and a metal subsequently deposited on the material, wherein the nickel or the zinc or the indium tin oxide material is formed through adopting laser to irradiate the plastic substrate, decomposing an additive previously added to the plastic, and adopting reductive chemical plating to treat. The manufacturing method comprises: adopting laser to selectively scan the plastic substrate. According to the present invention, the additive does not adopt a copper-containing oxide, a copper chelate, a copper complex and a metal oxide having a spinel structure, and adopts the environmentally friendly non-toxic inorganic salt containing nickel and zinc, and the indium tin oxide material, the coupling agent is adopted to carry out coating modification to prepare the additive having a core-shell structure, and the additive is added to the plastic to prepare the laser composite plastic; the laser is adopted to decompose the shell part of the additive so as to release active ingredients in the core; the present invention belongs to a new material based advanced assembly and manufacturing technology in the field of electronic and electric apparatuses; and the structure and the method are used for manufacturing mobile phone antennas, transparent lamp parts, automobile parts, three-dimensional circuits and other products.

The invention relates to a ceramic surface modifying technology, particularly relates to a method for metalizing the surface of a ceramic profiled bar, and specifically provides a preparation method of a ceramic circuit board... The preparation method of the ceramic circuit board comprises the preparation steps of: (1) preparing a ceramic substrate; (2) engraving a required circuit pattern with laser on the surface of the ceramic substrate; (3) in chemical plating, and chemically plating copper on the ceramic substrate obtained in the step (2) to realize bottoming; and (4) chemically plating nickel or chemically plating gold or silver on the surface of a plated layer, so as to prevent copper from being oxidized. According to the preparation method of the ceramic circuit board provided by the invention, a laser engraving technology is combined with chemical copper plating, so that the ceramic board is selectively coated with copper, and the good selectivity is achieved. By using the laser engraving technology, the binding force of a conductive layer with a ceramic base body is good; production equipment is cheap and easy to obtain. Furthermore, the three-dimensional ceramic circuit board can be easily produced; the circuit pattern design is very simple; and the circuit precision is high. Moreover, compared with the other technologies, the preparation method provided by the invention has the advantage that the 'three wastes' emission in a production process is reduced.

The invention relates to the technical field of a composite material with a core shell structure and provides a surface chemical plating treatment process for hollow glass microspheres. The surface chemical plating treatment process comprises the following steps: carrying out alkaline wash and hydrogen peroxide wash before plating to coarsen and hydroxylate the surface of the hollow glass microsphere; and carrying out chemical plating on the processed hollow glass microsphere to obtain a metal-plated hollow glass microsphere. In the method, complex preprocessing technology, such as sensitization, activation and the like in the existing method, can be simplified, and the use of expensive stannous chloride and palladium chloride which are not environmentally-friendly is avoided. Compared with the existing hot alkaline liquor processing method, the process provided by the invention has the advantages that possible microsphere fracture caused by the long-time soaking in the alkaline liquor can be avoided, and the surface hydroxylation efficiency of the hollow glass microsphere can be greatly increased by using hydrogen peroxide. The hollow glass microsphere processed with the method is easy to plate. The obtained metal-plated hollow glass microsphere has the advantages of a complete metal layer, light weight, good electrical conductivity and the like. When the obtained metal-plated hollow glass is used as a filler, material density can be lowered, cost is lowered, mechanical property is enhanced, and the plated metal hollow glass microsphere is applied to the aspects of staticelectricity coating, electromagnetic wave interference coating, wave adsorption coating and the like.

The invention provides a metal plating (copper or nickel or zinc) graphite compound material and a preparation method thereof. One of the preparation method is degreasing and coarsening the surface of the graphite radiating material; soaking and washing the processed material in sensitizing solution and activating solution; and finally carrying out chemical plating of copper or nickel or zinc and the like in plating solution, drying and post-treatment to obtain the finish product. The other preparation method is carrying out degreasing, coarsening and other pre-processing on the surface of the graphite radiating material before electroplating, and then carrying out electroplating in electroplating solution to obtain the finish product. By both of the preparation methods provided by the invention, whether chemical plating or electroplating, a graphite board material which can beautify the graphite cooling plate, improve the strength of the graphite cooling plate and add the connecting mode (like welding) of the graphite cooling plate and the metal base material can be obtained. The metal plating graphite compound material has the characteristics of low density, high heat conductivity and strength, and easy joining with metals, is an outstanding radiating material, and can be widely used in thermal management systems of electronic products.

The invention, relating to the field of ceramic surface modification, discloses a power module metalized ceramic substrate and a metallization method thereof. The method disclosed herein comprises the following steps: firstly depositing copper or silver with a thickness of 0.1-5 mum on the surface of a power module ceramic substrate by magnetron sputtering or arc ion plating; then depositing copper, silver, copper alloy or silver alloy with a thickness of 50-1000 mum by chemical plating or electroplating; and finally depositing silver, gold, tin or nickel with a thickness of 0.1-5 mum by magnetron sputtering or arc ion plating, or depositing a tin or nickel layer with a thickness of 2-5mum by chemical plating or electroplating. According to the invention, the metalized ceramic component obtained by the method disclosed herein has large current-carrying capacity, strong thermal conductivity and heat dissipation capability, good gas tightness, reliable and stable quality, etc., is easily welded with other metals or ceramics and composite materials, and can be used in the fields of vacuum devices, aerospace, aviation, radio and television, communication, metallurgy, medicine, high-energy physics, etc.

The invention relates to a method for preparing a multilayer high corrosion resistant-wear resistant composite protective coating on a magnesium alloy surface, belonging to the technical field of metal surface treatment. The method comprises the following steps that: first, carrying out plasma anodization on a magnesium alloy to form a porous ceramic layer growing on the matrix surface, then, carrying out organic coating hole sealing treatment on the coating, carrying out chemical plating the treated coating to form an Ni-P coating, finally, carrying out electroplating to form a high corrosion resistant-wear resistant Ni-P coating. According to the invention, by the prepared composite protective coating comprising the ceramic layer, the organic coating and the nickel coating on the magnesium alloy surface, the high protection and high wear resistance of the magnesium alloy matrix are realized. According to the invention, the defect of single surface treatment technique of the magnesium alloy is overcome, and the multilayer composite coating formed on the magnesium alloy surface has characteristics of good bonding force, high rigidity, corrosion resistance and wear resistance, thusbeing an ideal protective coating for magnesium alloy, meeting the protective requirements of the magnesium alloy products in the harsh environment.

During the preparation of ordered nano structure metal material, correponding colloid crystal template is first prepared via capillary abstraction self-assembling method. Spacer is set between two parallel plates to form micro passage in the same thickness as the spacer, one end of the micro passage is soaked into microsphere emulsion so that the emulsion is driven by capillary effect to the micro passage to form ordered arrangement. The bottom of the micro passage is then soaked into sensitizing stannous ion solution, so that the surface of the microsphere has one layer of sensitizing stannous ion adsorbed and is sensitized. The present invention features the surface seed growing method and colloidal crystal of polystyrene microsphere as template. When the template is set inside chemical plating solution, some interval is formed between microspheres owing to electrostatic repulsion, and the interval permits forming metal shell in the outer surface of the medium microsphere.

The invention discloses a processing method of high-precision metal patterns on the surface of a ceramic material product. The processing method comprises the following steps of: carrying out pretreatment on the ceramic material product firstly, plating a metal film with the thickness of 0.01 micron to 100 microns on the surface of the ceramic material product, then coating a corrosion-resistant photosensitive material on the metal film, carrying out exposure and development on the metal film, etching the metal film by virtue of an etching solution finally, removing the cured photosensitive material after etching, exposing metal film layer patterns, and further carrying out electroplating or chemical plating treatment on the surface of a metal film layer according to the needs. The processing method is used for manufacturing high-precision micro-nano metal patterns on the surface of the ceramic material product. With the adoption of the processing method, as the manufactured metal patterns have the characteristics that colors and the electric conductivity are adjustable, the patterns can be arbitrarily designed, the grade and the ornamental value of the ceramic material product can be increased, a ceramic substrate is not damaged, and the cost is low.

The invention provides a plastic composition and a plastic surface metallizing method. The plastic composition contains plastic matrix resin and metal chelate; the metal chelate is a complex of metal ions and organic chelating agent; and the organic chelating agent is at least one of diketone, aminocarboxylic acid, thiocarboxylic acid, polycarboxylic acid and nitrogen-containing heterocyclic compound with a general formula CnH8N2, wherein n is 10, 12 or 14. The plastic surface metallizing method comprises the following steps of: performing injection molding on the plastic composition provided by the invention to form a plastic piece, then performing laser etching on the plastic piece by adopting laser with wavelength of 1,064 nanometers to 1,000 microns, and chemically plating a laser etching area to form a metal plating layer. The organic chelating agent adopted in the plastic composition has low cost and is sensitive to the laser, so the plastic surface has high activation degree; and when the plastic surface is metallized, the infrared laser with lower cost is adopted so that the metal ions of the metal chelate in the plastic piece are decomposed as an active center of subsequent chemical plating and the precision is very high.

The invention provides a magnesium alloy direct chemical plating NI-P-SiC plating solution formula and a plating process. The formula consists of chemical plating Ni-P plating solution and SiC dispersing solution, wherein the chemical plating Ni-P plating solution comprises 20-30g/l of nickel sulfate, 20-30g/l of sodium hypophosphite, 15-30g/l of complexing agent, 15-25g/l of sodium acefate, 10-20g/l of fluoride, 1-2mg/l of stablizer, appropriate amount of PH value modifier and the balance of water; the SiC dispersing solution is formed by stirring 10-80mg/l of surface active agent and 1-8g/lof micron SiC by magnetic force; and after pretreatment of the magnesium alloy, a Ni-P-SiC composite plating layer with thickness being 20-50Mum is obtained under the process conditions that the temperature is 80-90 DEG C, the PH value is 4.8-5.6, and the plating time is 60-120 minutes. In the invention, basic nickel carbonate is replaced by nickel sulfate which is introduced as main salt; and themicron SiC is added to conduct plating directly; on the base of keeping the excellent performance of magnesium alloy chemical plating Ni-P alloy, the rigidity and abrasive resistance of the magnesiumalloy chemical plating layer are greatly improved; the problem of lower abrasive resistance of magnesium alloy nickel-plating layer is solved; and the preparation of the plating solution is convenient, the cost is low, the plating solution is stable and the deposition rate is quick.