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1374 results about "Chemical plating" patented technology

Plating chemicals and anodizing chemicals include metal salts, formula additives, and other consumables for the electrodeposition, electroless plating, electroplating, or anodized layer formation. Electrodeposition is a process which deposits a metal at the cathode from a solution of its ions.

Catalyst for hydrogen production by catalyzing and hydrolyzing borohydride and preparation method thereof

The invention relates to hydrogen production and hydrogen storage technologies and materials, in particular to a catalyst for catalytic hydrolysis of borane for the hydrogen production and a preparation method thereof, thereby solving the problems that the direct application of powder catalyst in a catalytic hydrolysis solid-liquid reaction system can cause the loss of the catalyst, the catalytic hydrolysis reaction is difficult to control and the hydrolysis by-products are difficult to be recovered, etc. The catalyst is composed of an active component and a carrier; the active component is a binary, ternary or multinary alloy or a single precious metal or the combination thereof which is composed of one or more transition metals, rare earth metals or precious metals and metalloids; the active component is deposited on the carrier through the improved chemical plating technology, the surface thereof is rough and porous, and the structure of the prepared catalyst is the amorphous or the nanocrystalline structure. The preparation method has simple preparation process, high preparation efficiency and convenient large-scale preparation; the sources of the used raw materials are rich; the catalytic activity of the prepared supported catalyst is high, the real-time control of the catalytic hydrolysis reaction of the borane can be realized, the catalytic performance is stable, and the catalyst can be repeatedly used for a plurality of times.

Surface enhanced raman detection test paper and application thereof

The invention relates to a piece of surface enhanced raman detection test paper and the application thereof, which belong to the technical field of ultra-sensitive test analysis, in particular to the piece of surface enhanced raman detection test paper and the application of the paper to detection of biological or chemical probe molecules with raman signals. The surface enhanced raman detection test paper is obtained by covering a precious metal layer on the surface of paper with a natural fiber micro nano multi-grade structure through the physical vapor deposition or chemical plating technology, the paper can be filter paper, parchment paper, napkin, newspaper or printing paper and the like, the precious metal film is gold or silver and the like, and the thickness of the precious metal film is 5 nanometers to 90 nanometers. Combined action of size, period and roughness enables incident light to generate a local electric field on the surface of a multi-stage structure and enables the electric field to be enhanced, and the detection limit can reach 10-10mol/L. The test paper has the advantages of being good in flexibility, low in cost, free of environment pollution, capable of being prepared in batch and the like, thereby being capable of being used in detection of probe molecules such as rhodamine 6G, p-aminothiophenol, riboflavin or ethanol and the like.

Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device

The invention discloses a method for manufacturing and repairing a three-dimensional molding interconnection device conductive line. The method comprises the following steps: (1) depositing a 0.1-50 micrometer thick prearranged sizing agent layer of a conductive sizing agent on the surface of a molding structural element according to the design configuration of a conductive line; (2) baking or airing the prearranged layer of the conductive sizing agent, and removing an organic solvent thereof; (3) utilizing a laser beam to irradiate the prearranged sizing agent layer so as to enable metal conductive particles in the sizing agent to be melted and mixed with a 5-500mum thin layer of the surface of a plastic matrix, and the metal conductive particles in the sizing agent to be embedded in the surface of the matrix, thereby obtaining a conductive pattern; and (4) conducting chemical plating of 2-10mum copper on the surface of the conductive pattern, and then conducting chemical plating of 1-3mum anticorrosion metal. By the method, various complex conductive lines can be quickly and directly manufactured or repaired on the surface of three-dimensional molding structural member of various plastic matrix. No platability is required for base materials or no special requirement is needed for the molding technical. The invention has the advantages of simple process, environment-friendliness, low cost and high flexibility.

Surface chemical metal plating carbon nanotube field-emission cathode preparation method

ActiveCN101661858AImprove stabilityFacilitates electron conductionCold cathode manufactureState of artChemical plating
The invention provides a surface chemical metal plating carbon nanotube field-emission cathode preparation method, which belongs to a carbon nanotube field emission cathode technology, solves the shortcomings of the existing technology, improves the electronic conduction and emission capabilities of the carbon nanotube and enhances the contact between a carbon nanotube film and a substrate electrode. The preparation method comprises the following steps: the carbon nanotube is processed through purification, cutting, scattering, and then through sensitization and activation, the carbon nanotubesurface forms a noble metal catalytic center; then the carbon nanotube surface forms a metal layer through a chemical plating method, the surface chemical metal plating carbon nanotube is prepared into evenly and stably dispersed carbon nanotube electrophoresis liquid, and finally pulse electrophoresis deposition is used for preparing the cathode of the carbon nanotube. The surface chemical metalplating carbon nanotube has good electronic conduction and emission capabilities, the carbon nanotube field-emission cathode and a substrate electrode can form good attachment, and the invention canrealize large-area, imaging and uniform preparation for the carbon nanotube field-emission cathode.

Method of manufacturing vacuum composite film coating on surface of neodymium iron boron magnet

The invention relates to the technical filed of vacuum plating, in particular to a preparation method for conducting vacuum compound plating on the surface of a neodymium iron boron magnet, which is characterized in that the preparation method comprises the following steps: A. pre-treatment, the mixed liquor of washing liquid and purified water is used for conducting oil removal and parting medium washing to the magnet surface in an ultrasonic wave cleaner; B. ion cleaning and activation, the pre-treated neodymium iron boron magnet which is dried at 80-100 DEG C for 5-10 minutes undergoes bombardment activation of a glow plasma in vacuum environment, so as to increase surface activation energy; and C. vacuum plating, vacuum plating treatment is conducted to the neodymium iron boron magnet washed by ions in a vacuum chamber, and a metal plating is prepared on the surface. The deposited metal film on the surface of the neodymium iron boron magnet has the advantages of good stability, high bonding force and tightness, stronger anti-corrosion performance in cold and hot alternation environment. Furthermore, in the physical vapor deposition plating process, the plating thickness is affected much less by the magnet workpiece corner than in electroplating and chemical plating, and the pollution problem is avoided in the preparation process.

Magnesium alloy with zinc and nickel compound plating layers and preparation method thereof

InactiveCN101525711AWeak corrosiveCorrosion freeChemical platingNickel compounds
The invention discloses a magnesium alloy with zinc and nickel compound plating layers and a preparation method thereof. A zinc plating layer of the magnesium alloy is taken as a bottom layer with the width between 20 microns and 25 microns, a nickel plating layer is taken as a surface layer, and the total width of the zinc plating layer and the nickel plating layer is less than or equal to 40 microns. The method comprises the following steps: firstly, plating preliminary treatment, i.e. zinc is activated in an acid solution and then soaked in sulphate; secondly, zinc electrodeposition, i.e. after the zinc is soaked in the sulphate in the first step, the zinc layer of the magnesium alloy is electrodeposited; thirdly, nickel bright plating, i.e. the magnesium alloy which is nicely processed in the second step is brightly plated with nickel in a nickel plating solution; fourthly, sodium silicate water solution sealing. With the method, the obtained zinc plating layer is nicely combined with a base body, has uniform width and high corrosion resistance, can be taken as a protective plating layer to be singly used and can be also taken as a transition layer to carry out plating or chemical plating or other protective or decorative platings, and the nickel plating layer obtained from the zinc plating layer by plating is nicely combined with the zinc plating layer and is uniform, exquisite, bright and beautiful.

Structure and manufacturing method for selectively forming metal on plastic substrate

The present invention relates to a structure and a method for selectively forming a compact and precise metal pattern on a plastic substrate surface. The structure comprises three layers of materials such as a plastic substrate, nickel or zinc or an indium tin oxide material, and a metal subsequently deposited on the material, wherein the nickel or the zinc or the indium tin oxide material is formed through adopting laser to irradiate the plastic substrate, decomposing an additive previously added to the plastic, and adopting reductive chemical plating to treat. The manufacturing method comprises: adopting laser to selectively scan the plastic substrate. According to the present invention, the additive does not adopt a copper-containing oxide, a copper chelate, a copper complex and a metal oxide having a spinel structure, and adopts the environmentally friendly non-toxic inorganic salt containing nickel and zinc, and the indium tin oxide material, the coupling agent is adopted to carry out coating modification to prepare the additive having a core-shell structure, and the additive is added to the plastic to prepare the laser composite plastic; the laser is adopted to decompose the shell part of the additive so as to release active ingredients in the core; the present invention belongs to a new material based advanced assembly and manufacturing technology in the field of electronic and electric apparatuses; and the structure and the method are used for manufacturing mobile phone antennas, transparent lamp parts, automobile parts, three-dimensional circuits and other products.

Preparation method of ceramic circuit board

The invention relates to a ceramic surface modifying technology, particularly relates to a method for metalizing the surface of a ceramic profiled bar, and specifically provides a preparation method of a ceramic circuit board... The preparation method of the ceramic circuit board comprises the preparation steps of: (1) preparing a ceramic substrate; (2) engraving a required circuit pattern with laser on the surface of the ceramic substrate; (3) in chemical plating, and chemically plating copper on the ceramic substrate obtained in the step (2) to realize bottoming; and (4) chemically plating nickel or chemically plating gold or silver on the surface of a plated layer, so as to prevent copper from being oxidized. According to the preparation method of the ceramic circuit board provided by the invention, a laser engraving technology is combined with chemical copper plating, so that the ceramic board is selectively coated with copper, and the good selectivity is achieved. By using the laser engraving technology, the binding force of a conductive layer with a ceramic base body is good; production equipment is cheap and easy to obtain. Furthermore, the three-dimensional ceramic circuit board can be easily produced; the circuit pattern design is very simple; and the circuit precision is high. Moreover, compared with the other technologies, the preparation method provided by the invention has the advantage that the 'three wastes' emission in a production process is reduced.

Surface chemical plating treatment process for hollow glass microsphere, plated metal hollow glass microsphere and application thereof

ActiveCN102311233AEasy PlatingCoarse wellChemical platingMicrosphere
The invention relates to the technical field of a composite material with a core shell structure and provides a surface chemical plating treatment process for hollow glass microspheres. The surface chemical plating treatment process comprises the following steps: carrying out alkaline wash and hydrogen peroxide wash before plating to coarsen and hydroxylate the surface of the hollow glass microsphere; and carrying out chemical plating on the processed hollow glass microsphere to obtain a metal-plated hollow glass microsphere. In the method, complex preprocessing technology, such as sensitization, activation and the like in the existing method, can be simplified, and the use of expensive stannous chloride and palladium chloride which are not environmentally-friendly is avoided. Compared with the existing hot alkaline liquor processing method, the process provided by the invention has the advantages that possible microsphere fracture caused by the long-time soaking in the alkaline liquor can be avoided, and the surface hydroxylation efficiency of the hollow glass microsphere can be greatly increased by using hydrogen peroxide. The hollow glass microsphere processed with the method is easy to plate. The obtained metal-plated hollow glass microsphere has the advantages of a complete metal layer, light weight, good electrical conductivity and the like. When the obtained metal-plated hollow glass is used as a filler, material density can be lowered, cost is lowered, mechanical property is enhanced, and the plated metal hollow glass microsphere is applied to the aspects of staticelectricity coating, electromagnetic wave interference coating, wave adsorption coating and the like.

Metal coating plumbago composite material and method of producing the same

The invention provides a metal plating (copper or nickel or zinc) graphite compound material and a preparation method thereof. One of the preparation method is degreasing and coarsening the surface of the graphite radiating material; soaking and washing the processed material in sensitizing solution and activating solution; and finally carrying out chemical plating of copper or nickel or zinc and the like in plating solution, drying and post-treatment to obtain the finish product. The other preparation method is carrying out degreasing, coarsening and other pre-processing on the surface of the graphite radiating material before electroplating, and then carrying out electroplating in electroplating solution to obtain the finish product. By both of the preparation methods provided by the invention, whether chemical plating or electroplating, a graphite board material which can beautify the graphite cooling plate, improve the strength of the graphite cooling plate and add the connecting mode (like welding) of the graphite cooling plate and the metal base material can be obtained. The metal plating graphite compound material has the characteristics of low density, high heat conductivity and strength, and easy joining with metals, is an outstanding radiating material, and can be widely used in thermal management systems of electronic products.

Method for preparing multilayer high corrosion resistant-wear resistant composite protective coating on magnesium alloy surface

The invention relates to a method for preparing a multilayer high corrosion resistant-wear resistant composite protective coating on a magnesium alloy surface, belonging to the technical field of metal surface treatment. The method comprises the following steps that: first, carrying out plasma anodization on a magnesium alloy to form a porous ceramic layer growing on the matrix surface, then, carrying out organic coating hole sealing treatment on the coating, carrying out chemical plating the treated coating to form an Ni-P coating, finally, carrying out electroplating to form a high corrosion resistant-wear resistant Ni-P coating. According to the invention, by the prepared composite protective coating comprising the ceramic layer, the organic coating and the nickel coating on the magnesium alloy surface, the high protection and high wear resistance of the magnesium alloy matrix are realized. According to the invention, the defect of single surface treatment technique of the magnesium alloy is overcome, and the multilayer composite coating formed on the magnesium alloy surface has characteristics of good bonding force, high rigidity, corrosion resistance and wear resistance, thusbeing an ideal protective coating for magnesium alloy, meeting the protective requirements of the magnesium alloy products in the harsh environment.

Magnesium alloy direct chemical plating NI-P-SiC plating solution formula and plating process

The invention provides a magnesium alloy direct chemical plating NI-P-SiC plating solution formula and a plating process. The formula consists of chemical plating Ni-P plating solution and SiC dispersing solution, wherein the chemical plating Ni-P plating solution comprises 20-30g/l of nickel sulfate, 20-30g/l of sodium hypophosphite, 15-30g/l of complexing agent, 15-25g/l of sodium acefate, 10-20g/l of fluoride, 1-2mg/l of stablizer, appropriate amount of PH value modifier and the balance of water; the SiC dispersing solution is formed by stirring 10-80mg/l of surface active agent and 1-8g/lof micron SiC by magnetic force; and after pretreatment of the magnesium alloy, a Ni-P-SiC composite plating layer with thickness being 20-50Mum is obtained under the process conditions that the temperature is 80-90 DEG C, the PH value is 4.8-5.6, and the plating time is 60-120 minutes. In the invention, basic nickel carbonate is replaced by nickel sulfate which is introduced as main salt; and themicron SiC is added to conduct plating directly; on the base of keeping the excellent performance of magnesium alloy chemical plating Ni-P alloy, the rigidity and abrasive resistance of the magnesiumalloy chemical plating layer are greatly improved; the problem of lower abrasive resistance of magnesium alloy nickel-plating layer is solved; and the preparation of the plating solution is convenient, the cost is low, the plating solution is stable and the deposition rate is quick.
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