563 results about "Chemical plating" patented technology

The invention belongs to the field of new materials, and particularly relates to preparation and application of chemical copper plating cellulose composite fibers. The preparation method of the composite fiber comprises the following steps: (1) mixing absolute ethyl alcohol, ammonia water and water in proportion, adding cellulose fiber, heating, stirring and uniformly mixing, adding a dopamine hydrochloride solution, washing and drying to obtain a polydopamine coating / cellulose composite fiber; (2) adding the composite fiber prepared in the step (1) into an alkaline solution, adding a silver nitrate solution, stirring, washing and drying to obtain a polydopamine reduced nano-silver / cellulose composite fiber; and (3) adding the composite fiber obtained in the step (2) into a chemical plating solution containing copper ions for plating to obtain the chemical copper-plated cellulose composite fiber. The electroless copper-plated cellulose composite fiber shows outstanding electric heating and photo-thermal properties, can accurately capture electrocardiosignals of a human body before and after movement at the same time, and provides a new thought for development of wearable electronic fabrics and intelligent sensors.

The invention belongs to the technical field of conductive microsphere preparation, and particularly relates to a surface-roughened nickel-plated conductive microsphere and a preparation method and application thereof. The preparation method comprises the following steps: carrying out pretreatment to enable the surfaces of the polymer microspheres to contain nickel ions, reducing the nickel ions into nickel nanoparticles, activating the microspheres and carrying out chemical plating. According to the invention, the specific surface area of the conductive microspheres is increased by reducing the nickel nanoparticles on the surfaces of the microspheres, a large amount of impurities cannot be generated among the microspheres, and adhesion among the microspheres can be effectively prevented. According to the prepared conductive microspheres, the plating layer and the polystyrene microspheres are firmly combined, and the risk that the conductivity is reduced due to the fact that the surface of the plating layer falls off is reduced. The preparation method is safe, environment-friendly, simple, convenient and suitable for industrial production requirements.

The invention discloses a protruding conductive microsphere and a pretreatment method thereof. The pretreatment method specifically comprises the steps of roughening treatment, protruding and interface activity treatment, sensitization treatment, activating treatment and chemical plating. In the protruding and interfacial activity treatment, by adding an interfacial agent, the electronegativity of the surfaces of the microspheres is enhanced, electrostatic adsorption with positively charged nickel nanoparticles is generated, and meanwhile, agglomeration of the nickel nanoparticles on the surfaces of the polymer microspheres is effectively prevented through the steric hindrance effect; therefore, a nickel nanoparticle bulge structure which is high in density, uniform in distribution and firm in combination is formed on the surface of the polymer microsphere. The method effectively solves the problems that a traditional conductive microsphere coating is prone to cracking and falling off, poor in dispersity and the like, the prepared protruding conductive microspheres have the outstanding advantages of being high in coating binding force, excellent in conductivity, good in dispersity, not prone to agglomeration and the like, the technological process is simple, mass production is easily expanded, and the method is suitable for large-scale production. The anisotropic conductive adhesive film has a wide commercial application prospect in the field of electronic packaging such as anisotropic conductive adhesive films.

The invention discloses a preparation method of a PCB, and the method comprises the steps: preparing a high polymer material into a solution, and adding a nanoscale pore-forming agent to form a mixture; coating the mixture on the surface of a PCB substrate; grinding the surface of the PCB substrate; etching is carried out on the PCB substrate; carrying out chemical plating on the etched PCB substrate; performing electrochemical deposition of a metal layer on the PCB substrate subjected to chemical plating treatment to obtain a metal-clad plate; and performing outer-layer circuit manufacturing on the metal-clad plate to obtain the PCB. According to the PCB prepared by the preparation method disclosed by the invention, the surface roughness is reduced, the surface flatness of the PCB is improved, the binding force between the substrate and the metal layer is improved, and the signal loss of the PCB can be greatly reduced; and meanwhile, the production process flow is shortened, the production cost is reduced, and the production efficiency is improved.

The invention belongs to the field of hard alloy materials, and provides a modified high-performance non-magnetic hard alloy and a preparation process thereof. The surface of a WC particle is chemically plated with a Ni-P-B-Cr-Cu amorphous shell layer, and a binding phase is converted into Ni3P and Ni3B nanophase through two-stage sintering. The WC alloy comprises the following components in parts by weight: 85-95 parts of WC, 12-25 parts of a binding phase and 0.5-1.4 parts of a grain growth inhibitor, the nanophase accounts for 35-50% of the volume of the binding phase and 35-50% of the total volume of the binding phase, and the grain size is 80-125 nm; the average grain size of WC is 0.6-1.0 [mu] m; and the thickness of an interface P enrichment layer is 8-15 nm (the coverage rate is 85-95%). Through interface engineering and controlled crystallization from amorphous to nanocrystalline, the relative magnetic conductivity is 1.001-1.015, the hardness HRA is 90.5-93.0, the strength TRS is 2.2-3.0 GPa, the toughness KWP is 300-450 N / mm, and the magnetic saturation strength is 0.02-0.15 T. The problem of decoupling of the magnetic property and the mechanical property of a traditional non-magnetic hard alloy is solved, and the non-magnetic hard alloy is suitable for magnetic sensitive environments such as semiconductor equipment, precise measurement, MRI tools and oil service logging.

The invention relates to the technical field of photovoltaics, and discloses photovoltaic conductive silver-coated copper micro powder and a preparation method thereof, and the preparation method aims to solve the problem that performance and cost of existing silver-coated copper micro powder in photovoltaic application are difficult to consider at the same time. Through pH adjustment, organic pre-bonding treatment and gradient ammonification, the activity of the copper powder is reserved, and a uniform copper-ammonia complexing layer is constructed; in the chemical silver plating stage, the pretreatment liquid is added into a composite base solution containing a complexing agent, organic amine, a dispersing agent and a combined reducing agent, and a silver-ammonia solution is dropwise added for reaction under ultrasonic dispersion and nitrogen introduction protection; and in the post-treatment stage, a finished product is obtained through ethanol reflux desorption, antioxidant treatment, vacuum drying, low-temperature plasma activation and screening, uniform and complete coating of a silver layer can be achieved under the low silver content, and a feasible path is provided for replacing photovoltaic pure silver powder with silver-coated copper micro powder on a large scale.

The invention relates to a preparation method of a ceramic-based composite material, in particular to a preparation method of a ceramic-based composite material with a pyrolytic carbon-carbon nanotube interface, which is used for solving the problem that in the aspect of improving the thermal conductivity of an interface layer, metals such as Fe, Co, Ni and the like are widely used as catalysts for growing carbon nanotubes at present, so that the thermal conductivity of the interface layer is improved. Carbon nanotubes obtained through a traditional preparation method are prone to agglomeration and uneven in distribution, the risk of the preparation process is high, the carbon nanotubes are not suitable for large-scale production, although metal particles can be reduced through a chemical plating method, the particle sizes of the metal particles are not controlled, the distribution of the metal particles is uneven, and the requirement of a chemical vapor reduction method for distribution of an earlier-stage metal salt solution is high. And the defect is difficult to realize easily. According to the preparation method of the ceramic-based composite material with the pyrolytic carbon-carbon nanotube interface, the ceramic-based composite material with the pyrolytic carbon-carbon nanotube interface is finally obtained through pretreatment, solution A preparation, metal salt solution in-situ reduction and chemical vapor deposition in sequence.

The invention discloses a method for chemically plating silver on the surface of a nickel-plated ceramic copper-clad substrate, and relates to the technical field of metal surface treatment. The preparation method comprises the following steps: S1, sequentially adding nitric acid, imidazole and a surfactant into deionized water, and uniformly mixing to obtain an activating agent; s2, after the ceramic copper-clad substrate is pretreated, chemical nickel plating treatment is carried out, cleaning and drying are carried out, and a nickel-plated ceramic substrate is obtained; and S3, the nickel-plated ceramic substrate is immersed in an activating agent for activating treatment, chemical silver plating treatment and post-treatment are conducted, and a product is obtained. According to the method provided by the invention, the problem of copper ion migration in the later silver welding process of chemical silver plating on the surface of the ceramic copper-clad substrate can be solved, and the performance of the packaging module is improved.

The invention discloses an electromagnetic shielding cable for a radio altimeter and a preparation method thereof, and relates to the technical field of cables. The preparation method comprises the following steps: treating ethylene-tetrafluoroethylene copolymer particles, a mixed compatilizer, a chemical foaming agent and a nano nucleating agent by using mixed gas low-temperature plasma containing acrylic acid, performing melt blending by using a double-screw extruder, injecting supercritical carbon dioxide, and performing slow cooling and shock cooling to obtain a three-dimensional porous matrix containing micro-nano cells; the preparation method comprises the following steps: synthesizing ferroferric oxide particles by a solvothermal method, coating a silicon dioxide dielectric layer, and then chemically silvering to prepare ternary core-shell composite particles; modifying the particles with aminopropyltriethoxysilane and a block copolymer to obtain modified composite particles; melting, mixing and granulating the porous matrix and the modified composite particles to obtain the electromagnetic shielding composite material. And performing extrusion molding on a conductor to form an insulation shielding layer, thereby obtaining the cable. The cable has an excellent electromagnetic shielding effect.

The invention discloses a modified FeSiCr soft magnetic material, a preparation method thereof and application of the modified FeSiCr soft magnetic material in marine environment devices, and belongs to the technical field of soft magnetic materials. Comprising flaky FeSiCr soft magnetic powder, and a Ni-P alloy layer, a dopamine-quaternary ammonium salt copolymer grafting layer, a tannic acid-metal ion layer, a nano SiO2-Al2O3 layer and a polysiloxane resin-boron nitride layer which sequentially coat the FeSiCr soft magnetic powder from inside to outside, and the preparation method comprises the steps of chemical plating, grafting modification, sol-gel sintering and hot press molding. Through the synergistic effect of the five coating layers, the modified FeSiCr soft magnetic material achieves comprehensive improvement of corrosion resistance, antibacterial property, insulativity and magnetic performance in the marine environment, is suitable for marine anti-corrosion wave-absorbing coatings, high-frequency electromagnetic elements and other scenes, and has the advantages of being long-acting in service, high in environmental adaptability and the like.

The invention discloses a preparation method of an integrated collector plate for a vanadium battery. The preparation method comprises the following steps: preparing foamed nickel deposited by carbon nanotubes; pressing the conductive particles into sheets, sequentially putting the conductive sheets, the modified foamed nickel and the conductive sheets into a mold, and integrally forming by using a hot press to obtain the composite bipolar plate. Silver-copper composite powder is prepared by plating silver on the surface of copper powder through chemical plating, conductive adhesive containing silver-copper metal powder is prepared, and a copper plate and a composite bipolar plate are bonded through the conductive adhesive to prepare the integrated collector plate. The foamed nickel is used as a framework material, the interface between the foamed nickel and the carbon composite layer is improved by depositing the carbon nanotubes on the surface of the foamed nickel, the mechanical strength and the conductivity of the composite bipolar plate are improved, nano-scale silver particles on the surface of the copper powder can be melted by performing heat treatment on the silver-copper composite powder, a continuous silver film is formed, and the conductivity of the composite bipolar plate is improved. The conductivity and oxidation resistance of the conductive adhesive are improved, and the contact resistance between the bipolar plate and a copper plate is reduced, so that the performance of the flow battery is improved.

The invention discloses a composite material with a shielding function, a preparation method thereof and an interphone shell. The composite material comprises a polycarbonate-acrylonitrile-butadiene-styrene copolymer, a modified conductive filler, maleic anhydride grafted polyethylene, polyaryletherketone, a flame retardant, an antioxidant, glass microfibers and a compatilizer, wherein the modified conductive filler is aluminum oxide ceramic particles subjected to chemical copper plating and graft polymerization treatment. The preparation method comprises the steps of modified conductive filler preparation, step-by-step raw material mixing, twin-screw extrusion granulation and drying. The interphone shell is prepared from the composite material through injection molding, and the injection molding process comprises the steps of raw material drying, injection molding machine preheating, charging and injection molding, and demolding and finishing. The composite material is stable in electromagnetic shielding performance and has good mechanical strength and heat resistance; the preparation method can improve the dispersity of the components and is adaptive to conventional equipment; the interphone shell can block electromagnetic wave interference, is suitable for being used in multiple environments, and meets the requirements of an electronic equipment shell for shielding and structural performance.

The invention provides a silicon carbide MOS device chemical plating grid electrode protection method and a process structure, and the protection method comprises the steps: enabling a contact surface of a printing net to be pasted on a target wafer, enabling the position of a mesh to correspond to the position of a grid electrode bonding pad, enabling a net body to accurately cover a region of a source electrode bonding pad, enabling a protection glue to be accurately coated on a designated region instead of the whole surface of the target wafer, and enabling the surface of the target wafer to be protected. Therefore, the use amount of the protective glue is effectively saved and cost is reduced. After gluing is completed, a protective glue layer with a stable structure is formed on the surface of the grid bonding pad through a light curing process, and the protective layer has the peelable characteristic while keeping good adhesive force. And after the chemical plating treatment of the source electrode bonding pad is completed, the protection glue layer can be completely removed without residual pollutants, so that the reliable protection of the grid electrode bonding pad is realized. According to the chemical plating grid protection method for the silicon carbide MOS device, the protection effect and the process stability of the grid region in the chemical plating process are improved by optimizing the selection of the protection material and the coating process.

The invention discloses a hardness sensor based on pressure and strain sensor co-integration and a preparation method, and belongs to the technical field of flexible hardness sensors. The hardness sensor comprises a lower packaging layer, a lower electrode, a lower strain sensor, a lower pressure-sensitive film, an upper pressure-sensitive film, an upper strain sensor, an upper electrode and an upper packaging layer which are sequentially arranged from bottom to top. According to the invention, the pressure-sensitive film is prepared by a template method, the electrode layer is adhered to the pressure-sensitive film through the adhesive, and then the redundant pressure-sensitive film is etched by laser to obtain the pressure sensor; and the strain sensor is obtained through laser etching and chemical plating. As the space utilization rate of the pressure sensor is not high, the strain sensor is embedded into the gap of the pressure sensor, so that the pressure sensor and the strain sensor are positioned on the same plane, the space utilization rate of the device is improved, the sensitivity and the response speed of the sensor are improved, and more accurate and efficient hardness detection is realized.

The invention discloses a wood-plastic lightweight porous copper foil, a preparation method thereof and an application of the wood-plastic lightweight porous copper foil in a secondary battery. Firstly, lignin and cellulose obtained from wood are used as base materials, a suspension is prepared, and a lignocellulose membrane is prepared through film casting; then the lignocellulose membrane is subjected to coupling or cross-linking treatment, and the mechanical strength and chemical stability of the lignocellulose membrane are improved; and finally carrying out sensitization, activation and chemical copper plating treatment to obtain the wood-plastic lightweight porous copper foil current collector. The wood-plastic light porous copper foil is rough in surface and porous, so that the adhesive force between an active substance and a current collector is increased, the adhesive force and electric contact between active particles and the current collector are improved, and the rate capability of the battery is further improved; meanwhile, a larger internal space is provided for accommodating the volume change of the active substance, and the cycle life of the battery is prolonged. The problems that a current collector is large in mass, the adhesive force between an active substance and an electrode coating is weak, and a copper foil current collector preparation process is complex in equipment and too high in cost are solved.

The invention relates to the field of copper plating solutions, and provides a low-stress chemical copper plating solution for a glass substrate and a preparation method of the low-stress chemical copper plating solution. The invention discloses a copper ion carboxyl chelate, which is composed of copper ion carboxyl chelate, 2, 2 '-bipyridine, polyethylene glycol-8000, lauryl sodium sulfate, a sodium carbonate buffer agent, deionized water and a pretreatment solvent, and the copper ion carboxyl chelate is prepared by chelating a polyacrylate-itaconic acid copolymer with copper chloride and then carrying out stepwise cross-linking with epichlorohydrin and N, N'-methylene bisacrylamide. The copper-bis-salicylaldehyde ethylenediamine complex is obtained by reacting bis-salicylaldehyde ethylenediamine with copper acetate, crystallizing and purifying. The preparation method comprises the steps of solvent premixing, chelating activation, staged additive integration, pH dynamic regulation and control and plating solution purification, through nitrogen protection, high-shear stirring and accurate pH regulation, the problems that a traditional chemical copper plating layer is high in stress and poor in conductivity are solved, and the method is suitable for high-precision glass substrate surface metallization.

The invention provides a gradient composite graphene electrolysis electrode plate and an in-situ preparation method thereof. The electrode plate comprises a metal conductive base material (such as titanium alloy), a porous ceramic skeleton layer (Al2O3-40% ZrO2, the porosity of which is 30 + / -5%), a chemical copper plating layer for filling pores, an electroplated nickel-ruthenium alloy catalytic layer (Ni: Ru = 9: 1) and 3-5 graphene functional layers (ID / IG is less than or equal to 0.08) grown in situ, wherein the porous ceramic skeleton layer (Al2O3-40% ZrO2) is laser-cladded on the surface of the porous ceramic skeleton layer (Al2O3-40% ZrO2). The preparation method comprises the following steps: performing laser cladding on a ceramic skeleton, wherein the power density is 300-500W / mm < 2 >, and sintering at 1600 DEG C to form metallurgical bonding; gradient plating: electroless copper plating (containing nano-diamond enhancement) and pulse electroplating of Ni Ru (duty ratio is 1: 5); and performing directional CVD growth: after reducing the catalyst layer by H2 at 1050 DEG C, introducing CH4 / H2 (the volume ratio is 1: 4) in a pulse manner, and realizing full coverage of the inner wall of the mesh by vortex air intake. The technical effects are as follows: (1) the overpotential of chlorine evolution in saturated salt water at 80 DEG C is as low as 268mV (1A / cm < 2 >); (2) strong acid environment service life gt; the time is 100 thousand hours (12 times that of the national standard); (3) the production cost is lt; and 620 / m < 2 > (90% lower than that of a traditional ruthenium-iridium coating). The problems of graphene transfer damage and special-shaped electrode covering are solved.

The invention relates to the technical field of composite metal materials, in particular to a silver-coated graphene copper composite material and a preparation method thereof, and aims at solving the problems that traditional silver-coated copper powder is high in silver consumption, copper is oxidized due to the fact that a silver layer is prone to being damaged, and conductivity is insufficient. The method comprises the steps that a graphene coating layer is formed on a copper powder substrate in situ through chemical vapor deposition, and graphene copper powder is obtained; performing etching treatment on the graphene copper powder to controllably expose part of the copper substrate so as to form anchoring points for silver ion deposition; carrying out reduction treatment on the etched graphene copper powder so as to ensure that an anchoring site has chemical activity; in a reductive liquid phase environment, enabling a chemical silver plating solution to react with the graphene copper powder subjected to reduction treatment, and guiding silver ion deposition by utilizing an anchoring point, so as to form a silver coating layer on the surface of the graphene coating layer; and separating and drying the reacted system to obtain the silver-coated graphene copper composite material. The material is better in oxidation resistance and conductivity, and the process is free of waste liquid.

The invention provides a copper etching solution and application thereof. The copper etching liquid comprises an inorganic acid, hydrogen peroxide, an azole compound, a halogen ion source and an amine compound, wherein the amine compound is selected from a compound shown in a formula 1 or an ammonium salt with a structural fragment shown in a formula 2. When the copper etching solution is applied to etching treatment on a chemical copper plating seed layer by a semi-additive method, the copper etching solution shows excellent differential etching capability, and has no obvious etching on the side wall of electroplating copper and the seed layer at the bottom of a copper circuit on the basis of effectively removing the seed layer between the copper circuits, so that the etching quality of the copper plating seed layer is improved. The undercut phenomenon can be prevented, the line width reduction amount is small, and the reliability degree of micronized line wiring can be obviously improved.

The invention discloses a coating for a chemical plating process and a preparation method of the coating, and belongs to the field of three-dimensional precision machining. The coating is arranged on the surface of a base material, and based on the mass percentage of the coating, the coating comprises 55%-85% of a cross-linked product of an epoxy resin AB agent, 1%-5% of nano metal particles and 10%-40% of water-soluble polymers. The coating is adopted for a chemical plating process, the process steps are few, and the binding force between a metal circuit and a base material in the prepared three-dimensional interconnection molding device is excellent.

The present invention relates to a palladium-free activated chemical copper deposition process for a resin substrate, the process comprising the following steps: (1) sequentially performing a degreasing treatment and a roughening treatment on the resin substrate to obtain a pretreated resin substrate; (2) immersing the pretreated resin substrate in a pyrrole solution for a period of time, then immersing the resin substrate in a ferric chloride solution and allowing it to stand for a period of time to obtain a substrate with a polypyrrole film, placing the substrate with the polypyrrole film above boiling water so that water vapor fumigates the substrate with the polypyrrole film, and then washing to obtain an activated substrate; (3) immersing the activated substrate in a chemical copper deposition solution to perform chemical copper deposition to obtain a chemical copper plating layer. Compared with the prior art, the present invention uses pyrrole-loaded colloidal iron as a catalytic active site for chemical copper plating to achieve chemical copper deposition on the surface of a non-conductive plastic substrate, replacing the use of precious metals, solving the problem of difficult treatment of waste liquid from precious metal catalytic reactions, and reducing production costs.

The present invention discloses a low-reflection magnetic electromagnetic shielding polyimide non-woven fabric and its preparation and application, belonging to the technical field of electromagnetic shielding materials. The present invention adopts green and environmentally friendly water-alcohol electrospinning and thermal imidization process to prepare polyimide fiber non-woven fabric, and uses a roughening liquid to roughen the fiber surface; at the same time, a specific metal salt is used as an activator of the chemical plating solution to achieve surface metallization of the polyimide fiber, and then a specific surfactant is used to perform surface treatment on it, and a "needle-shaped" magnetic material outer layer loading is achieved through a hydrothermal method and high-temperature annealing treatment. The preparation process of the present invention is simple and easy to operate, and is expected to be applied to fields that require electromagnetic shielding, such as aerospace, military equipment, microelectronic equipment, and civilian electrical appliances.

The invention belongs to the field of water electrolysis hydrogen production, and relates to a gradient pore structure electrode and a preparation method and application thereof.The preparation method comprises the following steps that 1, the surface of an electrode substrate is sequentially coated with polystyrene of different particle sizes, then low-temperature sintering is conducted, and the polystyrene is fixed to the surface of the electrode substrate; obtaining an electrode substrate fixed with a polystyrene molecular template; 2) electroplating a metal coating on the surface of the electrode substrate fixed with the polystyrene molecular template by adopting a chemical plating method to obtain the electrode substrate which contains the metal coating and is fixed with the polystyrene molecular template; and 3) carrying out template removal and metal substrate removal treatment on the electrode substrate which contains the metal coating and is fixed with the polystyrene molecular template obtained in the step 2) to obtain the gradient pore structure electrode. An efficient three-phase reaction interface is constructed through the gradient holes, the bubble shielding effect is reduced, the overpotential and the water electrolysis energy consumption are reduced, and the water electrolysis hydrogen production efficiency is improved.

A metal interconnect structure is doped with zinc, indium, or gallium using top-down doping processes to improve diffusion barrier properties with minimal impact on line resistance. Dopant is introduced prior to metallization or after metallization. Dopant may be introduced by chemical vapor deposition on a liner layer at an elevated temperature prior to metallization, by chemical vapor deposition on a metal feature at an elevated temperature after metallization, or by electroless deposition on a copper feature after metallization. Application of elevated temperatures causes the metal interconnect structure to be doped and form a self-formed barrier layer or strengthen an existing diffusion barrier layer.

The present application relates to a modified diamond micro-powder and a preparation method and application thereof. The preparation method of the modified diamond micro-powder comprises the following steps: performing hydroxylation treatment on diamond micro-powder to obtain surface hydroxylated diamond micro-powder; performing pretreatment on the surface hydroxylated diamond micro-powder in a mixed solution of a silane coupling agent and an organic solvent under ultrasonic conditions with a frequency of 25KHz-40KHz and an intensity of 1W / cm 2 -3W / cm 2 to obtain pretreated diamond micro-powder; and performing vacuum heat treatment on the pretreated diamond micro-powder to obtain modified diamond micro-powder. The preparation method greatly improves the bonding force between the modified layer and the diamond and improves the micro-powder agglomeration, so that the pretreatment link before chemical plating has the feasibility of batch processing, which not only doubles the production efficiency, but also reduces the production cost to one third of the traditional method.

The invention discloses a submicro-scale self-supporting metal grid flexible transparent electrode and a manufacturing method thereof, and belongs to the technical field of flexible electrode manufacturing. The manufacturing method provided by the invention comprises the following steps: preparing a printing solution, wherein the printing solution contains a polymer, silver nitrate and a solvent; printing a submicro-scale polymer-based seed layer grid structure on the hydrophobic substrate by using an electric field driven spray deposition micro-nano 3D printing technology; performing steam reduction on the surface of the polymer-based seed layer grid structure, and then depositing metal through chemical plating to form a metal grid structure; and stripping from the surface of the hydrophobic substrate. According to the invention, simple, efficient and low-cost manufacturing of the submicro-scale, ultrathin, soft, breathable and substrate-support-free self-supporting metal grid flexible transparent electrode with high photoelectric performance is realized, and the electrode has general applicability in the application fields of electronic skin, flexible sensors, transparent wearable and portable electronic equipment and the like.

The invention discloses a micro-through-hole structure polymer metallization method for guided wave transmission, and belongs to the technical field of photoelectric device processing, a polymer substrate is used for replacing a traditional all-metal material, and the micro-through-hole structure polymer metallization method for guided wave transmission is achieved through the multi-stage processes of plasma activation, chemical coarsening, sensitization, chemical plating, electroplating and the like. And forming a compact and high-adhesion metal layer on the inner surface of the through hole of the polymer substrate. In the process, a microfluid pump or a peristaltic pump is adopted to drive the solution to circularly flow in the through hole and the microcavity. According to the micro-through-hole structure polymer metallization method for guided wave transmission, dynamic flowing of a chemical plating solution in a micro-through hole and an internal cavity is achieved by introducing a micro-fluid pump or a peristaltic pump, and therefore a uniform, compact and firmly-attached metal layer is obtained.

The invention provides a high-entropy rare earth doped WC hard alloy and a preparation method and application thereof, and belongs to the technical field of alloys. The precursor is prepared through wet codeposition, compared with ball-milling mixing, atomic-scale dispersion can be achieved, rare earth segregation can be avoided, high-entropy rare earth nano-particles are distributed in WC crystals and pinned in WC crystal boundaries, dislocation movement is hindered, meanwhile, WC is doped with high-entropy rare earth, all elements in the high-entropy rare earth act synergistically, the hardness and strength of the alloy are improved, and the performance of the alloy is improved. And compared with chemical plating, Co is plated through magnetron sputtering, the interface bonding strength can be improved, introduction of impurities is avoided, and the hardness and strength of the alloy are further improved. The result of the embodiment shows that the hardness of the prepared high-entropy rare earth doped WC hard alloy is 93.9 HRA or above, and the bending strength is 2980 MPa or above.

The invention discloses a chemical plating method for plating copper on the surface of a silicon wafer, which belongs to the technical field of semiconductor coating, and comprises the following steps: modifying a semiconductor material BaTiO3 nanocrystal by a silane coupling agent to prepare quantum dot ink, spin-coating the quantum dot ink on the surface of a P-type silicon wafer cleaned by RCA to form a quantum dot array, and coating the quantum dot array on the surface of the P-type silicon wafer. The preparation method comprises the following steps: activating in a solution containing copper sulfate and trisodium citrate under the assistance of ultrasonic waves, carrying out chemical copper plating in a micro-fluidic reaction cavity by using an alkaline plating solution containing copper sulfate, disodium ethylene diamine tetraacetate and glyoxylic acid under the assistance of ultrasonic waves and lasers, and finally washing with deionized water and ethanol and drying with nitrogen to obtain a silicon wafer with a copper-plated surface. Through the BaTiO3 quantum dots, the micro-fluidic channel, the pulse liquid supply system and the auxiliary synergistic effect of the ultrasonic wave and the laser array, the copper film which is uniform in thickness, high in adhesive force, good in conductivity and excellent in corrosion resistance can be prepared, and the chemical copper plating efficiency and quality are improved.

The invention provides a method for improving the fineness of a laser activation selective metallization fine line by using a water layer. The invention belongs to the field of laser activation selective metallization, and particularly relates to a method for improving the fineness of a metal layer through a water layer in the laser activation selective metallization machining process. The inventor finds that the surface of the selective metallization composite material capable of being activated by laser is covered with a horizontal hydrostatic layer, so that activated thin wires with the fineness degree superior to the line width limit in an air medium can be activated on the composite material containing a laser sensitizer by laser, and chemical copper plating with a good effect can be carried out on the surface of an activated area. The metal fine wire with the wire width of 55-60 microns is obtained by covering the composite material base material with the horizontal static water layer. Compared with a traditional air medium processing method, the method breaks through the limit of coating fineness of laser selective activation processing under an air medium, and the obtained coating is very excellent in thickness and strength. The method has the advantages of low cost, convenience in manufacturing, easiness in large-scale use and excellent industrial application value.