357 results about "Copper plating" patented technology

The invention discloses a copper plating method for a superconducting strip. The method comprises the following steps: S1, carrying out initial electrochemical copper plating on a processed strip; s2, high-precision continuous thickness measuring equipment is adopted to test the thickness of the plating layer in the length direction and the width direction of the strip; s3, compensating the thickness error by adjusting the position of the shielding plate according to the thickness distribution data obtained by testing; and S4, the steps S2-S3 are repeated until the plating layer is accumulated to reach the target thickness. The thicknesses of the copper plating layers on the two sides of the superconducting tape are adjusted by adjusting the shielding plates, non-contact detection and dynamic adjustment of the thickness of the plating layer are achieved, and the precision of the thickness of the plating layer is improved.

The invention provides a preparation method of a bipolar current collector based on a selective double-sided modified masking film. The preparation method comprises the following steps: depositing a Ni-Cr alloy layer on a single side surface of an aluminum substrate; one side of the masking film is etched to form a roughened surface, and the other side of the masking film is hydrophobic to form a hydrophobic surface; the roughened surface of the masking film and the surface, without the Ni-Cr alloy layer, of the aluminum matrix are pressed, and the edge is coated with curing glue; and placing the pressed and glued sample in an electroplating solution to electroplate a copper layer, finally cutting off an edge glue sealing area, and stripping the masking film. According to the preparation method, the masking film used for protecting the back surface of the aluminum substrate is subjected to double-sided differential treatment, the edge sealing technology is matched, and the Ni-Cr alloy is adopted for bottoming, so that the adhesive force between the copper plating layer and the aluminum substrate is improved, the risk of causing corrosion of a primary battery is reduced, the bipolar current collector which is firmly combined and has a pure interface can be prepared, and the service life of the bipolar current collector is prolonged. And a feasible solution is provided for realizing light-weight and high-performance current collectors for electronic devices such as lithium batteries and the like.

The invention discloses a semiconductor structure and a forming method thereof. The forming method comprises the following steps: providing a substrate; forming a copper column structure on the substrate, wherein the copper column structure comprises a plurality of layers of copper column sections which are sequentially stacked and connected; the forming method of the copper column structure comprises the steps that a plurality of photoetching electroplating processes are carried out on a substrate, a layer of copper column section is formed in each photoetching electroplating process, and then the thickness of a photoetching layer formed in each photoetching electroplating process can be reduced, so that the technological difficulty of forming the photoetching layer and photoetching development is reduced. And the electroplating time of each layer of copper cylinder section is effectively shortened compared with the time of electroplating the whole copper cylinder at one time, so that the phenomena of swelling, cracking and the like of the photoetching layer in the electroplating operation for a long time can be avoided. The depth-to-width ratio of the single-layer copper column section is small, the exchange efficiency of copper plating liquid medicine can be guaranteed, and then the copper nodule phenomenon is reduced. And the copper column structure is divided into multiple layers of copper column sections, so that the height limitation of electroplating the whole copper column at a time can be broken through, and the copper column structure has higher designability.

This application relates to the field of communication technology, and discloses an antenna, its fabrication method, and a terminal device. The antenna includes a substrate and a radiator. The radiator includes a copper plating layer and a protective layer. The copper plating layer is formed on the surface of the substrate, and a passivation layer is disposed on the side of the copper plating layer facing away from the substrate. The passivation layer can protect the copper plating layer, reduce the risk of corrosion of the copper plating layer, and thus improve the reliability of the antenna. Furthermore, since the layer structure of the radiator is relatively simple, the antenna fabrication process is significantly simplified, and the manufacturing cost is reduced.

The invention discloses a blending method of a copper plating bearing agent, which comprises a blending device, and the blending device is provided with a structure for simultaneously starting multiple powers with a stirring structure for a feeding port and is used for blending the copper plating bearing agent; the method comprises the following steps: raw material pretreatment, device debugging, step-by-step feeding, and starting of a multi-power structure by a filter screen plate. And the concentration is finely adjusted until the concentration of the copper plating bearing agent reaches the standard, and qualified mixed liquid is guided out. By adopting the method, the adding uniformity of the copper sulfate pentahydrate powder and the overall blending efficiency are improved, accurate blending of the copper plating bearing agent is guaranteed, and accurate control over the concentration of the copper plating bearing agent can be achieved through step-by-step input, medium-term sampling detection and fine adjustment.

The invention provides a treatment method for synergistically enhancing the comprehensive performance of a neodymium-iron-boron magnet, and belongs to the technical field of magnetic materials. According to the method, a heavy rare earth layer and a corrosion-resistant metal layer such as copper, nickel and cobalt for promoting grain boundary diffusion of heavy rare earth are respectively deposited on the surface of the neodymium-iron-boron magnet by adopting a multi-layer electroplating method, the coercivity of the neodymium-iron-boron magnet is enhanced through grain boundary diffusion, and the corrosion resistance of the magnet is enhanced through a nickel-cobalt coating. The treatment method comprises the following steps: carrying out electrochemical deposition on the neodymium-iron-boron magnet in a heavy rare earth metal plating solution, and then respectively electroplating a copper plating layer and a nickel-cobalt plating layer to obtain a heavy rare earth-containing plating layer with strong corrosion resistance and good plating film binding force; the neodymium-iron-boron magnet containing the heavy rare earth coating is subjected to heat treatment, and the coercive force of the magnet is improved through heavy rare earth grain boundary diffusion. The neodymium iron boron grain boundary diffusion process and the surface corrosion prevention process are subjected to integrated treatment, the technological process of high-performance neodymium iron boron industrial preparation is shortened, and the coercive force and the corrosion resistance of the magnet are comprehensively enhanced.

The invention provides a copper etching solution and application thereof. The copper etching liquid comprises an inorganic acid, hydrogen peroxide, an azole compound, a halogen ion source and an amine compound, wherein the amine compound is selected from a compound shown in a formula 1 or an ammonium salt with a structural fragment shown in a formula 2. When the copper etching solution is applied to etching treatment on a chemical copper plating seed layer by a semi-additive method, the copper etching solution shows excellent differential etching capability, and has no obvious etching on the side wall of electroplating copper and the seed layer at the bottom of a copper circuit on the basis of effectively removing the seed layer between the copper circuits, so that the etching quality of the copper plating seed layer is improved. The undercut phenomenon can be prevented, the line width reduction amount is small, and the reliability degree of micronized line wiring can be obviously improved.

The invention discloses an FPC film strain gauge and a manufacturing method thereof. The strain gauge comprises a flexible insulating substrate, a specific-component copper-nickel alloy layer (with 55% of Cu and 45% of Ni and the thickness of 1-5m) sputtered on the flexible insulating substrate, a plurality of independent sensitive grids etched on the alloy layer and arranged along different directions, and a signal lead on the other surface of the substrate, wherein the flexible insulating substrate is connected with the specific-component copper-nickel alloy layer through a via hole with a metalized hole wall. The manufacturing method comprises the steps of drilling, three-step plasma treatment, magnetron sputtering of alloy, electroplating of copper to reinforce the hole wall, double-sided photoetching and etching and the like. Through glue-free sputtering combination and a specific alloy formula, the problems of glue layer aging and temperature drift of a traditional strain gauge are solved, and the product has the advantages of being ultrathin, flexible, high in stability, high in precision and suitable for batch production.

The invention discloses a high-temperature superconducting strip with non-uniform distribution of critical current density and a preparation method thereof, and belongs to the technical field of high-temperature superconducting materials. The critical current density of the high-temperature superconducting strip is non-uniformly distributed in the width direction, the current distribution of the high-temperature superconducting strip can be regulated and controlled according to requirements, the high-temperature superconducting strip comprises a high-temperature superconducting layer, the chemical formula of the high-temperature superconducting layer is Re < 1 + a > Ba < 2 + b > Cu < 3 + c > O < 7-d + x% (mol) BaMO3, and Re is selected from Y, Gd, Eu and Sm; m is selected from Hf, Zr and Sn; the preparation method comprises the following steps: depositing the high-temperature superconducting layer on the strip substrate; depositing a metal silver layer on the deposited strip; and carrying out heat treatment on the deposited strip in an oxygen environment, and carrying out laser heat treatment after slitting and / or copper plating. The critical current density of the high-temperature superconducting strip in the width direction is non-uniformly distributed and controllable, the failure risk of the strip is effectively reduced, and the service performance of the strip is improved.

The invention discloses a preparation method of a novel low-alloy steel solid welding wire. The preparation method comprises the following steps of S1, raw material smelting, S2, a hot working stage, S3, a cold working stage, S4, surface treatment and S5, quality detection. During raw material selection, C-Mn-Si is adopted as a basic alloy, the content of C is 0.06-0.12%, the content of Mn is 1.2-1.6%, then a Ti-B microalloy is added, the hardenability is improved, the O / N content is limited at the same time, then a two-stage refining process combining vacuum induction melting and electroslag remelting is adopted, the melting temperature, time and refining slag system components are regulated and controlled, and the hardness of the alloy is improved. The method comprises the following steps: preparing a copper plating solution through equipment, deeply removing harmful impurities such as S and P, promoting floating and size refinement of inclusions by applying an electromagnetic stirring technology, remarkably improving the purity of a metal matrix, thereby improving the purity of raw material smelting, proportioning the copper plating solution through the equipment, setting the parameters of the copper plating equipment to be 10-15A / dm in current density and 2-3mu m in plating thickness, and carrying out a copper plating process on a welding wire.

The invention discloses a preparation method of a high-strength corrosion-resistant copper alloy wire. The preparation method comprises the following steps: (1) preparing composite powder; (2) preparing pretreatment powder; (3) sensitization treatment and activation are carried out, surface chemical copper plating is carried out on the activated powder, and copper plating powder is obtained; (4) weighing copper powder, nickel powder, silicon powder and copper-plated powder, heating and melting, adding the copper-plated powder into the melt, casting and molding, heating to eliminate stress, cooling, and drawing into a copper alloy wire by using a wire drawing machine; and the copper alloy wire is subjected to heat preservation for 30 min at the temperature of 220 DEG C, then the temperature is increased to 300 DEG C, heat preservation aging is conducted for 3 h, furnace cooling is conducted to 200 DEG C or below after heat preservation is completed, then the copper alloy wire is taken out and subjected to air cooling to the normal temperature, and the high-strength corrosion-resistant copper alloy wire is obtained. The copper alloy casting prepared through the method has high tensile strength, and the prepared copper alloy wire is high in self-corrosion potential and shows good strength and corrosion resistance.

The invention provides a method for manufacturing copper columns on a packaging substrate and the packaging substrate, and the method comprises the steps: sequentially covering a copper deposition layer and a graphical dry film on the surface of the packaging substrate, and vertically and continuously electroplating n first copper column groups of which the heights form an arithmetic progression on the graphic surfaces of the inner layer and the outer layer of a groove between the dry films; and the packaging carrier plate is rotated by 180 degrees, second copper column sets arranged in the height arithmetic progression are vertically and continuously electroplated on the first copper column sets correspondingly, the corresponding copper columns of the second copper column sets and the first copper column sets form target copper columns, and the heights of the target copper columns are the same. According to the invention, the first copper column group with equal height is arranged on the surface of the packaging carrier plate, and the second copper column group with equal height is arranged after up-down rotation, so that the single vertical continuous electroplating process does not exceed the single maximum copper plating amount, and the target copper column height is increased; meanwhile, increasing the height of the target copper column is beneficial to expanding the application range of the double-sided packaging process; in addition, redundant copper columns are arranged in the large plate before cutting, the residual copper rate of the whole plate is increased, the risk of plate burning and leakage is reduced, and the uniformity of the target copper columns is improved.

The invention discloses a copper plating device and method for a stainless steel pipe for refrigeration equipment, and relates to the technical field of copper plating devices.The copper plating device is characterized in that a moving mechanism for driving a first clamping mechanism and a second clamping mechanism to be slidably connected in the horizontal direction is arranged on a support, and a driving mechanism for driving the stainless steel pipe to be electroplated to rotate is arranged on the moving mechanism; the anode shaft is located in the stainless steel pipe to be electroplated, the first anode plate and the second anode plate are located on the two sides of the stainless steel pipe to be electroplated respectively and connected with a power source anode, and the stainless steel pipe to be electroplated is connected with a power source cathode. Conducting is achieved through close contact of the elastic conducting strip and the stainless steel pipe to be electroplated, rotating contact conducting of the conducting slip ring and the annular electric brush is matched, the elastic conducting strip is electrically connected with the conducting slip ring, uninterrupted conducting is achieved on the premise that rotation of the stainless steel pipe to be electroplated is guaranteed, and the problem of coating defects caused by poor contact is avoided; and the overall quality of the surface coating of the to-be-electroplated stainless steel pipe is ensured.

According to the single-polarized omnidirectional ceiling antenna provided by the utility model, the micro-arc oxidation ceramic layer is arranged on the surface of the aluminum radiation oscillator, so that oxidation and corrosion of the aluminum radiation oscillator are effectively prevented, and the copper plating layer is arranged on the micro-arc oxidation ceramic layer, so that the conductivity of the aluminum radiation oscillator is improved, and the signal transmission quality of the antenna is improved. And finally, a layer of nickel-phosphorus alloy is plated on the copper plating layer, so that the radiation oscillator has good wear resistance and hardness, the durability and the stability of the radiation oscillator are improved, the cost is greatly reduced compared with a copper radiation oscillator, and the radiation oscillator is suitable for different use environments. In addition, a plurality of copper short-circuit sheets coated with ferrite wave-absorbing coatings are arranged on the peripheral side of the radiation oscillator at equal intervals, so that the performance of the antenna is further optimized, and the anti-interference capability and the signal transmission efficiency of the antenna are improved.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

The invention relates to the technical field of metal composite materials, in particular to high-conductivity low-cost copper-iron composite powder and a full-coating preparation method thereof.The two steps of chemical copper plating and 450-600 DEG C heat treatment are combined, micro-pores in an initial copper layer are diffused and healed by atoms, a compact copper shell is formed, the surface of the composite powder is free of red rust after a test, and the copper-iron composite powder is high in conductivity and low in cost. The corrosion resistance is improved compared with that of a non-heat-treated sample; a 0.5-3 m mutual diffusion layer is formed on the copper-iron interface through heat treatment, metallurgical bonding is achieved, the interface shear strength is improved to be larger than or equal to 25 MPa from less than 10 MPa of traditional physical bonding, and the problem that a coating layer is prone to stripping in the subsequent pressing, sintering or using process is solved.

The utility model relates to PCB board production equipment technical field, the technical problem that the utility model solves is uneven current distribution, rework rate is too high. In order to solve the above technical problem, the utility model provides a kind of copper tank for the copper of PCB board immersion copper. The utility model includes: rectifier;Outer tank body is equipped with medicine water and conductive roller;Soaking tank is located in outer tank body;Conveying assembly is located in soaking tank, and conveying assembly includes upper roller piece group and the lower roller piece group corresponding with being equipped in upper roller piece group below;Anode plate assembly is located in soaking tank;Anode plate assembly includes upper conductive plate and the lower conductive plate corresponding with being equipped in upper conductive plate below;Upper conductive plate is located in upper roller piece group;Positive terminal is connected with upper conductive plate, lower conductive plate, and negative terminal is connected with conductive roller;Rectifier, conductive roller, circuit board, upper conductive plate, lower conductive plate and soaking liquid constitute circuit loop. The utility model current distribution is more uniform, and rework is reduced.

The application provides a copper plating method for superconducting tape, which comprises the following steps: firstly, carrying out bright copper plating treatment on the processed tape; and then, carrying out sand surface copper plating treatment on the tape. The bright copper plating treatment adopts third current electroplating treatment, and the sand surface copper plating treatment adopts second current electroplating treatment. The current density of the third current is 0.5-3.5 A / dm 2 , and the current density of the second current is 3-8 A / dm 2 . By means of the bright copper plating treatment and then the sand surface copper plating treatment, the outer surface of the tape forms a sand surface, which can effectively prevent the axial sliding deviation of the wound coil cake.

The invention discloses a copper-plated circuit board and a copper plating process thereof, and relates to the technical field of circuit board manufacturing. The copper plating process of the circuit board comprises the following steps: after carrying out surface cleaning pretreatment on a dielectric substrate, injecting metal particles by adopting a high-energy ion beam to form a metal seed layer; performing magnetic filtering arc deposition treatment on the surface of the metal seed layer to form a metal bottom layer; and performing copper plating on the surface of the metal bottom layer through pulse magnetron sputtering treatment to form a copper foil layer combined with the dielectric substrate. According to the method, the metal particles are injected through the high-energy ion beam, then the metal layer is deposited on the surface in an electric arc mode, then copper plating is conducted through pulse magnetron sputtering, high-strength combination of the metal copper foil and the base material is achieved by combining physical vapor deposition and the ion injection technology, meanwhile, the surface roughness of the copper foil is low, and the requirements for reliability and low loss of the circuit board are met.

This application relates to the field of electroplating technology, and more particularly to an acidic copper plating brightener and its preparation method. An acidic copper plating brightener, by weight, comprises the following raw materials: 25-30 parts brightener, 6-8 parts leveling agent, 40-50 parts wetting agent, 7-10 parts hydroxyethyl cellulose, 8-12 parts collagen, and 900-930 parts deionized water. The acidic copper plating brightener of this application has excellent technical effects and can be widely used in the field of copper electroplating to improve the quality of the electroplated copper layer, including gloss, tensile strength, elongation, hole-filling efficiency, uniform plating ability, and through-hole deep plating ability, thus meeting the requirements for the conductivity of through-holes in circuit boards.

The present application relates to a quantitative characterization of the bonding force between polyimide and copper-plated interface test sample and preparation method, comprising the following steps: solidifying a layer of polyimide film on a silicon wafer; preparing a copper layer on the polyimide film, and protecting the copper layer from oxidation; wafer dicing treatment, cutting into a certain size of polyimide and copper-plated interface sample; the upper surface of the polyimide and copper-plated interface sample is welded together with the bottom surface of the tensile clamp, and the integration of the test sample and the tensile clamp is completed. The present application avoids the method of preparing a copper layer on the silicon wafer, and then preparing a polyimide film on the copper layer in a specified pattern, but instead, a polyimide film is first prepared on the silicon wafer in its entirety, then a copper-plated layer is prepared on the polyimide film in a specified pattern, and a tensile clamp is welded on the copper layer. The high-strength weld reduces the risk of fracture of the non-test surface during the test process, thereby achieving the quantitative characterization of the bonding force between the polyimide and the copper-plated interface.

A kind of plating experiment device and method for preparing high bonding force copper plating layer on aluminum-based heat sink surface, it relates to material processing technical field.Plasma chamber is provided with heater, motion control mechanism can carry out public self-rotating compound motion and is connected bias power supply, evaporation source includes crucible, electron gun, deflection coil and ion source, so that the inside of plasmaplasma chamber forms pure strong current ion flushing area and strong current ion enhanced electron beam evaporation plating area, vacuum and gas supply system connects plasmaplasma chamber and carries out vacuumizing, and respectively with plasmaplasma chamber and ion source connection supply reaction gas and working gas.By the spatial partition layout of plasmaplasma chamber cooperation motion control mechanism public self-rotating compound motion, workpiece is periodically alternated through two functional areas in film forming process, utilizes the ion beam mixing effect of high-energy ion to realize film densification and eliminate interface stress, ensure the bonding force and reliability of the deposited copper plating layer, multiple workpieces can be simultaneously loaded to improve production efficiency.

The utility model discloses an integrated tank body structure of a tire bead steel wire copper plating auxiliary tank. The integrated tank body structure comprises an auxiliary tank I, an auxiliary tank II, an auxiliary tank III, a partition plate, a high-position overflow pipe, a discharge pipe, a stirrer, a communicating pipe, a metering pump, a circulating pump and a liquid level pipe, partition plates are connected into the first auxiliary groove and the second auxiliary groove, stirrers are connected to top plates, on the two sides of the partition plates, of the first auxiliary groove and the second auxiliary groove, the first auxiliary groove is connected to the top face of the second auxiliary groove, the second auxiliary groove is connected to the top face of the third auxiliary groove, and the bottoms of the side faces of the first auxiliary groove, the second auxiliary groove and the third auxiliary groove are all connected with discharge pipes and high-position overflow pipes; the bottom of the side face of the third auxiliary tank is further connected with a liquid level pipe, the high-position overflow pipe is connected with a discharge pipe, and the second auxiliary tank and the third auxiliary tank are connected through a metering pump and a circulating pump. Compared with the prior art, the copper plating auxiliary tanks are integrally connected to form a new tank body structure by using the connecting pipes connected with the ball valves and the metering pumps, so that the occupied area of the tank body is reduced, the stability of the concentration of a solution is ensured, and the dripping accuracy of the solution is improved.

The invention discloses a PCB surface treatment process based on local gold plating and nickel and gold immersion, and relates to the technical field of surface treatment processes. The method is used for processing a PCB which needs local hard gold plating and nickel gold immersion at other positions, and comprises the following steps: S1, pre-processing: processing the PCB to a copper thickness before electroplating; s2, first-layer pattern processing: pasting a dry film on the CS surface of the PCB and etching to form a pattern; s3, gold plating preparation; s4, local gold plating; s5, removing the film and processing a second layer of pattern; s6, removing the wire; s7, resistance welding and protection; and S8, nickel and gold immersion treatment. According to the surface treatment process, the microcosmic roughness of the surface of the substrate is accurately controlled through multi-step pretreatment, and high-pressure water washing and plasma cleaning are combined, so that the mechanical embedding force of a plating layer and a copper layer is ensured, and the problem that the plating layer is not uniform due to too large roughness is avoided. And meanwhile, the current distribution is regulated and controlled by adopting pulse current and a magnetic mask in the copper deposition and electroplating stages, so that the compactness and thickness uniformity of the coating are improved.

A wired circuit board (1) is provided with a metal support layer (2), a conductor layer (3), a first insulating layer (4), and a conductor pattern (5). The conductor layer (3) and the conductor pattern (5) include a copper plating layer, and the metal support layer (2) includes a metal different from the conductor layer (3) and the conductor pattern (5). The brightness (S12) of the second surface (S12) of the conductor layer (3) is equal to or greater than the brightness (S1) of the one side surface (S1) of the metal support layer, and the difference between the brightness (S12) and the brightness (S1) of the one side surface (S1) is equal to or less than 7.0, or the brightness (S12) of the second surface (S12) of the conductor layer (3) is less than the brightness (S1) of the one side surface (S1) of the metal support layer, and the difference between the brightness (S12) and the brightness (S1) of the one side surface (S1) is equal to or less than 24.0.

The invention discloses a porefilling copper plating method, which comprises an electrolytic tank body, a power supply module, a partition flow control module and a temperature control module, the electrolytic tank body is divided into a pretreatment area, a porefilling area and a post-treatment area, the power supply module comprises three groups of independent adjustable electrodes which are respectively arranged in the porefilling area, the partition flow control module is arranged in the porefilling area, and the temperature control module is arranged in the porefilling area. Sequentially carrying out oil removal, micro-etching, activation and pre-plating treatment on the PCB to be plated in the pretreatment area; fixing the pretreated PCB in a hole filling area, injecting a hole filling plating solution, starting a power supply module and a partition flow control module, performing hole filling and copper plating by adopting parameters of gradient current, pulse frequency of 500800Hz and plating solution temperature of 28-32 DEG C, and performing hole filling and copper plating by adopting a spraying flow rate of 1.0-1.2 m / s and a circulating flow rate; according to the method, hole-filling copper plating combining the solution and the device is adopted, hole-filling copper plating of micro holes with the hole diameter smaller than or equal to 0.2 mm is met, the filling rate of copper layers in the holes can reach 95% or above, the thickness difference between hole openings and plate surface plating layers is smaller than or equal to 5 micrometers, the overall process stability is high, and operation is easy.

The application discloses a sealing method of an ultra-thick high-low frequency metal shell, which comprises the following steps: pre-oxidation and pre-plating of raw materials, cleaning of a mold; pre-oxidation and pre-plating of the raw materials to obtain a shell, a lead wire and glass; a section of glass is assembled with the shell and the lead wire, a graphite column is sleeved on the lead wire to press the glass, and the whole is placed in a selected atmosphere to perform first sealing at 800-1200 DEG C. After the first sealing, the mold and the graphite column are removed, the sealed metal shell is treated in diluted hydrofluoric acid for dozens of seconds, a second section of glass is assembled, and the assembled shell is placed at 800-1200 DEG C to perform second sealing. The plating mode of the high-low frequency metal shell is gold plating, copper plating, nickel plating or the like. The application uses step-by-step sealing to replace conventional one-step sealing, and meets the use requirements of high insulation and voltage resistance of the metal shell; and provides technical support for mass production of other types of ultra-thick metal shells.

To provide a copper clad laminate and a method for manufacturing the same that enables high adhesion between low-dielectric resin film and copper plating layer and good volume resistivity while suppressing transmission loss when applied to flexible circuit boards.SOLUTION: A copper clad laminate according to the present invention includes: a low dielectric resin film with a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz; and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film, the weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and the adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.SELECTED DRAWING: Figure 1

This invention provides a highly reliable substrate in which fine through-holes are filled with metal, enabling high-density mounting and high reliability, as well as a method for manufacturing the same. [Solution] The above problem is solved by a micro-through-hole filled substrate 10 in which a plurality of micro-through holes 2 formed in a substrate 1 are filled, wherein the micro-through holes 2 are filled with a conductive layer (at least 3b) formed on their inner wall surface and a metal solder layer 3c formed on the conductive layer, the conductive layer having a copper plating layer 3b formed on the metal solder layer side, and the metal solder layer 3b being filled with nickel-containing molten solder treated with an organic fatty acid-containing solution. The substrate 1 is preferably a quartz substrate or a glass substrate, and an intermetallic compound layer 4 is formed on the conductive layer 3b side of the metal solder layer 3c that combines with the copper component constituting the conductive layer 3b to prevent copper corrosion.

The application discloses an anti-interference unmanned aerial vehicle core component copper-plated film covering cap and relates to the technical field of unmanned aerial vehicles.The application comprises a bottom plate, the top of the bottom plate is provided with spare parts, and the top of the bottom plate is provided with a top cover; a dismounting assembly is arranged in the inner cavity of the bottom plate, and the dismounting assembly comprises a rotating rod movably connected to the inner cavity of the bottom plate.The linkage structure of the rotating rod and the cam drives the sliding block to slide transversely, the inserting rod is quickly inserted into or withdrawn from the insertion slot at the bottom of the top cover, the elastic reset function of the first spring is matched, one-handed operation type dismounting of the cover body is realized, the application is especially suitable for narrow space operation, in addition, the inclined surfaces of the inclined block and the inclined strip automatically push the reinforcing plate to press the spare parts when the top cover is closed, the buffer effect of the second spring is combined, the structural stability after installation is ensured, the tool operation required by traditional bolt fixing is avoided, and therefore, the task response efficiency and practicality of the unmanned aerial vehicle are improved.