537 results about "Copper plating" patented technology

The invention relates to the technical field of electroplating, and discloses a ceramic substrate through hole electro-coppering hole filling process control method which comprises the following steps: acquiring structural parameters of a target ceramic substrate through hole, optimizing the proportion of a prefabricated electroplating solution to obtain a proportioned electroplating solution, analyzing a composite electroplating medium of the proportioned electroplating solution, and inquiring a pulse current waveform; the copper deposition morphology is monitored, polarization effect coefficients under different current densities are calculated, duty ratio indexes are optimized to score a shaped current sequence, a multi-order electric field is applied to obtain in-hole flow field data, and the copper deposition uniformity is calculated; and performing multi-cycle electroplating-annealing iteration to obtain a copper hole filling structure, testing residual stress, identifying a lattice distortion section, generating a crystallization-annealing curve, and formulating a process optimization scheme according to regulation and control data. According to the invention, the reliability of the through hole electro-coppering filling process can be improved.

The invention relates to the technical field of metal processing, and discloses a production method of an ER2209 austenite ferrite duplex stainless steel welding wire, the ER2209 austenite ferrite duplex stainless steel welding wire comprises an adopted vacuum induction melting furnace and a liquid storage tank, the outer side of the vacuum induction melting furnace is provided with a protective shell, one side of the liquid storage tank is fixedly connected with a conveying pump, and the other side of the liquid storage tank is fixedly connected with a vacuum pump. A cooling assembly is arranged in the protective shell. The preparation method comprises the following steps that S1, raw materials are prepared and smelted; s2, cooling the vacuum induction melting furnace; s3, forging is conducted; s4, hot rolling and solution treatment; s5, acid pickling and surface treatment; s6, cold drawing and intermediate annealing; s7, surface copper plating and finish drawing; and S8, winding and packaging. In the acid pickling process of the wire rod, the oxidation degree of the wire rod is detected, meanwhile, the concentration of the acid pickling solution is adjusted according to the actual situation, and the situation that the surface of the wire rod is excessively corroded or is not thoroughly cleaned due to the fact that the concentration of the acid pickling solution is improper is prevented.

The invention discloses a copper plating method for a superconducting strip. The method comprises the following steps: S1, carrying out initial electrochemical copper plating on a processed strip; s2, high-precision continuous thickness measuring equipment is adopted to test the thickness of the plating layer in the length direction and the width direction of the strip; s3, compensating the thickness error by adjusting the position of the shielding plate according to the thickness distribution data obtained by testing; and S4, the steps S2-S3 are repeated until the plating layer is accumulated to reach the target thickness. The thicknesses of the copper plating layers on the two sides of the superconducting tape are adjusted by adjusting the shielding plates, non-contact detection and dynamic adjustment of the thickness of the plating layer are achieved, and the precision of the thickness of the plating layer is improved.

The invention discloses a high-reliability hole copper control method for an automobile circuit board, and the method comprises the steps: adjusting the drilling parameters according to the hole diameter and the thickness-diameter ratio, improving the roughness of a hole wall through optimizing a drilling technology, and enabling the copper thickness of the hole wall after copper plating to meet the production requirements. According to the method, after the drilling technology is optimized, the hole wall roughness is smaller than or equal to 25 micrometers, and after electroplating, the hole wall copper thickness is larger than or equal to 25 micrometers.

The invention provides a preparation method of a bipolar current collector based on a selective double-sided modified masking film. The preparation method comprises the following steps: depositing a Ni-Cr alloy layer on a single side surface of an aluminum substrate; one side of the masking film is etched to form a roughened surface, and the other side of the masking film is hydrophobic to form a hydrophobic surface; the roughened surface of the masking film and the surface, without the Ni-Cr alloy layer, of the aluminum matrix are pressed, and the edge is coated with curing glue; and placing the pressed and glued sample in an electroplating solution to electroplate a copper layer, finally cutting off an edge glue sealing area, and stripping the masking film. According to the preparation method, the masking film used for protecting the back surface of the aluminum substrate is subjected to double-sided differential treatment, the edge sealing technology is matched, and the Ni-Cr alloy is adopted for bottoming, so that the adhesive force between the copper plating layer and the aluminum substrate is improved, the risk of causing corrosion of a primary battery is reduced, the bipolar current collector which is firmly combined and has a pure interface can be prepared, and the service life of the bipolar current collector is prolonged. And a feasible solution is provided for realizing light-weight and high-performance current collectors for electronic devices such as lithium batteries and the like.

The invention discloses a manufacturing method of a small-spacing lamp panel. The manufacturing method comprises the following steps: pressing; drilling is conducted, specifically, through holes are mechanically drilled, and the hole diameter is 0.2-0.3 mm; copper deposition: the thickness of a hole wall copper plating layer is 0.3-0.5 [mu] m; electroplating through holes, wherein the copper thickness in the holes is greater than or equal to 18 microns; the through holes are filled with epoxy resin with the shrinkage rate smaller than 0.5%, and curing is conducted; ceramic board grinding is conducted, an aluminum oxide ceramic grinding wheel is adopted for board grinding, the resin surface in the hole is flush with the surface of the outer layer copper foil of the multi-layer circuit board, the surface roughness Ra is smaller than 0.1 micrometer, and board grinding technological parameters are as follows: the pressure is 5-8 N / cm < 2 >, the rotating speed is 200-300 rpm, and the linear speed is 1-2 m / min; secondary copper deposition: copper deposition is carried out on the surface of the hole plugging resin to form a copper plating layer, and the thickness of the copper plating layer is 0.3-0.5 [mu] m; the whole board is electroplated, and the copper thickness on the resin is larger than or equal to 12 micrometers; and manufacturing an outer-layer circuit. The manufacturing method of the small-spacing lamp panel has the advantages of being low in cost, high in yield, simple in process and the like.

The invention discloses a semiconductor structure and a forming method thereof. The forming method comprises the following steps: providing a substrate; forming a copper column structure on the substrate, wherein the copper column structure comprises a plurality of layers of copper column sections which are sequentially stacked and connected; the forming method of the copper column structure comprises the steps that a plurality of photoetching electroplating processes are carried out on a substrate, a layer of copper column section is formed in each photoetching electroplating process, and then the thickness of a photoetching layer formed in each photoetching electroplating process can be reduced, so that the technological difficulty of forming the photoetching layer and photoetching development is reduced. And the electroplating time of each layer of copper cylinder section is effectively shortened compared with the time of electroplating the whole copper cylinder at one time, so that the phenomena of swelling, cracking and the like of the photoetching layer in the electroplating operation for a long time can be avoided. The depth-to-width ratio of the single-layer copper column section is small, the exchange efficiency of copper plating liquid medicine can be guaranteed, and then the copper nodule phenomenon is reduced. And the copper column structure is divided into multiple layers of copper column sections, so that the height limitation of electroplating the whole copper column at a time can be broken through, and the copper column structure has higher designability.

The invention discloses a preparation method of a surface copper-plated molybdenum wire, which innovatively introduces an electrolysis process after a traditional molybdenum wire processing technology, removes a surface graphite coating through electrochemical pretreatment to prepare a clean white wire substrate, and then realizes uniform plating of a copper layer by adopting an electroplating technology. According to the innovative method, the smoothness of the surface of the molybdenum wire is improved through electrolytic cleaning, a better environment is provided for copper plating, the copper plating layer protects the molybdenum wire, meanwhile, the conductivity of the electrode wire is remarkably improved, the overall resistance of the electrode wire is reduced, discharge energy is saved, and loss of the electrode wire in the machining process is reduced; the high conductivity requirement of large-current cutting can be met, and the surface quality requirement of small-current fine machining can also be met.

This application relates to the field of communication technology, and discloses an antenna, its fabrication method, and a terminal device. The antenna includes a substrate and a radiator. The radiator includes a copper plating layer and a protective layer. The copper plating layer is formed on the surface of the substrate, and a passivation layer is disposed on the side of the copper plating layer facing away from the substrate. The passivation layer can protect the copper plating layer, reduce the risk of corrosion of the copper plating layer, and thus improve the reliability of the antenna. Furthermore, since the layer structure of the radiator is relatively simple, the antenna fabrication process is significantly simplified, and the manufacturing cost is reduced.

The invention provides a gradient composite graphene electrolysis electrode plate and an in-situ preparation method thereof. The electrode plate comprises a metal conductive base material (such as titanium alloy), a porous ceramic skeleton layer (Al2O3-40% ZrO2, the porosity of which is 30 + / -5%), a chemical copper plating layer for filling pores, an electroplated nickel-ruthenium alloy catalytic layer (Ni: Ru = 9: 1) and 3-5 graphene functional layers (ID / IG is less than or equal to 0.08) grown in situ, wherein the porous ceramic skeleton layer (Al2O3-40% ZrO2) is laser-cladded on the surface of the porous ceramic skeleton layer (Al2O3-40% ZrO2). The preparation method comprises the following steps: performing laser cladding on a ceramic skeleton, wherein the power density is 300-500W / mm < 2 >, and sintering at 1600 DEG C to form metallurgical bonding; gradient plating: electroless copper plating (containing nano-diamond enhancement) and pulse electroplating of Ni Ru (duty ratio is 1: 5); and performing directional CVD growth: after reducing the catalyst layer by H2 at 1050 DEG C, introducing CH4 / H2 (the volume ratio is 1: 4) in a pulse manner, and realizing full coverage of the inner wall of the mesh by vortex air intake. The technical effects are as follows: (1) the overpotential of chlorine evolution in saturated salt water at 80 DEG C is as low as 268mV (1A / cm < 2 >); (2) strong acid environment service life gt; the time is 100 thousand hours (12 times that of the national standard); (3) the production cost is lt; and 620 / m < 2 > (90% lower than that of a traditional ruthenium-iridium coating). The problems of graphene transfer damage and special-shaped electrode covering are solved.

The invention discloses a blending method of a copper plating bearing agent, which comprises a blending device, and the blending device is provided with a structure for simultaneously starting multiple powers with a stirring structure for a feeding port and is used for blending the copper plating bearing agent; the method comprises the following steps: raw material pretreatment, device debugging, step-by-step feeding, and starting of a multi-power structure by a filter screen plate. And the concentration is finely adjusted until the concentration of the copper plating bearing agent reaches the standard, and qualified mixed liquid is guided out. By adopting the method, the adding uniformity of the copper sulfate pentahydrate powder and the overall blending efficiency are improved, accurate blending of the copper plating bearing agent is guaranteed, and accurate control over the concentration of the copper plating bearing agent can be achieved through step-by-step input, medium-term sampling detection and fine adjustment.

The invention provides a treatment method for synergistically enhancing the comprehensive performance of a neodymium-iron-boron magnet, and belongs to the technical field of magnetic materials. According to the method, a heavy rare earth layer and a corrosion-resistant metal layer such as copper, nickel and cobalt for promoting grain boundary diffusion of heavy rare earth are respectively deposited on the surface of the neodymium-iron-boron magnet by adopting a multi-layer electroplating method, the coercivity of the neodymium-iron-boron magnet is enhanced through grain boundary diffusion, and the corrosion resistance of the magnet is enhanced through a nickel-cobalt coating. The treatment method comprises the following steps: carrying out electrochemical deposition on the neodymium-iron-boron magnet in a heavy rare earth metal plating solution, and then respectively electroplating a copper plating layer and a nickel-cobalt plating layer to obtain a heavy rare earth-containing plating layer with strong corrosion resistance and good plating film binding force; the neodymium-iron-boron magnet containing the heavy rare earth coating is subjected to heat treatment, and the coercive force of the magnet is improved through heavy rare earth grain boundary diffusion. The neodymium iron boron grain boundary diffusion process and the surface corrosion prevention process are subjected to integrated treatment, the technological process of high-performance neodymium iron boron industrial preparation is shortened, and the coercive force and the corrosion resistance of the magnet are comprehensively enhanced.

The invention discloses a method for improving copper plating uniformity of a circuit board. The method comprises the following steps: performing surface treatment on a drilled circuit board; the circuit board is placed in the electroplating solution to be electroplated, and the technological conditions are that the temperature of the electroplating solution is 20-30 DEG C, and the current density is 1.5-2.5 A / dm < 2 >; the main chemical components of the electroplating solution comprise copper sulfate pentahydrate, sulfuric acid, hydrochloric acid and an additive, the concentration of the copper sulfate pentahydrate is 200-250 g / L, the concentration of the sulfuric acid is 50-70 g / L, and the concentration of chloride ions is 70-90 ppm. According to the method for improving the copper plating uniformity of the circuit board, by optimizing the components of the electroplating liquid and the parameters of the electroplating process, a plating layer is more uniform, the copper thickness range inside and outside holes is controlled to be about 8.0 microns, and the requirements of high-reliability PCBs (such as HDI and carrier plates) with the thickness-diameter ratio larger than 8: 1, such as 5G communication backboards and the like are met.

The invention relates to a method for preparing a high-strength and high-conductivity powder metallurgy copper-iron alloy from copper-coated iron powder, and belongs to the technical field of electrochemistry and powder metallurgy materials. S2, preparing a copper source solution; s3, mixing and replacing powder and liquid; s4, performing two-stage reduction; s5, powder raw material mixing; s6, pressing and forming the raw materials; s7, sintering and densifying; s8, deformation processing treatment; and S9, high-temperature heat treatment. According to the method for preparing the high-strength and high-conductivity powder metallurgy copper-iron alloy through the copper-coated iron powder, the prepared copper-coated iron composite powder is uniform in coating layer structure and good in compactness, and compared with a replacement copper plating method, a large number of loose copper block heterogeneous distribution does not occur on the surface; and secondly, the prepared copper-iron alloy billet is low in oxygen content, high in sintering density, uniform in component, free of segregation, small in grain size, excellent in processability, few in residual solid solution iron atoms in copper, high in strength and high in conductivity, and has important application prospects in key components in the fields of electronic information, aerospace, electromagnetic shielding and the like.

The invention provides a copper etching solution and application thereof. The copper etching liquid comprises an inorganic acid, hydrogen peroxide, an azole compound, a halogen ion source and an amine compound, wherein the amine compound is selected from a compound shown in a formula 1 or an ammonium salt with a structural fragment shown in a formula 2. When the copper etching solution is applied to etching treatment on a chemical copper plating seed layer by a semi-additive method, the copper etching solution shows excellent differential etching capability, and has no obvious etching on the side wall of electroplating copper and the seed layer at the bottom of a copper circuit on the basis of effectively removing the seed layer between the copper circuits, so that the etching quality of the copper plating seed layer is improved. The undercut phenomenon can be prevented, the line width reduction amount is small, and the reliability degree of micronized line wiring can be obviously improved.

The invention discloses a Kovar alloy electroplating method. The method comprises the steps that a Kovar alloy base material is pretreated; the pretreated kovar alloy base material is immersed in an acidic copper sulfate plating solution for electrolytic copper plating, so that a copper plating layer is formed on the surface of the kovar alloy base material; immersing the kovar alloy on which the copper plating layer is formed into a chemical nickel plating solution so as to form a nickel plating layer on the surface of the copper plating layer; and immersing the kovar alloy base material on which the nickel plating layer is formed into a nanogold seed crystal solution so as to form a soft gold plating layer on the surface of the nickel plating layer. The coating quality of the kovar alloy can be improved.

The invention discloses an FPC high step manufacturing process, which comprises the following steps of: firstly selecting copper plating and then removing a film to carry out whole board copper plating, firstly carrying out local copper electroplating on an area which only needs to be thickened, and covering and protecting a circuit part by a dry film without participating in the copper plating process, so that the copper thickness of a via hole area can be effectively improved on the premise of not excessively increasing the copper thickness of the circuit; after selective plating is completed, copper electroplating is conducted on the whole plate, so that a thin copper layer is evenly plated on the surface of the whole copper foil base material, the step height difference generated during selective copper plating can be effectively reduced, the step gradient can be reduced, and copper surface transition is smoother.

The invention relates to the technical field of wafer packaging, and particularly discloses wafer-level packaging copper interconnection electroplating liquid and a wafer-level packaging interconnection electroplating process. According to the application, the growth of copper at an orifice is inhibited by utilizing the synergistic effect among the components such as the ammonium pyrrolidine dithiocarbamate, the chloride ions, the copper salt and the polyethylene glycol, and the thickness of a copper plating layer on the surface of the cathode is reduced by adding the anthraquinone sulfonate; and the thickness of the plating layer in the center of the through hole is increased through the synergistic effect of anthraquinone sulfonate, the leveling agent, the accelerator, the brightening agent and the inhibitor, so that the through hole can be effectively filled under the high current density, the good deep plating capacity is achieved, and the product quality can be fully improved.

The invention discloses an FPC film strain gauge and a manufacturing method thereof. The strain gauge comprises a flexible insulating substrate, a specific-component copper-nickel alloy layer (with 55% of Cu and 45% of Ni and the thickness of 1-5m) sputtered on the flexible insulating substrate, a plurality of independent sensitive grids etched on the alloy layer and arranged along different directions, and a signal lead on the other surface of the substrate, wherein the flexible insulating substrate is connected with the specific-component copper-nickel alloy layer through a via hole with a metalized hole wall. The manufacturing method comprises the steps of drilling, three-step plasma treatment, magnetron sputtering of alloy, electroplating of copper to reinforce the hole wall, double-sided photoetching and etching and the like. Through glue-free sputtering combination and a specific alloy formula, the problems of glue layer aging and temperature drift of a traditional strain gauge are solved, and the product has the advantages of being ultrathin, flexible, high in stability, high in precision and suitable for batch production.

The invention provides a lead frame raw material surface treatment method. The method comprises the following steps: providing a pretreated lead frame raw material; placing the pretreated lead frame raw material in a copper pre-plating solution, applying an ultrasonic field in the copper pre-plating solution, and pre-plating a copper layer on the surface of the lead frame raw material under the action of the ultrasonic field; and performing infrared heating on the discharge end of the lead frame raw material pre-plated with the copper layer to obtain the lead frame raw material with the required surface state. According to the method, a uniform and compact pre-plated copper layer can be formed, the subsequent electroplating effect is improved, and large-scale preparation of the high-performance lead frame is realized.

The invention discloses a high-temperature superconducting strip with non-uniform distribution of critical current density and a preparation method thereof, and belongs to the technical field of high-temperature superconducting materials. The critical current density of the high-temperature superconducting strip is non-uniformly distributed in the width direction, the current distribution of the high-temperature superconducting strip can be regulated and controlled according to requirements, the high-temperature superconducting strip comprises a high-temperature superconducting layer, the chemical formula of the high-temperature superconducting layer is Re < 1 + a > Ba < 2 + b > Cu < 3 + c > O < 7-d + x% (mol) BaMO3, and Re is selected from Y, Gd, Eu and Sm; m is selected from Hf, Zr and Sn; the preparation method comprises the following steps: depositing the high-temperature superconducting layer on the strip substrate; depositing a metal silver layer on the deposited strip; and carrying out heat treatment on the deposited strip in an oxygen environment, and carrying out laser heat treatment after slitting and / or copper plating. The critical current density of the high-temperature superconducting strip in the width direction is non-uniformly distributed and controllable, the failure risk of the strip is effectively reduced, and the service performance of the strip is improved.

The invention discloses a chemical plating method for plating copper on the surface of a silicon wafer, which belongs to the technical field of semiconductor coating, and comprises the following steps: modifying a semiconductor material BaTiO3 nanocrystal by a silane coupling agent to prepare quantum dot ink, spin-coating the quantum dot ink on the surface of a P-type silicon wafer cleaned by RCA to form a quantum dot array, and coating the quantum dot array on the surface of the P-type silicon wafer. The preparation method comprises the following steps: activating in a solution containing copper sulfate and trisodium citrate under the assistance of ultrasonic waves, carrying out chemical copper plating in a micro-fluidic reaction cavity by using an alkaline plating solution containing copper sulfate, disodium ethylene diamine tetraacetate and glyoxylic acid under the assistance of ultrasonic waves and lasers, and finally washing with deionized water and ethanol and drying with nitrogen to obtain a silicon wafer with a copper-plated surface. Through the BaTiO3 quantum dots, the micro-fluidic channel, the pulse liquid supply system and the auxiliary synergistic effect of the ultrasonic wave and the laser array, the copper film which is uniform in thickness, high in adhesive force, good in conductivity and excellent in corrosion resistance can be prepared, and the chemical copper plating efficiency and quality are improved.

The invention discloses a preparation method of a novel low-alloy steel solid welding wire. The preparation method comprises the following steps of S1, raw material smelting, S2, a hot working stage, S3, a cold working stage, S4, surface treatment and S5, quality detection. During raw material selection, C-Mn-Si is adopted as a basic alloy, the content of C is 0.06-0.12%, the content of Mn is 1.2-1.6%, then a Ti-B microalloy is added, the hardenability is improved, the O / N content is limited at the same time, then a two-stage refining process combining vacuum induction melting and electroslag remelting is adopted, the melting temperature, time and refining slag system components are regulated and controlled, and the hardness of the alloy is improved. The method comprises the following steps: preparing a copper plating solution through equipment, deeply removing harmful impurities such as S and P, promoting floating and size refinement of inclusions by applying an electromagnetic stirring technology, remarkably improving the purity of a metal matrix, thereby improving the purity of raw material smelting, proportioning the copper plating solution through the equipment, setting the parameters of the copper plating equipment to be 10-15A / dm in current density and 2-3mu m in plating thickness, and carrying out a copper plating process on a welding wire.

The invention discloses a preparation method of a high-strength corrosion-resistant copper alloy wire. The preparation method comprises the following steps: (1) preparing composite powder; (2) preparing pretreatment powder; (3) sensitization treatment and activation are carried out, surface chemical copper plating is carried out on the activated powder, and copper plating powder is obtained; (4) weighing copper powder, nickel powder, silicon powder and copper-plated powder, heating and melting, adding the copper-plated powder into the melt, casting and molding, heating to eliminate stress, cooling, and drawing into a copper alloy wire by using a wire drawing machine; and the copper alloy wire is subjected to heat preservation for 30 min at the temperature of 220 DEG C, then the temperature is increased to 300 DEG C, heat preservation aging is conducted for 3 h, furnace cooling is conducted to 200 DEG C or below after heat preservation is completed, then the copper alloy wire is taken out and subjected to air cooling to the normal temperature, and the high-strength corrosion-resistant copper alloy wire is obtained. The copper alloy casting prepared through the method has high tensile strength, and the prepared copper alloy wire is high in self-corrosion potential and shows good strength and corrosion resistance.

The invention relates to the field of resistor materials, and particularly discloses a piezoresistor and a preparation process thereof.The piezoresistor comprises a ceramic substrate and copper-based electrodes formed on the two sides of the ceramic substrate, and each copper-based electrode comprises a nickel bottom layer sputtered on the ceramic substrate through a magnetron sputtering vacuum plating process and a copper surface layer sputtered on the nickel bottom layer; the preparation process comprises the following steps: S1, placing a to-be-treated zinc oxide-based ceramic substrate in a vacuum coating chamber, vacuumizing, and carrying out magnetron sputtering by using a nickel target until the thickness of a nickel bottom layer is 100-200nm; and S2, after the air pressure is adjusted, copper and palladium are replaced for copper plating till the thickness of a copper surface layer is 3-5 microns. According to the invention, the production cost of the piezoresistor is reduced, and the obtained piezoresistor has good stability and electrical properties.

The invention provides a method for manufacturing copper columns on a packaging substrate and the packaging substrate, and the method comprises the steps: sequentially covering a copper deposition layer and a graphical dry film on the surface of the packaging substrate, and vertically and continuously electroplating n first copper column groups of which the heights form an arithmetic progression on the graphic surfaces of the inner layer and the outer layer of a groove between the dry films; and the packaging carrier plate is rotated by 180 degrees, second copper column sets arranged in the height arithmetic progression are vertically and continuously electroplated on the first copper column sets correspondingly, the corresponding copper columns of the second copper column sets and the first copper column sets form target copper columns, and the heights of the target copper columns are the same. According to the invention, the first copper column group with equal height is arranged on the surface of the packaging carrier plate, and the second copper column group with equal height is arranged after up-down rotation, so that the single vertical continuous electroplating process does not exceed the single maximum copper plating amount, and the target copper column height is increased; meanwhile, increasing the height of the target copper column is beneficial to expanding the application range of the double-sided packaging process; in addition, redundant copper columns are arranged in the large plate before cutting, the residual copper rate of the whole plate is increased, the risk of plate burning and leakage is reduced, and the uniformity of the target copper columns is improved.

The invention discloses a copper plating device and method for a stainless steel pipe for refrigeration equipment, and relates to the technical field of copper plating devices.The copper plating device is characterized in that a moving mechanism for driving a first clamping mechanism and a second clamping mechanism to be slidably connected in the horizontal direction is arranged on a support, and a driving mechanism for driving the stainless steel pipe to be electroplated to rotate is arranged on the moving mechanism; the anode shaft is located in the stainless steel pipe to be electroplated, the first anode plate and the second anode plate are located on the two sides of the stainless steel pipe to be electroplated respectively and connected with a power source anode, and the stainless steel pipe to be electroplated is connected with a power source cathode. Conducting is achieved through close contact of the elastic conducting strip and the stainless steel pipe to be electroplated, rotating contact conducting of the conducting slip ring and the annular electric brush is matched, the elastic conducting strip is electrically connected with the conducting slip ring, uninterrupted conducting is achieved on the premise that rotation of the stainless steel pipe to be electroplated is guaranteed, and the problem of coating defects caused by poor contact is avoided; and the overall quality of the surface coating of the to-be-electroplated stainless steel pipe is ensured.

According to the single-polarized omnidirectional ceiling antenna provided by the utility model, the micro-arc oxidation ceramic layer is arranged on the surface of the aluminum radiation oscillator, so that oxidation and corrosion of the aluminum radiation oscillator are effectively prevented, and the copper plating layer is arranged on the micro-arc oxidation ceramic layer, so that the conductivity of the aluminum radiation oscillator is improved, and the signal transmission quality of the antenna is improved. And finally, a layer of nickel-phosphorus alloy is plated on the copper plating layer, so that the radiation oscillator has good wear resistance and hardness, the durability and the stability of the radiation oscillator are improved, the cost is greatly reduced compared with a copper radiation oscillator, and the radiation oscillator is suitable for different use environments. In addition, a plurality of copper short-circuit sheets coated with ferrite wave-absorbing coatings are arranged on the peripheral side of the radiation oscillator at equal intervals, so that the performance of the antenna is further optimized, and the anti-interference capability and the signal transmission efficiency of the antenna are improved.

The application discloses a manufacturing method of a ground performance metal-based circuit board for an intelligent networked automobile. According to design data, a substrate is manufactured, first drilling is performed, and carbon oil is filled, then first baking and curing are performed, a filling hole is formed, and a filling plate is formed on the whole plate; then polishing is performed, a ground circuit pattern is manufactured on the surface copper layer, and a metal-based circuit board is formed on the whole plate through subsequent processing; through the manufacturing method, the problem of hole wall cracking and separation caused by the thermal expansion and cold shrinkage difference of multi-layer materials of the substrate is effectively avoided in the method for forming a ground circuit by adopting an electroplating hole in the prior art; meanwhile, the complex processes such as copper deposition and copper plating required in electroplating are omitted, the processing flow is simplified, the carbon oil material cost is lower than that of silver paste and copper paste in the prior art, the material matching of the carbon oil with the circuit board body is better, the electrical connection between the ground circuit and the metal-based layer can be stably realized, and good ground performance is ensured.

The invention relates to the technical field of metal composite materials, in particular to high-conductivity low-cost copper-iron composite powder and a full-coating preparation method thereof.The two steps of chemical copper plating and 450-600 DEG C heat treatment are combined, micro-pores in an initial copper layer are diffused and healed by atoms, a compact copper shell is formed, the surface of the composite powder is free of red rust after a test, and the copper-iron composite powder is high in conductivity and low in cost. The corrosion resistance is improved compared with that of a non-heat-treated sample; a 0.5-3 m mutual diffusion layer is formed on the copper-iron interface through heat treatment, metallurgical bonding is achieved, the interface shear strength is improved to be larger than or equal to 25 MPa from less than 10 MPa of traditional physical bonding, and the problem that a coating layer is prone to stripping in the subsequent pressing, sintering or using process is solved.