75 results about "Copper plating" patented technology

The utility model relates to PCB board production equipment technical field, the technical problem that the utility model solves is uneven current distribution, rework rate is too high. In order to solve the above technical problem, the utility model provides a kind of copper tank for the copper of PCB board immersion copper. The utility model includes: rectifier;Outer tank body is equipped with medicine water and conductive roller;Soaking tank is located in outer tank body;Conveying assembly is located in soaking tank, and conveying assembly includes upper roller piece group and the lower roller piece group corresponding with being equipped in upper roller piece group below;Anode plate assembly is located in soaking tank;Anode plate assembly includes upper conductive plate and the lower conductive plate corresponding with being equipped in upper conductive plate below;Upper conductive plate is located in upper roller piece group;Positive terminal is connected with upper conductive plate, lower conductive plate, and negative terminal is connected with conductive roller;Rectifier, conductive roller, circuit board, upper conductive plate, lower conductive plate and soaking liquid constitute circuit loop. The utility model current distribution is more uniform, and rework is reduced.

The application provides a copper plating method for superconducting tape, which comprises the following steps: firstly, carrying out bright copper plating treatment on the processed tape; and then, carrying out sand surface copper plating treatment on the tape. The bright copper plating treatment adopts third current electroplating treatment, and the sand surface copper plating treatment adopts second current electroplating treatment. The current density of the third current is 0.5-3.5 A / dm 2 , and the current density of the second current is 3-8 A / dm 2 . By means of the bright copper plating treatment and then the sand surface copper plating treatment, the outer surface of the tape forms a sand surface, which can effectively prevent the axial sliding deviation of the wound coil cake.

A kind of plating experiment device and method for preparing high bonding force copper plating layer on aluminum-based heat sink surface, it relates to material processing technical field.Plasma chamber is provided with heater, motion control mechanism can carry out public self-rotating compound motion and is connected bias power supply, evaporation source includes crucible, electron gun, deflection coil and ion source, so that the inside of plasmaplasma chamber forms pure strong current ion flushing area and strong current ion enhanced electron beam evaporation plating area, vacuum and gas supply system connects plasmaplasma chamber and carries out vacuumizing, and respectively with plasmaplasma chamber and ion source connection supply reaction gas and working gas.By the spatial partition layout of plasmaplasma chamber cooperation motion control mechanism public self-rotating compound motion, workpiece is periodically alternated through two functional areas in film forming process, utilizes the ion beam mixing effect of high-energy ion to realize film densification and eliminate interface stress, ensure the bonding force and reliability of the deposited copper plating layer, multiple workpieces can be simultaneously loaded to improve production efficiency.

The application discloses an anti-interference unmanned aerial vehicle core component copper-plated film covering cap and relates to the technical field of unmanned aerial vehicles.The application comprises a bottom plate, the top of the bottom plate is provided with spare parts, and the top of the bottom plate is provided with a top cover; a dismounting assembly is arranged in the inner cavity of the bottom plate, and the dismounting assembly comprises a rotating rod movably connected to the inner cavity of the bottom plate.The linkage structure of the rotating rod and the cam drives the sliding block to slide transversely, the inserting rod is quickly inserted into or withdrawn from the insertion slot at the bottom of the top cover, the elastic reset function of the first spring is matched, one-handed operation type dismounting of the cover body is realized, the application is especially suitable for narrow space operation, in addition, the inclined surfaces of the inclined block and the inclined strip automatically push the reinforcing plate to press the spare parts when the top cover is closed, the buffer effect of the second spring is combined, the structural stability after installation is ensured, the tool operation required by traditional bolt fixing is avoided, and therefore, the task response efficiency and practicality of the unmanned aerial vehicle are improved.

This invention provides a functional cyanide-free silver plating method and coating structure, belonging to the field of metal surface treatment technology. This invention adds a trivalent chromium plating layer between the cyanide-free copper plating layer and the cyanide-free silver plating layer prepared by existing technology. The trivalent chromium plating layer provides electrochemical protection to the underlying copper plating layer, and the resulting coating structure effectively prevents corrosive media from eroding towards the substrate. The trivalent chromium plating layer has excellent corrosion resistance, effectively resisting corrosion from corrosive media, overcoming the defect of copper rust easily appearing on the surface of parts plated directly on copper plating layers. Simultaneously, by controlling the composition of the plating solution and adding lanthanum chloride heptahydrate and praseodymium chloride heptahydrate, the two have a synergistic effect, further improving the corrosion resistance of the plated parts.

This invention discloses a process and coating structure for rare earth modified trivalent chromium pearl chromium plating on zinc alloys. The process includes sequentially preparing a cyanide-free copper plating layer, a cyanide-free copper-zinc alloy plating layer, a high-corrosion-resistant nickel-phosphorus alloy plating layer, a bright nickel-cobalt alloy plating layer, a pearl nickel plating layer, a rare earth modified trivalent chromium pearl chromium plating layer, and an anti-discoloration protective film on a zinc alloy substrate. The rare earth modified trivalent chromium pearl chromium plating process is as follows: chromium chloride hexahydrate 90-130 g / L, potassium chloride 90-160 g / L, ammonium chloride 90-160 g / L, ammonium bromide 18-28 g / L, ammonium formate 40-60 g / L, boric acid 45-65 g / L, rare earth additives 8-12 mL / L, leveling agent 2-4 mL / L, accelerator 1-3 mL / L, plating bath pH 2.5-3.2, plating bath temperature 25-35℃, and cathode current density 8-16 A / dm². The rare earth additives have a synergistic effect on improving the performance of trivalent chromium plating solution. No rust was observed on the surface of the plated parts after undergoing a neutral salt spray test for 132 hours according to GB / T 10125–2021 standard.

The application discloses a copper-based alloy single crystal wafer preparation method based on surface energy regulation. The method comprises the following steps: S1, depositing a high surface energy metal film on a copper-plated surface in a Cu(111) / sapphire single crystal wafer, wherein the high surface energy metal is a metal with a surface energy greater than that of copper; S2, re-depositing a copper film on the surface of the high surface energy metal film in the high surface energy metal / Cu(111) / sapphire wafer obtained in the step S1; and S3, placing the copper / high surface energy metal / Cu(111) / sapphire wafer obtained in the step S2 in a chemical vapor deposition reaction chamber and performing annealing recrystallization. The Cu(111) single crystal wafer with a relatively mature process is used as a template, so that the in-plane twin problem existing in the direct single crystallization process of the existing copper-based alloy wafer can be effectively solved. Meanwhile, through the surface energy regulation strategy, the solid-state dewetting phenomenon of the high surface energy metal layer can be successfully inhibited, so that the controllable preparation of the ultra-flat copper-based alloy single crystal metal wafer can be realized.

This invention relates to the field of welding material preparation technology, and particularly to a method for preparing submerged arc welding wire based on integrated drawing and copper plating. The method involves coating the copper-plated surface of the welding wire with fluorescent marking grids after copper plating and drying. Dynamic images of the markings on the copper-plated surface are continuously acquired using an imaging system. Quantitative parameters of the two orthogonal diagonals of each fluorescent marking grid are extracted in real time. The presence of pre-existing signs of drawing instability in the corresponding region of the fluorescent marking grid is determined by calculating the elongation parameters of the drawn wire. A sequence of drawing instability evolution directions along the welding wire axis is constructed, and the instability state of the copper plating layer is determined based on the spatial consistency of this sequence. Finally, differentiated fine-drawing process control is implemented for different instability states. This method enables online detection of pre-existing relative slippage between the copper plating layer and the welding wire core during the drawing process. By distinguishing the drawing instability state of the copper plating layer, the preparation process can be adjusted accordingly.

This invention relates to the field of printed circuit board surface treatment technology, specifically to a highly stable chemical copper plating solution, comprising at least: 8-12 g / L copper salt, 9-13 g / L reducing agent, 25-32 g / L main complexing agent, 16-22 g / L auxiliary complexing agent, 0.2-0.35 g / L main stabilizer, 0.12-0.2 g / L auxiliary stabilizer, 0.1-0.18 g / L surfactant, and pH... The copper plating solution comprises: a regulator (18-25 g / L), a buffer (3-6 g / L), a corrosion inhibitor (0.08-0.15 g / L), and a flocculant (0.15-0.3 g / L). The main complexing agent is one or a mixture of ethylenediaminetetraacetic acid tetrasodium, ethylenediaminetetraacetic acid disodium, or sodium hypotriacetate. The auxiliary complexing agent is sodium gluconate. The main stabilizer is one or a mixture of 4,4'-bipyridine, 2-methylimidazole, or benzimidazole. The auxiliary stabilizer is one or a mixture of two of mercaptoethanol or 5-methylbenzotriazole. The copper plating solution provided by this invention ensures excellent copper plating performance while also having a long service life, effectively reducing maintenance frequency and copper plating costs.

The application belongs to the technical field of powder metallurgy, and discloses a kind of corrosion-resistant powder metallurgy stainless steel gear and its processing technology, solve the problem of low density and easy brittle fracture of traditional powder metallurgy stainless steel gear, the gear is composed of stainless steel powder matrix and embedded steel wire framework, the matrix adopts stainless steel coarse and fine doping powder;The steel wire framework is a meshed cylindrical structure welded by transverse annular steel wire ring and longitudinal straight steel wire, the surface is plated with copper plating layer, the processing technology includes steel wire framework preparation and pretreatment, powder high-frequency vibration filling, staged pressurization pressing, sintering under argon protection, the application improves the gear density and mechanical properties, ensures the matrix density and tensile strength, the corrosion resistance remains unchanged, and is suitable for heavy-load industrial transmission scene.

This invention discloses a graphene nanosheet composite aluminum-based material, comprising: adding copper-plated graphene nanosheets to an aluminum-based melt, wherein the proportion of copper-plated graphene nanosheets added is 0.1%-1.0%; the copper-plated graphene nanosheets are graphene nanosheets with a copper atom coating formed on their surface. This invention also discloses its preparation method. The graphene nanosheets with added chemical copper plating produced by this invention can effectively improve the tensile strength and elongation (mechanical properties) of test bars, and have a significant effect on improving the performance of aluminum alloy materials.

This invention discloses a printed circuit board and its copper plating process. The copper plating process of the printed circuit board includes the following steps: providing a substrate: providing a printed circuit board substrate, the substrate defining a region to be protected and a region to be copper plating; applying protective ink: applying a protective ink made of a mildly peelable protective composite material to the region to be protected; curing: curing the applied protective ink to form a protective layer on the region to be protected; copper plating: copper plating the substrate with the protective layer applied to form a copper layer on the region to be copper plating; and peeling: after the copper plating is completed, using a peeling liquid capable of selectively dissolving the structural resin in the composite material, peeling off the protective layer. This invention has the advantages of strong protection and mild peelability.

The application discloses a preparation method of a composite wave-absorbing material, the composite wave-absorbing material and communication equipment. The preparation method comprises the following steps: performing copper plating treatment on graphene oxide to obtain copper-plated graphene oxide; and performing composite treatment on the copper-plated graphene oxide and carbonyl iron powder to obtain the composite wave-absorbing material.

This invention discloses a low-dielectric glass material, glass-ceramic, and a method for preparing TGV through-holes for integrated circuit packaging. The glass material is composed of SiO2, B2O3, Al2O3, RO, R2O, and rare earth oxides Gd2O3 / La2O3, satisfying a SiO2 / B2O3 molar ratio of 2.0~3.5 and an Al2O3 / (Gd2O3+La2O3) molar ratio of 1:1~4:1. Through the "mixed base-like effect" and lattice distortion effect generated by the Gd2O3 / La2O3 dual doping, a dielectric constant ≤4.6, dielectric loss ≤0.001, and CTE 32~50 × 10⁻⁶ are achieved. ‑7 / °C. Further heat treatment yields a glass-ceramic containing single-crystal β-CaSiO3 phase, with a flexural strength ≥250 MPa. Based on this, laser-induced modification combined with wet etching is used to form TGV vias with an aspect ratio ≥50:1, followed by pulsed copper plating for filling, and low-temperature sealing with Kovar alloy at 975°C. Slow cooling and compressive stress design suppress bubbles and cracks. This invention solves the problems of signal loss, thermal stress failure, and insufficient mechanical strength in high-frequency packaging, and is suitable for RF connectors, MEMS, and 3D system-level packaging.

This invention discloses a method for preparing and applying a copper-based nanosheet catalyst. Specifically, it includes the following steps: (1) preparing a copper oxide nanosheet precursor via precipitation and hydrothermal reaction; sputtering copper onto a PTFE film or hydrophobic carbon paper using magnetron sputtering to obtain a copper-plated substrate; loading a dispersion solution onto the surface of the copper-plated substrate using drop-coating or spray-coating to prepare a working electrode; (2) using a flow cell, in-situ electrochemically reducing carbon dioxide in an electrolyte to prepare a copper-based nanosheet catalyst on the substrate. Furthermore, this invention also develops a novel nickel / copper electrode material for the oxidation of glycerol to formic acid. This reaction occurs at the anode, replacing the oxygen evolution reaction, allowing for the simultaneous preparation of ethylene at the cathode and formic acid at the anode, achieving the preparation of two products in one reactor and improving equipment utilization efficiency.

This invention discloses a method for preparing W-Cu micro-layered composite materials based on chemical copper plating, comprising the following steps: Step 1, ball milling W powder to form flakes, obtaining flake-shaped W powder; Step 2, preparing a copper plating solution; Step 3, adding the flake-shaped W powder to the copper plating solution for reaction, followed by repeated filtration and washing with deionized water, and then freeze-drying to obtain a W-Cu composite powder with Cu-coated flake-shaped W powder; Step 4, sintering the Cu-coated flake-shaped W powder under vacuum hot pressing to obtain the W-Cu micro-layered composite material. The W-Cu micro-layered composite material obtained by this invention improves thermal conductivity while reducing the coefficient of thermal expansion.

This application proposes a method for fabricating a connection structure with signal conduction, comprising the following steps: providing a copper-clad substrate having a first through-hole; electroplating the inner wall of the first through-hole to form a ground layer; filling the first through-hole with a first material to form a first filling layer, with the two opposing surfaces of the first filling layer flush with the first copper plating layer and the second copper plating layer, respectively; forming a second through-hole in the first filling layer, with the second through-hole coaxially arranged with the first through-hole; electroplating the inner wall of the second through-hole to form a signal transmission layer; and connecting a first component to be connected and a second component to be connected to the signal transmission layer, thereby obtaining the connection structure. The connection structure fabricated by this application has high impedance matching and low risk of signal leakage. This application also provides a connection structure prepared by the above method.

The application provides a brightener, a preparation method and application thereof. The brightener has a structure as shown in formula 1, wherein R is any one of CH3-(CH2) x -, Ph-(CH2) y - or an azacyclic group, x is 2-5, and y is 0-4. The brightener is connected with a functional group having strong polarity, has good inhibition effect on copper, and has a capturing cuprous ion at the other end of the structure, accelerates copper deposition, has certain leveling performance, can form leveling effect on the surface copper high potential, forms acceleration effect on the low point position in the hole, and can effectively improve the deep plating capacity of the acid copper plating solution, and the deep plating capacity can reach 79-85%.

This invention discloses a method for producing copper oxide nanosheets from PCB acidic etching solutions, belonging to the field of PCB acidic etching solution treatment technology. This invention uses a reducing agent to react with acidic waste etching solution for precipitation. During the precipitation process, by controlling the pH, the content of hydroxide-type alkalis, and carbonate-type alkalis, copper ions can first be converted into cuprous chloride and basic copper carbonate intermediates before decomposing into copper oxide nanosheets. The process of this invention is simple, low-cost, and can produce high-purity copper oxide nanosheets from PCB acidic waste etching solution without high-temperature calcination. The provided method is applicable to copper plating, energy storage, solar cells, and chemical catalysts in the electronics industry.

This invention relates to the field of fine chemicals, and more particularly to an imidazole cyclic sulfide quaternary ammonium salt compound, its preparation method, and its application. The structural formula of the compound is shown in Formula (I). This invention provides a novel imidazole sulfide quaternary ammonium salt compound, its preparation method, and its application in electroplating solutions. This compound, during continuous electroplating at low current densities, can produce a bright and smooth copper-plated surface on the workpiece, while also possessing excellent deep plating capability and a good copper layer lattice structure, thus adapting to the specific needs of current copper plating additive processes.

This invention discloses a method for preparing copper-plated soft magnetic composite material, the soft magnetic composite material and its application. The preparation method includes the following steps: (1) preparing iron-based soft magnetic powder and activating it; (2) preparing a copper plating solution containing a copper source; (3) chemical plating; (4) drying; (5) low-temperature pre-crystallization treatment; (6) annealing: (6.1) heating to 500-600℃ at 3-8℃ / min and holding for 10-30min; (6.2) heating to 750-850℃ at 8-12℃ / min and holding for 15-30min; (6.3) cooling to 300-400℃ at 1-3℃ / min and holding for 60-90min; (6.4) cooling to 200-250℃ at 1-2℃ / min and holding for 90-120min, thereby achieving the dual continuous function of "Cu-rich phase insulation at grain boundaries and thermal and magnetic conduction of iron grains".

The application discloses a copper plating composition and a chemical copper plating process, and relates to the field of copper plating compositions, which is composed of the following components: a copper salt providing divalent copper ions; a complexing agent for complexing the divalent copper ions; a stabilizer for stabilizing the copper plating composition, which is selected from at least one of the group consisting of 2,2'-dipyridyl, potassium selenocyanate, potassium thiocyanate and 2-mercaptobenzimidazole; a reducing agent for reducing the complexed divalent copper ions to metallic copper; an alkaline adjusting agent for adjusting the pH value of the composition to an alkaline range suitable for chemical copper plating; and a solvent. The process stability and product yield are improved: through the optimized combination of the core stabilizer, the complexing agent and the reducing agent, the self-decomposition of the copper plating bath is effectively inhibited, the process stability is significantly enhanced, the incidence of key defects such as backlight defects in the metalization of the circuit board hole is greatly reduced, and the high yield of the final product is ensured.

The utility model discloses a PCB copper deposition process copper deposition liquid adding device relates to PCB copper deposition technical field, including copper deposition pool, one side fixed mounting of copper deposition pool has the base, the upper surface fixed mounting of base has the support, the top fixed mounting of support has the liquid storage bucket, the fixed mounting of liquid storage bucket on has the supporting block, the fixed mounting of supporting block on has the rotating rod, be provided with the apron on the liquid storage bucket, the fixed mounting of apron on has the swivel, swivel rotation installs on the rotating rod, the one side fixed mounting of supporting block is close to swivel has the torsional spring, the other end fixed mounting on swivel of torsional spring, be provided with valve mechanism on the liquid storage bucket, the fixed mounting of liquid outlet pipe in the liquid storage bucket, in the utility model, through the setting of supporting block, rotating rod, swivel, first powerful magnetic block and valve mechanism etc.

A method for manufacturing a wiring board, including: forming a resist layer on a seed layer comprising a metal provided on a support body; forming a pattern including an opening to which the seed layer is exposed in the resist layer by light exposure and development of the resist layer; and forming a copper plating layer on the seed layer exposed into the opening by electrolytic plating, in this order. The arithmetic mean roughness Ra of the surface of the seed layer on a side opposite to the support body is 0.05 μm or more and 0.30 μm or less.

The utility model provides a kind of copper-plated steel wire drawing lubricant copper adsorption device, including tank, the lower part of tank is provided with liquid inlet and liquid outlet, the inside both sides of tank are provided with clamping groove plate in pairs, clamping groove plate is installed with polar plate between, the outside of clamping groove plate is installed with copper bar, multiple RTO fuse holders are installed on copper bar;Clamping groove plate is uniformly machined with groove on one side, the side of the clamping groove plate of both sides machined with groove is oppositely arranged, polar plate is clamped in the groove inside of the clamping groove plate of both sides;Multiple RTO fuse holders on the copper bar of the clamping groove plate of both sides are staggered arrangement, the top end both sides of polar plate are provided with convex edge, when polar plate is installed to clamping groove plate, only one side convex edge is contacted with RTO fuse holder on copper bar to form electric connection.The utility model sets up multiple polar plate, under the action of positive and negative electrode, copper ion in lubricant is adsorbed on polar plate, to effectively reduce the content of copper ion in lubricant, greatly improve the performance of lubricant.

In one aspect, a method for manufacturing a solar cell includes: manufacturing a barrier layer on a transparent conductive film of a solar cell wafer; manufacturing a first copper seed layer on the barrier layer by a chemical copper plating method; manufacturing a second copper seed layer on the first copper seed layer by a sputtering method; and manufacturing a grid line electrode on the second copper seed layer.