10 results about "Chemical-mechanical planarization" patented technology

A method and system includes: a pad comprising a first side and a second side opposite the first side, wherein the first side is configured to receive a wafer during chemical mechanical planarization (CMP), and a platen adjacent the pad along the second side, wherein the platen comprises a suction opening that interfaces with the second side; a pump configured to produce suction at the suction opening to adhere the second side to the platen; and a sensor configured to collect sensor data characterizing a uniformity of adherence between the pad and the platen, wherein the pump is configured to produce the suction at the suction opening based on the sensor data.

The embodiment of the present disclosure relates to a chemical mechanical polishing device and a method for adjusting chemical mechanical planarization. The chemical mechanical polishing device comprises: a polishing pad carrying a polishing pad; a polishing head located above the polishing pad, the polishing head carrying a wafer on one side close to the polishing pad; a first detection device arranged outside the wafer, used for detecting the thickness change of the wafer, and generating a thickness difference signal according to the thickness change; a control device connected with the first detection device, used for receiving the thickness difference signal, and generating a control signal according to the thickness difference signal, the control signal being used for adjusting the first distance between the polishing pad and the polishing head, so that the polishing rate of the polishing pad polishing the wafer remains unchanged. According to the thickness difference signal, the control signal for adjusting the first distance between the polishing pad and the polishing head is generated, so that the change of the polishing pad and the wafer thickness does not affect the polishing rate of the chemical mechanical polishing process, thereby ensuring that the polishing process of the chemical mechanical polishing process is stably carried out.

An example of the present invention relates to a polishing pad used in a chemical mechanical planarization (CMP) process of a semiconductor, a method of manufacturing the same, and a method of manufacturing a semiconductor device using the same, the polishing pad of the example of the present invention can improve a polishing rate, and significantly reduce surface residues, surface scratches, and dishing of a wafer by adjusting surface roughness characteristics of the polishing pad after polishing is performed.

This invention provides chemical mechanical planarization (CMP) polishing compositions, methods, and systems for polishing copper. The CMP polishing compositions contain specific amino alcohol compounds that have a weak inhibitory effect on copper polishing to protect low-lying areas during the removal of protrusion features, thereby maintaining planarization efficiency in advanced node Cu CMP processes.

1. Name of the product in this design: Multi-size compatible chemical mechanical planarization equipment. 2. Application of this design: It is used in the semiconductor manufacturing field to perform chemical mechanical polishing (CMP) on semiconductor wafers of various sizes to achieve high-precision planarization of the wafer surface. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

Described are pads and methods used in chemical-mechanical polishing (also referred to as chemical-mechanical planarization) of microelectronic substrates, the pads having a polishing surface that includes rigid sections and compliant sections.

A polishing pad for chemical mechanical polishing comprises a polishing layer containing a polymer matrix, which is a reaction product of an isocyanate-terminated prepolymer and a curing agent, wherein the polymer matrix has hard and soft segments, and wherein a multi-segmented polymer component formed by pre-expanded polymer microspheres is present in the polymer matrix. The polishing pad can be manufactured by: preparing a premix of isocyanate-terminated prepolymer and pre-expanded fluid-filled polymer microspheres in a stirred tank; pumping a portion of the premix from the bottom of the stirred tank through a conduit and recirculating it to the top region of the stirred tank; mixing the portion of the premix with a curing agent to form a mixture; casting the mixture into a mold; and curing the mixture in the mold.

The application provides a process method for chemical mechanical planarization of a recyclable wafer, comprising the following steps: S1, providing a recyclable wafer, cerium oxide polishing liquid and an alkaline solution containing ammonia; S2, rinsing the recyclable wafer; S3, pre-flowing by using the cerium oxide polishing liquid; S4, polishing by using the cerium oxide polishing liquid and scraping the polishing pad; S5, rinsing the polishing pad and the surface of the recyclable wafer and water polishing while scraping the polishing pad; S6, polishing the recyclable wafer by using the cerium oxide polishing liquid and the dresser is not working; S7, rinsing the polishing pad and the surface of the recyclable wafer and water polishing while scraping the polishing pad; S8, polishing the recyclable wafer by using the cerium oxide polishing liquid and scraping the polishing pad; S9, rinsing the polishing pad and the recyclable wafer and water polishing with reduced pressure; S10, separating the recyclable wafer from the polishing pad, rinsing and increasing the pressure of the dresser to scrape the polishing pad; and S11, grinding the recyclable wafer by using the alkaline solution and a soft polishing pad.

Described are pads and methods used in chemical-mechanical polishing (also referred to as chemical-mechanical planarization) of microelectronic substrates, the pads having a polishing surface that includes rigid sections and compliant sections.

This application relates to the field of semiconductor chemical mechanical planarization technology, and provides a liquid supply device. The liquid supply device includes: a frame, a liquid dispensing mechanism connected to a first liquid supply device, and a liquid supply mechanism connected between the liquid dispensing mechanism and a processing device. The frame includes at least two mounting spaces, one mounting space housing the liquid dispensing mechanism and the other mounting space housing the liquid supply mechanism. The liquid dispensing mechanism includes several different types of metering containers, and the metering containers can be selected and installed according to the type of the second liquid. The metering containers are connected to the second liquid supply device and are used to meter the volume of the second liquid delivered by the second liquid supply device to the liquid dispensing mechanism. This solution integrates the liquid dispensing mechanism and the liquid supply mechanism into one unit and is equipped with different types of metering containers, enabling the configuration and supply of multiple types of processing liquids using a single liquid supply device.