1048 results about "Titanium nitride" patented technology

The invention provides nickel-based superalloy powder and a preparation method and application thereof, nickel-based superalloy and a preparation method and application thereof, and relates to the technical field of alloys. The preparation method comprises the following steps: smelting a nickel-based high-temperature alloy raw material to obtain alloy liquid; and the alloy liquid is atomized and crushed, and the nickel-based high-temperature alloy powder is obtained. Compared with traditional nickel-based superalloy preparation, aluminum nitride and titanium nitride raw materials are added in the nickel-based superalloy powder preparation process, aluminum nitride and titanium nitride are separated out in the alloy powder preparation process to form a strengthening phase, and the tensile strength and the elongation at break of the nickel-based superalloy can be improved; and particularly, as a main raw material for additive manufacturing of high-performance metal components, the material has a very good application prospect.

The invention provides a titanium nitride doped fluoride-free photo-thermal super-hydrophobic coating and a preparation method and application thereof.The titanium nitride doped fluoride-free photo-thermal super-hydrophobic coating is prepared from polydimethylsiloxane modified titanium nitride, hydrophobic nanoparticles and an adhesive and has the excellent local surface plasma resonance effect and photo-thermal effect; meanwhile, the coating is of a rough and uniform micro-nano hierarchical structure, dynamic water can be efficiently removed, icing can be delayed, the surface temperature can reach 12 DEG C only through irradiation of one sunlight intensity in the environment of-30 DEG C, and rapid deicing can be achieved. The coating has good functions of self-cleaning, anti-icing, deicing, defrosting and the like, renewable solar energy is utilized, and the coating is green, environment-friendly, energy-saving and emission-reducing. Meanwhile, the super-hydrophobic surface of the coating can effectively delay icing and inhibit ice adhesion. According to the coating, organic combination of an active deicing strategy and a passive deicing strategy is achieved based on the synergistic effect of the super-hydrophobicity and the photothermal effect.

The present application discloses a cell contact structure, a semiconductor device, and a method for fabricating the semiconductor device. The cell contact structure includes a contact layer positioned on a substrate and enclosed by a plurality of bit line structures and a plurality of partition layers; and a liner layer positioned between the contact layer and the substrate, between the contact layer and the plurality of bit line structures, and between the contact layer and the plurality of partition layers. A top surface of the contact layer and a top surface of the liner layer are substantially coplanar. The liner layer includes doped polycrystalline silicon, doped polycrystalline germanium, or doped polycrystalline silicon germanium. The contact layer includes tungsten, titanium, or titanium nitride.

The invention discloses a semiconductor chip, a preparation method of a metal interconnection layer and the metal interconnection layer. The semiconductor chip comprises a semiconductor substrate, and a plurality of device structures are formed on the semiconductor substrate; the metal interconnection layer is located above the semiconductor substrate and used for connecting a plurality of device structures, and the metal interconnection layer at least comprises a first titanium layer located above the semiconductor substrate, a second titanium layer located above the semiconductor substrate and a third titanium layer located above the semiconductor substrate; a first titanium nitride layer over the first titanium layer; a metal layer over the first titanium nitride layer; the at least two groups of composite barrier layers are positioned above the metal layer; each group of composite barrier layers comprises a second titanium layer and a second titanium nitride layer located above the second titanium layer; the thickness of the second titanium nitride layer in each group of composite barrier layers is smaller than a first preset thickness; and the sum of the thicknesses of the second titanium nitride layers in each group of composite barrier layers is equal to or greater than a second preset thickness. According to the semiconductor chip, the metal residue defect on the surface of the semiconductor substrate is reduced while the thickness requirement is met.

The invention belongs to the field of metal processing, and relates to an in-situ self-generated NiMoCoAlTi high-entropy alloy toughened metal ceramic material and a preparation method thereof. According to the invention, Ti (C, N) ceramic is used as a matrix, Ni, Mo, Co, Al and Ti are directly added as binders, and spark plasma coupling high-frequency induction sintering is carried out to obtain the high-temperature-resistant ceramic. The preparation method comprises the following steps: firstly, mixing Ti (C, N), Ni, Mo, Co, Al and Ti, then carrying out ball milling and drying to obtain powder, and carrying out spark plasma coupling high-frequency induction sintering. The method is beneficial to improving the mechanical property of the material, saves the preparation time of the high-entropy alloy powder, and has the advantages of being simple in preparation method, convenient to operate and the like. The obtained titanium carbonitride-based metal ceramic has higher toughness and hardness and excellent antifriction and wear-resisting properties, and can be used for manufacturing high-precision numerical control machine tool guide rails and other wear-resisting and corrosion-resisting parts.

The invention relates to the technical field of wear-resistant materials, in particular to a nano wear-resistant composite material and a preparation method and application thereof, and the nano wear-resistant composite material comprises the following raw materials in parts by weight: 45-50 parts of nano tungsten carbide, 10-15 parts of cobalt powder, 7-11 parts of a modified nano titanium nitride agent, 5-7 parts of nano neodymium oxide, and 4-6 parts of a nano TaC-doped complexing agent. According to the nano wear-resistant composite material, the nano tungsten carbide is matched with the cobalt powder and the nano neodymium oxide, the modified nano titanium nitride agent, the doped nano TaC and the synergist are coordinated and matched, and the raw materials are coordinated and synergistic, so that the wear resistance, the yield strength performance and the fatigue resistance of the obtained nano wear-resistant composite material are coordinated and improved; meanwhile, the product is excellent in performance stability under different degrees of salt corrosion conditions.

The invention relates to the field of material surface treatment, and discloses a silica gel and metal combined treatment process which comprises the following steps: S1, ultra-short pulse laser is adopted to machine a three-dimensional micro-nano composite structure on the surface of a titanium alloy, the structure comprises a periodic groove array and surface nano holes, and the surface roughness Ra of the titanium alloy is larger than or equal to 5 microns; and S2, a titanium nitride transition layer and a siloxane self-assembly molecular layer are sequentially formed on the roughened titanium alloy surface through atomic layer deposition, and a gradient chemical interface is formed. According to the method, the micro-nano composite structure is processed through ultra-short pulse laser, the interface mechanical embedding area is remarkably increased, the two-dimensional rough limitation of a traditional sand blasting process is broken through, deep barb-shaped anchoring is achieved, the anti-stripping capacity is greatly enhanced, gradient chemical bonding is formed by the atomic layer deposition titanium nitride transition layer and the amino self-assembly molecular layer, and the anti-stripping performance is improved. The thermal expansion difference is effectively buffered, and the interface high-temperature resistance is improved.

The invention relates to the technical field of conductive corrosion-resistant coatings for metal bipolar plates of hydrogen fuel cells, and discloses a conductive corrosion-resistant silver-doped titanium nitride coating for a metal bipolar plate as well as preparation and application of the conductive corrosion-resistant silver-doped titanium nitride coating. The conductive corrosion-resistant silver-doped titanium nitride coating for the metal bipolar plate is formed by sequentially stacking a pure Ti transition layer, a silver-doped titanium nitride coating and a pure titanium nitride covering layer. According to the conductive corrosion-resistant silver-doped titanium nitride coating for the metal bipolar plate, silver can be stably and uniformly distributed in the titanium nitride coating, a conductive path is formed, the contact resistance of the coating is reduced, the titanium nitride coating forms a compact structure, the corrosion resistance and the surface hydrophobicity of the titanium nitride coating are enhanced, and the service life of the coating is prolonged. The surface contact resistance can reach 4.18 m omega.cm < 2 >, the corrosion current density can reach 0.59 mu A.cm < 2 >, the corrosion potential can reach 0.08 V, and the water contact angle can reach 106.70 degrees.

The invention discloses a composite positive electrode material which comprises a layered oxide and a coating layer, the general formula of the layered oxide is NaMe < 1-x > Al < x > O < 2 >, Me is one or more of nickel, iron, manganese and cobalt, and x is greater than 0; the coating layer is coated outside the layered oxide, the coating layer sequentially comprises a first coating layer, a second coating layer and a third coating layer from inside to outside, the first coating layer is titanium aluminum carbide, the second coating layer is titanium nitride, the third coating layer is nitrogen-doped polymeric porous carbon, and the composite positive electrode material forms an Al-N bond. The invention also discloses a positive plate with the composite positive electrode material and a sodium ion battery. The cyclic expansion rate can be effectively controlled while the cyclic electrical performance is guaranteed.

The invention relates to the field of coatings, and discloses a wear-resistant and corrosion-resistant high-entropy alloy composite coating and a preparation method thereof.The wear-resistant and corrosion-resistant high-entropy alloy composite coating is prepared by depositing functional high-entropy alloy composite powder on the surface of a base body in a laser cladding mode, the functional high-entropy alloy composite powder comprises high-entropy alloy powder, a modified additive and composite ceramic powder, the modified additive is prepared by using urea and titanium tetrachloride as raw materials, growing nano titanium nitride particles on the surface of a silicon carbide nanowire in situ to prepare a nano titanium nitride / silicon carbide nanowire composite material, and then coating a layer of nano titanium dioxide particles on the surface of the nano titanium nitride / silicon carbide nanowire composite material by using tetrabutyl titanate; and the composite ceramic powder is prepared by compounding zirconium carbide, niobium carbide, hafnium carbide and tantalum disilicide. The hardness, wear resistance and corrosion resistance of the high-entropy alloy coating are enhanced by adding the modified additive and the composite ceramic powder.

The invention discloses a method for preparing a conductive ceramic with controllable resistivity, and relates to the technical field of conductive ceramics. The invention adopts three different particle sizes of aluminum oxide, titanium nitride, and silicon dioxide to form a ceramic slurry, which reduces the possibility of deformation, and adjusts the amount of titanium nitride added to adjust the ceramic resistivity, thereby realizing the controllable resistivity of the ceramic; the invention adopts methacrylic acid glycidyl ether and starch to form a gel skeleton, and uses amino-treated nanographite sheets as a support to ensure the mechanical strength of the ceramic; the ceramic slurry is used as a core material, and then a layer of gel is wrapped around the outer layer of the core material, and a three-stage high-temperature sintering treatment is performed to optimize the strength of the ceramic, while making the zirconium ions and nickel ions doped with the gel combine with the lanthanum ions in the atomized liquid, and form a zirconium-nickel-lanthanum-carbon crystal structure under a H2O / O2 atmosphere, which greatly improves the conductivity of the gel layer, thereby forming a uniform and continuous conductive path on the surface and inside of the ceramic.

The invention discloses a titanium nitride single-crystal thin film and a preparation method and application thereof, and the preparation method comprises the following steps: S1, cleaning a single-crystal substrate, and feeding the single-crystal substrate into a sputtering chamber of magnetron sputtering equipment; s2, vacuumizing the sputtering chamber, and heating the single crystal substrate; s3, nitrogen and argon are introduced into the sputtering chamber, a high-purity titanium target is used as a sputtering target material, a radio-frequency power supply or a direct-current power supply is turned on, and pre-sputtering is conducted; s4, the power of a power source is set, the flow ratio of nitrogen to argon is adjusted to be 0.1-0.5, and a titanium nitride film grows on the single crystal substrate through magnetron sputtering; and S5, turning off the power supply, keeping the air pressure in the original cavity unchanged, and cooling to obtain the titanium nitride single crystal film. According to the method, the titanium nitride single crystal film is prepared by adopting a magnetron sputtering technology, and the stress between crystal lattices of the TiN film can be changed by adjusting the growth atmosphere and introducing nitrogen and argon mixed gas according to a certain proportion, so that the superconducting transition temperature is increased.

The invention provides a high-strength antibacterial implant material and a preparation method thereof. The implant material comprises a composite matrix, a graphene-titanium nitride composite coating and a tantalum-silver composite coating, wherein the graphene-titanium nitride composite coating and the tantalum-silver composite coating are sequentially arranged on the surface of the composite matrix from inside to outside; wherein the graphene-titanium nitride composite coating is of a multi-layer alternating structure formed by alternately stacking graphene layers and titanium nitride layers; the tantalum content and the silver content in the tantalum-silver composite coating are in opposite gradient changes. The mechanical strength and the antibacterial property of the implant material are remarkably improved through the multi-layer alternate structure design, the hardness and the biocompatibility of the material are enhanced through the graphene-titanium nitride composite coating, and the implant material is endowed with the antibacterial property and the corrosion resistance through the tantalum-silver composite coating; the implant material has long-acting antibacterial property and biological safety while keeping high strength, so that the implant material is widely applied to the medical implant fields of orthopedics, dentistry and the like.

One or more embodiments of the disclosure are directed to methods of forming structures that are useful for FEOL and BEOL processes. Embodiments of the present disclosure advantageously provide methods of depositing titanium nitride (TiN) in high aspect ratio (AR) structures with small dimensions. Some embodiments advantageously provide seam-free high-quality TiN films to fill high AR trenches with small dimensions. Embodiments of the present disclosure advantageously provide methods of filling 3D structures, such as finFETs, GAAs, and the like, without creating a seam. The methods include selective deposition processes using blocking compounds in order to provide seam-free TiN gapfill in 3D structures, such as GAA devices.

The present application discloses a cell contact structure, a semiconductor device, and a method for fabricating the semiconductor device. The cell contact structure includes a contact layer positioned on a substrate and enclosed by a plurality of bit line structures and a plurality of partition layers; and a liner layer positioned between the contact layer and the substrate, between the contact layer and the plurality of bit line structures, and between the contact layer and the plurality of partition layers. A top surface of the contact layer and a top surface of the liner layer are substantially coplanar. The liner layer includes doped polycrystalline silicon, doped polycrystalline germanium, or doped polycrystalline silicon germanium. The contact layer includes tungsten, titanium, or titanium nitride.

The invention relates to the technical field of water electrolysis devices, bipolar plates and coating materials, in particular to a metallic compound coating, a preparation method thereof and a modified bipolar plate. The metal compound coating is used for covering the surface of the bipolar plate of the water electrolysis device, and the preparation method of the metal compound coating comprises the following steps: by taking the bipolar plate of the water electrolysis device as a substrate, depositing a titanium nitride coating on the surface of the substrate by adopting a pulse laser deposition process; and then oxygen permeation is conducted on the titanium nitride coating through a plasma surface oxygen permeation technology, and the titanium oxynitride coating with the oxygen content changing in a gradient mode is formed. According to the invention, a layer of titanium oxynitride coating with gradient change of oxygen content is generated on the surface of the titanium bipolar plate by mainly adopting a pulse laser deposition technology and a plasma oxygen permeation technology, and the titanium oxynitride coating has corrosion resistance and conductivity; the problems that according to an existing composite coating preparation method, due to interface defects and stress concentration between different coatings, the protective performance of the coatings is reduced, and the long-term stability of the coatings is affected are solved.

The invention relates to a method for improving hardness of a cover plate, which comprises the following steps: pretreating the surface of the cover plate to remove oil stain and dust on the surface; a titanium nitride layer is sprayed on the surface of the cover plate, and after the titanium nitride layer is sprayed, residual stress in the titanium nitride layer is eliminated through an annealing process; carrying out curing treatment on the cover plate; wherein the technological parameters for spraying the titanium nitride on the surface of the cover plate comprise that the powder feeding amount is set to be 30-40 g / min, the electric power is set to be 20-40 KW, the argon gas flow is set to be 4-5 L / min, the hydrogen gas flow is set to be 1-2 L / min, the spray gun voltage is set to be 50-55 V, and the spray gun current is set to be 200-300 A. Spraying is conducted on the surface through plasma spraying equipment or electric arc spraying equipment, the spraying process is controlled, and the hardness of the cover plate can be improved. After spraying, heating curing or ultraviolet curing is carried out, and it is ensured that the coating can be firmly attached to the surface of the cover plate after curing. Substances such as titanium nitride are sprayed on the surface of the cover plate, so that the hardness of the cover plate is effectively enhanced.

A memory device includes a bit line structure disposed over a semiconductor substrate, and a lower capacitor contact disposed in and extending above the semiconductor substrate. The lower capacitor contact includes polysilicon. The memory device also includes an upper capacitor contact disposed over the lower capacitor contact. The upper capacitor contact includes titanium nitride. The memory device further includes a first spacer layer disposed between the lower capacitor contact and the bit line structure and between the upper capacitor contact and the bit line structure. In addition, the memory device includes a capacitor disposed over the first spacer layer.

The utility model discloses a TOPCon solar cell structure, which relates to the field of solar cells and sequentially comprises a first silver electrode, a first antireflection film layer, a boron doping layer, a silicon substrate, a tunneling layer and a polycrystalline silicon doping layer in a single direction, and further comprises a second antireflection film layer, a diffusion barrier layer and a second silver electrode. One grid line of the diffusion barrier layer is arranged between two adjacent grid lines of the second antireflection film layer, and the grid line of the second silver electrode is located on the grid line of the diffusion barrier layer; a titanium nitride layer TiN or a titanium oxynitride layer TiON is deposited between the polycrystalline silicon layer and the metal electrode to serve as a diffusion barrier layer, and the second silver electrode is of a grid line structure instead of full coverage; according to the structure, the characteristics of high conductivity and electron selective transmission of titanium nitride or titanium oxynitride are utilized, so that electrons have low resistance during transmission, and electron collection is facilitated. And by adopting a grid line structure, the absorption of titanium nitride or titanium oxynitride on long-wave-band light is effectively avoided, and the double-sided topcon battery is very suitable for the existing double-sided topcon battery.

The invention discloses a halogen-free low-volatility anti-icing photo-thermal super-hydrophobic coating for the surface of a wind power blade and a preparation method thereof. The coating is prepared by compounding functionalized modified multi-walled carbon nanotubes, functionalized modified nano titanium nitride, polydimethylsiloxane / nano silicon dioxide modified epoxy resin and a curing agent. Wherein the multi-walled carbon nanotubes are subjected to amidation and dual functionalization of lauric acid and 3-aminopropyl triethoxy silane; the surface of the nano titanium nitride is uniformly modified through bionic polydopamine coating; hydroxyl-terminated polydimethylsiloxane and nano SiO are doped into an epoxy resin base material, so that the system is endowed with low surface energy and high weather-resistant binding force. After curing and film forming at room temperature for 24 hours or at 80 DEG C for 2 hours, the water contact angle is greater than or equal to 155 DEG C, the ice adhesion strength is less than or equal to 10 kPa, the photo-thermal temperature is greater than or equal to 40 DEG C, and the performance is not attenuated after 50 times of heating and cooling tests; and after 150-hour damp heat, 500-hour ultraviolet radiation, acid corrosion and abrasive paper friction, the coating does not blister or fall off. The coating disclosed by the invention is green and environment-friendly, low in curing energy consumption, high in photo-thermal temperature rise and strong in super-hydrophobic durability, and can be used for remarkably improving the long-term anti-icing capability of wind power blades in cold and high-humidity regions.

A memory device includes a bit line structure disposed over a semiconductor substrate, and a lower capacitor contact disposed in and extending above the semiconductor substrate. The lower capacitor contact includes polysilicon. The memory device also includes an upper capacitor contact disposed over the lower capacitor contact. The upper capacitor contact includes titanium nitride. The memory device further includes a first spacer layer disposed between the lower capacitor contact and the bit line structure and between the upper capacitor contact and the bit line structure. In addition, the memory device includes a capacitor disposed over the first spacer layer.

The invention provides a preparation method of a molybdenum phosphide / titanium nitride composite material and a battery positive electrode material and a lithium-carbon dioxide battery, and belongs to the technical field of new energy materials. And then a titanium nitride conductor layer is deposited on the molybdenum phosphide by using an atomic layer deposition technology to prepare the molybdenum phosphide / titanium nitride, the molybdenum phosphide is combined as a transition metal phosphide to have stable catalytic performance, and the titanium nitride is used as a conductor to have excellent conductivity. The lithium-carbon dioxide battery positive electrode catalyst with high catalytic activity, high conductivity and excellent stability is obtained through the synergistic effect of the two materials, and when the lithium-carbon dioxide battery positive electrode catalyst is applied to a lithium battery, higher energy density, longer cycle life and better rate capability are shown, so that the overall performance of the battery is improved, and the application prospect is wide. The requirements on high-performance batteries in the fields of electric automobiles, energy storage systems and the like are met.

The invention discloses a titanium carbonitride-based metal ceramic alloy with a micro-nano bicrystal plate-shaped structure and a preparation method of the titanium carbonitride-based metal ceramic alloy with the micro-nano bicrystal plate-shaped structure. Binding phase powder; a carbon-nitrogen balancing powder; the Fsss particle size of the first TiCN powder is larger than the Fsss particle size of the second TiCN powder. The interface bonding property of a hard phase and a binding phase is better, better impact toughness is achieved, TiC can effectively enhance the strength and hardness of CN of the formed binding phase-based composite material (TiM), the W element can achieve solid solution and strengthen the binding phase, the hardness of the material is improved, and the wear resistance of the material is improved; the balance carbon content can improve the hardness, strength and wear resistance of the steel, and the submicron second TiCN is used for refining grains, improving the toughness and increasing the hardness of hard particles, so that the toughness of the steel is remarkably improved, the work hardening capacity is improved, and the wear resistance of the steel is obviously improved.

A compressor of an embodiment includes a compression mechanism part that compresses a refrigerant in a sealed container. The compression mechanism part includes Cr and includes a first member and a second member which slidingly move relative to each other. The first member has a chromium layer and a nitride layer formed on a base member surface in this order. The nitride layer includes CrN and TiN. Carbide is deposited on a surface of the second member.

A gradient multilayer nano Ti (C, N)-based metal ceramic and a preparation method thereof relate to the field of powder metallurgy, and the method comprises the following steps: S1, mixing 64.9% by mass of titanium carbonitride, 23% by mass of tungsten carbide, 8% by mass of cobalt, 4% by mass of molybdenum carbide and 0.1% by mass of graphene nanosheets to obtain mixed powder I; mixing 60.9% of titanium carbonitride, 23% of tungsten carbide, 8% of cobalt, 8% of molybdenum carbide and 0.1% of graphene nanosheets to obtain mixed powder II; and S2, the mixed powder I and the mixed powder II are added into a mold layer by layer, three layers of mixed powder with the surface layer being the mixed powder II layer and the core layer being the mixed powder I layer are obtained, spark plasma sintering is carried out, and the gradient multi-layer nano Ti (C, N)-based metal ceramic is obtained. According to the Ti (C, N)-based metal ceramic and the preparation method thereof, different molybdenum carbide mass proportions of the surface layer and the core layer are controlled, a hard phase enrichment area is formed on the surface layer, a binding phase enrichment area is formed on the inner core part, the Vickers hardness can be improved through hard phase enrichment, the fracture toughness can be improved through binding phase enrichment, and therefore the Ti (C, N)-based metal ceramic with the hardness and the fracture toughness is obtained.

The disclosed technology generally relates to forming a titanium nitride-based thin films, and more particularly to a conformal and smooth titanium nitride-based thin films and methods of forming the same. In one aspect, a method comprises forming a diffusion barrier comprising TiSiN having a modulus exceeding 290 GPa and a Si content exceeding 2.7 atomic % by exposing a semiconductor substrate to one or more first deposition phases alternating with one or more second deposition phases. Exposing the semiconductor substrate to the one or more first deposition phases comprises alternatingly exposing the semiconductor substrate to a titanium (Ti) precursor and a nitrogen (N) precursor. Exposing the semiconductor substrate to the one or more second deposition phases comprises sequentially exposing the semiconductor substrate to the Ti precursor, followed by a silicon (Si) precursor, followed by the N precursor.

The application discloses a high-temperature-resistant and high-barrier composite film and a preparation method thereof, and relates to the technical field of layered products, which comprises A, B and C layers in sequence; the A layer comprises a temperature-resistant layer, a substrate layer and a barrier layer in sequence; the B layer comprises a substrate layer, a connecting layer, a barrier layer, an aluminum plating layer and a protective layer in sequence; the C layer is a heat-sealing layer; the preparation raw materials of the temperature-resistant layer material comprise aluminum oxide and titanium nitride; the preparation raw materials of the barrier layer material comprise ethylene-vinyl alcohol copolymer, succinamic acid, furoinic acid and carbon nanotubes; and the preparation raw materials of the heat-sealing layer material comprise titanium carbide, high-density polyethylene, metallocene polyethylene and zinc stearate. The high-temperature-resistant and high-barrier composite film provided by the application has excellent high-temperature resistance and barrier properties.

The invention belongs to the technical field of conductive ceramics, and discloses a silicon nitride conductive ceramic material and a preparation method thereof.The method comprises the steps that a yttrium oxide, aluminum oxide and magnesium oxide ternary composite system is arranged, rare earth elements are doped, and a sintering aid is formed; a resistance adjusting agent is composed of a titanium nitride-titanium dioxide core-shell structure and silicon carbide fibers, and the silicon carbide fibers are directionally distributed and arranged in a magnetic field, so that efficient composition of the silicon nitride conductive ceramic material is achieved, and the effects of high bending resistance, high conductivity and low sintering temperature are achieved; forming the slurry; performing spark plasma sintering; conducting network directional regulation and control; the preparation method comprises the steps of raw material mixing and ball milling, post-treatment and performance optimization, a convenient preparation process can be formed, too many tedious steps are not needed, a ball mill used in raw material mixing and ball milling is further provided with a pre-grinding device for pre-grinding the materials, the subsequent ball milling quality is enhanced, and the situation that the materials are not completely ground is avoided.

The invention discloses high-toughness and high-thermal-conductivity aluminum nitride ceramic and a production process, and relates to the related field of aluminum nitride ceramic. Hexagonal boron nitride and Ti3SiC2 composite particles with the surfaces coated with titanium nitride are introduced into aluminum nitride ceramic, a cerium oxide sintering aid and a reasonable organic adding system are supplemented, synergistic improvement of thermal conductivity and toughness is achieved, Ti3SiC2 is subjected to TiN nanometer coating, interface stability and oxidation resistance are enhanced, combination of Ti3SiC2 and a matrix is improved, and the thermal conductivity and toughness of the aluminum nitride ceramic are improved. The fracture toughness and the mechanical strength of the ceramic are obviously improved; meanwhile, aluminum nitride and hexagonal boron nitride construct an efficient thermal conductivity network, so that the material keeps excellent thermal conductivity, the overall scheme is reasonable in structural design and scientific in component matching, and the obtained ceramic is high in density, high in thermal conductivity, excellent in mechanical property and high in thermal shock resistance.