The invention relates to the technical field of
semiconductor packaging and micromachining, in particular to a defect-free
electroplating filling method and
system for a high-aspect-ratio glass through hole. The method comprises the following steps: preparing an ultrathin and compact
copper seed composite layer with
strong binding force on the inner wall of a glass through hole by adopting an
atomic layer deposition (ALD) technology; preparing an
electroplating solution containing a specific additive
system; and implementing a segmented
pulse electroplating strategy, and realizing defect-free
copper filling from the bottom to the top of the through hole by regulating and controlling the
current density, the pulse width and the intermittent time in stages and combining a reverse pulse technology. The
system integrates ALD deposition,
pulse electroplating and an
electroplating liquid circulation system, and high precision and high yield in the filling process are ensured. The method effectively solves the problems of insufficient seed layer coverage, limited
mass transfer, cavity / suture defects and the like in the filling of the glass through hole with the high depth-
diameter ratio (greater than or equal to 20: 1), and is suitable for advanced packaging and manufacturing of large-size glass substrates (such as 510mm * 515mm).