381 results about "Electroless plating" patented technology

The invention discloses a multi-layer plating process for optimizing surface characteristics of a base material, which is characterized by comprising the following steps of: pretreating the surface of a plated base material, improving the surface smoothness of the base material, and removing dirt on the surface of the base material; electroplating the base material by using the nickel pre-plating solution; chemical plating: the base material subjected to pre-plating treatment is placed in a chemical composite plating solution for chemical plating; the chemical composite plating solution comprises a basic plating solution and second-phase particles, the second-phase particles are nano niobium carbide, and the second-phase particles are wrapped and embedded into an alloy plating layer in the chemical plating process, so that the second-phase particles are distributed in plating layer matrix metal in a discrete mode to form a discontinuous phase. The hard particles niobium carbide are added and are dispersed and distributed in a coating substrate (Ni-P alloy), the hard particles can effectively refine the substrate metal, so that the hardness of the substrate metal is improved, and the niobium carbide hard phase particles are high in hardness, excellent in wear resistance, large in yield limit and high in pressure resistance.

The invention relates to the technical field of glass through hole machining, and discloses chemical plating equipment for TGV machining and a chemical plating method.The chemical plating equipment comprises a plating tank, a driving component, a hook, a hanging basket, a heating component, a plating solution circulating component, an air injection component, a vibration component and a control component, and the plating tank is provided with a containing cavity with an opening in the top; the driving part is arranged above the plating tank; one end of the hook is connected with the driving part, and the other end extends towards the accommodating cavity; the hanging basket is hung on the hook, at least part of the hanging basket extends into the containing cavity, and the hanging basket is used for containing a to-be-processed glass substrate; the heating part is arranged around the accommodating cavity; the plating solution circulating component is provided with a solution outlet and a solution inlet, and the solution outlet and the solution inlet are both communicated with the containing cavity; the air injection component is inserted into the accommodating cavity; the vibration component is arranged on the plating tank; and the control component is electrically connected with the driving component, the heating component, the plating solution circulating component, the air injection component and the vibration component. During processing, the glass substrate is in full contact with a plating solution, so that the uniformity of a plating layer can be improved, and skip plating is reduced.

The invention relates to a preparation method of silver-coated copper powder for the electronic industry, in particular to a preparation method of silver-coated copper powder for low-temperature slurry, which comprises the following steps: (1) alkali washing; (2) pickling; (3) organic modification; and (4) chemical silver plating is conducted, filtering, cleaning and drying are conducted after chemical silver plating is completed, and the silver-plated copper powder is obtained. Copper powder replacement is inhibited through surface organic modification, so that the copper powder does not participate in the reaction or does not participate in the reaction slightly, on one hand, copper powder raw material waste caused by the replacement reaction can be reduced, and on the other hand, batch instability caused by the morphology and specific surface area difference of the copper powder can be reduced. The silver-coated copper powder prepared by the method has excellent conductivity, high temperature resistance and silver-copper interlayer binding force, and can meet shearing acting forces such as high temperature and extrusion in the preparation and use process of low-temperature slurry.

The invention discloses a preparation method and application of a composite metal foil. The method comprises the following steps: preparing a high polymer material into a continuous film; carrying out surface pretreatment on the continuous film; carrying out chemical plating on the pretreated film to form a metal conductive layer; and after the metal conductive layer is formed, electrochemically depositing a metal layer to obtain the composite metal foil. According to the composite metal foil prepared according to the technical scheme, the plating layer is high in binding force, more uniform and high in conductivity; the preparation method is simple to operate, short in technological process, low in production cost and high in production efficiency.

Proposed is a method for forming an electroless plating electrode through selective cross-linking layer formation using a laser, specifically, the method includes forming a selective cross-linking layer by sintering a water-soluble polymer thin film layer, which is formed on a substrate by coating, to form a patterned shape thereon using a laser, followed by forming a precise metal pattern by electroless-plating the selective cross-linking layer with copper, nickel, or other metals. The method offers a simple manufacturing process, cost efficiency, and flexibility in manufacturing without being limited by the shape of a substrate, thereby patterns may be formed on various substrates. A catalyst material for electroless plating is mixed with a polymer material to directly cross-link the substrate. Thus, durability is improved but also an electrode may be formed with a substrate by electroless plating simply and in a short time due to use of only a single material.

The present invention provides a method for preparing silver-coated copper powder, which relates to the technical field of metal powder preparation. This preparation method directly prepares a copper core by chemical reduction method, then uses electroless plating method to grow a silver layer on its surface, and finally uses jet milling to improve the density of the powder. In the present invention, reducing agents with different reduction effects are added twice to reduce copper sulfate, which reduces the initial reaction rate, makes the whole reaction stable, and improves the sphericity of copper crystal nuclei. At the same time, sulfate radicals in the reaction system can form silver sulfate precipitation with silver ions in the subsequent reaction, further slowing down the reduction rate of silver ammonia complex ions and enabling the dense growth of the silver layer. At the same time, the unreacted completely glucose remaining in the reaction system can continue to reduce silver ammonia complex ions when silver ammonia solution is added dropwise later. By strictly controlling the growth rate of silver powder from crystal seeds to particles, the present invention reduces the structural defects caused by rapid growth and improves the performance of the final product.

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

An electrolytic capacitor includes a capacitor element that includes an anode part and a cathode part, an exterior body that seals the capacitor element, a first external electrode that is electrically connected to the anode part, and a second external electrode that is electrically connected to the cathode part. At least one of an end face of the anode part or an end face of the cathode part is exposed from the exterior body to be electrically connected to a corresponding one of the first external electrode or the second external electrode. The end face exposed from the exterior body is covered with an electroless Ni plating layer, and the electroless Ni plating layer is covered with an electroless Ag plating layer. The electroless Ag plating layer is covered with the corresponding one of the first external electrode or the second external electrode.

The invention discloses a graphene reinforced Al-Cu composite material and a preparation method and application thereof, and belongs to the technical field of metal matrix composite materials and preparation thereof. The problems that in an existing graphene reinforced aluminum matrix composite, graphene is poor in dispersity in an aluminum matrix, and harmful interface reaction is serious at the high temperature are solved. According to the preparation method, the surface of aluminum powder is plated with nano-copper particles through chemical plating, the potential of the aluminum powder in a water medium is regulated and controlled through a copper plating layer on the surface, the surface of the aluminum powder is provided with positive charges, graphene can be evenly dispersed in a matrix through electrostatic self-assembly, and meanwhile the surface copper plating layer is used for inhibiting interface reaction and hindering generation of a brittle phase. In addition, by adding the metal copper, the solid solution and second phase strengthening effects can be achieved, and the mechanical property of the composite material is further improved.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The utility model discloses a wafer carrier for chemical plating, and relates to the field of wafer equipment. The wafer carrier for chemical plating comprises a carrier main body which is provided with a plurality of supporting grooves capable of supporting wafers; the matching piece is arranged above the carrier main body and connected with the carrier main body, and the matching piece is configured to be connected through a transferring mechanism so as to flow in the plurality of plating tanks; and the coating structure covers the plurality of supporting grooves, and the coating structure is configured to be in direct contact with the wafer when the wafer is loaded to the carrier main body. The wafer carrier for chemical plating provided by the utility model can reduce the influence on the flowing mode of a chemical solution and improve the quality of chemical plating.

The invention relates to the technical field of wireless communication equipment manufacturing, in particular to a method for manufacturing an FPC flexible antenna through integrated injection molding and the antenna, and the method comprises the following steps: preparing a copper foil layer on the surface of a double-layer polyimide substrate flexible circuit, and chemically plating a nickel-gold layer on the surface of the copper foil layer; a receding groove is formed in a golden finger area of the FPC flexible circuit board, and a positioning hole is formed in the edge of the FPC flexible circuit board; a Teflon coating is sprayed on the inner wall of the mold cavity, and a positioning column is mounted in the mold cavity; the method comprises the following steps: firstly, fixing a preprocessed FPC flexible circuit board in a mold cavity through a positioning column; and injecting a thermoplastic high polymer material heated to a molten state into a mold cavity, applying a dwell pressure to the injected molten material, so that the FPC flexible circuit board is completely coated with the molten material, cooling, and demolding to obtain the FPC flexible antenna. According to the invention, seamless integration of the antenna and the shell can be realized, so that the coupling problem of line damage and impedance mismatch in a traditional injection molding antenna is solved.

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

The present invention relates to a method for electroless copper depositing onto a surface of a non-conductive or carbon-fibres containing substrate, the method comprising the steps: (I) activating the surface of a non-conductive or carbon-fibres containing substrate for electroless copper depositing, the activation method using an aqueous, palladium-free activation composition comprising (i) a first species of dissolved transition metal ions which are copper ions and additionally metal particles thereof which are copper particles, (ii) one or more than one complexing agent, and (iii) permanently or temporarily one or more than one reducing agent, and (II) an enhancer treatment of the activated surface of a non-conductive or carbon-fibres containing substrate, the enhancer treatment method using an alkaline aqueous enhancer composition comprising water and a formaldehyde compound; and (III) an electroless copper depositing of the enhanced surface of a non-conductive or carbon-fibres containing substrate, the electroless copper depositing method using an electroless copper metallizing solution and substrates, and method for subsequent metallization.

The invention provides a copper-containing plating solution and a method for plating copper on the surface of graphene, and belongs to the technical field of chemical plating. The copper-containing plating solution provided by the invention comprises copper sulfate pentahydrate, hypophosphite, glyoxylic acid, ethylenediamine tetraacetic acid tetrasodium salt, sodium citrate and deionized water. The glyoxylic acid in the copper-containing plating solution can quickly provide electrons in the initial reaction stage, so that copper ions are quickly nucleated; hypophosphite can continuously reduce copper ions in the plating solution into copper atoms, and continuous growth of a copper layer is achieved; tetrasodium ethylene diamine tetraacetate and copper ions can form a complex with high stability, and the copper ions are slowly released; sodium citrate is used as an auxiliary complexing agent, so that the discharge potential can be adjusted, and the deposition process of copper ions is further optimized, so that compact coating of a to-be-plated copper matrix is realized, and the copper plating effect is effectively improved. Results of the embodiment show that the copper-containing plating solution provided by the invention can form a compactly coated copper layer on the surface of graphene.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

To provide a method for producing a resin-plated material by which the adhesive strength between a base material and a plating layer can be made higher than that in the conventional method without substantially forming ruggedness on the surface of the base material.SOLUTION: The method includes a step (a) of preparing a base material made of an insulating resin material, a step (b) of irradiating a surface of the base material with ultraviolet rays in an atmosphere containing oxygen to modify a region from the surface of the base material to a predetermined depth into a microporous layer including pores having a size of nm order in the base material, and a step (c) of performing a plasma treatment on the base material to remove a part of the microporous layer. The method includes a step (d) of imparting a hydrophilic functional group to the surface of a base material, a step (e) of supporting a catalyst on the base material after the step (d), and a step (f) of forming an electroless plating layer on the surface of the base material via the catalyst after the step (e).SELECTED DRAWING: Figure 7

This system automatically applies electroless plating to individual raw chain links used in a chain connection, without causing discoloration to the connected plated chain. [Solution] A partial chain plating apparatus 10 is provided, comprising a polishing machine 14 for barrel polishing the raw chain links 3 to be plated, a plating tank 16 for electroless plating, a water washing tank 18 for cleaning, and an oil tank 22 for baking, all arranged side by side, the apparatus further comprising a holder 24 for holding the chain in a hanging position after folding it in half so that the raw chain links are at the lowest end, a traverse device 26 for moving the holder horizontally, a lifting device 28 for changing the height of the holder, a fan 32 for blowing air toward the chain hanging from the holder, and a control device for controlling the operation of at least the traverse device and the lifting device.

A method of selectively metallizing a multi-component molded plastic part. The multi-component molded plastic part comprises at least one first region to be metallized formed of a first plastic and at least one second region that is not to be metallized formed of a second plastic. The method includes the steps of (a) contacting the multi-component molded plastic part with a chromic acid-free etchant, wherein the chromic acid-free etchant comprises manganese sulfate; (b) optionally, neutralizing the manganese sulfate to Mn2+ ions; (c) activating surfaces of the plastic part with an activator; (d) contacting the activated surfaces of the plastic part with an accelerator; and (e) depositing an electroless plating layer on the surfaces of the multi-component molded plastic part with an electroless plating electrolyte comprising nickel and copper to form an electroless copper-nickel layer on substantially only the first region formed of the first plastic.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The invention provides a lithium primary battery negative electrode with deep sea pressure bearing capacity and a preparation method thereof, and belongs to the technical field of deep sea lithium primary battery manufacturing, the lithium primary battery negative electrode comprises a negative electrode current collector, a lithium layer is arranged on the surface of the negative electrode current collector through electrochemical plating lithium, the surface of the lithium layer is coated with an SEI film layer, and an electroplating electrolyte of electrochemical plating lithium comprises a lithium salt and a solvent, the lithium salt comprises LiPF6, and the solvent comprises DMC. According to the present invention, with the electrochemical lithium plating method, the compact metal lithium layer can be deposited on the surface of the negative electrode current collector, and the metal lithium layer prepared through the method can maintain the close connection with the negative electrode current collector in the 0-127 MPa hydrostatic pressure environment, and can maintain the pressure resistance stability between the metal lithium layer and the SEI film in the pressure environment.

The present invention relates to a composite hydrogen filtration membrane with an amorphous nickel-tungsten alloy as an intermediate diffusion layer and a preparation method thereof. The composite hydrogen filtration membrane is composed of a porous alumina ceramic support, an amorphous nickel-tungsten layer, and a pure palladium layer. First, the porous ceramic support is pretreated, and its surface is sensitized and activated by a dilute hydrochloric acid solution of SnCl2 and PdCl2, and then a layer of pure palladium is plated by electroless plating. Then, an amorphous nickel-tungsten layer is obtained by electroplating, and finally, a pure palladium layer is electrolessly plated on the surface. The pure palladium layer provides the dissociation and desorption of hydrogen. On the one hand, the amorphous nickel-tungsten layer provides better strength and ductility, ensuring the long-term stable operation of the composite membrane. On the other hand, it replaces part of the palladium material with a material of lower price, reducing the manufacturing cost of the composite hydrogen filtration membrane. Since the tungsten element with a lower hydrogen retention amount is used as an alloying element and has a unique amorphous structure, the amorphous nickel-tungsten alloy layer prepared by the present invention is not prone to hydrogen embrittlement caused by the accumulation of hydrogen atoms during the diffusion process of hydrogen atoms.

The application belongs to the technical field of electroplating wastewater treatment, and particularly relates to a method and device for treating electroplating wastewater by electrolysis-oxidation coordination. The electroplating wastewater is adjusted and matched to obtain pretreated wastewater, and the electroplating wastewater contains heavy metal elements; the pretreated wastewater is separated by a charged nanofiltration membrane to obtain complex heavy metal wastewater and ionic heavy metal wastewater; the complex heavy metal wastewater is treated by ozone oxidation to obtain oxidized wastewater, and the oxidized wastewater is treated by first diaphragm electrolysis to recover heavy metals; and the ionic heavy metal wastewater is treated by second diaphragm electrolysis to recover heavy metals. The application realizes efficient separation and resource recovery of copper and nickel in the electroplating wastewater, and combines electroplating wastewater treatment and resource recovery, thus having a wide application prospect.

The problem of unevenness in the laminated film of a tin oxide film and a catalyst layer used in the pretreatment of electroless plating is that it is easy to produce unevenness. According to a method for forming a tin oxide laminated film with a catalyst layer, a uniform catalyst layer can be formed. The method comprises the following steps: preparing a concentrated solution containing a tin compound dissolved in a polar solvent; diluting the concentrated solution with the polar solvent and a fluoride solution to prepare a reaction solution that is a stable divalent tin solution; immersing a treatment object in the reaction solution to form a tin oxide layer on the surface of the treatment object; and immersing the treatment object with the tin oxide layer formed on the surface in a catalyst solution containing catalyst metal ions to form a catalyst layer on the tin oxide layer.

To provide a copper clad laminate and a method for manufacturing the same that enables high adhesion between low-dielectric resin film and copper plating layer and good volume resistivity while suppressing transmission loss when applied to flexible circuit boards.SOLUTION: A copper clad laminate according to the present invention includes: a low dielectric resin film with a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz; and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film, the weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and the adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.SELECTED DRAWING: Figure 1

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

To provide a photosensitive dry film, to provide a composition solution which generates the same, and to provide an electroless plating method of a kind of metal layer.SOLUTION: A photosensitive dry film includes a composition for catalyst formation and a photocatalyst 102. The composition for catalyst formation includes a metal complex and a water-soluble polymer 106. The photocatalyst is dispersed in the composition for catalyst formation, and the photocatalyst is deposition of a photocatalyst precursor. In the photosensitive dry film, a composition solution is dried, exposed and developed and the photocatalyst is deposited first, and then, the photocatalyst is induced to generate an electron-hole, and on the surface of the photocatalyst, metal particles 104 are reduced and generated. With the metal particles being a catalyst, electroless plating is performed and a metal layer can be formed.SELECTED DRAWING: Figure 1

The application discloses a glass powder for silver paste and a preparation method thereof, and comprises glass powder A, glass powder B and a modified coupling agent; the glass powder A comprises oxide powder; the glass powder B is prepared by electroless silver plating on the surface of the glass powder A; and the modified coupling agent has the structure shown in formula I. The glass powder for silver paste is prepared by the following steps: (1) uniformly mixing the glass powder A, the modified coupling agent and deionized water, filtering, washing, drying and reserving; (2) uniformly mixing the glass powder B, the modified coupling agent and deionized water, filtering, washing, drying and reserving; and (3) mixing the products of the steps (1) and (2) and crushing, so that the particle size is D50=200-500 nm, thereby obtaining the glass powder for silver paste. The glass powder for silver paste has excellent dispersibility, can enhance the printing performance of the silver paste and can significantly improve the photoelectric conversion efficiency of a battery.

This invention relates to the field of semiconductor wafer electroless plating process tank technology, specifically a shaking mechanism for a semiconductor wafer electroless plating process tank. The mechanism includes a wafer electroless plating tank with a working cavity at its lower end and a guide rod fixedly installed at the upper end of the working cavity. The working cavity contains a wafer basket-type positioning assembly and a wafer plating assembly. By combining the basket unit with the positioning unit, the wafer is reinforced and mounted. The shaking unit enables the basket unit to reciprocate horizontally, achieving uniform contact between the wafer and the plating solution. Furthermore, the shaking unit, in conjunction with the curved positioning plate, ensures stable horizontal movement of the basket unit while allowing for small-amplitude longitudinal shaking during the horizontal reciprocating movement of the wafer, enhancing the shaking effect of the wafer plating. It also assists in cleaning crystals formed at the bottom of the basket unit, achieving a multi-functional design.

The application discloses a foamed copper low-temperature methanol water vapor reforming hydrogen catalyst and a preparation method thereof, and belongs to the technical field.The technical scheme is as follows: including pretreatment, chemical plating reaction, impregnation, pre-copper plating, copper electroplating, calcination, hydrothermal reaction and high-temperature treatment.The foamed copper catalyst prepared by the application has the advantages of more uniform dispersion of active components, higher porosity and better stability;Al does not need to be added, and the active component is the carrier;and the preparation process is simple, convenient to operate, low in cost and obvious in industrial application value.