251 results about "Electroless plating" patented technology

An electrolytic capacitor includes a capacitor element that includes an anode part and a cathode part, an exterior body that seals the capacitor element, a first external electrode that is electrically connected to the anode part, and a second external electrode that is electrically connected to the cathode part. At least one of an end face of the anode part or an end face of the cathode part is exposed from the exterior body to be electrically connected to a corresponding one of the first external electrode or the second external electrode. The end face exposed from the exterior body is covered with an electroless Ni plating layer, and the electroless Ni plating layer is covered with an electroless Ag plating layer. The electroless Ag plating layer is covered with the corresponding one of the first external electrode or the second external electrode.

The utility model discloses a wafer carrier for chemical plating, and relates to the field of wafer equipment. The wafer carrier for chemical plating comprises a carrier main body which is provided with a plurality of supporting grooves capable of supporting wafers; the matching piece is arranged above the carrier main body and connected with the carrier main body, and the matching piece is configured to be connected through a transferring mechanism so as to flow in the plurality of plating tanks; and the coating structure covers the plurality of supporting grooves, and the coating structure is configured to be in direct contact with the wafer when the wafer is loaded to the carrier main body. The wafer carrier for chemical plating provided by the utility model can reduce the influence on the flowing mode of a chemical solution and improve the quality of chemical plating.

The invention relates to the technical field of wireless communication equipment manufacturing, in particular to a method for manufacturing an FPC flexible antenna through integrated injection molding and the antenna, and the method comprises the following steps: preparing a copper foil layer on the surface of a double-layer polyimide substrate flexible circuit, and chemically plating a nickel-gold layer on the surface of the copper foil layer; a receding groove is formed in a golden finger area of the FPC flexible circuit board, and a positioning hole is formed in the edge of the FPC flexible circuit board; a Teflon coating is sprayed on the inner wall of the mold cavity, and a positioning column is mounted in the mold cavity; the method comprises the following steps: firstly, fixing a preprocessed FPC flexible circuit board in a mold cavity through a positioning column; and injecting a thermoplastic high polymer material heated to a molten state into a mold cavity, applying a dwell pressure to the injected molten material, so that the FPC flexible circuit board is completely coated with the molten material, cooling, and demolding to obtain the FPC flexible antenna. According to the invention, seamless integration of the antenna and the shell can be realized, so that the coupling problem of line damage and impedance mismatch in a traditional injection molding antenna is solved.

The present invention relates to a method for electroless copper depositing onto a surface of a non-conductive or carbon-fibres containing substrate, the method comprising the steps: (I) activating the surface of a non-conductive or carbon-fibres containing substrate for electroless copper depositing, the activation method using an aqueous, palladium-free activation composition comprising (i) a first species of dissolved transition metal ions which are copper ions and additionally metal particles thereof which are copper particles, (ii) one or more than one complexing agent, and (iii) permanently or temporarily one or more than one reducing agent, and (II) an enhancer treatment of the activated surface of a non-conductive or carbon-fibres containing substrate, the enhancer treatment method using an alkaline aqueous enhancer composition comprising water and a formaldehyde compound; and (III) an electroless copper depositing of the enhanced surface of a non-conductive or carbon-fibres containing substrate, the electroless copper depositing method using an electroless copper metallizing solution and substrates, and method for subsequent metallization.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

To provide a method for producing a resin-plated material by which the adhesive strength between a base material and a plating layer can be made higher than that in the conventional method without substantially forming ruggedness on the surface of the base material.SOLUTION: The method includes a step (a) of preparing a base material made of an insulating resin material, a step (b) of irradiating a surface of the base material with ultraviolet rays in an atmosphere containing oxygen to modify a region from the surface of the base material to a predetermined depth into a microporous layer including pores having a size of nm order in the base material, and a step (c) of performing a plasma treatment on the base material to remove a part of the microporous layer. The method includes a step (d) of imparting a hydrophilic functional group to the surface of a base material, a step (e) of supporting a catalyst on the base material after the step (d), and a step (f) of forming an electroless plating layer on the surface of the base material via the catalyst after the step (e).SELECTED DRAWING: Figure 7

This system automatically applies electroless plating to individual raw chain links used in a chain connection, without causing discoloration to the connected plated chain. [Solution] A partial chain plating apparatus 10 is provided, comprising a polishing machine 14 for barrel polishing the raw chain links 3 to be plated, a plating tank 16 for electroless plating, a water washing tank 18 for cleaning, and an oil tank 22 for baking, all arranged side by side, the apparatus further comprising a holder 24 for holding the chain in a hanging position after folding it in half so that the raw chain links are at the lowest end, a traverse device 26 for moving the holder horizontally, a lifting device 28 for changing the height of the holder, a fan 32 for blowing air toward the chain hanging from the holder, and a control device for controlling the operation of at least the traverse device and the lifting device.

A method of selectively metallizing a multi-component molded plastic part. The multi-component molded plastic part comprises at least one first region to be metallized formed of a first plastic and at least one second region that is not to be metallized formed of a second plastic. The method includes the steps of (a) contacting the multi-component molded plastic part with a chromic acid-free etchant, wherein the chromic acid-free etchant comprises manganese sulfate; (b) optionally, neutralizing the manganese sulfate to Mn2+ ions; (c) activating surfaces of the plastic part with an activator; (d) contacting the activated surfaces of the plastic part with an accelerator; and (e) depositing an electroless plating layer on the surfaces of the multi-component molded plastic part with an electroless plating electrolyte comprising nickel and copper to form an electroless copper-nickel layer on substantially only the first region formed of the first plastic.

The invention provides a lithium primary battery negative electrode with deep sea pressure bearing capacity and a preparation method thereof, and belongs to the technical field of deep sea lithium primary battery manufacturing, the lithium primary battery negative electrode comprises a negative electrode current collector, a lithium layer is arranged on the surface of the negative electrode current collector through electrochemical plating lithium, the surface of the lithium layer is coated with an SEI film layer, and an electroplating electrolyte of electrochemical plating lithium comprises a lithium salt and a solvent, the lithium salt comprises LiPF6, and the solvent comprises DMC. According to the present invention, with the electrochemical lithium plating method, the compact metal lithium layer can be deposited on the surface of the negative electrode current collector, and the metal lithium layer prepared through the method can maintain the close connection with the negative electrode current collector in the 0-127 MPa hydrostatic pressure environment, and can maintain the pressure resistance stability between the metal lithium layer and the SEI film in the pressure environment.

The application belongs to the technical field of electroplating wastewater treatment, and particularly relates to a method and device for treating electroplating wastewater by electrolysis-oxidation coordination. The electroplating wastewater is adjusted and matched to obtain pretreated wastewater, and the electroplating wastewater contains heavy metal elements; the pretreated wastewater is separated by a charged nanofiltration membrane to obtain complex heavy metal wastewater and ionic heavy metal wastewater; the complex heavy metal wastewater is treated by ozone oxidation to obtain oxidized wastewater, and the oxidized wastewater is treated by first diaphragm electrolysis to recover heavy metals; and the ionic heavy metal wastewater is treated by second diaphragm electrolysis to recover heavy metals. The application realizes efficient separation and resource recovery of copper and nickel in the electroplating wastewater, and combines electroplating wastewater treatment and resource recovery, thus having a wide application prospect.

To provide a copper clad laminate and a method for manufacturing the same that enables high adhesion between low-dielectric resin film and copper plating layer and good volume resistivity while suppressing transmission loss when applied to flexible circuit boards.SOLUTION: A copper clad laminate according to the present invention includes: a low dielectric resin film with a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz; and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film, the weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and the adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.SELECTED DRAWING: Figure 1

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

To provide a photosensitive dry film, to provide a composition solution which generates the same, and to provide an electroless plating method of a kind of metal layer.SOLUTION: A photosensitive dry film includes a composition for catalyst formation and a photocatalyst 102. The composition for catalyst formation includes a metal complex and a water-soluble polymer 106. The photocatalyst is dispersed in the composition for catalyst formation, and the photocatalyst is deposition of a photocatalyst precursor. In the photosensitive dry film, a composition solution is dried, exposed and developed and the photocatalyst is deposited first, and then, the photocatalyst is induced to generate an electron-hole, and on the surface of the photocatalyst, metal particles 104 are reduced and generated. With the metal particles being a catalyst, electroless plating is performed and a metal layer can be formed.SELECTED DRAWING: Figure 1

The application discloses a glass powder for silver paste and a preparation method thereof, and comprises glass powder A, glass powder B and a modified coupling agent; the glass powder A comprises oxide powder; the glass powder B is prepared by electroless silver plating on the surface of the glass powder A; and the modified coupling agent has the structure shown in formula I. The glass powder for silver paste is prepared by the following steps: (1) uniformly mixing the glass powder A, the modified coupling agent and deionized water, filtering, washing, drying and reserving; (2) uniformly mixing the glass powder B, the modified coupling agent and deionized water, filtering, washing, drying and reserving; and (3) mixing the products of the steps (1) and (2) and crushing, so that the particle size is D50=200-500 nm, thereby obtaining the glass powder for silver paste. The glass powder for silver paste has excellent dispersibility, can enhance the printing performance of the silver paste and can significantly improve the photoelectric conversion efficiency of a battery.

This invention relates to the field of semiconductor wafer electroless plating process tank technology, specifically a shaking mechanism for a semiconductor wafer electroless plating process tank. The mechanism includes a wafer electroless plating tank with a working cavity at its lower end and a guide rod fixedly installed at the upper end of the working cavity. The working cavity contains a wafer basket-type positioning assembly and a wafer plating assembly. By combining the basket unit with the positioning unit, the wafer is reinforced and mounted. The shaking unit enables the basket unit to reciprocate horizontally, achieving uniform contact between the wafer and the plating solution. Furthermore, the shaking unit, in conjunction with the curved positioning plate, ensures stable horizontal movement of the basket unit while allowing for small-amplitude longitudinal shaking during the horizontal reciprocating movement of the wafer, enhancing the shaking effect of the wafer plating. It also assists in cleaning crystals formed at the bottom of the basket unit, achieving a multi-functional design.

The application discloses a foamed copper low-temperature methanol water vapor reforming hydrogen catalyst and a preparation method thereof, and belongs to the technical field.The technical scheme is as follows: including pretreatment, chemical plating reaction, impregnation, pre-copper plating, copper electroplating, calcination, hydrothermal reaction and high-temperature treatment.The foamed copper catalyst prepared by the application has the advantages of more uniform dispersion of active components, higher porosity and better stability;Al does not need to be added, and the active component is the carrier;and the preparation process is simple, convenient to operate, low in cost and obvious in industrial application value.

To provide a pretreatment cleaning agent for electroless plating and a method for forming electroless plating using the same that eliminate the need of surface roughening to a substrate with a strong acid such as a chromic acid or permanganic acid, can perform cleaning of the surface of a substrate and coupling treatment at the same time, and can form metal plating having a flat contact surface to a substrate.SOLUTION: A pretreatment cleaning agent for electroless plating includes an inorganic alkali, a cleaning agent including a surfactant, and a silane coupling agent and can perform cleaning of the surface of a substrate and coupling treatment at the same time.SELECTED DRAWING: Figure 1

This invention discloses a chemical plating batch clamping fixture based on structural constraint and its application method, belonging to the field of fixture technology. The fixture includes at least one clamping unit, comprising an upper frame, a lower frame, and isolation columns connecting the upper and lower frames. After assembly via the isolation columns, the upper and lower frames have corresponding hollow structures. The contour of the hollow structures matches the planar projection contour of the workpiece. A sandwich structure exists between the upper and lower frames. Longitudinal and transverse protrusions are provided around the hollow structures to constrain the parts within the hollow structure area. Based on the principle of physical interference, the fixture is highly effective in preventing the flipping of lightweight, small parts, eliminating damage to the parts, and is particularly suitable for precision parts.

Circuit board chemical copper plating equipment with ultrasonic oscillation comprises an electroplating bath, an ultrasonic oscillation device and a processing device, the ultrasonic oscillation device and the processing device are arranged in the electroplating bath, mounting seats are arranged on two opposite side surfaces of the electroplating bath, a connecting rod is arranged between the two mounting seats, and the ultrasonic oscillation device is arranged on the connecting rod and moves along the connecting rod; the ultrasonic vibration device comprises an ultrasonic vibration rod, and the outer surface of the ultrasonic vibration rod is provided with a convex ring and a groove; an ultrasonic transducer is arranged on the bottom surface of the external treatment device, a flow guide part is arranged at the top of the external treatment device, the flow guide part is gradually reduced from bottom to top, an exhaust port is formed in the top of the flow guide part, a vacuum pump is arranged on the outer side of the exhaust port, an air outlet hole is formed in the upper portion of the outer side of the vacuum pump, and a backflow pipe is arranged on the side face of the vacuum pump; and the bottom end of the return pipe is connected to the treatment tank. Through the arrangement of the movable ultrasonic vibration device and the processing device, the electroplating quality is improved, the practicability is high, and the electroplating device has high popularization significance.

The present invention is characterized by comprising: a base metal layer formation step (S01) for forming a base metal layer (11) composed of a metal that is less noble than Cu; and a nanoporous Cu layer formation step (S02) for forming a nanoporous Cu layer (12) by subjecting the base metal layer (11) to electroless plating using an electroless copper-plating solution.

The invention discloses a water electroplating process for a PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) material thin decorative part. The water electroplating process comprises the following treatment steps: pretreatment; activating treatment: after the surface of the thin decorative part made of the PC / ABS material is roughened, the rough surface of the thin decorative part made of the PC / ABS material is activated, so that the rough surface of the thin decorative part made of the PC / ABS material can accept deposition of plating metal; chemical plating treatment: carrying out chemical nickel plating treatment on the to-be-plated surface of the PC / ABS material thin decorative part; electroplating treatment: carrying out copper plating treatment, nickel plating treatment and chromium plating treatment on the chemical nickel surface of the PC / ABS material thin decorative part; wherein the thickness range of the plated copper is 24-28 [mu] m, the thickness range of the plated nickel is 1-3 [mu] m, and the thickness range of the plated chromium is 0.01-0.04 [mu] m; and post-treatment: carrying out cleaning treatment and drying treatment on the electroplated PC / ABS material thin decorative part to obtain the PC / ABS material thin decorative part. By means of the water electroplating process, the problem that the strength of the PC / ABS material decorating part is poor after water electroplating can be solved.

The subject matter disclosed herein relates to a composition (PC) suitable for electroless platinum plating, a process for plating a platinum coating onto a substrate based on the use of the composition (PC), an apparatus suitable for performing the process, and a platinum-plated article formed therefrom.

The invention relates to the technical field of printed circuit boards, and discloses a process method for optimizing a copper lattice to improve the binding force of a plating layer, which comprises the following steps of: glue residue removal treatment: carrying out glue residue removal treatment on a drilled printed circuit board to form a roughened structure on the surface of a hole wall; activating treatment: adsorbing palladium catalytic particles on the coarsened pore wall surface to form a uniformly distributed catalytic center; and chemical copper deposition: immersing the activated plate in a chemical copper solution, controlling the reaction temperature to be 41-45 DEG C, maintaining the concentration of copper ions, alkali and a reducing agent through automatic compensation and liquid mixing, and depositing on the hole wall to form an initial copper layer. The technological method for optimizing the copper lattice to improve the coating binding force aims at solving the problems that in high-density interconnection and high-speed and high-frequency printed circuit board manufacturing, due to the fact that a traditional chemical copper plating technology lacks dynamic regulation and control capacity, the coating binding force is insufficient, the lattice structure is loose, and uniformity is poor.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuit module die. In some embodiments, the SF may be electroless nickel plating and electroless palladium immersion gold (ENEPIG). In other embodiments, SF may be gold leaching electroless palladium leaching (IGEPIG). In other embodiments, the SF may include an electrolytic palladium gold layer on the indium layer or on the ferrocobalt layer.

A method of manufacturing a semiconductor package (100) is disclosed. In this method, for example, the surface of an insulating resin layer (20) on a substrate (10), i.e., a printed wiring board, is irradiated with oxygen plasma (plasma P) to perform surface treatment. The insulating resin layer (20) is formed from, for example, a solder resist containing an inorganic filler. The inorganic filler (22) deposited on the surface of the solder resist by irradiation of the plasma (P) is removed by ultrasonic cleaning. Then, a plating layer (30) is formed on the solder resist from which the inorganic filler (22) has been removed by electroless plating. According to this method, since the inorganic filler that affects the electroless plating is removed, the electroless plating can be reliably deposited on the surface of the solder resist.

This invention provides a method for preparing nickel-silver-tungsten composite electrical contact materials, the electrical contact materials themselves, and electrical contacts. The method involves chemically plating silver and nickel metal nanoparticles onto the surface of tungsten powder in a layered manner, resulting in tungsten powder with a tightly packed core-shell structure of silver-nickel bimetallic layers. Then, different mass fractions of the core-shell tungsten powder and silver powder are uniformly mixed using solution ball milling. Finally, the mixed powder is crystallized and solidified using electro-spark plasma sintering technology to obtain a series of nickel-silver-tungsten composite electrical contact materials. The nickel-silver-tungsten composite electrical contact materials provided by this invention exhibit good compressive strength, excellent ductility, and superior resistance to arc erosion.

According to this invention, disclosed is an electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr and Al, dispersed in the parent phase.

This application discloses a coating for electroless plating and its preparation method, belonging to the field of three-dimensional precision machining. The coating is applied to the surface of a substrate and, based on its mass percentage, comprises: 55%–85% crosslinking product of epoxy resin AB agent, 1%–5% nano-metal particles, and 10%–40% water-soluble polymer. Using the coating of this application for electroless plating involves fewer process steps and results in excellent adhesion between the metal circuitry and the substrate in the prepared three-dimensional interconnected molded device.

The utility model relates to the technical field of circuit boards, and discloses an improved ground wire chemical gold skip plating structure which comprises a fixed bottom plate, a chemical gold bonding pad is arranged on the inner wall of the fixed bottom plate, a fixed top plate is fixedly connected to the upper surface of the fixed bottom plate, and a second sliding plate is slidably connected to the outer wall of the fixed top plate. A second sliding plate is arranged in the fixed bottom plate, a limiting assembly is arranged in the second sliding plate and used for limiting the circuit board, a first sliding plate is slidably connected to the inner wall of the fixed bottom plate, and a fixing assembly is arranged on the outer wall of the first sliding plate and used for fixing the circuit board; the fixing assembly comprises a supporting base. According to the utility model, the ground wire area can be reduced, the occupied area is reduced, the contact resistance is reduced, a stable fixing structure is adopted, the gold plating and skip plating bonding pad can be connected with a circuit board more firmly, and the electrical performance, the mechanical stability and the overall reliability are greatly improved.

A catalyst solution for electroless plating is provided. The catalyst solution is printable and devoid of an amine. The catalyst solution comprises a catalytic metal salt, a solvent, and an epoxy.