140 results about "Electroless plating" patented technology

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

This system automatically applies electroless plating to individual raw chain links used in a chain connection, without causing discoloration to the connected plated chain. [Solution] A partial chain plating apparatus 10 is provided, comprising a polishing machine 14 for barrel polishing the raw chain links 3 to be plated, a plating tank 16 for electroless plating, a water washing tank 18 for cleaning, and an oil tank 22 for baking, all arranged side by side, the apparatus further comprising a holder 24 for holding the chain in a hanging position after folding it in half so that the raw chain links are at the lowest end, a traverse device 26 for moving the holder horizontally, a lifting device 28 for changing the height of the holder, a fan 32 for blowing air toward the chain hanging from the holder, and a control device for controlling the operation of at least the traverse device and the lifting device.

A method of selectively metallizing a multi-component molded plastic part. The multi-component molded plastic part comprises at least one first region to be metallized formed of a first plastic and at least one second region that is not to be metallized formed of a second plastic. The method includes the steps of (a) contacting the multi-component molded plastic part with a chromic acid-free etchant, wherein the chromic acid-free etchant comprises manganese sulfate; (b) optionally, neutralizing the manganese sulfate to Mn2+ ions; (c) activating surfaces of the plastic part with an activator; (d) contacting the activated surfaces of the plastic part with an accelerator; and (e) depositing an electroless plating layer on the surfaces of the multi-component molded plastic part with an electroless plating electrolyte comprising nickel and copper to form an electroless copper-nickel layer on substantially only the first region formed of the first plastic.

The invention provides a lithium primary battery negative electrode with deep sea pressure bearing capacity and a preparation method thereof, and belongs to the technical field of deep sea lithium primary battery manufacturing, the lithium primary battery negative electrode comprises a negative electrode current collector, a lithium layer is arranged on the surface of the negative electrode current collector through electrochemical plating lithium, the surface of the lithium layer is coated with an SEI film layer, and an electroplating electrolyte of electrochemical plating lithium comprises a lithium salt and a solvent, the lithium salt comprises LiPF6, and the solvent comprises DMC. According to the present invention, with the electrochemical lithium plating method, the compact metal lithium layer can be deposited on the surface of the negative electrode current collector, and the metal lithium layer prepared through the method can maintain the close connection with the negative electrode current collector in the 0-127 MPa hydrostatic pressure environment, and can maintain the pressure resistance stability between the metal lithium layer and the SEI film in the pressure environment.

The application belongs to the technical field of electroplating wastewater treatment, and particularly relates to a method and device for treating electroplating wastewater by electrolysis-oxidation coordination. The electroplating wastewater is adjusted and matched to obtain pretreated wastewater, and the electroplating wastewater contains heavy metal elements; the pretreated wastewater is separated by a charged nanofiltration membrane to obtain complex heavy metal wastewater and ionic heavy metal wastewater; the complex heavy metal wastewater is treated by ozone oxidation to obtain oxidized wastewater, and the oxidized wastewater is treated by first diaphragm electrolysis to recover heavy metals; and the ionic heavy metal wastewater is treated by second diaphragm electrolysis to recover heavy metals. The application realizes efficient separation and resource recovery of copper and nickel in the electroplating wastewater, and combines electroplating wastewater treatment and resource recovery, thus having a wide application prospect.

[Object]To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.[Solving Means]A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N / cm or more.

To provide a photosensitive dry film, to provide a composition solution which generates the same, and to provide an electroless plating method of a kind of metal layer.SOLUTION: A photosensitive dry film includes a composition for catalyst formation and a photocatalyst 102. The composition for catalyst formation includes a metal complex and a water-soluble polymer 106. The photocatalyst is dispersed in the composition for catalyst formation, and the photocatalyst is deposition of a photocatalyst precursor. In the photosensitive dry film, a composition solution is dried, exposed and developed and the photocatalyst is deposited first, and then, the photocatalyst is induced to generate an electron-hole, and on the surface of the photocatalyst, metal particles 104 are reduced and generated. With the metal particles being a catalyst, electroless plating is performed and a metal layer can be formed.SELECTED DRAWING: Figure 1

The application discloses a glass powder for silver paste and a preparation method thereof, and comprises glass powder A, glass powder B and a modified coupling agent; the glass powder A comprises oxide powder; the glass powder B is prepared by electroless silver plating on the surface of the glass powder A; and the modified coupling agent has the structure shown in formula I. The glass powder for silver paste is prepared by the following steps: (1) uniformly mixing the glass powder A, the modified coupling agent and deionized water, filtering, washing, drying and reserving; (2) uniformly mixing the glass powder B, the modified coupling agent and deionized water, filtering, washing, drying and reserving; and (3) mixing the products of the steps (1) and (2) and crushing, so that the particle size is D50=200-500 nm, thereby obtaining the glass powder for silver paste. The glass powder for silver paste has excellent dispersibility, can enhance the printing performance of the silver paste and can significantly improve the photoelectric conversion efficiency of a battery.

This invention relates to the field of semiconductor wafer electroless plating process tank technology, specifically a shaking mechanism for a semiconductor wafer electroless plating process tank. The mechanism includes a wafer electroless plating tank with a working cavity at its lower end and a guide rod fixedly installed at the upper end of the working cavity. The working cavity contains a wafer basket-type positioning assembly and a wafer plating assembly. By combining the basket unit with the positioning unit, the wafer is reinforced and mounted. The shaking unit enables the basket unit to reciprocate horizontally, achieving uniform contact between the wafer and the plating solution. Furthermore, the shaking unit, in conjunction with the curved positioning plate, ensures stable horizontal movement of the basket unit while allowing for small-amplitude longitudinal shaking during the horizontal reciprocating movement of the wafer, enhancing the shaking effect of the wafer plating. It also assists in cleaning crystals formed at the bottom of the basket unit, achieving a multi-functional design.

The application discloses a foamed copper low-temperature methanol water vapor reforming hydrogen catalyst and a preparation method thereof, and belongs to the technical field.The technical scheme is as follows: including pretreatment, chemical plating reaction, impregnation, pre-copper plating, copper electroplating, calcination, hydrothermal reaction and high-temperature treatment.The foamed copper catalyst prepared by the application has the advantages of more uniform dispersion of active components, higher porosity and better stability;Al does not need to be added, and the active component is the carrier;and the preparation process is simple, convenient to operate, low in cost and obvious in industrial application value.

This invention discloses a chemical plating batch clamping fixture based on structural constraint and its application method, belonging to the field of fixture technology. The fixture includes at least one clamping unit, comprising an upper frame, a lower frame, and isolation columns connecting the upper and lower frames. After assembly via the isolation columns, the upper and lower frames have corresponding hollow structures. The contour of the hollow structures matches the planar projection contour of the workpiece. A sandwich structure exists between the upper and lower frames. Longitudinal and transverse protrusions are provided around the hollow structures to constrain the parts within the hollow structure area. Based on the principle of physical interference, the fixture is highly effective in preventing the flipping of lightweight, small parts, eliminating damage to the parts, and is particularly suitable for precision parts.

Circuit board chemical copper plating equipment with ultrasonic oscillation comprises an electroplating bath, an ultrasonic oscillation device and a processing device, the ultrasonic oscillation device and the processing device are arranged in the electroplating bath, mounting seats are arranged on two opposite side surfaces of the electroplating bath, a connecting rod is arranged between the two mounting seats, and the ultrasonic oscillation device is arranged on the connecting rod and moves along the connecting rod; the ultrasonic vibration device comprises an ultrasonic vibration rod, and the outer surface of the ultrasonic vibration rod is provided with a convex ring and a groove; an ultrasonic transducer is arranged on the bottom surface of the external treatment device, a flow guide part is arranged at the top of the external treatment device, the flow guide part is gradually reduced from bottom to top, an exhaust port is formed in the top of the flow guide part, a vacuum pump is arranged on the outer side of the exhaust port, an air outlet hole is formed in the upper portion of the outer side of the vacuum pump, and a backflow pipe is arranged on the side face of the vacuum pump; and the bottom end of the return pipe is connected to the treatment tank. Through the arrangement of the movable ultrasonic vibration device and the processing device, the electroplating quality is improved, the practicability is high, and the electroplating device has high popularization significance.

The invention discloses a water electroplating process for a PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) material thin decorative part. The water electroplating process comprises the following treatment steps: pretreatment; activating treatment: after the surface of the thin decorative part made of the PC / ABS material is roughened, the rough surface of the thin decorative part made of the PC / ABS material is activated, so that the rough surface of the thin decorative part made of the PC / ABS material can accept deposition of plating metal; chemical plating treatment: carrying out chemical nickel plating treatment on the to-be-plated surface of the PC / ABS material thin decorative part; electroplating treatment: carrying out copper plating treatment, nickel plating treatment and chromium plating treatment on the chemical nickel surface of the PC / ABS material thin decorative part; wherein the thickness range of the plated copper is 24-28 [mu] m, the thickness range of the plated nickel is 1-3 [mu] m, and the thickness range of the plated chromium is 0.01-0.04 [mu] m; and post-treatment: carrying out cleaning treatment and drying treatment on the electroplated PC / ABS material thin decorative part to obtain the PC / ABS material thin decorative part. By means of the water electroplating process, the problem that the strength of the PC / ABS material decorating part is poor after water electroplating can be solved.

The subject matter disclosed herein relates to a composition (PC) suitable for electroless platinum plating, a process for plating a platinum coating onto a substrate based on the use of the composition (PC), an apparatus suitable for performing the process, and a platinum-plated article formed therefrom.

The invention relates to the technical field of printed circuit boards, and discloses a process method for optimizing a copper lattice to improve the binding force of a plating layer, which comprises the following steps of: glue residue removal treatment: carrying out glue residue removal treatment on a drilled printed circuit board to form a roughened structure on the surface of a hole wall; activating treatment: adsorbing palladium catalytic particles on the coarsened pore wall surface to form a uniformly distributed catalytic center; and chemical copper deposition: immersing the activated plate in a chemical copper solution, controlling the reaction temperature to be 41-45 DEG C, maintaining the concentration of copper ions, alkali and a reducing agent through automatic compensation and liquid mixing, and depositing on the hole wall to form an initial copper layer. The technological method for optimizing the copper lattice to improve the coating binding force aims at solving the problems that in high-density interconnection and high-speed and high-frequency printed circuit board manufacturing, due to the fact that a traditional chemical copper plating technology lacks dynamic regulation and control capacity, the coating binding force is insufficient, the lattice structure is loose, and uniformity is poor.

According to this invention, disclosed is an electroless plating solution containing a metal ion source having a parent phase that contains Sn and a Sn-Cu alloy, and an intermetallic compound crystal that contains Sn, Cu, Cr and Al, dispersed in the parent phase.

This application discloses a coating for electroless plating and its preparation method, belonging to the field of three-dimensional precision machining. The coating is applied to the surface of a substrate and, based on its mass percentage, comprises: 55%–85% crosslinking product of epoxy resin AB agent, 1%–5% nano-metal particles, and 10%–40% water-soluble polymer. Using the coating of this application for electroless plating involves fewer process steps and results in excellent adhesion between the metal circuitry and the substrate in the prepared three-dimensional interconnected molded device.

The invention belongs to the technical field of metal material processing, and particularly relates to a chemical corrosion forming method of a titanium alloy straight rib pipe. In order to overcome the defects that in the prior art, a titanium alloy straight rib pipe is complex in manufacturing process, high in cost and poor in flexibility, the titanium alloy straight rib pipe manufacturing method comprises the steps that firstly, rare earth elements lanthanum and yttrium are added, and a titanium alloy pipe good in toughness, heat stability and fatigue performance is obtained through multiple times of vacuum melting; plating a metal protective film; carrying out chemical corrosion forming on a part which is not covered by the mask by utilizing an acidic corrosive liquid; and finally, the metal protective film on the surface of the pipe is removed through chemical stripping, surface finishing is conducted, and the titanium alloy straight rib pipe with the accurate size and various complex shapes is obtained. The method is easy to operate, low in cost, high in design freedom degree and suitable for small-batch and multi-variety customized production requirements; and the used electroplating liquid and corrosive liquid can be recycled, and the concept of green and sustainable development of the modern manufacturing industry is met.

The invention provides a method for reducing chromatic aberration through chemical galvanization, a chemical galvanization device and chemical galvanization equipment, and relates to the technical field of semiconductor manufacturing, and the method comprises the following steps: after zinc replacement of a wafer is completed in a bath solution of a chemical galvanization bath, opening a bath cover of the chemical galvanization bath, and hoisting the wafer; the partition plate extends out to separate the water injection nozzle from the tank liquid; the wafer is located between the water spraying opening and the partition plate, and ionized water sprayed by the water spraying opening is sprayed to the wafer; and after spraying is completed, the tank cover is closed, the air injection devices on the two sides of the partition plate conduct N2 blowing drying on the partition plate, and after drying is completed, the partition plate is retracted. Compared with the prior art, the device and the method for chemical galvanization replacement can further reduce chromatic aberration; a new zinc replacement tank and related equipment do not need to be purchased, and the zinc replacement tank can be put into production and use only by slightly transforming an existing tank body and adding a water and air spraying device, a partition plate and a transmission device.

This invention discloses a high-strength, high-conductivity beryllium copper alloy rod for limit switches and its manufacturing method, belonging to the field of electronic component manufacturing technology. Its chemical composition, by weight percentage, includes: Be: 0.10%–0.30%, Co: 0.10%–0.30%, Ni: 0.30%–0.50%, Si: 0.020%–0.040%, Mn: 0.05%–0.10%, Zr: 0.05%–0.10%, Ag: 1.00%–1.20%, RE: 0.0140%–0.0180%, Ag-SiC: 0.80%–1.20%, Cu-CNTs: 0.40%–0.80%, Pb ≤ 0.005%, Sn ≤ 0.005%, other impurity elements ≤ 0.01%, and the balance being Cu. The manufacturing method includes electroless plating of SiC and CNTs with Ag and Cu, respectively, followed by gas atomization powdering, mixing, vacuum hot pressing sintering, hot extrusion, cold drawing, and aging treatment to obtain rods. This invention achieves simultaneous improvement in strength and conductivity through the synergistic effect of low Be and metal cladding reinforcement. The finished product has a yield strength >1050MPa, tensile strength >1200MPa, elongation >4%, and conductivity >40% IACS.

This invention relates to the field of metal surface treatment technology, and more particularly to an apparatus, a chemical plating solution, and a method for electroless plating of platinum into the inner cavity of a workpiece. Addressing the problems of poor reducing agent stability, short solution life, poor coverage of the inner cavity, low deposition rate, and insufficient coating adhesion in existing electroless plating technologies, this invention provides a chloroplatinic acid plating solution using ethylene glycol as both a reducing agent and solvent, combined with a three-temperature zone circulating flow device for electroless plating. The plating solution includes chloroplatinic acid, ethylene glycol, a complexing agent, a stabilizer, and a pH adjuster. The apparatus includes a preheating tank (60-120°C), an electroless plating tank (130-160°C), and a rapid cooling tank (0-30°C). The electroless plating solution flows through the inner cavity of the workpiece under the drive of a circulating pump, sequentially passing through the three temperature zones. By controlling the plating solution composition, pH value, reaction temperature, and circulation flow method, this invention significantly improves the uniformity and quality of electroless plating of platinum into the inner cavity, resulting in a long solution life and a dense, strong coating.

The invention relates to the technical field of IC (integrated circuit) packaging carrier plates, in particular to an FCBGA carrier plate bump manufacturing method, which comprises the following steps of: printing developing ink on a pattern plate in a solder resist manner, pasting an anti-plating PET (polyethylene terephthalate) film, punching copper cylinder holes in preset positions of the pattern plate by using a laser punching technology, filling the copper cylinder holes by using electroplating to form copper cylinders, and forming bumps on the pattern plate. And tinning the top of the copper column in a chemical tinning mode, forming Bump on the exposed part of the top of the pattern plate, and tearing off the anti-plating PET film to finish processing. Solder resist exposure and solder resist development procedures in a traditional solder ball implanting process are avoided, and the problem that the opening caliber is larger than 50 microns and the distance is larger than 90 microns due to the solder resist ink characteristic and the solder ball characteristic is avoided.

Compositions for electroless plating baths and their use are disclosed, and more particularly chemical solutions and a method to transform a plating bath from the ability to produce one type of plated layer into a plating bath able to produce a different type of plated layer.

A method of producing an aperture plate for a nebuliser is described. A substrate (2) is patterned with a resist (5, 6) and a metal (10) is applied by electroless deposition so that the resist forms a desired aperture pattern. The substrate (2) has an array of domes (2(b)) to provide aperture plates (16) with domes (101) and flanges (102) without need for application of mechanical force pressing after deposition. The substrate is shaped for simultaneous manufacture of a plurality of aperture plates in which the resist pattern provides a deposition region for each aperture plate. By using electroless plating the aperture plate accuracy is excellent, especially for defining apertures having a diameter in the rang of only less than 10 μm, and having improved corrosion and fracture resistance for high frequency nebulizer operation.

The invention discloses a production and processing technology of a copper-embedded circuit board, and relates to the technical field of circuit board manufacturing. According to the process, through the key steps of substrate pretreatment, copper embedding groove machining, accurate copper block embedding, fixing and reinforcing, circuit layer preparation, post-treatment and the like, the technical problems that in a traditional copper embedding process, combination of a copper block and a substrate is not firm, the positioning precision is low, and the circuit conduction stability is poor are solved. According to the process, a copper-embedded groove machining mode combining laser cutting and mechanical polishing is adopted, a hot melt adhesive and chemical plating dual-fixing structure is matched, the mechanical strength and the conductivity of a copper-embedded part are remarkably improved, meanwhile, through a step-by-step circuit layer preparation process, accurate butt joint of a circuit and a copper-embedded block is ensured, and the production efficiency is improved. The method is suitable for producing circuit boards of high-density and high-reliability electronic equipment, and has the advantages of simple process, high production efficiency, high product percent of pass and the like.

The invention discloses electroplating liquid containing a PEGDA additive, a copper-zinc compound zinc negative electrode material and a preparation method and application of the copper-zinc compound zinc negative electrode material. According to the electroplating solution, a solvent is water, and the electroplating solution comprises ZnSO4, Na2SO4 and PEGDA. According to the preparation method of the copper-zinc compound zinc negative electrode material, a copper foil serving as a working electrode and a zinc plate serving as a counter electrode are placed in the electroplating solution for electroplating treatment, and the copper-zinc compound zinc negative electrode material is obtained. According to the invention, a copper foil is used as a substrate, and a PEGDA additive is added by optimizing an electrochemical galvanizing process to prepare the copper-zinc compound. The additive PEGDA (polyethylene glycol diacrylate) is introduced into the electroplating solution, so that uniform deposition of zinc ions is realized, a zinc deposition substrate can be effectively improved, dendritic crystals are inhibited, side reactions are reduced, a more compact coating with better binding force is obtained, the mechanical strength and interface stability of a negative electrode are remarkably improved, and the performance of the aqueous zinc ion battery is improved.

The invention discloses a composite metal foil and a preparation method thereof, a current collector and a battery wherein the composite metal foil has a sandwich structure and comprises: an MXene layer; and the chemical plating metal layers are arranged on the two sides of the MXene layer. The preparation method comprises the following steps: providing the substrate; loading an MXene material on the surface of the substrate to form an MXene layer; the matrix is peeled off, and an independent MXene layer is obtained; and performing chemical plating on the surfaces of the two sides of the independent MXene layer to form a chemical plating metal layer, thereby obtaining the composite metal foil with the sandwich structure.

Precious metal and single-metal plating, such as silver and tin, are widely used in electronic equipment connectors, switches, relays, and other contact and terminal components due to their high conductivity. However, terminals using such precious metals or single metals have had durability issues. [Solution] The above problem was solved by an electroless plating solution containing a metal ion source in which intermetallic compound crystals containing Sn, Cu, Cr, and Al are dispersed in a matrix phase containing Sn and a Sn-Cu alloy.

The application relates to the technical field of semiconductor wafer chemical plating, in particular to a semiconductor wafer chemical plating equipment and an operation method, which comprises a semiconductor wafer chemical plating equipment main body, and has the beneficial effect that: through the combination of the plating pool assembly, the plating solution tank assembly and the basket assembly, the plating solution discharge pipe and the plating solution inlet pipe in the plating pool not only play the role of limiting and clamping installation of the wafer installation cabin, but also realize the circulation and uniform flow of the plating solution by injecting the plating solution into the wafer installation cabin from the lower part and then sucking it away from the upper part through the plating solution recovery pipe and the plating solution conveying pipe, so that the uniformity of the plating layer is improved; the wafer installation cabin not only plays the role of separately placing the semiconductor wafer, but also forms independent chemical plating reaction chambers; after the plating solution is injected, the pressure is increased, the non-target plating surface of the wafer is pressed and attached to the wafer installation buckle plate, the uniformity of the plating layer is improved, and the problem that another clamping assembly is designed to clamp and press the target plating surface of the wafer is avoided.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.