476 results about "Electroless plating" patented technology

The invention discloses a multi-layer plating process for optimizing surface characteristics of a base material, which is characterized by comprising the following steps of: pretreating the surface of a plated base material, improving the surface smoothness of the base material, and removing dirt on the surface of the base material; electroplating the base material by using the nickel pre-plating solution; chemical plating: the base material subjected to pre-plating treatment is placed in a chemical composite plating solution for chemical plating; the chemical composite plating solution comprises a basic plating solution and second-phase particles, the second-phase particles are nano niobium carbide, and the second-phase particles are wrapped and embedded into an alloy plating layer in the chemical plating process, so that the second-phase particles are distributed in plating layer matrix metal in a discrete mode to form a discontinuous phase. The hard particles niobium carbide are added and are dispersed and distributed in a coating substrate (Ni-P alloy), the hard particles can effectively refine the substrate metal, so that the hardness of the substrate metal is improved, and the niobium carbide hard phase particles are high in hardness, excellent in wear resistance, large in yield limit and high in pressure resistance.

The invention relates to the technical field of glass through hole machining, and discloses chemical plating equipment for TGV machining and a chemical plating method.The chemical plating equipment comprises a plating tank, a driving component, a hook, a hanging basket, a heating component, a plating solution circulating component, an air injection component, a vibration component and a control component, and the plating tank is provided with a containing cavity with an opening in the top; the driving part is arranged above the plating tank; one end of the hook is connected with the driving part, and the other end extends towards the accommodating cavity; the hanging basket is hung on the hook, at least part of the hanging basket extends into the containing cavity, and the hanging basket is used for containing a to-be-processed glass substrate; the heating part is arranged around the accommodating cavity; the plating solution circulating component is provided with a solution outlet and a solution inlet, and the solution outlet and the solution inlet are both communicated with the containing cavity; the air injection component is inserted into the accommodating cavity; the vibration component is arranged on the plating tank; and the control component is electrically connected with the driving component, the heating component, the plating solution circulating component, the air injection component and the vibration component. During processing, the glass substrate is in full contact with a plating solution, so that the uniformity of a plating layer can be improved, and skip plating is reduced.

The invention relates to a preparation method of silver-coated copper powder for the electronic industry, in particular to a preparation method of silver-coated copper powder for low-temperature slurry, which comprises the following steps: (1) alkali washing; (2) pickling; (3) organic modification; and (4) chemical silver plating is conducted, filtering, cleaning and drying are conducted after chemical silver plating is completed, and the silver-plated copper powder is obtained. Copper powder replacement is inhibited through surface organic modification, so that the copper powder does not participate in the reaction or does not participate in the reaction slightly, on one hand, copper powder raw material waste caused by the replacement reaction can be reduced, and on the other hand, batch instability caused by the morphology and specific surface area difference of the copper powder can be reduced. The silver-coated copper powder prepared by the method has excellent conductivity, high temperature resistance and silver-copper interlayer binding force, and can meet shearing acting forces such as high temperature and extrusion in the preparation and use process of low-temperature slurry.

The invention discloses a preparation method and application of a composite metal foil. The method comprises the following steps: preparing a high polymer material into a continuous film; carrying out surface pretreatment on the continuous film; carrying out chemical plating on the pretreated film to form a metal conductive layer; and after the metal conductive layer is formed, electrochemically depositing a metal layer to obtain the composite metal foil. According to the composite metal foil prepared according to the technical scheme, the plating layer is high in binding force, more uniform and high in conductivity; the preparation method is simple to operate, short in technological process, low in production cost and high in production efficiency.

Proposed is a method for forming an electroless plating electrode through selective cross-linking layer formation using a laser, specifically, the method includes forming a selective cross-linking layer by sintering a water-soluble polymer thin film layer, which is formed on a substrate by coating, to form a patterned shape thereon using a laser, followed by forming a precise metal pattern by electroless-plating the selective cross-linking layer with copper, nickel, or other metals. The method offers a simple manufacturing process, cost efficiency, and flexibility in manufacturing without being limited by the shape of a substrate, thereby patterns may be formed on various substrates. A catalyst material for electroless plating is mixed with a polymer material to directly cross-link the substrate. Thus, durability is improved but also an electrode may be formed with a substrate by electroless plating simply and in a short time due to use of only a single material.

The present invention provides a method for preparing silver-coated copper powder, which relates to the technical field of metal powder preparation. This preparation method directly prepares a copper core by chemical reduction method, then uses electroless plating method to grow a silver layer on its surface, and finally uses jet milling to improve the density of the powder. In the present invention, reducing agents with different reduction effects are added twice to reduce copper sulfate, which reduces the initial reaction rate, makes the whole reaction stable, and improves the sphericity of copper crystal nuclei. At the same time, sulfate radicals in the reaction system can form silver sulfate precipitation with silver ions in the subsequent reaction, further slowing down the reduction rate of silver ammonia complex ions and enabling the dense growth of the silver layer. At the same time, the unreacted completely glucose remaining in the reaction system can continue to reduce silver ammonia complex ions when silver ammonia solution is added dropwise later. By strictly controlling the growth rate of silver powder from crystal seeds to particles, the present invention reduces the structural defects caused by rapid growth and improves the performance of the final product.

Provided are an epoxy resin composition for semiconductor encapsulation; and a semiconductor device having a cured product of such composition. The composition has a superior curability, and a metal layer (plated layer) can be selectively and easily formed on the surface of or inside the cured product of this composition via an electroless plating treatment. The composition of the present invention contains:(A) an epoxy resin;(B) a phenolic curing agent;(C) a curing accelerator having a urea structure;(D) a laser direct structuring additive; and(E) an inorganic filler.

A power component submount includes a ceramic substrate, a sputtering layer formed on the ceramic substrate, a conductive block formed on the sputtering layer, and three electroless plating layers that are sequentially stacked on the conductive block. The sputtering layer includes an electroplating portion. The conductive block is formed on the electroplating portion, and bottoms of the three electroless plating layers are connected to the ceramic substrate. Materials of the three electroless plating layers are gold, palladium, and gold, respectively; or, materials of the three electroless plating layers are nickel, palladium, and gold, respectively. One of the three electroless plating layers arranged away from the conductive block is provided for allowing a power component to be mounted thereon.

The invention provides a continuous high-phosphorus chemical nickel plating method, which comprises the following steps: preparing a chemical plating solution containing nickel salt, a complexing agent and an additive, adding a first reducing agent and a second reducing agent into the plating solution according to a mass ratio of (3-5): (1-2), the second reducing agent is one or more of lithium aluminum hydride, sodium borohydride, propionic acid or succinic acid; and the PH value of the plating solution needs to be adjusted to 4.5-5.5, the temperature of the plating solution is controlled to be 80-90 DEG C, and then continuous plating operation is conducted. The first reducing agent can stably release active phosphorus atoms at a low temperature, a rich phosphorus source is provided for the plating layer, and it is guaranteed that the plating layer reaches the high phosphorus content; the second reducing agent can effectively promote the reduction deposition process of nickel ions, and the deposition rate is increased. The two reducing agent components cooperate with each other, so that the plating solution keeps high stability, fluctuation of the plating solution components is effectively inhibited, and the consistency and stability of the plating layer quality are obviously improved.

The utility model discloses an efficient flow line production structure of a neodymium iron boron permanent magnet material grain boundary diffusion process. The efficient flow line production structure comprises a first screen printing machine, a first conveying tunnel furnace, a plate turnover machine, a second screen printing machine and a second conveying tunnel furnace. The first screen printing machine is used for printing slurry on the jig plate and conveying the jig plate printed with the slurry to the first conveying tunnel furnace; the jig plate flowing out of the first conveying tunnel furnace enters a plate turnover machine to be turned over; the plate turnover machine conveys the turned jig plate to the second screen printing machine to be used for printing slurry on the jig plate, and the jig plate printed with the slurry is conveyed to the second conveying tunnel furnace. According to the utility model, the sagging problem of the permanent magnet coating in the traditional spraying, electroplating and chemical plating assembly line is solved, and the quality of the coating and the stable performance of the permanent magnet are ensured. An efficient, environment-friendly and automatic permanent magnet coating arrangement mode is provided, and substantive technical progress is brought to the motor manufacturing industry.

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

An electrolytic capacitor includes a capacitor element that includes an anode part and a cathode part, an exterior body that seals the capacitor element, a first external electrode that is electrically connected to the anode part, and a second external electrode that is electrically connected to the cathode part. At least one of an end face of the anode part or an end face of the cathode part is exposed from the exterior body to be electrically connected to a corresponding one of the first external electrode or the second external electrode. The end face exposed from the exterior body is covered with an electroless Ni plating layer, and the electroless Ni plating layer is covered with an electroless Ag plating layer. The electroless Ag plating layer is covered with the corresponding one of the first external electrode or the second external electrode.

The invention is suitable for the field of metal matrix composite materials, and provides a copper-tungsten boron-containing diamond electric resistance welding electrode and a preparation method thereof, and the electrode material is composed of a copper phase, a tungsten phase and boron-containing diamond powder; the preparation method comprises the following steps: carrying out step-by-step metallization treatment of chemical copper plating and magnetron sputtering nickel on boron-containing diamond powder; the boron-containing diamond powder with the metalized surface and tungsten powder are mixed, subjected to ball milling and then subjected to cold isostatic pressing forming, and a tungsten prefabricated body is obtained; sintering the tungsten preform in a hydrogen or vacuum environment to form a porous tungsten skeleton; and filling pores of the tungsten skeleton through copper infiltration to obtain the copper-tungsten boron-containing diamond electrode material, and finally processing and forming. Through introduction of the conductive boron-containing diamond and a step-by-step metallization process, the contradiction between the conductivity and the wear resistance of a traditional electrode is broken through, meanwhile, the adhesion rate is remarkably reduced, and the method is suitable for welding high-strength steel, plated plates, copper alloys and other easy-adhesion working conditions.

The invention discloses a graphene reinforced Al-Cu composite material and a preparation method and application thereof, and belongs to the technical field of metal matrix composite materials and preparation thereof. The problems that in an existing graphene reinforced aluminum matrix composite, graphene is poor in dispersity in an aluminum matrix, and harmful interface reaction is serious at the high temperature are solved. According to the preparation method, the surface of aluminum powder is plated with nano-copper particles through chemical plating, the potential of the aluminum powder in a water medium is regulated and controlled through a copper plating layer on the surface, the surface of the aluminum powder is provided with positive charges, graphene can be evenly dispersed in a matrix through electrostatic self-assembly, and meanwhile the surface copper plating layer is used for inhibiting interface reaction and hindering generation of a brittle phase. In addition, by adding the metal copper, the solid solution and second phase strengthening effects can be achieved, and the mechanical property of the composite material is further improved.

The invention discloses a lithium battery tab electroplating process and device, and relates to the technical field of lithium battery tab processing, the lithium battery tab electroplating device comprises an electroplating bath, and the middle of the electroplating bath is provided with a middle plate used for adjusting the internal width of a tab metal sheet guide structure; a plurality of groups of tab metal sheet guide structures are arranged on the surface of the middle plate and one inner wall of the electroplating bath; the tab metal sheets cannot fall off along the interiors of the tab metal sheet guiding structures, the directions of the two second pressing blocks can determine the path of the strip-shaped tab metal sheets, the tab metal sheets are flattened, the surface flatness after electroplating is neat, the internal width of the electroplating bath can be adjusted according to the width of the tab metal sheets, and the electroplating efficiency is improved. The electrode lug metal sheet is ensured to be located between the fixing discs, the electroplating process is carried out through the electro-catalysis effect, the layer has excellent corrosion resistance, abrasion resistance and lubricity, the service life of parts can be prolonged, and the performance of chemical nickel alloy plating can be achieved through high-phosphorus electroplating.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The utility model discloses a wafer carrier for chemical plating, and relates to the field of wafer equipment. The wafer carrier for chemical plating comprises a carrier main body which is provided with a plurality of supporting grooves capable of supporting wafers; the matching piece is arranged above the carrier main body and connected with the carrier main body, and the matching piece is configured to be connected through a transferring mechanism so as to flow in the plurality of plating tanks; and the coating structure covers the plurality of supporting grooves, and the coating structure is configured to be in direct contact with the wafer when the wafer is loaded to the carrier main body. The wafer carrier for chemical plating provided by the utility model can reduce the influence on the flowing mode of a chemical solution and improve the quality of chemical plating.

The invention aims to provide a one-step pretreatment activating solution and a pretreatment method before chemical copper plating of PET (Polyethylene Terephthalate) fibers, and belongs to the technical field of chemical plating. An activation solution composed of dimethyl sulfoxide (DMSO), polyvinylpyrrolidone (PVP) and silver salt is innovatively provided, when the PET fiber is immersed in the activation solution, the DMSO enables the PET fiber to swell, a solvent can promote PVP molecules to enter a PET polymer chain, a surface physical interlocking network (SPIN) structure rich in PVP is formed on the surface of the PET fiber, the PET fiber is subsequently put into deionized water to be soaked, and the surface of the PET fiber is subjected to surface activation. The swelling structure collapses, so that the PVP is locked, and the sample is not substantially deformed or dissolved; the generated AgNPs are tightly attached to a PVP substrate, so that the adsorption performance of the PET fiber surface to silver nanoparticles is enhanced, and a large number of active sites are provided for subsequent copper deposition on the fiber surface. According to the method, one-step pretreatment is achieved, and the multi-step pretreatment process in traditional chemical plating is simplified.

The invention relates to the technical field of wireless communication equipment manufacturing, in particular to a method for manufacturing an FPC flexible antenna through integrated injection molding and the antenna, and the method comprises the following steps: preparing a copper foil layer on the surface of a double-layer polyimide substrate flexible circuit, and chemically plating a nickel-gold layer on the surface of the copper foil layer; a receding groove is formed in a golden finger area of the FPC flexible circuit board, and a positioning hole is formed in the edge of the FPC flexible circuit board; a Teflon coating is sprayed on the inner wall of the mold cavity, and a positioning column is mounted in the mold cavity; the method comprises the following steps: firstly, fixing a preprocessed FPC flexible circuit board in a mold cavity through a positioning column; and injecting a thermoplastic high polymer material heated to a molten state into a mold cavity, applying a dwell pressure to the injected molten material, so that the FPC flexible circuit board is completely coated with the molten material, cooling, and demolding to obtain the FPC flexible antenna. According to the invention, seamless integration of the antenna and the shell can be realized, so that the coupling problem of line damage and impedance mismatch in a traditional injection molding antenna is solved.

Embodiments can relate to an improved hydroflux, additive or electroless plating assisted densification cold sintering process to densify powdered metals at lower compaction pressures and lower temperatures (e.g., 520 MPa and 140° C.). The process can involve inducing dissolution precipitation mechanisms at powder interfaces by introducing a transport phase (formed by the introduction of water during the process to suppress melting temperatures) that is not an aqueous solution. Particle interfaces in the cold sinter fuse together by the presence of the additional transport phase, thereby reducing the temperatures and pressures needed for compaction. Some embodiments involve the use of elements to form a eutectic at the desired low temperature, thereby stabilizing certain crystal structure shapes of isometric crystal systems, inducing rapid densification, and facilitating pore smoothing. Embodiments of the process can be used to generate a green compact via sintering that exhibits improved green strength.

The present invention relates to a method for electroless copper depositing onto a surface of a non-conductive or carbon-fibres containing substrate, the method comprising the steps: (I) activating the surface of a non-conductive or carbon-fibres containing substrate for electroless copper depositing, the activation method using an aqueous, palladium-free activation composition comprising (i) a first species of dissolved transition metal ions which are copper ions and additionally metal particles thereof which are copper particles, (ii) one or more than one complexing agent, and (iii) permanently or temporarily one or more than one reducing agent, and (II) an enhancer treatment of the activated surface of a non-conductive or carbon-fibres containing substrate, the enhancer treatment method using an alkaline aqueous enhancer composition comprising water and a formaldehyde compound; and (III) an electroless copper depositing of the enhanced surface of a non-conductive or carbon-fibres containing substrate, the electroless copper depositing method using an electroless copper metallizing solution and substrates, and method for subsequent metallization.

The invention belongs to the technical field of composite material casting, and relates to an aluminum / iron double-metal composite material based on a chemical nickel-plating layer and a preparation method of the aluminum / iron double-metal composite material based on the chemical nickel-plating layer, a nickel layer with uniform thickness is preset on the surface of an iron base material in advance in a chemical plating mode, and the effect of thoroughly isolating direct contact between an aluminum material melt and the solid iron base material is achieved. The interface phase composition regulation and control of the aluminum / iron bimetallic composite material can be realized, the interface defects are greatly reduced, and the interface bonding strength is improved.

The invention provides a copper-containing plating solution and a method for plating copper on the surface of graphene, and belongs to the technical field of chemical plating. The copper-containing plating solution provided by the invention comprises copper sulfate pentahydrate, hypophosphite, glyoxylic acid, ethylenediamine tetraacetic acid tetrasodium salt, sodium citrate and deionized water. The glyoxylic acid in the copper-containing plating solution can quickly provide electrons in the initial reaction stage, so that copper ions are quickly nucleated; hypophosphite can continuously reduce copper ions in the plating solution into copper atoms, and continuous growth of a copper layer is achieved; tetrasodium ethylene diamine tetraacetate and copper ions can form a complex with high stability, and the copper ions are slowly released; sodium citrate is used as an auxiliary complexing agent, so that the discharge potential can be adjusted, and the deposition process of copper ions is further optimized, so that compact coating of a to-be-plated copper matrix is realized, and the copper plating effect is effectively improved. Results of the embodiment show that the copper-containing plating solution provided by the invention can form a compactly coated copper layer on the surface of graphene.

The present invention provides a catalyst-providing liquid useful for forming an electroless plating film having excellent pattern properties and plating-deposition properties on a metal material. 　Specifically, the present invention provides a catalyst-providing liquid for electroless plating, the liquid comprising: (A) at least one cationic compound selected from the group consisting of cationic polymers and cationic surfactants; and (B) a metal catalyst. The (B) metal catalyst includes at least one selected from the group consisting of Pd, Au, Ag, and Pt, and has a pH of 5 or lower. The content of the (A) cationic compound is 0.01-1000 mg / L, and the content of the (B) metal catalyst is 0.01-100 mg / L.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

The utility model discloses a suspension bracket for electroless plating copper on the surface of a circuit board, and relates to the field. A first sliding block is fixed in a protective shell, fixing piles are fixed to the two sides of the top of the first sliding block, a first spring is fixed to one end of each fixing pile, a wedge-shaped block is fixed to one end of each first spring, a rubber plate is fixed to one end of each wedge-shaped block, and a gear is rotationally connected to one side of each wedge-shaped block. The top and the bottom of one end of the gear are rotationally connected with a movable plate, one end of the movable plate is rotationally connected with a second fixing block, a push rod is fixed to one side of the second fixing block, and a conical block is slidably connected to the outer surface of the push rod. And when the gear rotates, the wedge-shaped block is driven to clamp or open.

To provide a method for producing a resin-plated material by which the adhesive strength between a base material and a plating layer can be made higher than that in the conventional method without substantially forming ruggedness on the surface of the base material.SOLUTION: The method includes a step (a) of preparing a base material made of an insulating resin material, a step (b) of irradiating a surface of the base material with ultraviolet rays in an atmosphere containing oxygen to modify a region from the surface of the base material to a predetermined depth into a microporous layer including pores having a size of nm order in the base material, and a step (c) of performing a plasma treatment on the base material to remove a part of the microporous layer. The method includes a step (d) of imparting a hydrophilic functional group to the surface of a base material, a step (e) of supporting a catalyst on the base material after the step (d), and a step (f) of forming an electroless plating layer on the surface of the base material via the catalyst after the step (e).SELECTED DRAWING: Figure 7

This system automatically applies electroless plating to individual raw chain links used in a chain connection, without causing discoloration to the connected plated chain. [Solution] A partial chain plating apparatus 10 is provided, comprising a polishing machine 14 for barrel polishing the raw chain links 3 to be plated, a plating tank 16 for electroless plating, a water washing tank 18 for cleaning, and an oil tank 22 for baking, all arranged side by side, the apparatus further comprising a holder 24 for holding the chain in a hanging position after folding it in half so that the raw chain links are at the lowest end, a traverse device 26 for moving the holder horizontally, a lifting device 28 for changing the height of the holder, a fan 32 for blowing air toward the chain hanging from the holder, and a control device for controlling the operation of at least the traverse device and the lifting device.

A method of selectively metallizing a multi-component molded plastic part. The multi-component molded plastic part comprises at least one first region to be metallized formed of a first plastic and at least one second region that is not to be metallized formed of a second plastic. The method includes the steps of (a) contacting the multi-component molded plastic part with a chromic acid-free etchant, wherein the chromic acid-free etchant comprises manganese sulfate; (b) optionally, neutralizing the manganese sulfate to Mn2+ ions; (c) activating surfaces of the plastic part with an activator; (d) contacting the activated surfaces of the plastic part with an accelerator; and (e) depositing an electroless plating layer on the surfaces of the multi-component molded plastic part with an electroless plating electrolyte comprising nickel and copper to form an electroless copper-nickel layer on substantially only the first region formed of the first plastic.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.