36 results about "Electroless plating" patented technology

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

This invention discloses a chemical plating batch clamping fixture based on structural constraint and its application method, belonging to the field of fixture technology. The fixture includes at least one clamping unit, comprising an upper frame, a lower frame, and isolation columns connecting the upper and lower frames. After assembly via the isolation columns, the upper and lower frames have corresponding hollow structures. The contour of the hollow structures matches the planar projection contour of the workpiece. A sandwich structure exists between the upper and lower frames. Longitudinal and transverse protrusions are provided around the hollow structures to constrain the parts within the hollow structure area. Based on the principle of physical interference, the fixture is highly effective in preventing the flipping of lightweight, small parts, eliminating damage to the parts, and is particularly suitable for precision parts.

This invention relates to the field of metal surface treatment technology, and more particularly to an apparatus, a chemical plating solution, and a method for electroless plating of platinum into the inner cavity of a workpiece. Addressing the problems of poor reducing agent stability, short solution life, poor coverage of the inner cavity, low deposition rate, and insufficient coating adhesion in existing electroless plating technologies, this invention provides a chloroplatinic acid plating solution using ethylene glycol as both a reducing agent and solvent, combined with a three-temperature zone circulating flow device for electroless plating. The plating solution includes chloroplatinic acid, ethylene glycol, a complexing agent, a stabilizer, and a pH adjuster. The apparatus includes a preheating tank (60-120°C), an electroless plating tank (130-160°C), and a rapid cooling tank (0-30°C). The electroless plating solution flows through the inner cavity of the workpiece under the drive of a circulating pump, sequentially passing through the three temperature zones. By controlling the plating solution composition, pH value, reaction temperature, and circulation flow method, this invention significantly improves the uniformity and quality of electroless plating of platinum into the inner cavity, resulting in a long solution life and a dense, strong coating.

A method of producing an aperture plate for a nebuliser is described. A substrate (2) is patterned with a resist (5, 6) and a metal (10) is applied by electroless deposition so that the resist forms a desired aperture pattern. The substrate (2) has an array of domes (2(b)) to provide aperture plates (16) with domes (101) and flanges (102) without need for application of mechanical force pressing after deposition. The substrate is shaped for simultaneous manufacture of a plurality of aperture plates in which the resist pattern provides a deposition region for each aperture plate. By using electroless plating the aperture plate accuracy is excellent, especially for defining apertures having a diameter in the rang of only less than 10 μm, and having improved corrosion and fracture resistance for high frequency nebulizer operation.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.

The application discloses a kind of integrated circuit chip package lead frame's electroless gold plating solution and its gold plating method, it is related to integrated circuit chip packaging field.Therein, electroless gold plating solution is following concentration component aqueous solution: water-soluble gold compound, with Au, concentration is 1-1.5g / L;Sodium hypophosphite 10~20g / L;Malic acid 15~20g / L;Citric acid 15~20g / L;N,N'-bis (2-hydroxyethyl) ethylenediamine 10~15g / L;Triammonium citrate 15~20g / L;EDTA-2Na 5~10g / L;5,5'-dimethyl hydantoin 5~10g / L;Metal ion catalyst, with metal ion, concentration is 2~3ppm;Mercaptoimidazole 0.01~0.015g / L;Hexamethylenetetramine 5~10g / L.The electroless gold plating solution in the application can consider stability, high deposition rate and plating layer deposition uniformity.

This invention discloses a graphene nanosheet composite aluminum-based material, comprising: adding copper-plated graphene nanosheets to an aluminum-based melt, wherein the proportion of copper-plated graphene nanosheets added is 0.1%-1.0%; the copper-plated graphene nanosheets are graphene nanosheets with a copper atom coating formed on their surface. This invention also discloses its preparation method. The graphene nanosheets with added chemical copper plating produced by this invention can effectively improve the tensile strength and elongation (mechanical properties) of test bars, and have a significant effect on improving the performance of aluminum alloy materials.

This invention discloses an etched carbonized bamboo fiber cloth-based lightweight electromagnetic shielding material and its preparation method. The method includes the following steps: (1) etching bamboo fibers in an alkaline solution to obtain etched bamboo fiber cloth; (2) carbonizing the etched bamboo fiber cloth under an inert atmosphere at high temperature to obtain carbonized bamboo fiber cloth; (3) subjecting the carbonized bamboo fiber cloth to acid immersion, sensitization, activation, and degumming in sequence, washing, and then accelerating the process. The treated bamboo fiber cloth is then subjected to electroless copper plating for metallization deposition, forming a continuous and dense copper conductive layer on the fiber surface. After drying, the etched carbonized bamboo fiber cloth-based lightweight electromagnetic shielding material is obtained. The material obtained by this invention is lightweight, flexible, has a large specific surface area, and excellent electromagnetic shielding performance, making it suitable for flexible electronic devices, electromagnetic protection, and lightweight functional composite materials.

This invention discloses a method for preparing W-Cu micro-layered composite materials based on chemical copper plating, comprising the following steps: Step 1, ball milling W powder to form flakes, obtaining flake-shaped W powder; Step 2, preparing a copper plating solution; Step 3, adding the flake-shaped W powder to the copper plating solution for reaction, followed by repeated filtration and washing with deionized water, and then freeze-drying to obtain a W-Cu composite powder with Cu-coated flake-shaped W powder; Step 4, sintering the Cu-coated flake-shaped W powder under vacuum hot pressing to obtain the W-Cu micro-layered composite material. The W-Cu micro-layered composite material obtained by this invention improves thermal conductivity while reducing the coefficient of thermal expansion.

This glass member (100) comprises a glass substrate (10), and a copper-containing conductive layer (20) formed on the glass substrate (10). In the conductive layer (20), the number of blisters having a longest diameter of 5 μm or more is 5 blisters / cm2 or less. This glass member manufacturing system is provided with an electroless plating apparatus that forms a first metal film containing copper on a glass substrate, by electroless plating at a deposition rate of 1.3 μm / hour or less.

An assembly with an electric feedthrough is provided, including a main body having an opening, through which an electric conductor is passed and held with a fixing material. The electric conductor surface not covered by the fixing material has a first coating while the surface covered by the fixing material lacks the first coating. The main body surface uncovered by the fixing material omits the first coating and optionally has a second coating, different from the first coating, or is provided completely with the first coating. The main body surface covered by the fixing material lacks the first coating, and the electric conductor surface uncovered by the fixing material lacks the first coating and is optionally provided with a second coating, different from the first coating. The first coating has one or more layers, and the outermost layer is an electrolessly deposited layer of a first coating material.

To provide a primer composition for electroless plating that enables the formation of a plating pattern with proper thickness without the need for etching.SOLUTION: A primer composition for electroless plating according to the present invention includes a phenoxy resin (A), a liquid epoxy resin (B), and a curing agent. The mass content of the liquid epoxy resin (B) is higher than that of the phenoxy resin (A).SELECTED DRAWING: Figure 1

The application discloses a three-dimensional core particle stacking system chip based on independent three-dimensional interconnection touch structure and a manufacturing method. The system chip comprises a bottom motherboard, a bonding area and an I / O pad array located at the periphery of the bonding area on the surface of the bottom motherboard, and the I / O pad array comprises at least N columns of pads, namely a first column of pads, a second column of pads to an Nth column of pads, and N is greater than or equal to 2. By transferring a TSV array for vertical interconnection to a medium layer at the periphery of a storage core particle, a TSV-free design of the storage core particle is realized, the manufacturing process of the storage core particle is simplified, the storage density is improved, the signal integrity of vertical interconnection is ensured through a TSV penetrating design, a chemical plating / electroplating self-growth metal interconnection process between pads is improved, the reliability and yield of stacking interconnection are improved, the process sequence of multi-layer stacking is compatible with an existing semiconductor production line, and the system chip has good industrial application prospects and industrialization value.

To provide an electroless plating inhibiting composition capable of improving the deposition and selectivity of electroless plating when forming a high-definition pattern.SOLUTION: An electroless plating inhibiting composition includes a catalytic activity inhibitor to inhibit the activity of an electroless plating catalyst, a water repellent, and a solvent comprising glycol ether. A catalytic activity inhibiting layer formed by the electroless plating inhibiting composition has a surface water contact angle of 50° or more.SELECTED DRAWING: None

To provide a technology that is advantageous for stably precipitating ruthenium on a raw material with electroless plating.SOLUTION: An electroless plating solution includes ruthenium salt, a complexing agent, a reductant and a pH adjuster, where the reductant includes a hydrazine-hydrate and the complexing agent includes carboxylic acid having one or two carboxyl groups.SELECTED DRAWING: Figure 1B

A laminate according to the present disclosure comprises a copper layer with a thickness of 5 μm or less and a resin layer provided on the surface of the copper layer, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less. A method for manufacturing a wiring board according to the present disclosure comprises a process of preparing a laminate having a copper layer with a thickness of 5 μm or less, a resin layer, and a support substrate in this order, and after being placed in an environment at a temperature of 130°C and a relative humidity of 85% for 200 hours, the absorption rate of the resin layer is 1% or less; a process of forming a seed layer on the surface of the copper layer by electroless copper plating; a process of forming a resist pattern on the surface of the seed layer having a groove that reaches to the surface of the seed layer; and a process of filling the groove with a conductive material containing copper by electrolytic copper plating.

This invention relates to the field of printed circuit board manufacturing technology, and discloses an acidic accelerator and its preparation method, comprising an organophosphonic acid-based main complexing stripping agent, an organosulfonic acid-based conductive and pH buffer medium, an electrochemical promoter, and a fluorinated wetting and penetrating agent. The fluorinated wetting and penetrating agent is a nonionic surfactant prepared by reacting a carboxyl-terminated perfluoropolyether with polyethylene glycol. The preparation method of this invention includes steps such as synthesizing the fluorinated wetting and penetrating agent and dissolving and preparing it. This invention utilizes the synergistic effect of organophosphonic and organosulfonic acids to efficiently and selectively remove the tin protective layer on the surface of colloidal palladium, while simultaneously using the fluorinated wetting and penetrating agent to reduce surface tension and enhance permeability to high aspect ratio micropores. This invention solves the problems of incomplete tin removal, damage to the palladium core, and instability of the working solution caused by traditional accelerators, improving the coverage uniformity and adhesion of subsequent electroless copper plating layers, and is suitable for the manufacture of high-density interconnect PCBs.

The application discloses Sn42Bi58 low-temperature tin paste solder doped with Cu ball micro-powder and a preparation method thereof, relates to the technical field of special functional solder material, and belongs to the patent classification B23K35 / 26. 3+ The Sn layer is deposited by reduction type electroless plating, the Ag layer is deposited by replacement, a Cu6Sn5 metallurgical bonding layer is generated at the Cu-Sn interface through low-temperature solid-phase diffusion heat treatment, and the Sn-Ag composite coated Cu ball powder is obtained; the Sn42Bi58 alloy powder is doped and modified by GQDs; the soldering paste containing modified nano-aluminum oxide is prepared; finally, the GQDs modified Sn42Bi58 alloy powder, the soldering paste, the composite Cu ball powder, nano-Ni particles and modified nano-CeO2 particles are mixed, and through defoaming and filtering, the soldering paste is obtained. The metallurgical bonding layer with low interface thermal resistance is constructed through Sn-Ag coating and heat treatment, micro-nano scale assisted heat conduction is realized by introducing GQDs and nano-aluminum oxide, nano-Ni and nano-CeO2 are used to cooperatively inhibit the excessive thickening of Cu6Sn5 in the whole life cycle, the heat conduction performance and the interface stability of the solder joint are significantly improved, and the process adaptability is strong, so that the application is suitable for industrial production.

This invention discloses a device and method for enhancing the plating solution exchange efficiency in electroless plating of ultra-large-scale PAD arrays. The device includes: a monolithic plating unit comprising a plating solution tank and a vacuum pre-wetting unit connected to the plating solution tank; a plating solution exchange activation device disposed within the plating solution tank to ensure high-speed flow of the plating solution upon reaching the wafer surface; an acoustic vibration device disposed at the bottom of the plating solution tank, having an adjustable frequency structure, to cause regular vibration of the plating solution to enhance plating solution exchange; a plating solution flow pressurization device connected to the plating solution tank to pressurize the plating solution into the PAD gaps of the wafer; and a dynamically adjustable wafer holder device disposed within the plating solution tank to hold the wafer with the ultra-large-scale PAD array. This invention systematically improves the plating solution exchange efficiency across the entire ultra-large-scale PAD array through the synergistic effect of multiple physical fields, significantly improving coating uniformity and process yield.

This invention relates to the field of electroless plating technology for printed circuit boards, and in particular to an automatic loading device for electroless plating fixtures of printed circuit boards. The device includes: a lifting platform, comprising a base, a board placement slot located above the base, and a lifting mechanism connected between the base and the board placement slot for horizontally raising and lowering the board placement slot; and primary clamping components, arranged opposite each other on both sides of the board placement slot for centering and clamping the boards inserted into the slot. This invention, through the lifting platform and primary clamping components, allows a worker to directly insert the board into the open end of the board placement slot and adaptively clamp it vertically between the opposing primary clamping components located inside the slot. The lifting mechanism raises the board placement slot, allowing the board to be plated to be placed directly under the fixture on the trolley. The worker only needs to lock the fixture to fix the board on the trolley, thereby reducing the labor intensity of manually lifting the board and effectively improving the production efficiency of the boards.

This invention provides an image-based electroless plating method based on pad printing, belonging to the field of flexible electronics manufacturing technology. This method innovatively designs the formulation of the electroless plating activation solution, enabling the improved activation solution to simultaneously meet the functions of an activation solution in electroless plating and the transfer requirements of pad printing technology. This not only avoids the risks of pattern distortion and deformation during pad printing but also effectively controls the solution viscosity, forming a three-dimensionally stable coating of silver nanoparticles as the catalytic center for electroless plating. Simultaneously, by enhancing the interfacial interaction between the solution and the substrate, the accuracy of pattern transfer and the adhesion performance of the plating layer are significantly improved.

This utility model discloses a wafer electroless plating apparatus, comprising: a main body of the apparatus, which has an internal electroless plating chamber for containing electroless plating solution; a lifting frame, which is liftable and mounted on the main body; multiple fixing fixtures for fixing wafers, which are detachably connected to the lifting frame and are lifted by the lifting frame to enter the electroless plating chamber for electroless plating; the fixing fixtures are provided with multiple liquid inlets; and a filter assembly for removing impurities from the electroless plating chamber. The advantages of this utility model are that, through the design of the lifting frame and fixing fixtures, multiple wafers can be electroless plated simultaneously, improving electroless plating efficiency; at the same time, the multiple liquid inlets reduce turbulence, ensuring electroless plating quality, and simplifying operation.

This application relates to a method, apparatus, electronic device, and storage medium for maintaining a magnesium alloy electroless plating solution, belonging to the field of surface engineering technology. The method includes: acquiring initial composition information of the electroless plating solution; using a coating corrosion performance prediction model to simulate multi-cycle plating based on the initial composition information, predicting the corresponding performance information of the electroless plating solution; detecting the remaining concentration of plating components in the electroless plating solution during the current plating cycle; generating a plating solution replenishment prompt for the current plating cycle based on the remaining concentration and the plating solution replenishment standard corresponding to the current plating cycle in the plating solution performance information; and replenishing the electroless plating solution according to the replenishment prompt, so that the replenished electroless plating solution meets the plating solution standard conditions for the next plating cycle corresponding to the current plating cycle. This application can achieve precise control and predictive maintenance of the plating solution state during the production process, ensuring product consistency and reliability.

The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg / L or more of manganese ions and 10 mg / L or more of monovalent silver ions.

Metallized polymer particle compositions may comprise polymer particles, and a metal coating on an outer surface of at least a portion of the polymer particles. The metal coating comprises a plating metal and overlays a plurality of two-dimensional conductive nanoparticles and a catalyst metal. The metal coating may be formed by at least an electroless plating process conducted in the presence of the catalyst metal. The polymer particles may comprise thermoplastic polymer particles.

This disclosure provides a colloidal palladium catalyst activator, its preparation method, and its application. The colloidal palladium catalyst activator comprises the following components by weight: 0.05-0.2 parts palladium salt; 0.1-0.3 parts reducing agent; 20-60 parts glycosyl polyether stabilizer; 25-65 parts buffer; and 10-100 parts dispersant. The activator reduces metallic palladium particles through the reducing agent, and forms colloidal particles by alternating shells of block polymers and glycosyl polyether compounds coating the surface of the palladium particles. This effectively locks the palladium core size and prevents particle agglomeration, resulting in small and uniformly distributed palladium particles in the colloidal particles. The colloidal particles have excellent zeta potential, achieving good electrostatic adsorption and uniform distribution, and exhibiting weather resistance and long-term stability. The colloidal palladium catalyst activator has pH-responsive characteristics, saving the degellation step, reducing palladium consumption, shortening the start-up time of electroless copper plating, and simplifying the process.

A substrate (1) having a GaN surface (2) is immersed in a catalyst metal solution (4) containing, potassium hydroxide and a plating catalyst metal salt while being irradiated with ultraviolet light to deposit a catalyst metal (5) on the GaN surface (2). A metal film (7) is formed on the GaN surface (2) having the catalyst metal (5) deposited thereon by electroless plating.

The application discloses an electrochemical characterization method for deposition rate in a chemical nickel plating process, and belongs to the technical field of chemical plating and electrochemical characterization. The application aims to solve the technical problems of poor real-time performance, low quantification degree and single function of the existing characterization method for chemical nickel plating, adopts a three-electrode test system and an electrochemical workstation to build an in-situ impedance measurement system, extracts key parameters such as solution resistance and charge transfer resistance, establishes a quantitative correlation model of the charge transfer resistance and the deposition rate, realizes real-time and accurate calculation of the deposition rate, and can complete complexant optimization and process performance evaluation. The application has the advantages of in-situ nondestructive, high quantification precision, multifunctional integration and wide applicability, the measurement error of the deposition rate is less than or equal to 5%, can be adapted to different substrates, plating solution systems and process parameters, provides technical support for accurate regulation, cost reduction and quality improvement of the chemical nickel plating process, and is suitable for characterization of nickel-phosphorus, nickel-boron and other alloy coating systems.

A power component submount includes a ceramic substrate, a sputtering layer formed on the ceramic substrate, a conductive block formed on the sputtering layer, and three electroless plating layers that are sequentially stacked on the conductive block. The sputtering layer includes an electroplating portion. The conductive block is formed on the electroplating portion, and bottoms of the three electroless plating layers are connected to the ceramic substrate. Materials of the three electroless plating layers are gold, palladium, and gold, respectively; or, materials of the three electroless plating layers are nickel, palladium, and gold, respectively. One of the three electroless plating layers arranged away from the conductive block is provided for allowing a power component to be mounted thereon.