3852results about "Fixed capacitor electrodes" patented technology

To provide a multilayer electronic component having excellent reliability by preventing penetration of external moisture or plating solution.SOLUTION: According to one embodiment of the present invention, there is provided a multilayer electronic component which includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an external electrode including a base electrode layer connected to the internal electrode; and an interface layer disposed between an end of the dielectric layer and the base electrode layer. The interface layer includes a first glass containing Ba, Zn, and Si, and the base electrode layer includes a second glass containing Ba and Si. When an average molar ratio (Ba / Si) of Ba to Si contained in the first glass is M1 and an average molar ratio (Ba / Si) of Ba to Si contained in the second glass is M2, M1 and M2 satisfy M1 / M2≥1.5.SELECTED DRAWING: Figure 5

The invention belongs to the technical field of nickel electrode slurry preparation, discloses a preparation process of ultra-fine particle size roll-printed nickel electrode slurry for an ultra-high capacity MLCC, and aims to solve the problems that in the prior art, ultra-fine nickel powder is easy to oxidize, the cost of covering nickel nitride powder is high, a covering layer is easy to damage and agglomerate during dispersion, and the performance of the slurry is poor. The method comprises three steps of raw material pretreatment, synchronization of material dispersion and nitridation, post-treatment and nitrogen protection, wherein the pretreatment is used for removing impurities and preventing oxidation, dispersion and nitridation are carried out synergistically through a sand mill and an ultrahigh-pressure homogenizer in a graded regulation and control mode, the post-treatment comprises filtering, inspection and double-layer vacuum packaging, the raw materials are prepared according to a specific proportion, key parameters are precisely regulated and controlled, and finally the slurry is prepared. Roll printing adaptability and co-firing requirements are met, independent nitridation and reduction procedures are omitted, cost is reduced, slurry uniformity, dispersion stability and MLCC reliability are improved, and large-scale mass production can be achieved.

An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly.

The invention relates to an electrode preparation method, an electrode prepared by the electrode preparation method and an energy storage device comprising the electrode, and the preparation method comprises the following steps: (1) preparing an electrode diaphragm: (a) mixing materials: uniformly mixing an electrode active material, a conductive additive and a non-fibrillated binder, then adding a fibrillated binder, and uniformly mixing the materials to obtain the electrode diaphragm; processing the obtained mixture to be flocculent or muddy; or uniformly mixing the electrode active material, the conductive additive, the non-fibrillated binder and the fibrillated binder, and processing the obtained mixture to be flocculent or muddy; (b) forming: forming the flocculent or muddy product obtained in the step (a) into an electrode membrane; and (2) depositing a current collector: depositing a metal layer on one surface of the electrode diaphragm obtained in the step (1) through a physical deposition method to serve as the current collector. The energy storage device provided by the invention has improved cycle performance, rate capability and first coulombic efficiency.

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a plurality of capacitance formation portions including first dielectric layers and internal electrodes alternately arranged in a first direction. An intermediate layer disposed is between the adjacent capacitance formation portions and includes a second dielectric layer. An external electrode is disposed on the body and connected to the internal electrode. The first and second dielectric layers may include a plurality of grains and pores. An average grain size of the first dielectric layer may be smaller than an average grain size of the second dielectric layer. A porosity of the first dielectric layer may be lower than a porosity of the second dielectric layer.

An internal electrode layer includes therein a plurality of inner ceramic particles within an observation range of a cross-section intersecting the internal electrode layer. The position of the inner ceramic particles in the internal electrode layer relative to the center position of the internal electrode layer in the thickness direction is correlated with the position from the center position to the edge position, and the corresponding positions are indicated by the numbers 0-100. Such an index is referred to as Dsp. Inside the internal electrode layer, within a region of Dsp of 40 or less, preferably 30 or less, the inner ceramic particles are present in an area of at least 50% of the total area of the inner ceramic particles present within the observation range.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are alternately laminated, a base electrode, and an external electrode. The internal electrodes include a first internal electrode and a second internal electrode. The base electrode includes a first base electrode and a second base electrode. The external electrode includes a first external electrode and a second external electrode. Each of the first base electrode and the second base electrode contains a plurality of sintered bodies made of dielectric particles. At least a part of the plurality of sintered bodies is located at the interface between each base electrode and the laminate.

The utility model discloses a silicon capacitor electrode structure and a silicon capacitor, which can further improve the capacitance of a capacitor in a limited space by nesting, combining and arranging a plurality of groups of element arrays distributed in a triangular grid mode more reasonably and precisely, so that the capacitor can store more charges.

A ceramic capacitor with double L-shaped pins comprises two supports arranged oppositely, one or more ceramic chips arranged between the two supports and two first solder layers respectively arranged between the end portions of the one or more ceramic chips and the opposite supports, and each support comprises two frames arranged symmetrically and a second solder layer arranged between the two frames. According to the invention, the structure of the ceramic capacitor is limited, and the two symmetrically arranged frames are mutually welded through the welding flux to serve as the support, so that the welding area of the prepared support and the PCB is doubled, the welding strength of the prepared ceramic capacitor is improved, the bonding strength of the ceramic capacitor and the PCB is better, and the service life of the ceramic capacitor is prolonged. Compared with a single-frame ceramic capacitor, the ceramic capacitor can resist higher-strength vibration, improves the reliability of a product, and can be applied to high-reliability occasions such as space flight and aviation.

Provided is a multi-layered ceramic capacitor in which a penetration-type electrode unit, which is manufactured in a cone shape, passes through a plurality of internal electrodes in a collective stack of the internal electrodes and the dielectric layers, so that the capacitor is miniaturized and the electrical reliability thereof is improved.

A band-pass filter includes a first port, a second port, first to third high-pass filters provided between the first port and the second port in this order from a first-port side in a circuit configuration, and a low-pass filter provided between the second high-pass filter and the third high-pass filter in the circuit configuration. Each of the first to third high-pass filters forms an attenuation pole on a low-pass side of the passband. A frequency of the attenuation pole formed by the second high-pass filter is higher than a frequency of the attenuation pole formed by each of the first and third high-pass filters.

In a multilayer ceramic capacitor, a segregation amount of silicon and magnesium on an outer layer side of an outermost internal electrode layer is larger than a segregation amount of silicon and magnesium on an inner layer side of the outermost internal electrode layer, and when a region defined by an existence region of the outermost internal electrode layer and a segregation region of silicon and magnesium in contact with the outermost internal electrode layer is defined as a first region, a line edge roughness of an outer layer side of the first region is larger than a line edge roughness of an inner layer side of the first region.

A multilayer ceramic electronic component includes a first extension portion including a bent portion in a cross section. The multilayer body is divided into four regions by a straight line passing through a middle portion of the multilayer body in a lamination direction and a straight line passing through a middle portion of the multilayer body in a length direction, and a region adjacent to a first main surface and a first end surface among the divided four regions is defined as a first reference region, and a regression line derived based on values of x and y with respect to the bent portion in a reference region is defined as a virtual connection line, the virtual connection line intersects an effective layer portion.

A multilayer ceramic electronic device includes an element body including a dielectric layer and an electrode layer being laminated. The dielectric layer contains a main component represented by a formula ABO3. The dielectric layer contains 0.05 mol or more and 0.25 mol or less Mn oxide in terms of MnO; 1.00 mol or more and 2.50 mol or less Mg oxide in terms of MgO; 0.50 mol or more and 1.50 mol or less R oxide in terms of R2O3, where R includes at least one selected from the group consisting of Y, Dy, Ho, Yb, Lu, Gd, and Tb; and 0.05 mol or more and 0.45 mol or less Zr oxide in terms of ZrO2, with respect to 100 mol of the main component. The dielectric layer further contains V. The dielectric layer has a Zr / V ratio of 2.00 or more and 4.00 or less in atomic ratio.

The technology described herein is directed towards a capacitor with a modified design (relative to standard capacitors), in which a first conductor is coupled to a second conductor via a distributed array of conducting interconnects through a dielectric that separates the conductors. The array of interconnects facilitates electrical surface current flow between the first conductor and the second conductor, and determines the self-resonant frequency of the capacitor. The array (or enlarged area) of conducting interconnects, not present in standard capacitors, results in capacitors with larger self-resonant frequency, e.g., having a substantially stable capacitance over a range of high radio frequencies, including millimeter wave frequencies. This further provides an improved quality factor. The improvements resulting from the technology described herein facilitate more optimal surface current density. The modified capacitor provides benefits in various circuits, e.g., in an impedance or a millimeter wave frequency phase shifter for antenna elements.

The invention discloses a fixed vacuum capacitor with a short circuit function, which comprises a vacuum capacitor body, a movable conducting rod is arranged in the vacuum capacitor body, and the conducting rod is configured to connect two electrode groups of the vacuum capacitor body when the conducting rod deflects along a set direction so as to realize short circuit of the vacuum capacitor body. The movable conducting rod is arranged in the vacuum capacitor body, and when the conducting rod deflects, the two electrode groups can be connected to realize short circuit, so that the fixed vacuum capacitor has a short circuit function under the condition that the volume of the fixed vacuum capacitor is not changed; according to the design, the tedious problem that the circuit design of the radio frequency matcher needs to be changed by dismounting the fixed vacuum capacitor in specific scenes such as test and debugging of the radio frequency matcher and design of double-frequency and multi-frequency matchers is effectively solved, and the operation convenience is greatly improved; the specific requirements of a user for rapidly switching the working frequency and changing the circuit design of the radio frequency matcher are met, and the working efficiency is improved.

A dielectric composition, including: dielectric grains containing a main component represented by a composition formula [(CaxSr(1-x))O]m[(TiyHfzZr(1-y-z))O2] (m is more than 1.020); a grain boundary phase located between the dielectric grains; and segregation grains each containing at least Ca, Si, and O. A first segregation grain is defined as a segregation further containing Mn among the segregation grains each containing at least Ca, Si, and O, and a second segregation grain is defined as a segregation containing substantially no Mn among the segregation grains each containing at least Ca, Si, and O. N1 / (N1+N2) is more than 0.23 and 1.00 or less, in which N1 is a number density of first segregation grains in a cross-section of the dielectric composition, and N2 is a number density of second segregation grains in the cross-section of the dielectric composition.

A metal-insulator-metal (MIM) capacitor includes a dielectric layer forming a plane and a capacitor dielectric formed in a pattern having a width parallel to the plane and a height transverse to the plane. Electrodes are formed as sidewall spacers on opposite sides of the width of the capacitor dielectric. Each of the electrodes has a contact to make an electrical connection to the electrode, the contact being disposed within the height.

The invention provides an in-plane capacitor and a preparation method and application thereof. The in-plane capacitor comprises a substrate layer, a thin film layer covering the surface of the substrate layer and two gear shaping electrodes which cover the surface of the thin film layer and are arranged in a staggered mode. And the thin film layer is composed of an Aurivillius compound. The thin film layer of the in-plane capacitor provided by the invention adopts the Aurivillius compound which is free of fatigue and lead and has anisotropy, so that the dielectric constant and the energy density of the capacitor are improved, and a common perovskite material or an Aurivillius compound out-plane capacitor does not have the performance; besides, a structure that multiple layers of transverse capacitors are formed on the substrate layer is adopted, and two gear shaping electrodes which are arranged in a staggered mode are arranged on the surface of the thin film layer in a matched mode to serve as the transverse capacitors, so that the dielectric constant of the capacitor is improved, and the in-plane capacitor with high energy density is obtained.

A multilayer ceramic capacitor includes a multilayer body and outer electrodes on two surfaces of the multilayer body. The multilayer body includes an inner-layer portion and two outer-layer portions. The inner-layer portion includes first dielectric layers laminated in the lamination direction and a first inner electrode between the first dielectric layers. Each outer-layer portion includes at least one second dielectric layer and a second inner electrode in contact with the at least one second dielectric layer. A length of the second inner electrode is less than a length of the first inner electrode, or a width of the second inner electrode is less than a width of the first inner electrode. When each outer-layer portion is divided into two equal regions, a porosity of a region near the inner-layer portion is less than a porosity of a region farther from the inner-layer portion.

A multilayer ceramic capacitor includes: a capacitor body comprising a dielectric layer and an internal electrode layer; and an external electrode disposed on an outside surface of the capacitor body, wherein the capacitor body includes an active portion where the dielectric layer and the internal electrode layer are alternately disposed, side margin portions disposed at both side end portions of the active portion facing each other, and bonding portions disposed between the active portion and the side margin portions, and at least one of the active portion or the side margin portions includes a barium titanate-based main ingredient including barium (Ba) and titanium (Ti), and gallium (Ga).

A multilayer ceramic capacitor includes a multilayer body having a dimensional relationship of the dimension in the width direction is greater than the dimension in the length direction which is greater than the dimension in the height direction. The dimension in the width direction of a third surface portion of a first external electrode is smaller than the dimension in the width direction of a first surface portion. The dimension in the width direction of an eighth surface portion of a second external electrode is smaller than the dimension in the width direction of a sixth surface portion. The dimensions in the height direction of a fourth surface portion and a fifth surface portion of the first external electrode are smaller than the dimension in the height direction of the first surface portion.

A multilayer electronic component includes a body including a dielectric layer and first to fourth internal electrode layers disposed alternately in a first direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces respectively, wherein the internal electrode layer includes an internal electrode and a dummy electrode spaced apart from each other with a spacing portion therebetween, and at least two of the spacing portions may include regions overlapping each other in the first direction and other regions do not overlapping each other.

The present invention provides a multilayer ceramic electronic component, such as a multilayer ceramic capacitor, that is highly reliable. In a multilayer ceramic electronic component (1): a plurality of internal electrode layers have a first internal electrode layer (6a) exposed from a first end surface (E1) and a second internal electrode layer (6b) exposed from a second end surface (E2); a laminate (2) has an inner layer part in which the first internal electrode layer (6a) and the second internal electrode layer (6b) face each other in the lamination direction (T); the particle diameter of ceramic contained on a first lateral surface (S1) side and a second lateral surface (S2) side of the laminate (2) is smaller than the particle diameter of the ceramic contained in the center part of the laminate (2) in the width direction (W); and the particle diameter of the ceramic contained in the end parts of the inner layer part on the first end surface (E1) side and the second end surface (E2) side is the same as or larger than the particle diameter of the ceramic contained in the center part of the inner layer part.

Via array configurations for metal-insulator-metal (MIM) capacitor structures are disclosed herein. An exemplary MIM capacitor structure includes a capacitor bottom metal layer, a first dielectric layer over the capacitor bottom metal layer, a capacitor middle metal layer over the first dielectric layer, a second dielectric layer over the capacitor middle metal layer, and a capacitor top metal layer over the second dielectric layer. A metal via array, which has a first metal via and a second metal via, is connected to the capacitor top metal layer and the capacitor bottom metal layer. A portion of the capacitor top metal layer covers an area of the second dielectric layer extending from the first metal via to the second metal via. From a top view, the portion of the capacitor top metal layer surrounds the first metal via and the second metal via.

The present invention provides a biaxially stretched polypropylene film exhibiting a high dielectric breakdown strength even at high temperatures, and a metallized film using the biaxially stretched polypropylene film. The present invention provides a biaxially stretched polypropylene film, wherein an average value of ultrasonic wave propagation velocities in an omni direction at room temperature measured by using an ultrasonic wave orientation tester is 1.60 Km / see or more.

A capacitance module may include a capacitance electrode on a first substrate, shielding material disposed on a second substrate where the second substrate is aligned with the first substrate, an antenna where the shielding material is between the antenna and the capacitance electrode, and a continuous opening defined in the shielding material. The continuous opening may include a branching shape, the branching shape having a stem and multiple branches extending from the stem; and the continuous opening may overlap with the antenna.

The utility model discloses a silicon capacitor electrode structure and a silicon capacitor, which can further improve the capacitance of a capacitor in a limited space by nesting, combining and arranging a plurality of groups of element arrays distributed in a quadrilateral grid mode more reasonably and precisely, so that the capacitor can store more charges.

A filter device includes a dielectric substrate, first and second ground electrodes connected to a ground terminal, and resonators between the ground electrodes and electromagnetically coupled to each other. The ground electrodes are at different positions in a normal direction of the dielectric substrate. Each of the resonators includes a first capacitor electrode partially overlapping with the first ground electrode in plan view of the dielectric substrate, a second capacitor electrode partially overlapping with the second ground electrode in plan view of the dielectric substrate, and a via connecting the capacitor electrodes. The resonators include a first resonator connected to an input terminal, a second resonator connected to an output terminal, and a third resonator between the first and second resonators. Shunt electrodes are connected to the via and the ground terminal in the first and second resonators, respectively.