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456 results about "Circuit architecture" patented technology

Universial energy conditioning interposer with circuit architecture

InactiveUS7110227B2Solve and reduce industry problemSolve and reduce and obstacleMagnetic/electric field screeningSemiconductor/solid-state device detailsEnergy regulationInterposer
The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.
Owner:X2Y ATTENUATORS L L C

Universal energy conditioning interposer with circuit architecture

InactiveUS7301748B2Cost effectiveSolve or reduce industry problems and obstaclesImpedence networksSemiconductor/solid-state device detailsEnergy regulationInterposer
The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.
Owner:X2Y ATTENUATORS L L C

Universal energy conditioning interposer with circuit architecture

InactiveUS20050286198A1Solve and reduce industry problemSolve and reduce and obstacleImpedence networksSemiconductor/solid-state device detailsEnergy regulationInterposer
The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.
Owner:X2Y ATTENUATORS L L C

Architectures, circuits, systems and methods for reducing latency in data communications

Circuits, architectures, systems and methods for facilitating data communications and/or reducing latency in data communications. The architecture includes a clock recovery loop receiving data from a host device and providing a recovered clock signal, a filter circuit receiving recovered clock signal information and providing a control signal that adjusts the transmitter clock in response to recovered clock signal information and the two clock signals, and a transmitter receiving the control signal and transmitting data to a destination device in accordance with the transmitter clock. The circuitry generally includes a clock alignment block receiving first and second periodic signals and providing a control signal in response thereto, a filter for first periodic signal information, and a logic circuit configured to combine the control signal and the filtered information, thereby providing an adjustment signal for the second periodic signal. The systems generally relate to those that include the present architecture and/or circuit. The method generally includes determining a phase difference between first and second periodic signals, one of the periodic signals being recovered from a data stream; adjusting the other periodic signal in response to the phase difference and filtered information from the recovered periodic signal; and transmitting the data stream in accordance with said adjusted periodic signal. The present invention advantageously eliminates a FIFO memory in the data path, thereby reducing transceiver latency and improving system performance.
Owner:MARVELL ASIA PTE LTD

Universal Energy Conditioning Interposer with Circuit Architecture

The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.
Owner:X2Y ATTENUATORS L L C

Variable threshold transistor for the Schottky FPGA and multilevel storage cell flash arrays

An IC solution utilizing mixed FPGA and MLC arrays is proposed. The process technology is based on the Schottky CMOS devices comprising of CMOS transistors, low barrier Schottky barrier diode (SBD), and multi-level cell (MLC) flash transistors. Circuit architectures are based on the pulsed Schottky CMOS Logic (SCL) gate arrays, wherein a variable threshold NMOS transistor may replace the regular switching transistor. During initialization windows, existing FPGA programming techniques can selectively adjust the VT of the switching transistor, re-configure the intra-connections of the simple SCL gates, complete all global interconnections of various units. Embedded hardware arrays, hardwired blocks, soft macro constructs in one chip, and protocols implementations are parsed. A wide range of circuit applications involving generic IO and logic function generation, ESD and latch up protections, and hot well biasing schemes are presented. The variable threshold transistors thus serve 3 distinctive functions. It acts as an analog device to store directly nonvolatile information in SCL gates. It couples the diode tree logic functions. Finally, it stores and operates large amount of information efficiently. The mixed SCL type FPGA and MLC storages shall emerge as the most compact logic and memory arrays in Si technology. Low power, high performance, and high capacity ICs are designed to mix and replace conventional CMOS-TTL circuits. The idea of multi-value logic composed of binary, ternary, and quaternary hardware and firmware is also introduced.
Owner:SUPER TALENT ELECTRONICS
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