11068 results about "Printed circuit board" patented technology

The invention relates to the technical field of PCB detection, and discloses a PCB defect detection method and system, and the method comprises the steps: collecting multispectral imaging data through an image collection module, and generating an original image data set; the defect analysis server receives the synchronous imaging data to construct a three-dimensional surface topology matrix; in combination with the original image data set and the real-time imaging data, performing multi-scale decomposition on the three-dimensional surface topological matrix, extracting texture features, positioning a defect region, outputting defect type space distribution features through a layered recognition model, and updating the original image data set; and dynamically calibrating the detection parameters according to the feature categories. The system comprises an image acquisition module group, a data transmission module, a three-dimensional modeling module, a defect identification module and a parameter calibration module. According to the scheme, the accuracy, comprehensiveness and efficiency of defect detection are improved, and the detection requirements of modern PCB production are met.

The invention relates to the technical field of printed circuit board assembly quality detection, and discloses a PCBA anomaly detection method and system based on three-dimensional modeling and AI fusion, and a medium. The method comprises the following steps: acquiring three-dimensional point cloud data of a PCBA board to be detected; generating a reference three-dimensional digital twin model according to a standard PCBA design drawing; carrying out spatial registration on the three-dimensional point cloud data and the reference three-dimensional digital twin model, obtaining the three-dimensional point cloud data, carrying out hierarchical processing on the obtained three-dimensional point cloud data, extracting geometric features of a welding spot region, contour features of an element region and surface features of a substrate region, and carrying out fusion to generate a feature vector group; constructing a generative adversarial model based on a preset semi-supervised learning framework and the normal PCBA sample vector group; and inputting the feature vector group into a generative adversarial model, and examining the abnormal vectors, the corresponding three-dimensional coordinates and the abnormal types in the feature vector group by the generative adversarial model to complete the abnormal detection of the PCBA board. The method is suitable for quality control of a high-density and miniaturized PCBA.

The invention relates to the technical field of printed circuit board manufacturing and quality detection, in particular to a PCB forming detection method based on a hole site scatter diagram and SPC analysis, and the method comprises the steps: collecting the actual hole site data of a PCB substrate through an optical scanner or a laser measurement device, generating a scatter diagram containing coordinates, aperture and tolerance, and carrying out the detection of the hole site scatter diagram; an abnormal region is identified by using an improved density clustering algorithm; performing multi-dimensional analysis on the scatter diagram based on an SPC model, extracting characteristic parameters such as hole site density deviation, constructing a dynamic control limit, and calculating a CPK to judge a processing state; and when the CPK is lower than a threshold value, optimization instructions such as drilling path correction and drill bit wear compensation are generated and fed back to the equipment through the anti-saturation fuzzy PID controller to realize closed-loop control. According to the method, the hole site machining quality can be accurately detected, the machining parameters are adaptively adjusted, and the PCB forming precision and the production stability are effectively improved.

The invention relates to the technical field of laser engraving, and discloses a laser engraving method and system capable of automatically correcting coordinates of a galvanometer and a camera, and the method comprises the following steps: calculating a target conversion coefficient based on a calibration size and a pixel size of an image collected by the camera, and controlling the galvanometer to perform laser etching on a cross mark on the surface of a PCB (Printed Circuit Board), recording origin data of a galvanometer coordinate system; adjusting the position of the camera to enable the cross center of the view of the camera to coincide with the cross mark, and calculating the coordinate offset; coordinate space transformation is carried out on all the points to be machined, and galvanometer marking coordinate data are obtained; after laser engraving is carried out on the galvanometer marking coordinate data, an engraving area image is collected, the position residual error and the size proportion deviation are calculated, laser engraving is carried out again, and a laser engraving result is obtained. The technical problem that the visual positioning coordinate and the galvanometer marking coordinate in the laser engraving system are not consistent is effectively solved.

The invention relates to the technical field of automatic detection, in particular to a multi-station PCBA (printed circuit board assembly) detection method based on machine vision, which comprises the following steps: acquiring a multi-station reference pulse period, dividing a time window, comparing starting time difference, controlling image acquisition to synchronize, locally imaging a PCBA based on a synchronizing signal, extracting temperature response of a welding spot, and constructing a heat conduction path. Mapping to a visible light image, evaluating welding spot symmetry, extracting welding spot hue change, marking abnormal frames, recording defect path nodes, and generating a defect path structure. According to the method, the temperature response coordinate points in the welding spot area are extracted and the heat conduction direction vector path is constructed, so that the welding quality is evaluated more carefully and accurately, the thermal grid chart is mapped to the visible light image frame, the image analysis process is further optimized, the defect detection accuracy is enhanced, and the potential defect area is effectively identified; the efficiency and reliability of PCBA board detection are significantly improved, and powerful technical support is provided for high-quality production.

To provide a game machine with further technical improvements. [Solution] The board for controlling the game is provided with a printed circuit board on which multiple electronic components are mounted, the printed circuit board having a multi-layer structure in which one or more insulating layers and one or more conductor layers are stacked, and on the board surface, outside the mounting area in which the multiple electronic components are mounted, there is a peripheral area having a different color from the mounting area due to a stacking structure different from that of the mounting area.

The invention discloses a printed circuit board defect detection method and system based on cross-modal prompt learning and visual guidance, and the method comprises the following steps: obtaining a defect-free PCB image sample, and obtaining a training data set; constructing an initial printed circuit board detection model; training the initial printed circuit board detection model by using the training data set to obtain a printed circuit board detection model; and completing the defect detection of the printed circuit board by using the printed circuit board detection model. According to the method, a synthetic anomaly generation strategy based on a PCB structure and physical prior is provided, a two-channel storage library mechanism is introduced, and a synthetic anomaly sample most valuable for model training is screened out through a difficult case mining strategy, so that visual anomaly mode guidance is provided. According to the method, a double-constraint alignment optimization strategy combining comparison loss and triple loss is adopted, the mapping relation between vision and text features is adjusted, and cross-modal alignment and clear normal / abnormal boundaries are achieved. According to the method provided by the invention, the accuracy, the robustness and the generalization capability of PCB defect detection under the data sparse condition can be remarkably improved.

Systems, methods, and articles for a wearable and lightweight portable power case are disclosed. The portable power case is comprised of a cylindrical housing, at least two battery elements connected to a printed circuit board (PCB), and at least one separating barrier between the at least two batteries and the PCB. The portable power case is operable to supply power to an amplifier, a radio, a wearable battery, a mobile phone, a tablet, a portable satellite dish and / or any other power consuming device. The portable power case is operable to be charged using solar panels, vehicle batteries, AC adapters, non-rechargeable batteries, and / or generators.

The invention discloses a roadway deformation monitoring device based on a millimeter wave radar. The roadway deformation monitoring device comprises a main shell, the millimeter wave radar, a laser sensor, a PCBA (Printed Circuit Board Assembly) and a bubble level, and an integrated multi-modal data fusion analysis module, a dynamic measurement range intelligent adjustment module, a real-time deformation prediction and control module and a self-calibration and fault diagnosis module. The multi-modal fusion system fuses radar and laser data through a Kalman filtering algorithm, and full-scale high-precision monitoring is realized by using median filtering, Gaussian fitting preprocessing and dynamic weight distribution; the dynamic range measurement module intelligently switches measurement and frequency sweeping ranges based on a decision tree algorithm according to mining progress, geological conditions and distance fluctuation coefficients; the real-time prediction module adopts an ARIMA model to predict the deformation in advance, and automatically adjusts the scanning angle and the acquisition frequency; the self-calibration module uses a high-precision reflecting plate to correct errors everyday; the system supports 5G communication and remote control, has the advantages of high precision, self-adaption and high reliability, and is suitable for long-term deformation monitoring of mine roadways.

The invention discloses a high aspect ratio micropore pulse abrupt change current copper filling method and system, and belongs to the technical field of printed circuit board manufacturing, and the method comprises the steps: obtaining micropore structure parameters, and generating a gradient pulse abrupt change current waveform; monitoring a deposition thickness parameter of the orifice of the micropore in real time, and when the deposition thickness parameter exceeds a preset thickness threshold value, activating the reverse peak clipping pulse group; generating a resonant composite sound field in the electroplating bath; detecting the concentration distribution of the additive in the micropores in real time, and generating a dynamic adjusting instruction according to the concentration distribution of the additive; the independent injection rate of the accelerator and the inhibitor is controlled according to the dynamic adjusting instruction; and based on the gradient pulse abrupt change current waveform, the resonant type composite sound field and the dynamic adjusting instruction, the copper filling process is executed till the target deposition parameters are achieved. According to the method, a multi-field coupling mechanism of gradient pulse dynamic peak clipping, composite sound field synergistic mass transfer and additive concentration real-time regulation and control is adopted, and defect-free high-reliability copper filling can be achieved.

An electronic candle, including an inner housing, a light element disposed on the inner housing, a candle tube sleeved outside the inner housing and an electronic assembly, the candle tube is light-transmissive and non-transparent, the lighting element emits light that passes through the candle tube; and the electronic assembly includes a printed circuit board assembly (PCBA) and a lamp head, at least a portion of the PCBA is arranged within the inner housing, the PCBA is electrically connected to both the light element and the lamp head, and the lamp head extends through the candle tube.

The invention discloses a printed circuit board production parameter intelligent dynamic optimization method and system, and relates to the technical field of circuit board processing optimization, and the method comprises the steps: monitoring the real-time temperature data of a lamination part in real time; processing the real-time temperature data, and identifying a temperature unstable region in the production process; screening hot pressing roller process sections with stable temperature distribution to execute lamination operation; evaluating the risk level of the current lamination process; screening a low-risk temperature distribution mode based on the risk level to carry out lamination production, obtaining a quality deviation coefficient, and judging whether a preset process standard is met or not based on the quality deviation coefficient; and for products which do not meet the preset process standard, temperature control parameters in the production process of the products are traced, and the temperature set value of the hot pressing roller is dynamically adjusted. The method has the advantages that the real-time quantitative evaluation of the wear state of the hot pressing roller is realized, and the line width precision control capability and the interlayer alignment consistency are remarkably improved.

The invention discloses a visual large model PCB defect detection system based on a YOLOv10 deep learning network. The system comprises an image screening module, a defect area positioning module, a defect category identification module, a defect data integration module and a defect evaluation display module. According to the method, the image of the printed circuit board is acquired through an industrial camera, an image quality evaluation standard is set, a high-quality input image is screened, the influence of interference factors is suppressed, image features are captured by a YOLOv10 network trunk extraction layer, a positioning area is accurately screened by applying the intersection and combination ratio of a prediction frame and a real frame, and the offset between the center of a candidate frame and the position of an anchor frame is calculated. According to the method, the positioning precision is strictly controlled, the false detection rate is effectively reduced, defect area images are cut and classified through YOLOv10 classification branches, and detection results are uniformly mapped into standard defect type identifiers according to informatization processing, so that the uniformity and standardization of detection types are realized, and the PCB defect detection efficiency is effectively improved.

The invention discloses a printed circuit board withstand voltage detection and evaluation method, which comprises the following steps: in the whole withstand voltage detection process, aiming at different process batches and environments, acquiring electrical signals, process parameters, environment variables and multi-modal visual data, and carrying out time sequence synchronization marking and standardized preprocessing; extracting multi-source features by using a feature coding algorithm, and establishing a multi-mode distribution model covering signal mutation, visual defects and working condition anomalies; through cross-modal feature fusion and a time sequence causal inference model, an abnormal event causal relationship graph is automatically constructed, and a voltage withstanding failure root cause chain is identified and positioned; according to the method, the efficient structured management of the detection data, the accurate traceability of the abnormal reasons and the cross-batch analysis are realized, and the capability of diagnosing and preventing the withstand voltage abnormality of the printed circuit board is remarkably improved.

The invention provides a PCBA (Printed Circuit Board Assembly) multi-defect collaborative diagnosis method fusing hypergraph diffusion and cross-modal comparison, which comprises the following steps of: constructing a multi-layer hypergraph structure, and generating a multi-modal defect sample by adopting a condition hypergraph diffusion model based on the multi-layer hypergraph structure. Performing cross-modal feature alignment on the multi-modal defect sample by adopting a multi-layer alignment mechanism, and calculating a defect interaction matrix of aligned features; according to the defect interaction matrix, node features of each node in the node layer are updated by adopting a message passing mechanism of a graph neural network; and inputting the node features into a multi-task learning framework, and predicting the defect of each node to obtain a node defect prediction result. According to the method, complex correlation between PCBA defects can be effectively modeled, multi-mode sensor information is fully utilized, and the method has real-time collaborative diagnosis capability so as to meet the urgent requirements of the modern electronic manufacturing industry for high-precision, high-efficiency and high-reliability quality detection.

The invention discloses a method for manufacturing a rigid-flex printed circuit board with a surface flexible layer, which comprises the following steps of: taking a double-sided flexible copper-clad plate, manufacturing a through hole and electroplating, and then manufacturing a circuit pattern to form a pattern plate; manufacturing a first windowing covering film for windowing corresponding to the golden finger area and covering the through hole and a second windowing covering film for windowing corresponding to the through hole and the ineffective area, respectively attaching the first windowing covering film and the second windowing covering film to the two surfaces of the pattern board, and then carrying out electrometallization to form a flexible core board; taking a rigid copper-clad plate, windowing the rigid copper-clad plate corresponding to the flexible layered area, and then manufacturing a circuit pattern to form a rigid core plate; stacking and laminating the structures to form a laminated plate; drilling and electroplating are carried out on the laminated plate, then laser ablation is carried out on a through hole area, and the rigid-flexible combined plate is formed through post-process processing; by forming a new processing flow, the defects of low adaptability, processing precision and reliability of a traditional rigid-flex printed circuit board manufacturing method are systematically solved, and high-precision processing of the rigid-flex printed circuit board with high integration level is formed.

The invention discloses a layout method of a printed circuit board, a product, equipment and a readable storage medium, and relates to the technical field of PCB design, and the method comprises the steps: carrying out the optimization decoupling and optimization separation of a position layout and a rotation angle into independent stages of sequential execution, avoiding the mutual interference of two types of decisions, greatly reducing the search space, and improving the convergence efficiency. After newly-added elements are placed every time, all the placed elements on the current board are subjected to rotation optimization, the accumulated influence of default direction deviation of early-stage elements on subsequent layout is eliminated, the optimal solution is gradually approached through multi-round iteration, the total length of a finally-arranged wire net is reduced, the signal transmission performance of the PCB is remarkably improved, and the reliability of the PCB is improved. Therefore, the problem of irreversible influence of early decision on subsequent layout is solved, and the beneficial effects of improving layout quality and optimizing PCB circuit performance are achieved.

Various advanced wiring assemblies for a humanoid robot are disclosed. The wiring assembly includes a first actuator printed circuit board (PCB) positioned near a first side of a first actuator and including a first PCB terminal. A second side of the first actuator includes: an output, an actuator cover coupled to the output and having a wire bundle opening formed therein, and an actuator opening formed through an extent of the second side. The wiring assembly includes a wire bundle having: a first end connector coupled to the first PCB terminal, a second end connector coupled to the second PCB terminal, and a plurality of wires that extend between the first end connector and the second end connector, and wherein said plurality of wires extends through the actuator opening of the second side of the first actuator and the wire bundle opening formed in the actuator cover.

The invention discloses a PCB circuit microdefect real-time detection algorithm optimization method based on artificial intelligence, and relates to the field of printed circuit board monitoring, and the method comprises the steps: collecting multi-physical field data including a temperature field, a stress field, current density distribution and corrosion medium concentration in real time; generating time-space synchronous multi-modal fusion data; quantifying a thermal-mechanical-electric-chemical field interaction relationship through an inter-field coupling coefficient matrix; generating a four-dimensional synergistic effect matrix through tensor fusion; and based on the four-dimensional synergistic effect matrix, in combination with a spatio-temporal evolution diagram output by the carbonization path prediction model, establishing a three-dimensional mapping relationship among the crack size, the carbonization path and the material residual strength, and predicting a residual life prediction value. The method has the advantages that through real-time synchronous fusion of multi-physical field data and tensor coupling modeling, accurate tracking of a crack propagation path and dynamic evaluation of the residual life are achieved, the detection sensitivity is improved, and the life prediction error is reduced.

The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB lamination parameter control method and system, and the method comprises the steps: receiving a global pressure adjustment instruction; acquiring real-time temperature data of the to-be-laminated sheet, and constructing a surface temperature distribution diagram of the to-be-laminated sheet; the surface temperature distribution diagram is analyzed, and operation areas, with different thermal response attributes, of the to-be-laminated sheet are divided; according to the thermal response attribute of each operation region and the global pressure adjustment instruction, obtaining a region area weight and a response deviation coefficient, carrying out differential decomposition on the global pressure adjustment instruction, and calculating differential pressure adjustment amounts of the plurality of operation regions; and mapping the differential pressure adjustment amount to a multi-partition hydraulic execution mechanism in the laminating equipment, and controlling a target pressure value output by each operation area. The method has the advantages that refined and differentiated pressure adjustment of operation areas with different thermal response attributes in the plate can be achieved, and local defects caused by uneven material response are effectively avoided.

Systems, methods, and computer-readable media for calibrating air quality sensors are provided. A sensor node includes a sensor node printed circuit board, a sensor module, and a communication module. The sensor node printed circuit board manages power of the sensor node circuitry, the sensor module, and the communication module such that power is provided from a primary power supply supplemented by a secondary power supply. The sensor module includes a plurality of air quality sensors to measure the concentration of air pollutants. The sensor module may be replaceable. The communication module may communicate air quality measurements to and receive configurations from a data management platform, which may perform processes to improve the accuracy of the air quality measurements.

The invention discloses an automatic processing device and method for PCB lamination, and the method comprises the steps: depositing an erodable film on a lamination material layer and arranging a cavity concentric with a through hole array before the lamination of a PCB, and collecting acoustic resonance frequency data to obtain a reference matrix; dynamic dot frequency tracking processing is carried out on the multi-point acoustic time sequence signals in the pressing heating stage, and a through hole instantaneous acoustic track library is obtained; performing coupling judgment on time-temperature-pressure ternary working condition data according to the trajectory library to obtain a blockage risk matrix; carrying out time delay and gradient adjustment on a pressing temperature and pressure curve based on the risk matrix; and carrying out three-dimensional inversion processing on the whole board broadband acoustic spectrum collected before cooling, calculating through hole filling rate distribution and judging the quality of the board. According to the scheme, the resin filling state of the micro through hole can be monitored in real time in the PCB pressing process, an acoustic detection channel is constructed through the erodable film and the cavity structure, early warning and active intervention of the blocking risk are achieved, and the pressing quality is ensured.

The invention discloses an industrial PCB cooperative control method based on open-source and Feiteng CPUs, particularly relates to the technical field of industrial automatic production line control, and is used for solving the problem that a quality control instruction and a board card physical flow in an existing PCB production line are difficult to accurately synchronize, so that an adjustment instruction is lagged or mistakenly acted. A unique identifier is generated for each printed circuit board, the position of each printed circuit board is tracked in real time, and when a board card enters a synchronous control area, a Feiteng CPU obtains the state of each execution device; selecting a data query strategy based on state consistency, and collecting node state feedback and quality data; according to the method, the consensus convergence rate and the phase-frequency characteristic distortion index of the system are calculated, the triggering time point of a control instruction is dynamically adjusted when the index is abnormal, and a correction instruction is sent to execution equipment through an open source gap distributed soft bus, so that high-precision cooperative control of the instruction and board card flow is realized, and the real-time performance and reliability of closed-loop quality control are improved.

A method for electrically connecting a first electronic component of a battery system with a second electronic component of the battery system is provided. The first electronic component includes a flexible printed circuit (FPC) including: a pin formed by folding a connection portion of the FPC; and a conductive strip on an outer surface of the folded connection portion. The second electronic component includes a printed circuit board (PCB) having a through-hole configured to receive the pin of the FPC and includes an electrically conductive plating adjacent to the through-hole. The method includes: attaching the FPC to a first side of the PCB such that the pin of the FPC is received in the through-hole in the PCB; and soldering the pin of the FPC to the conductive plating on the PCB to electrically interconnect the FPC and the PCB.

The invention relates to a printed circuit board multilayer interconnection method, which comprises the following steps: firstly, automatically identifying and dividing interconnection channel areas of a circuit board, acquiring multi-dimensional parameters such as materials, thermal expansion coefficients and thermal cycle working conditions, realizing differential distribution and accurate preparation of a nano composite sensing material based on the multi-dimensional parameters, and obtaining the multi-dimensional parameters of the circuit board through an in-situ physical parameter acquisition and self-adaptive discrimination algorithm. Dynamic discrimination of stress abnormity and reverse driving of a micro heater are realized, the structure is induced to generate directional deformation so as to realize local automatic compensation, multi-point parameter data before and after compensation are used for health state modeling and residual life prediction, and big data archiving is combined to feed back manufacturing process optimization.

The invention relates to the technical field of printed circuit board copper embedding, and discloses a method and device for controlling the copper embedding quality of a printed circuit board, computer equipment and a storage medium. The method comprises the following steps: acquiring a projection image of a copper nail grabbed by a mechanical arm and a hole site on a printed circuit board; converting the projection image into a three-dimensional image; extracting information in the three-dimensional image to obtain the diameter of the copper nail and the diameter of the hole site; calculating a difference value between the diameter of the copper nail and the diameter of the hole site to obtain an interference value; judging whether the interference value exceeds a preset threshold value or not; and if the interference value does not exceed the preset threshold value, controlling the mechanical arm to embed the copper nail into the hole site of the printed circuit board so as to complete the copper embedding operation. According to the method, high-precision quantitative detection of the diameter of the copper nail and the diameter of the hole site is achieved, the difference value of the two diameters is calculated in real time, whether the interference magnitude of copper embedding operation is within the design range or not can be accurately judged, the copper embedding yield is increased, and the rework and scrap cost caused by copper embedding defects is reduced.

The present invention relates to a magnetic resonance system and a gradient amplifier filter for a magnetic resonance system. The filter includes a plurality of non-magnetic core inductors and a printed circuit board having a multilayer structure, a plurality of filter capacitors being formed in a plurality of regions of the printed circuit board, respectively, wherein each non-magnetic core inductor is provided on the printed circuit board and spanning two of the plurality of filter capacitors.

The invention discloses an X-ray detection device and method for detecting a PCB, and the device comprises a housing, and an X-ray emission source transmission system, an X-ray detector transmission system and a PCB conveying system which are disposed in the housing. The X-ray emission source transmission system is high in X-ray emission source transmission speed, high in precision and small in vibration quantity, the X-ray detector transmission system is high in X-ray detector transmission speed, high in precision and small in vibration quantity, the PCB conveying system can automatically input and output PCBs, the height of the PCBs can be automatically adjusted, and the PCB conveying efficiency is improved. The PCB conveying system can adapt to PCBs with different width sizes, and can be prevented from blocking X rays.

A device may include a radome. A device may include a spacer coupled to the radome. A device may include a first antenna element formed on a first printed circuit board (PCB) and configured to be housed by the radome, wherein the first antenna element is a multi-band antenna element comprising: one or more low-band radiating elements, one or more mid-band radiating elements; and one or more high-band radiating elements. A device may include a second antenna element formed on a second PCB and configured to be housed by the radome, the second antenna element comprising one or more WiFi antenna elements. A device may include a third antenna element formed on a third PCB and configured to be housed by the radome, the third antenna element comprising one or more global positioning system (GPS) antenna elements.

The invention relates to the technical field of printed circuit board defect detection, and provides a PCB defect detection method, device and equipment based on improved YoloV11n, and the method comprises the steps: constructing and enhancing a data set; an improved YOLOv11n model is constructed, wherein a C3k2IPConv module is used for replacing C3k2 modules of p2, p4, p6 and p8 layers of a YOLOv11n backbone network; an IPConv module is used for replacing the two 3 * 3 Conv modules of the detection head part; constructing a small target detection head at the detection head part; replacing a CIoU loss function with an Inner-MPDIOU loss function at a detection head part; the enhanced data set is input into the improved YOLOv11n model for training; and the trained Yolov11n model is used to detect the PCB defect, and the defect type is obtained. According to the method, the modeling capability of the model to the edge features of the defects in the complex form is enhanced, the adaptability of the model to defect targets in different sizes is enhanced, and the instability in the training process is reduced.