Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

45964 results about "Printed circuit board" patented technology

A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.

Resilient contact structures formed and then attached to a substrate

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.
Owner:FORMFACTOR INC

Tablet computing device with three-dimensional docking support

InactiveUS6856506B2Improved expansion baseImproved docking stationInput/output for user-computer interactionCoupling device connectionsTablet computerData connection
The present invention provides a tablet computer and a docking station assembly. This docking station comprises a docking assembly for positioning with three degrees of freedom and having a data connector for mechanically supporting and interfacing with the tablet computer. A support member couples the docking assembly to an expansion base. The base includes a number of ports for interfacing with a variety of peripheral devices or power supplies. These varieties of ports mount to a printed circuit board contained within the expansion base. A flexible printed circuit (FPC) combines the signal pathways for the variety of ports, allowing the signal pathways to travel from the printed circuit board and to the data connector. The tablet computing device has a plurality of contact or touch points positioned on the right and left edges of the tablet to facilitate aligning the tablet to the docking assembly in either a landscape or portrait mode.
Owner:ZEBRA TECH CORP

Direct current combiner box with power monitoring, ground fault detection and communications interface

A combiner box is used to collect direct current from solar panels or other energy sources. The combiner box integrates all means necessary for ground fault detection, current monitoring, voltage monitoring, and power monitoring. The combiner box may include a communication interface suitable for Web enabled monitoring, electronic notifications of system status, and / or remote control of system functions. In one embodiment, the combiner box uses integrated circuits and printed circuit board technology to achieve new efficiencies in manufacturing, installation and system analysis at the string level. A separate hand piece may be used by installers to test the performance of the combiner box, installation of the solar panels, performance of the solar panels and connections between the solar panels and the combiner box.
Owner:ENERGY RECOMMERCE

Microwave garment for heating and/or monitoring tissue

A flexible microwave applicator and method of use thereof. The applicator includes a flexible, dielectric-containing compartment (e.g. temperature regulated water or oil) having a variable contour, tissue-engaging surface and an opposite non-tissue-engaging surface and an antenna array adjacent to a non-tissue-engaging surface. The antenna array includes at least one flexible printed circuit board having a front metal surface, a dielectric substrate, a back metal surface, a connection structure for connecting the antenna array to at least one external microwave device, at least one dual concentric conductor aperture on the front surface, and at least one microstrip feedline in communication with the dual concentric conductor aperture and the connection structure. The microwave applicator also includes flexible attachment material for placement over the antenna array and dielectric compartment to allow the microwave applicator to be attached to a subject like a garment which closely conforms to the anatomy portion to be heated. The flexible attachment material may be configured such that the microwave applicator is configured as an appropriately-shaped type of garment, for example, a vest, jacket, cap, hood, blanket, custom shaped conformal wrap, sleeve, or as a pair of shorts.
Owner:RGT UNIV OF CALIFORNIA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products