6356 results about "Printed circuit board" patented technology

The invention discloses a printed circuit board withstand voltage detection and evaluation method, which comprises the following steps: in the whole withstand voltage detection process, aiming at different process batches and environments, acquiring electrical signals, process parameters, environment variables and multi-modal visual data, and carrying out time sequence synchronization marking and standardized preprocessing; extracting multi-source features by using a feature coding algorithm, and establishing a multi-mode distribution model covering signal mutation, visual defects and working condition anomalies; through cross-modal feature fusion and a time sequence causal inference model, an abnormal event causal relationship graph is automatically constructed, and a voltage withstanding failure root cause chain is identified and positioned; according to the method, the efficient structured management of the detection data, the accurate traceability of the abnormal reasons and the cross-batch analysis are realized, and the capability of diagnosing and preventing the withstand voltage abnormality of the printed circuit board is remarkably improved.

Systems, methods, and computer-readable media for calibrating air quality sensors are provided. A sensor node includes a sensor node printed circuit board, a sensor module, and a communication module. The sensor node printed circuit board manages power of the sensor node circuitry, the sensor module, and the communication module such that power is provided from a primary power supply supplemented by a secondary power supply. The sensor module includes a plurality of air quality sensors to measure the concentration of air pollutants. The sensor module may be replaceable. The communication module may communicate air quality measurements to and receive configurations from a data management platform, which may perform processes to improve the accuracy of the air quality measurements.

The present invention relates to a magnetic resonance system and a gradient amplifier filter for a magnetic resonance system. The filter includes a plurality of non-magnetic core inductors and a printed circuit board having a multilayer structure, a plurality of filter capacitors being formed in a plurality of regions of the printed circuit board, respectively, wherein each non-magnetic core inductor is provided on the printed circuit board and spanning two of the plurality of filter capacitors.

The invention discloses an X-ray detection device and method for detecting a PCB, and the device comprises a housing, and an X-ray emission source transmission system, an X-ray detector transmission system and a PCB conveying system which are disposed in the housing. The X-ray emission source transmission system is high in X-ray emission source transmission speed, high in precision and small in vibration quantity, the X-ray detector transmission system is high in X-ray detector transmission speed, high in precision and small in vibration quantity, the PCB conveying system can automatically input and output PCBs, the height of the PCBs can be automatically adjusted, and the PCB conveying efficiency is improved. The PCB conveying system can adapt to PCBs with different width sizes, and can be prevented from blocking X rays.

The embodiment of the invention provides a preparation method of a carrier plate structure, the carrier plate structure and a mobile terminal, the carrier plate structure is used for connecting an integrated circuit and a printed circuit board, in the embodiment of the application, a first wiring layer is prepared on a first temporary substrate, and then a substrate is prepared on the first wiring layer, so that the preparation difficulty of the first wiring layer can be reduced, and the production efficiency is improved. And the possibility that the substrate is damaged in the preparation process of the first wiring layer is reduced. Meanwhile, the softer first wiring layer is prepared firstly, the second temporary substrate and the first wiring layer can carry out bottom wrapping on the substrate, stress borne by the substrate in the preparation process of the substrate and the second wiring layer can be reduced, the possibility that the substrate is damaged and cracked is further reduced, and therefore the preparation yield of the carrier plate structure is increased.

A vertically-polarized omnidirectional antenna, including: a body including: a host printed circuit board (PCB) including: first and second slots, and a metal flooded ground plane, first and second antenna PCBs forming four dipole pairs, the first and second antenna PCBs mounted to the host PCB, respective first to third ground connection fillet tabs, the first and second tabs being on an opposite side of the host PCB from the third tab, the first to third tabs being on a same side of its antenna PCB, an amplitude taper on each antenna PCB at transitions between the host and antenna PCBs, including: a first transmission line splitting off into a second transmission line and a third transmission line, the second transmission line feeding two antennas to form one dipole pair, the third transmission line stepping down using a quarter-wave transformer, and a radio frequency (RF) connector to receive a power supply.

The invention relates to the technical field of intelligent control, and discloses an intelligent control method for an etching process of a PCB (Printed Circuit Board), which comprises the following steps of: acquiring an image of an object to be processed, generating a discretized virtual load sequence, establishing a virtual shift register synchronized with a feedback pulse trigger clock of a transmission device encoder, driving the virtual load sequence to execute logic displacement of physical displacement phase locking; comparing the theoretical torque with the actual torque to obtain a torque residual error; a dynamic gain correction coefficient is calculated based on the torque residual error, the basic feed-forward gain is weighted and modulated in real time, and a control instruction is generated, and a time sequence error caused by transmission speed fluctuation is avoided by constructing a rigid space-time synchronization architecture based on a virtual shift register; a torque residual error is used as a non-intrusive observation variable, and a gain scheduling mechanism is combined, so that self-adaptive compensation for impedance drift of a controlled medium under the condition of no physical sensor is realized.

The invention discloses a high-density printed circuit board circuit forming process compensation method, which comprises the following steps of: firstly, collecting and standardizing structures and detection data of multiple batches and multiple process sections, and constructing a multi-target compensation optimization model through multi-dimensional parameter integration and feature extraction; the multi-objective compensation optimization model fuses objectives such as size precision, cost, electrical and thermal behaviors, establishes inter-objective collaborative constraints, introduces a reinforcement learning algorithm, dynamically adjusts weights of all the objectives, continuously optimizes compensation amount distribution in combination with process simulation feedback, finally fuses the optimal compensation weight into actual process control and collects effect feedback, and finally achieves the purpose of optimizing the optimal compensation weight. According to the method, high-precision and multi-target adaptive optimization of process compensation is realized, and the forming quality and the production efficiency of the circuit board are improved.

The invention discloses a PCB (Printed Circuit Board) defect detection method based on machine vision, which relates to the related technical field of computer vision, and comprises the steps of multi-modal data acquisition, data preprocessing and feature extraction, feature fusion, classification, positioning and marking of extracted feature vectors by adopting a support vector machine as a classifier, and establishment of a defect sample library. According to the method, each modal data reflects the state of the PCB from different aspects, the fusion of the multi-modal data can be mutually verified and supplemented, misjudgment and missed judgment are reduced, the related samples in the sample library can enable the model to know the performance of the defects on different materials, so that the defects can be identified more accurately in the detection, and the detection accuracy is improved. By acquiring the image sequences of the same circuit board in different production stages and processing the image sequences by using the long-short-term memory network model, the change trend of the defects in time sequence can be captured, so that the development of the defects in the future production stage can be predicted.

A keyboard may include a top case and a bottom case coupled with each other to define an internal compartment. Multiple internal layers are contained within the internal compartment. The multiple internal layers may include a plurality of keys mounted on a switch plate, wherein a portion of each of the plurality of keys protrudes over the top case; a printed circuit board (PCB) layer disposed under the switch plate; a gasket layer disposed under the PCB layer. The gasket layer comprises a peripheral wall and a bottom floor integrally formed with the peripheral wall. The switch plate is coupled with the peripheral wall of the gasket layer.

The invention discloses a piezoelectric air cooling device based on a piezoelectric film PZT technology, and relates to the technical field of MEMS. The device adopts a two-layer packaging structure of a piezoelectric cantilever beam MEMS chip and a PCB (Printed Circuit Board) with a vent hole. A cantilever beam of the MEMS chip is integrated with an SOI top silicon layer and an ultrathin PZT driving stack, low rigidity and high driving force are achieved, and the surface of the cantilever beam is covered with a PDMS flexible sealing layer to achieve dynamic sealing. When the device works, the cantilever beam is driven to resonate in an ultrasonic frequency band, and efficient synthetic jet is generated at the vent hole by periodically changing the volume of the pump cavity. The technical bottleneck that miniaturization and high performance are difficult to consider at the same time is broken through, and the device has the advantages of being compact in structure, mute and efficient and is suitable for precise heat dissipation of miniature electronic equipment.

The invention relates to the technical field of artificial intelligence, and discloses a wiring optimization method and device for a printed circuit board, equipment and a medium, and the method comprises the steps: recognizing the number of layers, obtained in advance, of the printed circuit board, carrying out the multi-dimensional feature analysis of the circuit wiring of each layer according to the number of layers, and obtaining the global wiring features of a circuit; performing wiring analysis on the global wiring characteristics of the circuit by using a predetermined optimization analysis algorithm to obtain a global wiring optimization path; extracting local key wiring features in the global wiring optimization path, and performing wiring analysis on the local key wiring features by using an optimization analysis algorithm to obtain a local wiring optimization path; and generating a wiring optimization scheme of the printed circuit board according to the global wiring optimization path and the local wiring optimization path. And the wiring accuracy of the printed circuit board is improved.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

Systems, devices, and methods related to dual linear polarized wideband antennas for compact antenna arrangements are provided. An example antenna structure includes a multi-layered printed circuit board (PCB); a folded magnetoelectric antenna element including a first portion disposed on a first layer of the multi-layered PCB and a first fold portion contiguous to the first portion and extending to at least a second layer of the multi-layered PCB; and a patch antenna element disposed on a third layer of the multi-layered PCB, wherein the first, second, and third layers are separate layers of the multi-layered PCB. The antenna structure further includes a first feeding port electrically coupled to the patch antenna element, and a second feeding port electrically coupled to the patch antenna element, where the first and second feeding ports are associated with different polarizations.

The invention relates to a multispectral-based printed circuit board detection method, which comprises the following steps of: firstly, acquiring and marking images and structural attributes of a printed circuit board under a multispectral channel, constructing a structured data set, and sequentially performing spatial correction, resolution unification and spectral normalization to form a consistent standard image; according to the method, space coordinate embedding and consistency modeling are utilized to realize accurate alignment of each channel image, and space and spectrum fusion parameters are optimized based on a joint adversarial learning network to obtain a self-adaptive enhanced image. On the basis, the micro-feature residual error is subjected to regional enhancement through a structural sensitive attention mechanism, and the detectability of the micro-defect is improved. And finally, the intelligent identification network realizes automatic screening and precise positioning of the micro-defects, and guarantees the detection precision and model adaptability based on a quality evaluation model and a self-correction feedback mechanism. According to the method, the PCB multispectral image fusion quality and the micro-defect detection capability can be remarkably improved.

The invention relates to the technical field of high-frequency electrotomes, in particular to a bending compensation device for a high-frequency electrotome, which comprises a handle, a button, a PCBA (printed circuit board assembly) control panel, a power line, a conductive part, a T-shaped part, an inner snake-bone tube, an outer snake-bone tube, a sleeve, a first connecting piece and an electrotome. According to the bending compensation device for the high-frequency electrotome, a rotating sleeve of the rotating assembly can drive an inner rotating block, a second connecting piece and a snake-bone pipe to rotate integrally, stability of a sliding ring is not affected when the inner snake-bone pipe rotates due to the arrangement of a bearing, and further rotating adjustment of the electrotome on the basis of bending is achieved; the cutting requirements of multiple directions and complex angles are met, and the flexibility and accuracy of surgical operation are improved.

The invention relates to the technical field of PCB production, in particular to a high-precision PCB press-fit board and a warping compensation device thereof, the warping compensation device is adopted to process the PCB press-fit board, the warping compensation device comprises a supporting frame, and the supporting frame is provided with a detection unit used for detecting the edge warping degree of the PCB press-fit board; the device further comprises a compensation unit movably connected to the supporting frame, the compensation unit comprises a moving part, the two ends of the moving part are movably connected with connecting frames, the outer ends of the connecting frames are fixedly provided with frame bodies, the frame bodies are internally and movably connected with adjusting mechanisms, and the adjusting mechanisms are used for applying external force to the edges of the two sides of the PCB pressing plate to achieve warping compensation. The warping degree of the edges of the two sides of the PCB press-fit plate can be accurately detected when the PCB press-fit plate is compensated, and the subsequent extrusion force on the PCB press-fit plate can be adaptively adjusted according to the warping degrees of different PCB press-fit plates, so that accurate warping compensation of the PCB press-fit plate is realized, and the high-precision PCB press-fit plate with low warping degree is obtained.

According to the printed circuit board and the preparation method thereof provided by the invention, the glass core plate is used for replacing a traditional resin material, and the characteristics of low thermal expansion coefficient, low humidity coefficient and low dielectric constant of the glass core plate are utilized, so that warping and signal interference caused by temperature change and environment humidity are effectively reduced, and the stability and reliability of the PCB are remarkably improved. Meanwhile, by repeatedly constructing a multilayer layer-adding structure, adopting an ABF layer at the position adjacent to the glass substrate and adopting dielectric layers with Dk < = 3.0 and Df < = 0.001 for the rest, signal attenuation and interference can be effectively reduced, signal integrity and transmission efficiency can be ensured, overall buckling deformation of the PCB structure can be reduced or even avoided, and the PCB structure is more stable in performance. The multi-layer adding meets the requirements of different application scenarios for the number of layers of the PCB, improves the flexibility and applicability of the PCB, and enables the PCB to be especially suitable for the application scenarios of high-frequency and high-speed signal transmission.

The invention relates to the technical field of electronic design automation, and provides a printed circuit board wiring method and device, equipment, a medium and a program, and the method comprises the steps: classifying an obstacle as a pushable object or a non-pushable object; based on the relative position relationship between the initial path and the pushing object, constructing a geometric occupied area of the pushing object, and performing path offset on the pushing object according to the geometric occupied area; in the deviation process, if the distance between any deviated object capable of being pushed and any deviated object not capable of being pushed is smaller than a preset safety distance, further deviation is stopped, and the deviated object capable of being pushed is reversely returned along the deviation track of the object until the distance between the object capable of being pushed and the object not capable of being pushed is larger than or equal to the safety distance; and re-planning a final path of the signal line according to the position of each pushable object after returning, and outputting a wiring result according with a wiring rule. The method is used for optimizing and completing signal path optimization and distribution in an environment with obstacles.

The invention provides a printed circuit board surface defect intelligent detection method and system, and the method comprises the steps: firstly collecting a batch-level defect classification original confidence sequence and synchronous process state parameters, extracting the mean value, variance, change rate and other dynamic characteristics of confidence, and fusing the dynamic characteristics with process parameters to obtain a data fusion model; inputting a pre-training time sequence model to predict the confidence coefficient trend of the next batch; the classification threshold value of the key defect category is dynamically adjusted through the deviation between the actual confidence coefficient mean value and the predicted confidence coefficient mean value, non-linear function self-adaptive mapping is adopted for the adjustment coefficient, and self-adaptive optimization of the classification model threshold value along with quality fluctuation is achieved; when the production line is in a stable stage, threshold adjustment is automatically frozen. The method improves the accuracy of defect identification and the adaptability of the production line.

A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths that are disposed on a surface of the base film, and a connector that has an opposing surface opposing the surface of the base film and that is connected to the plurality of conduction paths, the plurality of conduction paths and electrode terminals of the plurality of power storage elements are electrically connected, the connector includes connection portions that are connected to the plurality of conduction paths, and at least some of the plurality of conduction paths are routed from the connection portions through a space between the surface of the base film and the opposing surface of the connector.

An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.

Systems, methods, and articles for a wearable and lightweight portable power case are disclosed. The portable power case is comprised of a cylindrical housing, at least two battery elements connected to a printed circuit board (PCB), and at least one separating barrier between the at least two batteries and the PCB. The portable power case is operable to supply power to an amplifier, a radio, a wearable battery, a mobile phone, a tablet, a portable satellite dish and / or any other power consuming device. The portable power case is operable to be charged using solar panels, vehicle batteries, AC adapters, non-rechargeable batteries, and / or generators.

A retention mechanism is provided to couple a compression attached memory module (CAMM) to a printed circuit board (PCB). The retention mechanism includes a retention bracket and a retention spring. The retention bracket is soldered by a solder flange to the PCB and retains a CAMM connector within the retention bracket. The retention spring retains the CAMM and compresses the CAMM onto the CAMM connector and the PCB.

The invention relates to the technical field of machine vision detection, in particular to an intelligent production control method of a PCB (Printed Circuit Board). The method comprises the following steps of: shooting a sampling inspection board, extracting characters and fixed through hole characteristics, aligning the characters and the fixed through hole characteristics with a standard character board, mapping a silk-screen layer circuit to the standard board, and calculating the cross density of a character frame and a circuit; dividing the board into an upper area, a middle area and a lower area, screening characters with low cross density in each area as measurement identifiers, and calculating an offset vector and a vector mean value of each area; and then, according to the region weights and the vector mean values, evaluating an overall offset estimated value, if the overall offset estimated value exceeds a threshold value, generating an affine transformation matrix according to the vector mean values of the regions, obtaining continuously changing compensation parameters through smooth interpolation, and according to the affine transformation matrix, performing pre-deformation processing on the original silk-screen graph to generate a corrected silk-screen file to drive printing. According to the invention, automatic detection and intelligent compensation of character local offset are realized, and the printing alignment precision and the production quality are improved.

An electronic device is provided. The electronic device includes a slidable housing including a first housing and a second housing, a first substrate included in the first housing and including a processor, a second substrate included in the second housing, a flexible printed circuit board (FPCB) which includes a ground line, electrically connects the first substrate and the second substrate to each other, and has a shape changed according to the movement of the slidable housing, and a matching circuit electrically connecting the first substrate and at least a portion of the ground line of the FPCB, and changing impedance under the control of the at least one processor according to the shape of the FPCB.

A flexible light therapy helmet is disclosed. The flexible light therapy helmet comprises an outer layer formed of Ethylene Vinyl Acetate (EVA) material via an injection molding process. The outer layer defines a wearing space. An inner layer formed of the EVA material via the injection molding process. The inner layer is disposed on a side of the outer layer facing the wearing space. A printed circuit board (PCB) is disposed between the inner layer and the outer layer. The PCB comprises a plurality of light-emitting diodes (LEDs). A plurality of light-transmitting holes formed in the inner layer. Each light-transmitting hole is aligned with a corresponding LED to transmit therapeutic light toward a user's scalp.

Antenna for a motor vehicle, comprising a mounting plate suitable to be connected to a mounting surface of the motor vehicle, a first printed circuit board adapted to be connected, in a substantially horizontal position, to the mounting plate, first and second radiating elements for transceiving respective first and second signals with the environment outside the antenna.Both radiating elements comprise a respective printed circuit board along which there are arranged respectively a first electrically conducting track and a second electrically conductive track which extend along the respective printed circuit board along a substantially helical or serpentine path.The first radiating element has a maximum height, measured from the top surface of the first printed circuit board along the substantially vertical direction, and the first height of the first electrically conducting track is less than or equal to one-half of the maximum height of the first radiating element.

A power tool includes a housing, an electric motor disposed within the housing, a first printed circuit board assembly configured to selectively supply electric current to the electric motor, causing the electric motor to activate and drive a tool element, and a battery receptacle configured to support a removable battery pack. The battery receptacle has a battery terminal block electrically connected to the battery pack to supply electrical current to the first printed circuit board assembly. The power tool further includes a second printed circuit board assembly electrically connected between the first printed circuit board assembly and the battery terminal block. The second printed circuit board assembly has a fuse and a thermistor configured to detect a temperature of the fuse.

A lighting system comprising at least one bulb assembly, an integrated switching power supply, a plurality of electrical wires electrically connecting the bulb assembly to the power supply, and male / female connectors. The bulb assembly has a housing including a light source disposed on a surface of a printed circuit board (PCB), at least one processor provided on the PCB, at least one electrical connector disposed on another surface of the PCB and configured to connect to the plurality of wires, and a means for sealing the housing against water ingress.