46095 results about "Printed circuit board" patented technology

There is provided a flat type vibration motor 100 that includes a bracket 150 with a shaft 140 of which one end is inserted into and fixed to the center thereof, a printed circuit board 110 having a terminal portion 130 receiving external electricity and disposed on the side of the bracket 150, a stator disposed on the top of the printed circuit board 110, a rotor 170 rotatably installed in the shaft 140 and generating vibration while rotating by interaction with the stator 160, and a stopper 180 installed at the other end of the shaft 140. The bracket 150 and the shaft 140 are electrically connected with the terminal portion 130. Further, it is possible to use the bracket or a shaft as an external power connection terminal by electrically connecting a negative terminal to the bracket and the shaft through the contact portion.

A light emitting diode (LED) light bulb that includes plural individual elements as sub-assembly elements of the overall light bulb. Different sub-assembly elements of a lens, a LED printed circuit board, a housing also functioning as a heat sink, a lower housing, and other individual sub-assembly components are utilized. The LED printed circuit board sub-assembly containing the LEDs can also be provided relatively close to a base.

An accessory module is mountable to an interior surface of a vehicle windshield and includes a mounting element securable to an interior surface of a windshield of a vehicle, and an accessory support having a base portion attachable to the mounting element. The accessory support includes an accessory holding element configured to hold an accessory, at least one circuitry holding element configured to hold a printed circuit board at the accessory support, and an electrical connector for electrically connecting the printed circuit board and the accessory to an electrical source of the vehicle. The base portion, the accessory holding element and the circuitry holding element are integrally molded together so that the accessory support comprises a unitarily molded accessory support. The accessory module includes a cover portion attachable to the accessory support to substantially encompass the accessory and the printed circuit board within the accessory module.

An interior rearview mirror assembly for a vehicle includes a reflective element and a casing. An attachment plate is secured to the reflective element and an electronic circuitry element, such as a printed circuit board, is attached to the attachment plate. The attachment plate includes at least one mounting member protruding through the circuit board for engaging a mounting assembly that mounts the mirror assembly to an interior portion of the vehicle and directly supports the attachment plate, along with the printed circuit board and the reflective element at an end of the mounting assembly. The mounting assembly may comprise a toggle assembly for a prismatic reflective element.

A printed circuit board based digital or droplet microfluidic system and method for producing such microfluidic system are disclosed. The digital microfluidic device comprises a printed circuit board having a substrate and a plurality of electrode pads disposed on the top surface of the substrate in a rectangular array. A via extends from each electrode pad through the substrate to other locations on the substrate . A dielectric layer is disposed on the electrode pads. Droplets may be manipulated using electrowetting principles and others by applying a voltage to the desired electrodes. Each electrode pad can be controlled directly and independently from the other electrode pads to modify the surface wettability of the dielectric layer in the vicinity of the electrode pad by applying a voltage to the desired electrode pad(s). In this way, droplets may be formed, moved, mixed, and / or divided or other small objects manipulated while in air or immersed in a liquid on the dielectric surface.

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a "temporary" (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

System-in packages, or multichip modules, are described which can include multi-layer chips and multi-layer dummy substrates over a carrier, multiple through vias blindly or completely through the multi-layer chips and completely through the multi-layer dummy substrates, multiple metal plugs in the through vias, and multiple metal interconnects, connected to the metal plugs, between the multi-layer chips. The multi-layer chips can be connected to each other or to an external circuit or structure, such as mother board, ball grid array (BGA) substrate, printed circuit board, metal substrate, glass substrate, or ceramic substrate, through the metal plugs and the metal interconnects.

A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

A sensing device and method for use in imaging surface features of an object is provided. A surface along which an object can slide in a predetermined direction includes an array of contact sense elements configured to form a single array oriented transverse to the predetermined direction and at least one additional contact sense element located in spaced relation to the single array in a manner that enables a velocity measurement of the object in the predetermined direction. A scanning device is configured to provide a periodic scan of the array of contact sense elements, and a processor in circuit communication with the scanning device is configured to receive data from the scanning device and to produce image and velocity data related to the object. Preferably, the contact sense elements are electrically conductive elements disposed on a ceramic or polymeric substrate, using printed circuit board construction. A technique is described that enables the reconstruction of an object from such a device

A light fixture using LEDs includes a lower skin layer possessing heat transfer properties. A circuit board is affixed to the lower skin layer, and a single LED, or a plurality of LEDs, is electrically connected to the circuit board. The single LED, or plurality of LEDs, when electrically activated, emits light through substantially around a vertical axis. The light fixture also includes a core possessing heat transfer properties that is in thermal contact with the LED and has an interior cavity for the LED. The core is affixed to the lower skin layer, and an upper skin layer, containing a window or windows over the LED or LEDs, is affixed to the core. The LEDs may be white, infrared, ultraviolet, and / or colored and may be mounted on a printed circuit board or individually.

System-in packages, or multichip modules, are described which can include multi-layer chips and multi-layer dummy substrates over a carrier, multiple through vias blindly or completely through the multi-layer chips and completely through the multi-layer dummy substrates, multiple metal plugs in the through vias, and multiple metal interconnects, connected to the metal plugs, between the multi-layer chips. The multi-layer chips can be connected to each other or to an external circuit or structure, such as mother board, ball grid array (BGA) substrate, printed circuit board, metal substrate, glass substrate, or ceramic substrate, through the metal plugs and the metal interconnects.

Low cost millimeter wave imagers using two-dimensional focal plane arrays based on backward tunneling diode (BTD) detectors. Two-dimensional focal arrays of BTD detectors are used as focal plane arrays in imagers. High responsivity of BTD detectors near zero bias results in low noise detectors that alleviate the need for expensive and heat generating low noise amplifiers or Dicke switches in the imager. BTD detectors are installed on a printed circuit board using flip chip packaging technology and horn antennas direct the waves toward the flip chip including the BTD detectors. The assembly of the horn antennas, flip chips, printed circuit board substrate, and interconnects together work as an imaging sensor. Corrugated surfaces of the components prevent re-radiation of the incident waves.

The invention relates to a method and a device for transmission without crosstalk in interconnections used for sending a plurality of signals, such as the interconnections made with flat multiconductor cables, or with the tracks of a printed circuit board, or inside an integrated circuit. An interconnection with four parallel transmission conductors plus a reference conductor has each of its ends connected to a termination circuit. The transmitting circuit receives at its input the signals of the four channels of the source and its output terminals are connected to the conductors of the interconnection. The receiving circuit(s) input terminals are connected to the conductors of the interconnection, and its four output channels are connected to the destination. The signals of the four channels of an active source are sent to the four channels of the destination, without noticeable crosstalk.

Described herein designs for high frequency printed circuit board (PCB) resonator coils. The resonator coils are printed or etched on a thin substrate. The number of loops of the resonator coil, the width of each trace, the spacing between the traces, and the like are adjusted to increase the quality factor Q of the resonator coils.

A memory module connectable to a computer system includes a printed circuit board, a plurality of memory devices coupled to the printed circuit board, and a logic element coupled to the printed circuit board. The plurality of memory devices has a first number of memory devices. The logic element receives a set of input control signals from the computer system. The set of input control signals corresponds to a second number of memory devices smaller than the first number of memory devices. The logic element generates a set of output control signals in response to the set of input control signals. The set of output control signals corresponds to the first number of memory devices.