1157 results about "Printed circuit board" patented technology

The system provided herein may include an ablutionary fitting (e.g., sink, faucet, toilet) and a holographic user interface module. The module may be used to control operation of the ablutionary fitting. The module may include a printed circuit board assembly (PCBA), a display screen (e.g., a liquid crystal display (LCD), projection, dot matrix, light-emitting diode (LED), etc.) coupled to the PCBA, a holographic 3D plate, and an infrared touch bar. When light emits from the display screen, the light may be directed toward the holographic 3D plate, and the holographic 3D plate may transform the light into a screen image. The infrared touch bar may analyze activation of the screen image by a user and control the ablutionary fitting based on the activation of the screen image.

The present embodiment relates to an electrical connector that may be fixed to a printed circuit board when assembled. The connector includes an outer periphery having one or more circumferential grooves receiving at least one sealing member, and when the connector is fixedly attached to the printed circuit board, the connector is configured to move within a bore hole of a panel in two opposite directions.

The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust, and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust, and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

The invention relates to a device for protection against an attack on an electronic component (IC) mounted on a printed circuit board (PCB), the protection device (PM) comprising: a multilayer printed circuit board comprising upper and lower layers, the lower layers being machined to form two pillars (S1, S2) of a bridge, the pillars delimiting between each other and with a lower face (LF) of the upper layers a volume configured to house the component, the pillars having a height such that the lower face delimits an empty space with an upper face of the component when the component and the protection device disposed above the component are fixed on the printed circuit board (PCB), and conductive tracks formed in the upper and lower layers and connecting together connection elements of the protection device formed in a lower conductive layer of each of the pillars.Figure 2.

According to an embodiment of the disclosure, there may be provided a foldable electronic device. A foldable electronic device may include a flexible printed circuit board (FPCB). The foldable electronic device may comprise a first housing including a first component, a second housing including a second component, a hinge assembly rotatably connecting the first housing and the second housing, a flexible display disposed from the first housing across a folding area where the hinge assembly is disposed to the second housing, and a flexible printed circuit board electrically connecting the first component and the second component, including a plurality of layers, and including a flexible portion corresponding to the folding area and rigid portions at one end and another end of the flexible portion. A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board may include a metal material and include a first area, a second area, and a third area classified according to a degree of bending in a folding area of the flexible printed circuit board. At least one layer among the plurality of layers may be formed so that the metal material has different thicknesses in the first area, the second area, and the third area on a same layer. Other various embodiments may also apply.

An electronic accessory applied to a digital book is disclosed, including: a battery pack (100) made from a biomass material, the battery pack (100) having internally a battery element (101); an actuating element (300) electrically connected to the battery element (101); and a control component including a control device (210), a triggering element and a conductive element (230), where the control device (210) is electrically connected to the battery element (101) and the actuating element (300) respectively, the conductive element (230) is electrically connected to the control device (210), and the triggering element triggers the conductive element (230) to become conductive in order to allow the control device (210) to start the actuating element (300);and where the conducting element (230) includes paper (231) and a printed circuit board (232), and the printed circuit board (232) is arranged on the paper (231). Figure for abbreviation: [Fig 1];

According to various embodiments, the electronic device comprises a housing, a printed circuit board disposed in the housing, a plurality of electrical elements disposed on the printed circuit board, and a first heat transfer member that is cured to have a specific shape through a molding process and covers at least some of the plurality of electrical elements, wherein the first heat transfer member comprises at least two regions divided to cover some of the plurality of electrical elements, and the at least two regions may be determined by at least one of a height range, a temperature range, and a density of at least some of the plurality of electrical elements. Various other embodiments of the electronic device are possible.

The present invention provides a curable composition with excellent thermal expansion resistance when used in prepreg applications, as well as prepregs, resin films, metal-clad laminates, printed circuit boards, semiconductor packages, and a method for adjusting melt viscosity. [Solution] The resin contains at least two compounds that have different structures from the compounds represented by general formula (1), and R is present in the resin. 1 , R 2 and R 3 At least one of them is a vinylbenzyl group, and R present in the resin 1 , R 2 and R 3 A curable composition comprising a resin (A) in which at least one of the members is an arylalkyl group other than a vinylbenzyl group, an azo radical polymerization initiator (B), and an imidazole compound (C).

The application discloses a high-density integrated chip modularized PCB (Printed Circuit Board), which comprises a daughter board and a mother board. The daughter board is used for arranging high-density integrated chips containing blind holes and comprises a functional module area, a blind hole concentrated area and a daughter board pad area. The functional module area is arranged with a plurality of chips and supporting lines. The blind hole concentrated area is arranged with most or all blind holes corresponding to the plurality of chips at a set interval according to a machining parameter reference. The daughter board pad area comprises a plurality of daughter board pads arranged at intervals on the edges of multiple layers of the daughter board, and is used for connecting with part of the supporting lines and the mother board to transmit chip signals to the mother board. The mother board is connected with at least one daughter board and comprises a mother board pad area corresponding to the position of the daughter board pad area, and is used for welding the daughter board to the corresponding position of the mother board to realize input, output and control of the chip signals of at least one daughter board corresponding to the mother board, and solves the problems of manufacturing difficulty, cost and cycle of the PCB of the high-density integrated chip with blind buried holes.

This invention belongs to the field of flight control computer hardware architecture technology, specifically relating to a heterogeneous flight control core circuit and system. This invention integrates a microcontroller unit and an artificial intelligence coprocessor unit on the same printed circuit board, achieving data and command interaction through isolated high-speed interconnect channels. The microcontroller unit constitutes the safety control and real-time decision-making domain, used to execute safety-critical and hard real-time tasks, and to implement operational management and fault isolation for the artificial intelligence coprocessor unit; the artificial intelligence coprocessor unit constitutes the intelligent sensing and computing domain, used to execute computationally intensive and non-real-time critical tasks. This architecture achieves decoupling and collaboration between the safety domain and the computing domain at the hardware level, ensuring both high functional safety and determinism in flight control, while fully releasing the high-performance computing power required for intelligent sensing, thus meeting the dual requirements of advanced aircraft for highly reliable flight control and intelligent function expansion.

A multi-contact terminal has a body portion, a first contact row, a second contact row and a soldering tail. The body portion includes a pair of a first body plate and a second body plate having shapes corresponding to each other. The first contact row is formed at one edge of each of the first body plate and the second body plate, and includes a plurality of first contact beams arranged side by side. The second contact row is formed in a surface of each of the first body plate and the second body plate, and includes a plurality of second contact beams arranged side by side. The soldering tail is formed on another edge of each of the first body plate and the second body plate, and is soldered to a printed circuit board (PCB).

In a general aspect, a multilayer board structure is used to mechanically support and electrically connect a quantum processing unit. In some aspects, a multilayer board structure includes a stack of printed circuit boards. Each printed circuit board in the stack includes a dielectric substrate, a copper layer on a surface of the dielectric substrate; and a superconductive layer electroplated on a surface of the copper layer such that the copper layer is sandwiched between the superconductive layer and the dielectric substrate.

A system comprises one or more computing components arranged on a first side of a printed circuit board (PCB) within a server chassis. The system further comprises a cooling device arranged at least partially on a second side of the PCB opposite the first side. The system also comprises a thermally conductive component configured to transfer heat from the first computing component of the one or more computing components to the cooling device. The thermally conductive component has a main body coupled to the one or more computing components. The main body is approximately parallel to the PCB. The thermally conductive component further comprises a heat dissipation feature extending from the main body.The heat dissipation feature extends from the first side of the circuit board to the second side of the circuit board and is coupled to the cooling device.

A display apparatus includes: a display panel including a plurality of subpixels; a control printed circuit board including a first driving voltage line, a power management circuit, and at least one first feedback driving voltage line electrically connected to the power management circuit; a source printed circuit board electrically connected between the display panel and the control printed circuit board, the source printed circuit board including at least one second driving voltage line electrically connected to at least one of the subpixels; and at least one flexible flat cable connected between the source printed circuit board and the control printed circuit board. The first driving voltage line may be electrically connected to the at least one second driving voltage line through the at least one flexible flat cable, and the at least one first feedback driving voltage line may be electrically connected to the at least one flexible flat cable.

This disclosure relates to display devices and electronic devices. The display device includes: a display panel; a substrate film attached to and protecting the display panel; a cover panel attached to the substrate film via an adhesive layer on one side of the substrate film, the side of the substrate film being opposite to the side of the substrate film to which the display panel is attached; and a printed circuit board (PCB) attached to the cover panel via a PCB adhesive between the PCB and the cover panel, the PCB being electrically connected to the display panel via a flexible printed circuit board (FPCB), wherein, in a plan view, a cut-line area is formed around the area of ​​the PCB attached to the cover panel, forming an area larger than the area of ​​the PCB attached to the cover panel.

Described is an optical device including: a printed circuit board; an LED mounted on the printed circuit board; a light guide layer that embeds the LED therein and includes a reflective surface and an exit surface; and a reflective pattern layer formed on the reflective surface of the light guide layer, wherein the reflective surface of the light guide layer includes a curved shape such that light of the LED is entirely internally reflected using the reflective pattern layer and emitted from the exit surface. The optical device implements a stereoscopic light emitting image using the light guide layer including the curved reflective surface that entirely internally reflects LED light in a lamp structure of a vehicle.

The invention relates to a radio frequency signal control system for a household appliance (2) controlled by a management unit (3), the system comprising: - a radio frequency signal coupler (10), comprising a line segment (13a) printed on a printed circuit board (9) having a free end (13b) and connected in parallel with a transmission line (13) printed on the printed circuit board (9) the first end of which is connected to an electrical conductor (5), the coupler (10) comprising at least one coupling line (15a) a portion of which extends without electrical contact, parallel to the line segment (13a);- a radio frequency unit (7) for transmitting and / or receiving radio frequency signals comprising a radio frequency signal input and / or output (Sa) electrically connected to the coupler, - a radio frequency signal blocking circuit (12), printed on the printed circuit board and connected at one end to the transmission line (13).;

The present invention relates to a sensor device for attachment to an equipment shell, the device comprising a casing (1) configured for attachment to an equipment shell by means of a fastening system comprising a bushing (4) with a cylindrical part internal to the casing and a flange part (4a) configured to contact the equipment shell when the device is attached to it, the casing (1) housing a plurality of sensors for measuring data related to the operating condition of the equipment, at least one processor configured to receive the data measured by the sensors; and at least one means of wireless communication for communication with a server remote to the device, in which the casing (1) comprises a casing body (2), which receives, at one end, a printed circuit board (11) which receives an acoustic sensor (12) for structural noise measurement, the printed circuit board (11) being in contact with the flange part (4a) of the bushing (4).

A printed circuit board (PCB) test system and method including temperature chamber including at least one slot to accommodate at least one PCB test coupon, input bus connected to inputs of the at least one slot, and output bus connected to outputs of the at least one slot, wherein temperature chamber is configured to apply a temperature to the at least one PCB test coupon; signal generator including output bus connected to the input bus of the at least one slot, frequency meter comprising an input bus connected to the output bus of the at least one slot and an output bus, and a comparator connected to the output bus of the signal generator and the output bus of the frequency meter for comparing corresponding outputs of the signal generator and the frequency meter.

The application provides a printed circuit board defect detection method and system based on deep learning, wherein the method comprises the following steps: inputting a PCB original image into a deep neural network for target detection reasoning; before the target detection reasoning, performing data preprocessing and background and edge extraction on the PCB original image; wherein the deep learning method aligns the PCB original image with a standard board image; after the alignment of the PCB original image with the standard board image, a deep target detection model is used for defect detection, and the deep target detection model is a two-stage target detection model of a comprehensive single-stage target detection algorithm; based on the deep target detection model, the defect detection of the PCB original image is completed, and a detection result is output. The defect detection scheme and process are optimized in efficiency; while ensuring the recall rate of PCB appearance defect detection, the detection accuracy is improved, and the academic research and application prospect are very broad, and the application can truly contribute to the PCB industry.

This invention discloses a PCB dry film and its preparation method, belonging to the field of PCB manufacturing materials. The dry film comprises a polyester carrier film, a functional resin layer, and a polyethylene protective film. The resin layer polymer composition contains, by weight,: (A) 45-65 parts of a base binder resin; (B) 20-40 parts of a crosslinkable monomer; (C) 28 parts of a crosslinking initiator; and (D) 0.5-5 parts of additives. Wherein (A) is a multifunctional modified acrylate copolymer, with main or side chain bonds containing nitrogen or sulfur heterocyclic groups, olefinic unsaturated crosslinking groups, free carboxyl groups, and polylactic acid ester or polycaprolactone microblocks, a weight-average molecular weight of 30,000-80,000, and an acid value of 120-180 mgKOH / g. This invention ensures that the dry film has excellent developability, thereby meeting the manufacturing requirements of high-quality printed circuit boards.

This utility model discloses a printed circuit board stacking positioning and calibration device, including a main plate and a slider. The main plate has a groove inside, and a support frame is fixedly connected to the outer side of the bottom end of the main plate. The slider is slidably connected inside the groove, and a stop is located at the top of the slider. Driven by a motor, the internal threaded frame moves the stop via the slider towards the edge of the stacked printed circuit boards, causing several pressing rollers to simultaneously press the edge of the printed circuit boards. As the pressing force increases, two sets of flipping frames gradually unfold, and under the torque of a torsion spring, every two sets of pressing rollers unfold to press and align the edge of the printed circuit boards on the same side. Furthermore, a slot is opened inside the top of the slider, and a plug is fixed at the bottom of the stop, allowing the slider and the pressing calibration structure to be assembled by interlocking the plug and tightened by a fastening screw, thus making the disassembly and replacement of the pressing calibration structure more convenient.

This utility model relates to electrical engineering, specifically to autonomous power sources based on lithium-polymer (Li-Po) cells. It can be used in portable electronic devices, power tools, robotic systems, unmanned aerial vehicles, and other equipment requiring a stable, high-capacity DC power source. The technical result of this utility model is increased mechanical strength and operational safety.A lithium-polymer High Voltage battery for portable use comprises a housing made of heat-shrinkable tube, in which batteries are placed, fixed together with polypropylene adhesive tape to form a battery pack, the terminals of which are connected to a printed circuit board, to which a balancing and power cable are connected, while adhesive tape is glued to the current-carrying parts of the printed circuit board, followed by the application of gaskets made of ethylene vinyl acetate and electrical cardboard, which are fixed with reinforced adhesive tape, and the battery pack consists of lithium-polymer batteries with a capacity of 4300-4500 mAh and a voltage of 22.8 V. 1 fig.

A connector assembly may include an inner housing, a printed circuit board, an adhesive layer, a sensor film, and / or an outer housing. The inner housing may include a fluid flow path extending between a distal end and a proximal end of the inner housing. The printed circuit board may be on the inner housing. The printed circuit board may include a plurality of electrical contacts. The adhesive layer may be on the printed circuit board. The sensor film may be on the adhesive layer. The sensor film may be configured to generate a voltage in response to a force applied to the sensor film. The outer housing may surround the inner housing, the printed circuit board, the adhesive layer, and the sensor film.

The application relates to a light-emitting diode test circuit, a driving chip, a display module and a display panel. The light-emitting diode test circuit comprises: a plurality of first conductive elements, each first conductive element being used for corresponding connection with an anode of each light-emitting diode on a display module to be tested; a plurality of second conductive elements, each second conductive element being used for corresponding connection with a cathode of each light-emitting diode on the display module to be tested; a first conductive test element, which is connected with each first conductive element and is used for receiving a first driving voltage provided by an external test device; and a second conductive test element, which is connected with each second conductive element and is used for receiving a second driving voltage provided by the external test device, wherein the first driving voltage is greater than the second driving voltage. By using the above light-emitting diode test circuit, the number of top pins of a detection device can be reduced, and thus the detection cost is reduced.

The present invention relates to a housing (1) for an electronic circuit, the housing having a housing bottom (2), a housing top (3), and a printed circuit board (4) arranged in the housing (1) for receiving the electronic circuit. The housing bottom (2) is designed in a basin shape and has at least two support elements (6) for the printed circuit board (4) on at least two opposing inner walls (5). Furthermore, at least one position-fixing molded portion (7) is provided on each of the at least two opposing inner walls (5) for engaging with a corresponding fixing slot (8) in the printed circuit board (4) for position fixing. A first portion (10) of a locking device is provided on each of the at least two opposite outer walls (9) for connection with the housing top (3). The printed circuit board (4) is designed in a rectangular shape and has fixing slots (8) on at least two opposite sides for receiving the position of the housing bottom (2). The molded part is formed, and the printed circuit board (4) has slots (13) at its four corners (15), the slots extending parallel to the inner wall (5) of the bottom of the housing (2), on which support elements (6) are mounted, wherein the length of the slot (13) is greater than the distance between the slot (13) and the adjacent edge (14) of the printed circuit board, so that an elongated, elastic tab (16) is formed at each corner (15) of the printed circuit board (4), wherein the top of the housing (3) is designed to be basin-shaped and has pin-shaped portions (19) extending from the plane of the top edge (18) of the housing at its four corners, the pin-shaped portions being designed to press the tabs (16) formed on the printed circuit board (4) from the plane of the printed circuit board into the bottom of the housing (2) in the assembled state of the housing (1), and has a second part (11) of a locking device on at least two opposite outer walls (9) for connection with the bottom of the housing (2).

This invention belongs to the field of printed circuit board manufacturing and provides a fully automatic vacuum plugging machine, including a frame with a vacuum chamber inside. Within the vacuum chamber, a feeding bin, a printing bin, and an output bin are sequentially arranged. The feeding bin contains a receiving lifting platform, the printing bin contains a printing worktable and a printing mechanism opposite to the printing worktable, and the output bin contains a picking lifting platform. The machine also includes an alignment mechanism for adjusting the position of the printing worktable, a loading and positioning mechanism for adjusting the receiving lifting platform, and a board-moving mechanism for transferring the circuit board from the receiving lifting platform to the printing worktable and from the printing worktable to the picking lifting platform. This fully automatic vacuum plugging machine enables automatic positioning of the circuit board, ensuring printing stability and thus improving printing efficiency and yield.

The embodiment of the application provides a printed circuit board, a preparation method thereof and electronic equipment, and belongs to the electronic field. The printed circuit board comprises an isolation substrate and a plurality of blind holes distributed on the surface of the printed circuit board; the blind holes comprise coaxial first blind holes, second blind holes and third blind holes; the aperture of the first blind hole is larger than the aperture of the third blind hole; and the isolation substrate comprises a base body and an insulating layer arranged on the surface of the base body. The printed circuit board is used to improve the filling density of the blind hole and the uniformity of the copper layer, thereby reducing signal reflection, crosstalk and transmission delay.

The invention relates to a plug-in device (10) and to a method for producing such a plug-in device. The plug-in device (10) comprises a printed circuit board element (12), a first plug-in element (14) which is electrically and mechanically connected to the printed circuit board element (12) by means of a solder connection (16), and a second plug-in element (18) which is electrically and mechanically connected to the printed circuit board element (12) by means of a press-in contact (20), the second plug-in element having a housing portion (24) with a recess (26), the first plug-in element (14) being arranged in the recess (26) such that an outer surface (30, 32) of the first plug-in element (14) contacts an inner surface (34, 36) of the recess (26).