1706results about How to "Lower resistance" patented technology

A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern.

A RFID transponder having a microchip or integrated circuit, an impedance-matching structure and a resonant structure mounted on at least one substrate and connected to each other by an electric field.

A memory component includes: a first electrode; a memory layer; and a second electrode which are provided in that order, wherein the memory layer includes an ion source layer containing aluminum (Al) together with at least one chalcogen element selected from the group consisting of tellurium (Te), sulfur (S), and selenium (Se), and a resistance variable layer provided between the ion source layer and the first electrode and containing an aluminum oxide and at least one of a transition metal oxide and a transition metal oxynitride having a lower resistance than the aluminum oxide.

The present invention provides a separator that, when used in a lithium ion secondary battery, polymer lithium secondary battery, aluminum electrolytic capacitor or electric double-layer capacitor, offers desired levels of various practical characteristics, undergoes minimal heat shrinkage even when overheated, and exhibits high reliability and excellent workability. The electronic component separator proposed by the present invention comprises a porous base made of a substance having a melting point of 180° C. or above, and a resin structure provided on at least one side of and/or inside the porous base, and the porous base and/or resin structure contains filler grains.

A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolated lead frames that are separated from a common base carrier by a non-conductive layer of laminating material. A silicon die is attached inside a cavity formed in each lead frame. Direct connection of the active surface of the silicon die to the printed circuit board is then made by an array of solder bumps that is distributed across the surface of each die as well as the edges of the lead frame adjacent to each die.

The present invention presents methods for making oxidation-resistant and wear-resistant polyethylenes and medical implants made therefrom. Preferably, the implants are components of prosthetic joints, e.g., a bearing component of an artificial hip or knee joint. The resulting oxidation-resistant and wear-resistant polyethylenes and implants are also disclosed.

A wireless charging coil is provided herein. The wireless charging coil comprising a first stamped coil having a first spiral trace, the first spiral trace defining a first space between windings, and a second stamped coil having a second spiral trace, the second spiral trace defining a second space between windings, wherein the first stamped coil and second stamped coil are planar to and interconnected with one another, such that the first stamped coil is positioned within the second space of the second stamped coil, and the second stamped coil is positioned within the first space of the first stamped coil.

A tolerance ring comprising a metallic band for spring features and a complementary low friction material for frictional considerations is disclosed. The tolerance ring is designed to operate within a precisely controlled torque or axial force band to provide a defined amount of resistance and sliding force control between components that move relative to each other. Isolated portions of the tolerance ring form regions of contact with adjacent ones of the components. Other surfaces of the tolerance ring comprise portions with spring features that have geometry suitable for their spring rate, rather than conforming to mating surfaces of the adjacent components.

Therefore, disclosed above are embodiments of a multi-fin field effect transistor structure (e.g., a multi-fin dual-gate FET or tri-gate FET) that provides low resistance strapping of the source/drain regions of the fins, while also maintaining low capacitance to the gate by raising the level of the straps above the level of the gate. Embodiments of the structure of the invention incorporate either conductive vias or taller source/drain regions in order to electrically connect the source/drain straps to the source/drain regions of each fin. Also, disclosed are embodiments of associated methods of forming these structures.

A method for fabricating an integrated circuit includes forming a first layer of a workfunction material in a first trench of a plurality of trench structures formed over a silicon substrate, the first trench having a first length and forming a second layer of a workfunction material in a second trench, the second trench having a second length that is longer than the first length. The method further includes depositing a low-resistance fill material onto the integrated circuit to fill any unfilled trenches with the low-resistance fill material and etching the low resistance fill material, the first layer, and the second layer to re-expose a portion of each trench of the plurality of trenches, while leaving a portion of each of the first layer, the second layer, and the low-resistance fill material in place. Still further, the method includes depositing a gate fill material into each re-exposed trench portion.

A thin film transistor with which oxygen is easily supplied to an oxide semiconductor layer and favorable transistor characteristics are able to be restored and a display unit including the same are provided. The thin film transistor includes sequentially over a substrate a gate electrode, a gate insulting film, an oxide semiconductor layer including a channel region, and a channel protective layer covering the channel region A source electrode and a drain electrode are formed on the oxide semiconductor layer located on both sides of the channel protective layer, and at least one of the source electrode and the drain electrode has an aperture to expose the oxide semiconductor layer.

An opposed terminal structure including a supporting substrate, a first terminal, a nitride semiconductor with a light-emitting layer, and a second terminal. The second terminal forms an opposed terminal structure with the first terminal, which can be formed in a variety of patterns.

A heating element, electronic cigarette and method for forming heating element. The heating element includes a heating part and a connection part extending along both ends of the heating part so as to form a first connection end and a second connection end, which are electrically connected to a drive circuit respectively. The first connection end, the second connection end and the heating part are integrative, and the first connection end and the second connection end both has a coating covered on outer surface of them respectively. The heating element is integrated designed without any complex technique of the welding or riveting, and via electroplating to form a coating on the heating element instead, the production efficiency of the heating element gets highly improved, costs reduced and a stable resistance value gets obtained in the mass-produced heating elements, involving a consistency in mass production.

The invention discloses an ultrathin high-power direct current magnetoelectric motor, comprising a transmission shaft, a discal stator component sleeved at the middle section of the transmission shaft, discal rotor components which are respectively arranged at the two sides of the stator component and rotate with the transmission shaft, and an upper end cap and a lower end cap which are respectively arranged at the two sides of the rotor components. The stator component comprises a discal stator frame, a plurality of fan-shaped grooves which are arranged on the stator frame in a ring form, fan-shaped windings arranged in the fan-shaped grooves, and inner clamping rings and outer clamping ring for fixing the fan-shaped windings. The rotor component comprises a rotor plate fixedly connectedwith the transmission shaft, fan-shaped grooves which are arranged on the rotor plate in a ring form, and permanent magnets fixed in the grooves. The surface of the rotor plate, which provided with the permanent magnets, faces the fan-shaped windings. The motor of the invention has the advantages of higher efficiency and energy saving, and the manufacturing, the assembling and the maintenance of the stator winding are more simple, convenient and reliable.

A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.

Formation of a solar cell device from upgraded metallurgical grade silicon which has received at least one defect engineering process and including a low contact resistance electrical path. An anti-reflective coating is formed on an emitter layer and back contacts are formed on a back surface of the bulk silicon substrate. This photovoltaic device may be fired to form a back surface field at a temperature sufficiently low to avoid reversal of previous defect engineering processes. The process further forms openings in the anti-reflective coating and a low contact resistance metal layer, such as nickel layer, over the openings in the anti-reflective coating. The process may anneal the low contact resistance metal layer to form n-doped portion and complete an electrically conduct path to the n-doped layer. This low temperature metallization (e.g., <700° C.) supports the use of UMG silicon for the solar device formation without the risk of reversing earlier defect engineering processes.

A handheld or pocketsized electronic apparatus, such as a mobile telephone, having a display unit and a touch surface that is position-sensitive in a first and second direction for control of the electronic apparatus; the display unit having a display area taking up most of the front side of the apparatus and the touch surface being sufficiently narrow to fit on the side edge of the apparatus and curved in the first direction to convex shape, thus making it simple for a user to control the apparatus with one hand, without the display being hidden, and in an ergonomically correct manner, whereby control of the apparatus is attained without the use of a keyboard or similar input device.

Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom.

An electrical circuit for providing electrical power for use in powering electronic devices, such as monitors, televisions, white goods, data centers, and telecom circuit boards, is described herein. The electrical circuit includes a voltage reduction circuit cell that includes a first capacitor, a second capacitor, a switching circuit, and a hold capacitor. The switching circuit includes a plurality of switching devices that are coupled to the first and the second capacitors for delivering power from an input terminal to an output terminal. The plurality of switching devices includes at least two switching devices that are coupled to ground. The voltage reduction circuit cell also includes a controller for operating the switching circuit in a plurality of operational modes to deliver an output power signal at a desired voltage level.

Laser diodes containing aluminum at high concentration in an active layer have been usually suffered from remarkable facet deterioration along with laser driving operation and it has been difficult for the laser diodes to attain high reliability. An aluminum oxide film lacking in oxygen is formed adjacent to the semiconductor on an optical resonator facet, by which facet deterioration can be minimized and, accordingly, the laser diode can be operated with no facet deterioration at high temperature for long time and a laser diode of high reliability can be manufactured at a reduced cost.

The invention discloses an anti-microbial healing-promoting hydrogel dressing and a preparation method therefor. The main ingredients of the dressing are water-soluble high-molecular polymers, functional polymers with pseudoplastic, anti-microbial agents and water. The above ingredients are dissolved into a whole after a series of technologies. The solution is poured into a mold, and the hydrogel dressing is obtained after curing and irradiation disinfection. The results of wound healing experiments and in vitro anti-microbial experiments show that the hydrogel dressing can promote wound healing effectively, and has good bacteriostatic activity to multiple bacteria (the sterilizing rate is above 70%). The anti-microbial healing-promoting hydrogel dressing is better than existing hydrogel dressings obviously, and has advantages of substantial anti-microbial curative effects, transparency, high water content, simple preparation method, pure product, nontoxicity, innocuousness, no stimulation, good biocompatibility and the like. The hydrogel dressing is suitable for large-area promotion and application.

A photon detector is obtained by using the intersubband absorption mechanism in a modulation doped quantum well(s). The modulation doping creates a very high electric field in the well which enables absorption of input TE polarized light and also conducts the carriers emitted from the well into the modulation doped layer from where they may recombine with carriers from the gate contact. Carriers are resupplied to the well by the generation of electrons across the energy gap of the quantum well material. The absorption is enhanced by the use of a resonant cavity in which the quantum well(s) are placed. The absorption and emission from the well creates a deficiency of charge in the quantum well proportional to the intensity of the input photon signal. The quantity of charge in the quantum well of each detector is converted to an output voltage by transferring the charge to the gate of an output amplifier. The detectors are arranged in the form of a 2D array with an output amplifier associated with the entire array or a row of the array as in the known charge coupled devices, or a separate amplifier could be dedicated to each pixel as in the known architecture of the active pixel device. This detector has the unique advantage of near room temperature operation because the dark current is limited to the generation across the semiconductor bandgap and not the emission over the quantum well barrier. The detector also has the advantage that the readout circuitry is implemented monolithically by the HFETs formed in the GaAs substrate simultaneously, with the detecting elements.

An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.

The invention discloses an array substrate, a manufacturing method thereof and a liquid crystal display. The array substrate comprises a substrate, wherein data wires and grid lines, which are arranged in a crisscross pattern for forming a plurality of pixel units, are formed in a pixel region of the substrate, each pixel unit comprises a switch element, a pixel electrode and a public electrode, and the public electrodes have narrow slots and are arranged in a whole-block pattern in the pixel region, wherein public electrode wires are further formed in the pixel region, and the public electrode wires are communicated with the public electrodes. The public electrode wires are formed in the pixel region of the array substrate of the liquid crystal display, the public electrode wires are communicated with the pubic electrodes, and the public electrode wires and the public electrodes can form a parallel-connected circuit, thereby reducing the resistance of the public electrodes, further reducing RC (resistance-capacitance) signal delay of the public electrodes, improving the load capacity of public voltage signals, further weakening the crosstalk phenomenon and improving the image quality of the liquid crystal display.

An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of manufacturing the same. At least the stimulation/sensing portion is unitized through partially surrounding and supporting insulation and conductive element(s) of the stimulation/sensing portion with a fused matrix of material having mechanical properties consistent with a body of the lead.

A method addresses low cost, low resistance metal interconnects and mechanical stability in a high aspect ratio structure. According to the various implementations disclosed herein, a replacement metal process, which defers the need for a metal etching step in the fabrication process until after all patterned photoresist is no longer present. Under this process, the conductive sublayers may be both thick and numerous. The present invention also provides for a strut structure which facilitates etching steps on high aspect ratio structures, which enhances mechanical stability in a high aspect ratio memory stack

A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.

The invention discloses an array substrate, a touch display panel and a touch display device. According to one embodiment, the array substrate comprises a substrate body, a plurality of metal layers, a touch control electrode layer and a plurality of touch control signal lines, wherein the substrate body has a display area and a non-display area, the metal layers are perpendicular to the substrate body and include the first metal layers and the second metal layers, the first metal layers are used for forming scanning lines of the array substrate, and the second metal layers are used for forming data lines of the array substrate; a plurality of pixel units are arranged in the display area and distributed into an array, the line direction of the pixel units is the extending direction of the scanning lines, and the row direction of the pixel units is the extending direction of the data lines; the touch control electrode layer comprises a plurality of touch control electrodes, the touch control signal lines are electrically connected with one touch control electrode and used for transmitting touch control signals to the touch control electrode, and the touch control signal lines and at least one metal layer are located on the same layer. In this way, the complexity of the manufacturing process of the array substrate can be reduced.

In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

An optical reflection element includes a mirror portion and an oscillator coupled to the mirror portion. The oscillator includes a base, an insulating layer, a drive element, and a monitor element. The insulating layer is formed on the base. The drive element and the monitor element are formed on the insulating layer, and are separated from each other by a separation groove. Each of the drive element and the monitor element includes a lower electrode layer, a piezoelectric layer, and an upper electrode layer formed in that order on the insulating layer. The monitor element has high detection accuracy, allowing the optical reflection element to perform self-excited driving with high accuracy.