1results about How to "Improve process precision" patented technology

The application discloses a preparation method of a fan-out type double-sided surface mounting multi-chip package and a package, and mainly comprises the following steps: after a temporary thermal bonding film is adhered to a glass wafer, TMV chips are attached in a flip-chip mode, plastic packaging is completed, and a plastic package is formed; a device surface of the chip faces one side of the temporary thermal bonding film, a surface of the plastic package is a second surface, a front wiring layer and a back wiring layer are respectively formed on a first surface and the second surface, then ball implantation is performed on the second surface after the back wiring layer is formed, an integrated passive device IPD with a micro bump is attached to the first surface after the front wiring layer is formed, reflow bonding is performed, and a stacked package is obtained, and finally, unit cutting is performed on the stacked package to obtain a single package; and the application can fully utilize upper and lower surfaces of the plastic package, carry and place more tin balls and lead-out wires, and improve utilization efficiency of the plastic package area.