14 results about "Clamper" patented technology

The invention discloses a radio frequency front-end module, a protection circuit and electronic equipment, the radio frequency front-end module comprises a power amplifier, a clamping module, a switch module and an overvoltage protection module, the power amplifier is provided with a signal output end, and the signal output end is connected with a power supply port. The clamping module is connected between the signal output end and the grounding port. The clamping module comprises a plurality of first clamping devices which are connected in series. The switch module is connected with the clamping module, the switch module is provided with at least two adjusting gears, and under the different adjusting gears, the number of the first clamping devices connected into the clamping module is different. The overvoltage protection module is connected to the power supply port and the switch module, and is configured to control the switch module based on the amplitude of the power supply voltage, so that the switch module is switched among different adjusting gears. The clamping voltage of the clamping module can be flexibly adjusted according to the amplitude of the power supply voltage, so that the safety of the power amplifier is guaranteed on the premise that the saturation power is not lost.

This invention relates to the field of clamping control, and more particularly to an active voltage overshoot clamping system for battery testing equipment. The invention comprises a clamper, a feature memory, a filter, an interference analyzer, a predictor, and a clamping controller. It uses prior data—including the test step execution sequence, time-domain mapped overshoot characteristics, and the attribute characteristics of the tested battery—to filter out overshoot step combinations and construct a drift feature pool specific to each combination. Subsequently, when the test equipment pre-executes the overshoot step combination, the overshoot occurrence is predicted, and a clamping optimization strategy is determined based on the adaptability of the drift feature pool, adjusting the duty cycle upper limit in advance. This invention utilizes prior data to summarize overshoot step combinations and considers the differences in the attributes of the tested battery to construct a drift feature pool. This allows the system to perform clamping control adaptably to the attributes of the tested battery under different overshoot step combinations, improving the accuracy and reliability of overshoot voltage suppression.

A method of manufacturing a chip by dividing a wafer, includes first and second division steps. The first step includes pressing, while clamping a first region of a wafer unit by a clamper, a second region of the wafer unit from a back surface side of the wafer or from a front surface side. The wafer unit includes the wafer and a sheet fixed to a back surface of the wafer. The first region of the wafer unit is on one side of a first planned division line of the wafer. The second region is on the opposite side of the first planned division line. The second division step includes pressing the second region of the wafer unit from the back surface side or from the front surface side different from that in the first division step, while clamping the first region of the wafer unit by the clamper.

A composite logic gate circuit, a chip comprising the same and an electronic device, the composite logic gate circuit comprising a driving circuit and having a signal output end and K signal input ends, a first end of the driving circuit being connected to the signal output end of the composite logic gate circuit and connected to a high-level power supply through a load circuit, and a second end of the driving circuit being connected to a low-level power supply, wherein the driving circuit comprises K first depletion-mode HEMT devices and L clamping devices, the K first depletion-mode HEMT devices are arranged into M and structures, the L clamping devices are arranged into M clamping units, each and structure corresponds to a clamping unit, M and L are positive integers, and K is an integer greater than or equal to 2. Through the embodiments of the present application, the composite logic gate circuit based on the depletion-mode field effect tube of the compound semiconductor substrate is constructed, the performance density and the function density of the high-end radio frequency system of the compound hybrid circuit can be improved, and the cost can be reduced and the reliability can be improved.

A work processing device that performs a predetermined process on a workpiece includes a pair of side clampers that clamp a pair of opposing side surfaces of the workpiece from the sides of the workpiece, a top clamper that is provided on at least one of the pair of side clampers and with which the top surface of the workpiece comes into contact, and a height measuring means that measures the height of the top clamper.

To solve the problem that a clamper is inclined and an insert cannot be accurately fixed.SOLUTION: The cutting tool includes a holder, an insert, a clamp member, and a fixing member. The holder has a bar shape and includes a front end surface, a pocket, a first side surface, a first hole, and a second hole. The clamp member includes a main body and a protrusion. The fixing member includes a shaft portion, a first head portion, and a second head portion. The second head portion is attachable to and detachable from the shaft portion.SELECTED DRAWING: Figure 2

To provide a clamper that uniformly distributes the load applied to the input unit to a workpiece, and a clamper design method. [Solution] A clamper according to one aspect of the present disclosure comprises an input portion, a clamping surface facing the input portion, a high-rigidity portion, and a low-rigidity portion. The high-rigidity portion and the low-rigidity portion are arranged between the clamping surface and the input portion. The rigidity of the high-rigidity portion is higher than that of the low-rigidity portion. The rigidity of each position of the clamping surface relative to the input portion is proportional to the cube of the distance from the input portion.

A screen body holder includes two fixing clampers and a holder frame; a placing slot is downwardly formed from the top of the fixing clamper, and in a first direction, each of two ends of the placing slot includes an opening; placing slots of the two fixing clampers are disposed opposite each other in the first direction; locking slots are disposed on one of two slot walls of each placing slot, and the plurality of locking slots are spaced in a vertical direction; a to-be-supported screen body is capable of being obliquely placed in the placing slot and is engaged with one of the plurality of locking slots; two ends of the holder frame are connected to the two fixing clampers, respectively.

The application discloses a kind of super strong overvoltage protector of failure safety, it is related to electronic product field, including switching device and clamping device;Switching device and clamping device are packaged as a whole, located in the inside of shell;The inside of shell is provided with lead wire, one end of lead wire is connected with the combination of switching device and clamping device, the other end of lead wire is connected with electrode outside shell, and the welding spot of lead wire and lead wire is used as the failure open circuit device of overvoltage protector.The product size of the present application is miniaturized, and it is patching;The working voltage of electrical performance is high, and the fault tolerance of working voltage is high;Surge capacity is strong;Residual voltage is low, and the protection effect is good;Energy saving and environmental protection, that is, the electrical performance of overvoltage protector, under high working voltage, the leakage current is low, in high temperature environment, the temperature rise of product is small, and the reliability of long-term use is high;Failure open circuit;It has the extensive application demand and broad prospect of adapting to the development trend of present electronic industry.

An apparatus for manufacturing a display device includes a stamp member including an adsorption area and first to fourth edge areas, a stamp head unit which adsorbs the adsorption area of the stamp member, a main body unit which has the stamp head unit installed therein and is movable along a first direction and a second direction, a clamping unit installed in the main body unit to be movable along the first direction and the second direction, and a pressurizing unit installed in the main body unit to be movable along the first direction and the second direction, where the pressurizing unit operates in one of a first mode and a second mode, and the clamping unit includes first to fourth clampers which clamp the first to fourth edge areas of the stamp member, respectively, when the pressurizing unit is changed from the second mode to the first mode.

The present application relates to the field of clamping control, especially to a voltage overshoot active clamping system of a battery test equipment, the present application sets up a clamping device, a feature storage, a filter, an interference analyzer, a predictor and a clamping controller, records the test step execution sequence of the test equipment and the test step execution sequence, and the overshoot feature and the measured end attribute feature mapped in time domain as prior data, filters out the overshoot step combination, constructs the drift feature pool of the overshoot step combination, and predicts the overshoot occurrence in the pre-execution of the overshoot step combination of the test equipment, determines the clamping optimization strategy based on the adaptability of the drift feature pool, and adjusts the duty cycle upper limit in advance. The present application summarizes the overshoot step combination by using the prior data, constructs the drift feature pool by considering the difference of the measured battery attributes, so that the system can adapt to the clamping control under different overshoot step combinations combined with the measured battery attributes, and improve the accuracy and reliability of the overshoot voltage suppression.

To easily mount an electronic component on a solder precoat.SOLUTION: The disclosed substrate pressing device 400 includes a backup portion 405 having a first main surface 1a and a second main surface 1b opposite to the first main surface 1a and having a support surface 1b that supports, from below, the second main surface 405T of the substrate 1 on which the solder precoats 3 are formed on the first main surface 407S, a pair of side clampers 407 that have clamp surface 407S abutting against side surfaces of the substrate 1 and clamp the substrate 1 supported by the backup portion 405 with the clamp surface 1a interposed therebetween, and a roller 432 that presses the substrate 1 clamped by the side clampers 407 from the first main surface wall side to crush top portions of the solder precoats 3. When viewed from the normal direction of first main surface 1a, rotation axis A of roller 432 intersects with the direction in which clamp surface 407S extends.SELECTED DRAWING: Figure 4

This application discloses a power clamping device. An ESD power clamping device includes: an ESD detection circuit; a control circuit coupled to the ESD detection circuit; a field-effect transistor (FET) coupled to the control circuit; and an impedance element coupled to the FET. The FET includes: a drain terminal coupled to a first power node; a gate terminal coupled to the control circuit; a source terminal coupled to a second power node via the impedance element; and a body terminal coupled to the second power node.