930results about "Resistors adapted for applying terminals" patented technology

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the insulating layers, plated with a first conductive material, and separated from each other by a predetermined distance. The embedded passive component is interposed between the terminals and has electrodes formed on both sides thereof. The electrodes are separated from the terminals by a predetermined distance and electrically connected to the terminals through a second conductive material.

The invention relates to an electrothermal film and a manufacturing method thereof, belonging to the technical field of semiconductor heating. The electrothermal film is mainly prepared by adopting stannic chloride, titanium tetrachloride, stannic chloride, titanium trichloride, ferric chloride, antimony trichloride, calcium chloride, potassium chloride, cadmium chloride, stannic dioxide, stannictetroxide, hydrofluoric acid, boric acid, ethanol, isopropyl alcohol and inorganic water. By adopting the above formula, the mixture is mixed, stirred and heated to prepare into electrothermal film treating fluid, a semi-finished product of the electrothermal film is obtained by spraying the electrothermal film treating fluid at negative pressure on the electrothermal film carrier, and then silveroxide slurry is coated on the semi-finished product of the electrothermal film for baking to form a finished product of the electrothermal film. The electrothermal film has reasonable proportion andsimple manufacturing process, can be manufactured into various electrothermal film heating devices, has a working temperature capable of being up to 500 DEG C, and has wider application range. The electrothermal film of the invention also has the function of far infrared radiation, can play a role of physical therapy and health care to human body, and can help improve the quality and output of agricultural products.

Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.

The invention is directed to a method to embed a thick film resistor composition into a printed wiring board comprising the steps of applying a reinforcing composition onto a resistor composition disposed on a metallic substrate forming an assembly wherein the resistor composition is at least partially coated with the reinforcing composition; processing the assembly; and applying the assembly onto at least one side of an organic substrate forming a component wherein the organic substrate is at least partially coated with an adhesive layer and wherein the reinforcing composition side of the assembly is embedded into the adhesive layer. The reinforcing composition allows laser trimming of the fired resistor and also eliminates cracking during lamination steps of the invention.

A composite structural member with an integrated electrical circuit and an associated method of manufacture are provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

The invention provides a production method of a high-power precision alloy SMD (surface mount device) resistor. The production method comprises the steps: respectively combining two oxygen-free copper strips with two sides of a resistor alloy strip to form an integrated strip-shaped resistor strip, and wrapping a high-heat-conductivity substrate with the integrated strip-shaped resistor strip; etching a basic resistor structure on a wrapping body; precisely adjusting the resistance value of the basic resistance structure; coating, terminal electroplating and printing a resistor body to form a high-power precision alloy SMD resistor. The material with high heat radiation capability and high heat conductivity such as a metal substrate, a high-heat-conductivity ceramic substrate is used as the substrate, so that the actual load capacity of the resistor is greatly increased; the oxygen-free copper strip is partially arranged on the side surface and below the substrate and used as an electrode lead, so that the contact area is increased, and the heat conductivity of the resistor body is also increased on the other hand.

A force or pressure sensor and appertaining method for manufacturing are provided in which the sensor comprises a repeating conductive trace pattern that can be replicated to produce a consistent conductive trace across more than one adjacent pattern section forming an electrical bus, wherein more than one section of a series of conductive traces are printed on a thin and flexible dielectric backing using the pattern. The thin and flexible dielectric backing has a repeated pattern of conductive traces printed above the dielectric backing and one or more dielectric layers provided above the conductive traces, the dielectric layers having access regions permitting contact of conductors above the one or more dielectric layers, and a sensor conductor layer printed above the one or more dielectric layers that contacts the conductive traces via at least one of the access regions or regions not covered by the one or more dielectric layers.

A method and apparatus for manufacturing thin film heaters. According to one embodiment of the present invention, the method and apparatus includes an automated process for applying at least one conductor to a conductive substrate, where the conductor and the conductive substrate are in electrical communication. In alternate embodiments, a flexographic printing process is used to overlay two similar layers of ink on a carbon impregnated substrate and cure the ink to form at least one electrode conductor.

Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

A force sensor includes a polymeric substrate including a cavity with a tilt plane, at least two metal piezoresistors on the tilt plane, and a contact pad connected to the metal piezoresistors. The tilt plane may include a measured interface of from 15° to 75°.

An activated carbon fiber soft electric heating product and its manufacturing method for overcoming existing problems including uneven temperature rise and heat dissipation at surfaces of the product, unbendable feature, short life and poor safety. An activated carbon fiber cloth and a woven fiber cloth of the activated carbon fiber soft electric heating product are fixed by an epoxy resin layer, and a conducting copper net is disposed between the activated carbon fiber cloth and the epoxy resin layer and coupled to a power input wire. The manufacturing method includes the steps of: (1) spraying an epoxy resin on a surface of the woven fiber cloth, and bake-drying and hot pressing the woven fiber cloth; and (2) connecting the conducting copper net and the power input wire, laying the activated carbon fiber cloth, and performing a second-time hot pressing. Meanwhile, carbon fiber constitutes a heat generating surface with the advantages of a light weight, a soft texture, a bendable feature, a uniform electric heating performance, a fast temperature rise, a highly safe, reliable and long life feature. In addition, the method of the invention involves a simple technical skill and an easy operation.

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.

A chip resistor includes an insulating substrate 2 in the form of a chip having an upper surface and an opposite pair of side surfaces, a resistor film 4 formed on the upper surface of the insulating substrate 2, a pair of upper electrodes 5 formed on the upper surface of the insulating substrate 2 to flank the resistor film 4 in electrical connection thereto, a cover coat 6 covering the resistor film 4, an auxiliary upper electrode 7 formed on each of the upper electrodes 5 and including a first portion 7a adjoining the relevant side surface of the insulating substrate 2 and a second portion 7b overlapping the cover coat 6, and a side electrode 8 formed on each of the side surfaces of the insulating substrate 2 and electrically connected to at least the upper electrode 5 and the auxiliary upper electrode 7. The first portion 7a of the auxiliary upper electrode 7 has an obverse surface positioned higher than an obverse surface of the second portion 7b for projecting above an obverse surface of the cover coat 6.

A very robust sensor element for an absolute-pressure measurement is described, which is suitable for high temperatures and able to be miniaturized to a large extent. The micromechanical pressure-sensor element includes a sensor diaphragm having a rear-side pressure connection and at least one dielectrically insulated piezo resistor for signal acquisition. Furthermore, the pressure-sensor element has a front-side reference volume, which is sealed by a cap structure spanning the sensor diaphragm. The cap structure is realized as thin-film structure.

The invention discloses a microwave film resistor and a manufacturing method thereof, and belongs to the field of circuit elements. The microwave film resistor comprises a ceramic substrate, a film resistance layer which is adhered to the upper surface of the ceramic substrate and an electrode layer which is adhered to the film resistance layer. The film resistor has the advantages of high precision, high using frequency and high resistance stability. In addition, the invention also discloses a microwave film resistor network module and a manufacturing method thereof, wherein the microwave film resistor network module is formed by integrating three or more microwave film resistors on one module.

A metal oxide varistor with heat protection has a body, an insulated washer, a first lead, a second lead and a thermal fuse. The body has two sides and two contacts respectively on the sides. The insulated washer is attached to one contact and has a through hole. The first lead is mounted on the other contact. The second lead is mounted on the insulated washer. The thermal fuse is mounted on the insulated washer and electrically connects to the second lead and the second contact. When the body overloads and overheats, the thermal fuse causes the circuit to open quickly, and the insulated washer keeps the thermal fuse from electrically connecting to the second contact again.