203results about "Positive temperature coefficient thermistors" patented technology

The present disclose provides a sol-gel paste composition of matter that is provided for application to a substrate to form an electrically conductive coating which can be used, for example, as a resistor in a thick-film resistive heater, which a positive temperature coefficient of resistivity (PTCR) as a consequence of the electronic properties of the electrically conductive semiconductors used in the resistor layer and which exhibits self-limiting behavior at elevated temperatures. The composition includes a sol gel solution in which up to 90% by weight (wt. %) of the solution is comprised of conductive and insulative powders in a uniform stable solution.

In some embodiments, the multilayer electrical device may have a plurality of electrodes connected to respective terminals, with at least two specific terminals configured to allow relative movement with respect to one another to accommodate changes in the separation distance of each electrode due to temperature changes and to allow solder to provide a connection between the multilayer electrical device and the mounting surface when the multilayer electrical device is soldered onto the mounting surface. In some embodiments, the multilayer electrical device may further include a layer having a temperature dependent electrical property mounted between each of an adjacent pair of electrodes.

The application provides high-curie-temperature low-resistance lead-free thermosensitive ceramic and a preparation method thereof, and belongs to the technical field of electronic ceramic elements. 1‑x‑y La x (Bi 0.5 Na 0.5 ) y )(Ti 0.9996 Mn 0.0004 )O3; wherein the value range of x is 0.001<=x<=0.004, and the value range of y is 0.001<=y<=0.0075. The preparation method comprises the following steps: mixing (Bi 0.5 Na 0.5 )TiO3 powder synthesized by two-stage heating hydrothermal method, (Ba 1‑x La x )TiO3 powder synthesized by solid-phase reaction method, Mn(NO3)2 aqueous solution and sintering auxiliary agent AST powder, then performing granulation, molding, glue removal and sintering. The barium titanate-based thermosensitive ceramic prepared by the method has extremely low room temperature resistivity and relatively high curie temperature.

This negative-characteristic thermistor is provided with: a ceramic substrate formed from a ceramic composition containing Mn, Ni, and Fe; and an external electrode provided at an end portion of the ceramic substrate, in which the external electrode includes a base layer covering the end portion of the ceramic substrate and including Cu and glass, and a plating layer covering the base layer, and the Ni content, the Mn content, and the F content in the ceramic substrate satisfy the following formulae (1) and (2): 26.4 mol% < = [Ni] < = 29.5 mol%, 1.65 < = [Mn] / [Fe] < = 1.90 (2). Wherein [Ni], [Mn], and [Fe] are the contents (mol%) of Ni, Mn, and Fe, respectively, when the total content of Mn, Ni, and Fe contained in the ceramic matrix is 100 mol%.

Systems and methods for load pre-charging may include a machine having one or more machine batteries, one or more machine loads, and a pre-charge circuit intermediary to the one or more machine batteries and the one or more machine loads. The pre-charge circuit may include a power resistor electrically coupled in series with the one or more machine batteries. The pre-charge circuit may include a plurality of arrays of positive temperature control (PTC) resistors, the plurality of arrays of PTCs resistors electrically coupled in parallel with one another, and in series between the power resistor and the one or more machine loads.

This invention provides a method for producing polymer positive temperature coefficient (PPTC) materials that are suitable for flexible applications and have a low environmental impact. [Solution] A method for preparing a PPTC compound and conformally applying the compound to a substrate, comprising the steps of: preparing and mixing raw materials to form a PPTC mixture; processing the PPTC mixture in a polymer compounding apparatus; heating the PPTC mixture and performing a beam irradiation step on the polymer compound to be extruded as a PPTC compound to crosslink the polymer chains within the PPTC compound; and applying the PPTC compound to the substrate using a high-temperature application step. Here, the PPTC compound is heated and conformally applied to the surface of the substrate.

By preventing burnt, cracked, or short-circuited electronic components from occurring in high-voltage environments, this invention provides multilayer electronic components with excellent voltage resistance and reliability. [Solution] The multilayer ceramic capacitor, which is a multilayer electronic component, includes a body containing a first dielectric layer 111a, a second dielectric layer 111b, and internal electrodes 121, 122, and external electrodes 131, 132 disposed on the body. The first dielectric layer mainly contains a BaTiO3-based material, and the second dielectric layer has a different main component from the first dielectric layer (α β Γ δ )Ti x O y The substance contains (β≧0, δ≧0, x>0, y>0) as its main component, where α is one or more of Ba, Er, Ca, and Sr, and Γ is one or more of Nb, Mg, Ta, In, Mn, Hf, Zr, and Al.

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

An electrical device is specified. According to one embodiment, an electrical device includes an electrical element including two electrodes and two wires connected to the electrodes, where each wire includes a flat region constituting a wire end, and where the flat region is configured for contacting the electrodes. The invention further relates to a method for producing an electrical device.

This multilayer electronic component comprises: a layered body in which an internal electrode and a dielectric layer are alternately layered; a base electrode; and an external electrode. The internal electrode has a first internal electrode and a second internal electrode. The base electrode has a first base electrode and a second base electrode. The external electrode has a first external electrode and a second external electrode. The first base electrode and the second base electrode each include a plurality of sintered bodies that are made of dielectric particles. At least some of the plurality of sintered bodies are positioned at an interface between a respective base electrode and the layered body.

Provided is an electronic component comprising: an element body (20); an inorganic oxide layer (30) that covers an outer surface (21) of the element body (20); and a glass layer (50) that covers an outer surface (31) of the inorganic oxide layer (30). The glass layer (50) contains one or more elements selected from alkali metals and alkaline earth metals. Voids (P) are present between the element body (20) and the inorganic oxide layer (30).

An aspect of the disclosure relates to a composite thermistor element (10). The element comprises a sensor material (1) disposed between a pair of electrodes (2a, 2b). The sensor material comprises particles (3) in a dielectric matrix (4). The particles (3) have a core (6) with a temperature dependent resistance and a coating layer (7) of an inorganic material. The particles form an electronic conduction path (5) between the electrodes (2a, 2b) with a temperature dependent resistance and a baseline resistance. Further aspects relate to methods of making thermistors, coated particles, compositions for use in making composite thermistors comprising the particles, and temperature sensors comprising the thermistors disclosed herein.

It enhances the absorption efficiency of infrared rays across a wide wavelength range. [Solution] The infrared sensing element has a temperature sensing layer 22 and an infrared absorbing layer 25 provided separately from the temperature sensing layer 22, which absorbs infrared rays and converts them into heat. The temperature sensing layer 22 and the infrared absorbing layer 25 are thermally connected, and the infrared absorbing layer 25 contains iron oxide.

The present invention provides a multilayer ceramic capacitor which has high adhesion strength between an external electrode and a spacer and exhibits excellent durability when mounted. A multilayer ceramic electronic component 1 according to the present invention is provided with: a capacitor main body 1A that is provided with a multilayer body 2 and two external electrodes 3 which are disposed on two end surfaces of the multilayer body 2, are connected to an internal electrode layer 15, and extend to two main surfaces of the multilayer body 2 so as to partially cover the main surfaces; and two spacers 4 that are disposed on both end surface sides of one main surface side of the capacitor main body 1A, sandwiching the external electrodes 3 partially covering the main surfaces. The spacers 4 are longer than the external electrodes 3 covering the main surfaces, in the length direction, and each contain an intermetallic compound which contains at least one of Cu and Ni as a high melting point metal and Sn as a low melting point metal, and a protective material 6. If each of the spacers 4 is divided into two parts in the length direction along a line extending in a stacking direction, the content ratio of the protective material 6 is higher in a region that is closer to a central part of the capacitor main body 1A in the length direction than in a region that is farther from the central part of the capacitor main body 1A.

A multilayer ceramic electronic component includes a ceramic element in which dielectric layers and internal electrodes are alternately laminated along a first axis direction, and a pair of external electrodes provided at end portions of the ceramic element in a third axis direction so as to be electrically connected to the internal electrodes led out to a different end surface of the ceramic element in the third axis direction. Each of the pair of external electrodes includes a first region and a second region in this order from the ceramic element. An average crystal grain size of crystal grains forming the first region is smaller than an average crystal grain size of crystal grains forming the second region.

The application discloses a lower Curie point positive temperature coefficient polymer composite material and a preparation method and application thereof, and belongs to the polymer positive temperature coefficient thermistor material. The lower Curie point positive temperature coefficient polymer composite material is prepared from fatty acid, random copolymer and conductive filler. Specifically, the fatty acid is used as a phase change material, and the random copolymer is used as a composite material support. The polymer thermistor obtained by the technical scheme has the advantages of low room temperature resistance, poor repeatability and obvious NTC effect of the PTC material with a Curie temperature in the normal temperature range, and the lower Curie point positive temperature coefficient polymer composite material has low low-temperature resistivity, low Curie temperature and high PTC strength. The polymer thermistor has better reliability and stability, and has a wide application prospect in the fields of circuit protection and integrated circuits.

The application discloses a method for precisely depositing an atomic BaTiO3 film on the surface of nickel powder. The method adopts a fluidized bed atomic layer deposition technology, and realizes self-limiting growth of the BaTiO3 film on the surface of the nickel powder by taking titanium-based and barium-based precursors and an oxidizing agent as reaction sources under the conditions of a deposition temperature of 200-400 DEG C and a reaction pressure in a range of 0.1 Torr to normal pressure, so as to form a nanoscale and thickness-controllable dense structure. The method can overcome defects such as poor film quality and fuzzy interface in traditional technologies, and the prepared core-shell structure Ni@BaTiO3 composite powder has the characteristics of uniform coating, strong bonding force, excellent oxidation resistance and the like, can significantly improve the sintering matching property and electrical property of a multilayer ceramic capacitor, and is suitable for the field of internal electrode materials of other electronic components.

To provide a laminated electronic component excellent in reliability even in a high-voltage environment.SOLUTION: According to an aspect of the present disclosure, a multilayer electronic component may include a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, external electrodes disposed on the body and connected to the internal electrodes, and a support member disposed on at least one of opposing surfaces of the body in the first direction, wherein the support member has a first end portion contacting the external electrodes and a second end portion opposing the first end portion, and the second end portion has a thickness in the first direction smaller than that of the first end portion.SELECTED DRAWING: Figure 2

A temperature-sensitive battery connector is disclosed. The connector can include a connector body and at least one conductor attached to the connector body and configured to conduct a current signal used to measure voltage from a battery pack or battery cell to a battery management system (BMS). The connector can include a thermal switch device attached to the connector body and thermally coupled to a terminal of the battery pack or battery cell. The thermal switch device can be configured to provide an overtemperature signal to the BMS by altering or interrupting current conducted by the at least one conductor when the temperature of the battery pack or battery cell exceeds a threshold temperature.

A ceramic thermosensitive element comprises a ceramic body, an inner electrode layer, an interconnection structure and a packaging layer. The inner electrode layer is provided with a first inner electrode layer and a second inner electrode layer which respectively cover the upper surface and the lower surface of the ceramic body. The interconnection structure is provided with a first interconnection structure and a second interconnection structure which are respectively connected with the first inner electrode layer and the second inner electrode layer and extend to the lower part of the second inner electrode layer. The packaging layer wraps the ceramic body, the inner electrode layer and the interconnection structures, so that part of the first interconnection structures and part of the second interconnection structures are located on the lower side of the packaging layer.

The invention relates to the technical field of circuit protection components, in particular to a surface-mounted polymer PTC (Positive Temperature Coefficient) over-current protection component, which comprises a PTC core material, the plastic packaging layer wraps the PTC core material; the rewiring layer is arranged in the plastic packaging layer and is electrically connected with the conductive electrode of the PTC core material; the buried hole is formed in the plastic package layer; the bonding pads comprise a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are arranged outside the plastic packaging layer; the rewiring layer and the buried hole are combined to form an electrical connection path, and the bonding pad is electrically connected with the conductive electrode of the PTC core material through the electrical connection path. According to the invention, the rewiring layer and the buried hole are combined to form an electrical path, the traditional mode of directly manufacturing a bonding pad on an electrode is replaced, the dependence on the processing precision is reduced, the production yield is obviously improved, the cost is reduced, the electrical connection bottleneck of a miniaturized plastic package structure is overcome, and the overcurrent protection of the element is stably realized in a smaller size.

The invention discloses an infrared sensor bridge arm structure, a chip with the bridge arm structure and a preparation method of the infrared sensor bridge arm structure, and relates to an infrared sensor bridge arm structure which comprises an upper film layer, a metal layer and a lower film layer. The stress of the upper film layer is positive, and the stress of the lower film layer is negative; the upper film layer and the lower film layer have the same stress absolute value which is 100 MPa. By adjusting the power, the frequency, the temperature and the pressure of the reaction cavity of the chemical vapor deposition technology, the bridge arm structure with the upper film layer stress being positive, the lower film layer stress being negative and the absolute values of the upper film layer stress and the lower film layer stress being 100 MPa is prepared, and the bridge arm structure is stable and not prone to deformation; the thickness of the upper and lower film layers is changed by adjusting the deposition time of the chemical vapor deposition process, the thickness of the upper film layer is smaller than that of the lower film layer, and the deformation rate of the bridge arm is the lowest.

In embodiments a method for providing a contacting for a functional ceramic element includes providing a functional ceramic, applying a metal paste to two opposing surfaces of the functional ceramic, laminating ceramic substrate green films on the metal paste on the two opposite surfaces of the functional ceramic, and jointly sintering the functional ceramic, the ceramic substrate green films forming electrically insulating ceramic layers and the metal paste forming electrically conductive metal structures.

The invention discloses an automobile PTC (Positive Temperature Coefficient) core and controller assembly structure and an automobile air conditioner with the automobile PTC core and controller assembly structure. The PTC core body can be used for heating the air conditioning box; a PCB (Printed Circuit Board), wherein the PTC core body is arranged on the PCB; the PTC core body is perpendicular to the PCB, and the PTC core body and the PCB are connected to form an L-shaped structure; the PTC core body can be inserted into an air conditioning box; and the PCB does not shield the foot blowing air channel. Gaps are formed in the periphery of the PTC, interference with a foot blowing air channel is avoided, the structure change of an automobile air conditioner can be adapted, and the purposes of reducing cost and increasing efficiency are achieved.

The utility model relates to the technical field of resistors, in particular to an embedded resistor unit, which comprises an insulated support tube and a plurality of resistor modules, and two ends of the support tube are penetrated to form a heat dissipation channel; a plurality of limiting grooves are formed in the inner wall of the supporting pipe, and the resistor modules are inserted into the limiting grooves from ports of the supporting pipe in a one-to-one correspondence mode. Each resistor module comprises a plurality of resistor blocks which are arranged at intervals and a conductive strip which is used for positioning the plurality of resistor blocks and is connected in series. Compared with the prior art, the multiple resistor modules are arranged at the limiting grooves in the inner wall of the supporting pipe, more resistor modules can be contained, different numbers of resistor modules can be electrically connected according to needs during use, and use is more flexible; and when a local resistor module breaks down, the corresponding resistor module can be conveniently replaced, so that the whole resistor is not scrapped, and the application cost is saved.

Disclosed is a method for improving anti-reduction performance of a PTC thermosensitive element, including coating an inorganic protective layer, organic protective layer, or organic and inorganic composite protective layer coated with a mixture of an inorganic substance and an organic substance for blocking harmful reducing gases from entering an interior of a ceramic body through surface defects or grain boundaries of the ceramic body onto the surface of a PTC thermosensitive element based on barium lead titanate. Advantages: by coating the inorganic protective layer, organic protective layer, or organic and inorganic composite protective layer coated with the mixture of the inorganic substance and the organic substance onto the surface of the PTC thermosensitive element based on barium lead titanate to form an isolation protective layer for blocking reducing harmful gases from entering the interior of the ceramic body through the surface defects or grain boundaries of the ceramic body.

A positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance and a preparation method therefor, the thermistor element comprising a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has the following features: the thermistor element further comprises a microporous channel barrier layer, and the microporous channel barrier layer comprises a glass sealing layer or an organic matter sealant; when the microporous channel barrier layer is the glass sealing layer, the glass sealing layer integrally wraps the outer surface of the thermosensitive ceramic piece, and the metal ohmic electrodes are combined on two side surfaces of the glass sealing layer; and when the microporous channel barrier layer is the organic matter sealant, the organic matter sealant fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece. Thus, resistance to harsh environments is improved, service life is prolonged, and the reliability and expected service requirements of related heating groups are improved.

The application relates to the field of PTC thermistors, in particular to a sheet type PTC thermistor and a preparation method thereof. The sheet type PTC thermistor comprises a heat-conducting insulating framework and a PTC high polymer matrix, the heat-conducting insulating framework is a face-centered cubic structure PU framework and high-heat-conducting insulating particles coated on the surface of the PU framework; the PTC high polymer matrix is made of the following raw materials in mass percentage: 15-30% of hydrophobic modified conductive composite filler, 0.5-2% of anti-aging auxiliary agent, 0.2-0.8% of zinc stearate, and the rest is a thermoplastic high polymer resin with high linear thermal expansion coefficient. The heat induction sensitivity of the application is relatively excellent, the temperature induction lag time of the thermistor is shorter, the temperature monitoring module applied to a lithium battery cell can timely give an early warning, the safe driving coefficient of a vehicle is improved, and the property loss and the personal injury risk are reduced.

To provide a fabrication method that allows sintering solderable base metal and alloy elements under air.SOLUTION: A solderable electrode can be manufactured by heat treatment instead of electroplating. This method directly adds a large amount of metal powder to the electrode, and also adds metallic aluminum powder with a high oxidation enthalpy to protect the tin from oxidation. Adding other metals, such as metallic copper powder, produces a copper-tin alloy to increase its melting point. This method also directly uses a tin-based electrode, and covers the tin electrode with an aluminum film to prevent it from oxidizing during heat treatment. Adding a suitable metal, such as copper, to the tin film produces a tin-copper alloy, thereby increasing the melting point of the electrode. This invention thus uses a heat treatment process instead of electroplating to produce electrodes for an electronic device without the need for a tin electroplating process, resulting in solderable electrodes with excellent solderability and high performance properties.SELECTED DRAWING: Figure 6