560results about "Positive temperature coefficient thermistors" patented technology

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are alternately laminated, a base electrode, and an external electrode. The internal electrodes include a first internal electrode and a second internal electrode. The base electrode includes a first base electrode and a second base electrode. The external electrode includes a first external electrode and a second external electrode. Each of the first base electrode and the second base electrode contains a plurality of sintered bodies made of dielectric particles. At least a part of the plurality of sintered bodies is located at the interface between each base electrode and the laminate.

An energy storage system and energy storage module for providing electrical energy to a generator start energy system or other electrically driven system. One or more ultracapacitors are included within the energy storage module for storing and providing electrical charge via a two-post electrical connection of the energy storage module. A mountable housing of the energy storage module provides a variety of mounting orientations within a compartment of the generator start energy system or other electrically driven system.

The invention relates to the field of ceramic materials, provides a high-voltage-resistant PTC (Positive Temperature Coefficient) thermal sensitive ceramic material as well as a preparation method and application thereof, and aims to improve the voltage resistance and PTC effect stability of thermal sensitive ceramic. The material is composed of aluminum oxide-coated manganese-doped barium titanate nanorods, hollow-core silicon dioxide microspheres and a glass phase sintering aid, and the electric heating performance and the microstructure stability are optimized by constructing a core-shell structure and a three-dimensional composite system. A hydrothermal method and a sol-gel method are adopted to precisely control a raw material structure, and alcohol dispersion, tape casting and weak oxidizing atmosphere sintering are combined, so that the compactness and consistency of the ceramic are ensured. The material is suitable for high-voltage temperature control elements and over-current protection devices, and is widely applied to the fields of new energy automobile battery pack over-temperature protection, high-voltage power equipment current limiting elements, industrial automatic temperature control switches and the like.

The invention relates to a metallization layer for a PTC semiconductor ceramic for at least partially coating the surface of the PTC semiconductor ceramic, which contains at least one functional layer, wherein the at least one functional layer serves for current distribution, wherein the porosity of the at least one functional layer is less than 5%, as well as a method for applying the metallization layer to a PTC semiconductor ceramic, a PTC thermistor which has this metallization layer, and the use thereof.

The present invention discloses a sea-island structure conductive composite material and a PTC element. The sea-island structure conductive composite material has a resistivity of no more than 10Ω.cm and comprises: a first conductive composite material composition and a second conductive composite material composition, wherein the first crystalline polymer in the first conductive composite material composition has a melting point higher than that of the second crystalline polymer in the second conductive composite material composition by more than 15°C; the first conductive composite material composition is distributed in the second conductive composite material composition in the form of particles, presenting a sea-island structure, with a particle size of 0.1-50um, and accounting for 8% to 60% of the volume fraction of the sea-island structure conductive composite material. The PTC element prepared from the sea-island structure conductive composite material has a PTC effect with a double-step protection feature in its RT curve, and has an excellent overcurrent protection effect. The shortcomings of overcurrent protection element burning and failure to trigger protection in time can be avoided.

A thermal resistor includes a substrate, a thermistor, a front electrode, a passivation protection layer, and an external protection layer. The thermistor does not include an oxide and is made of a base metal. Therefore, it can reduce the production cost. The passivation protection layer is formed by sputtering, physical vapor deposition, or chemical vapor deposition, in which the passivation protection layer conformally covers a surface of the thermistor and can protect the underlying thermistor.

The invention belongs to the field of polymer films, and discloses a polyvinylidene fluoride film based on cross-linking reaction and a preparation method and application thereof, and the preparation method comprises the following steps: mixing cyclohexanone, polyvinylidene fluoride and polyoxyethylene diamine to obtain a mixed solution; curing the mixed solution into a film to obtain a blended polyvinylidene fluoride film; and carrying out cross-linking reaction on the blended polyvinylidene fluoride film to obtain a cross-linked polyvinylidene fluoride film, and culturing the cross-linked polyvinylidene fluoride film at 150-165 DEG C to obtain the polyvinylidene fluoride film with high gamma crystal form content. Through detection and comparison, in the polyvinylidene fluoride film based on the cross-linking reaction, the gamma-phase crystal content is obviously increased, and the alpha-phase crystal content is obviously reduced. The method is simple in process and convenient to operate, polyvinylidene fluoride is endowed with the capacity of obtaining gamma crystals at a low temperature in a short time, and the method can be widely applied to the fields of pressure sensors, lithium ion batteries, automobile motors, high-temperature-resistant thermistor devices and the like.

An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as α-PVDF, β-PVDF and γ-PVDF. The total amount of α-PVDF, β-PVDF and γ-PVDF is calculated as 100%, and the amount of γ-PVDF accounts for 33% to 42%.

The invention relates to a high-temperature-resistant thermosensitive crystal resonator without a sealing cover, which comprises a lower base, a quartz chip and a thermistor, an upper base is arranged at the upper end of the lower base, the middle part of the upper end of the lower base and the middle part of the lower end of the upper base are respectively provided with a groove, and the two grooves are butted up and down to form an inner cavity; a quartz chip is installed in the lower groove, a thermistor is installed in the upper groove, and external electrodes connected with the quartz chip and the thermistor in a one-to-one correspondence mode are arranged at the lower end of the lower base. The upper base is used for replacing a metal upper cover for sealing, so that the thermal stress of the thermosensitive crystal resonator is effectively reduced, the problem that gold-tin alloy overflows due to packaging of a traditional metal upper cover is solved, meanwhile, the sealing performance of the resonator is improved, and accurate real-time temperature signals can be provided; the purpose of stable work in a high-temperature environment is achieved.

An over-current protection element comprises an electrode layer and a thermistor layer. The electrode layer has an upper metal layer and a lower metal layer. The thermistor layer contacts the upper metal layer and the lower metal layer and is stacked between the upper metal layer and the lower metal layer. The thermistor layer has a positive temperature coefficient characteristic and contains a high-molecular polymer base material and a conductive filler. The high-molecular polymer base material contains a fluorine-containing polymer, the fluorine-containing polymer has a plurality of spherocrystals, and the fractal dimension of the surface of each spherocrystal is lower than 12.

An over-current protection device comprises first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler and a titanium-containing inner filler. The polymer matrix has a fluorine-free polyolefin-based polymer. The titanium-containing inner filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing inner filler accounts for 1-9% by volume of the PTC material layer.

The present invention relates to a high-temperature-resistant thermistor crystal resonator without a sealing cover, comprising a lower base, a quartz chip, and a thermistor. The upper end of the lower base is mounted with an upper base, and a groove is formed in the middle of the upper end of the lower base and the middle of the lower end of the upper base. The two grooves are connected to form an inner cavity, and the quartz chip is mounted in the lower groove, and the thermistor is mounted in the upper groove. The lower end of the lower base is provided with external electrodes connected to the quartz chip and the thermistor in a one-to-one correspondence. The present invention uses an upper base instead of a metal upper cover for sealing to effectively reduce the thermal stress of the thermistor crystal resonator, solves the problem of overflow of the gold-tin alloy caused by traditional metal upper cover packaging, and simultaneously improves the sealing of the resonator and can provide an accurate real-time temperature signal, achieving the purpose of stable operation in a high temperature environment.

To provide a fabrication method that allows sintering solderable base metal and alloy elements under air.SOLUTION: A solderable electrode can be manufactured by heat treatment instead of electroplating. This method directly adds a large amount of metal powder to the electrode, and also adds metallic aluminum powder with a high oxidation enthalpy to protect the tin from oxidation. Adding other metals, such as metallic copper powder, produces a copper-tin alloy to increase its melting point. This method also directly uses a tin-based electrode, and covers the tin electrode with an aluminum film to prevent it from oxidizing during heat treatment. Adding a suitable metal, such as copper, to the tin film produces a tin-copper alloy, thereby increasing the melting point of the electrode. This invention thus uses a heat treatment process instead of electroplating to produce electrodes for an electronic device without the need for a tin electroplating process, resulting in solderable electrodes with excellent solderability and high performance properties.SELECTED DRAWING: Figure 6

An electrical device is described. According to one embodiment, the electrical device comprises an electrical element comprising two electrodes and two wires connected to the electrodes, each wire comprising a flat area forming one end of the wire, and the flat areas being configured to touch the electrodes. Furthermore, a method for manufacturing an electrical device is described.

An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as α-PVDF, β-PVDF and γ-PVDF. The total amount of α-PVDF, β-PVDF and γ-PVDF is calculated as 100%, and the amount of α-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.

The present disclose provides a sol-gel paste composition of matter that is provided for application to a substrate to form an electrically conductive coating which can be used, for example, as a resistor in a thick-film resistive heater, which a positive temperature coefficient of resistivity (PTCR) as a consequence of the electronic properties of the electrically conductive semiconductors used in the resistor layer and which exhibits self-limiting behavior at elevated temperatures. The composition includes a sol gel solution in which up to 90% by weight (wt. %) of the solution is comprised of conductive and insulative powders in a uniform stable solution.

The present disclose provides a sol-gel paste composition of matter that is provided for application to a substrate to form an electrically conductive coating which can be used, for example, as a resistor in a thick-film resistive heater, which a positive temperature coefficient of resistivity (PTCR) as a consequence of the electronic properties of the electrically conductive semiconductors used in the resistor layer and which exhibits self-limiting behavior at elevated temperatures. The composition includes a sol gel solution in which up to 90% by weight (wt. %) of the solution is comprised of conductive and insulative powders in a uniform stable solution.

To provide a temperature sensor in which a thermistor is accurately determined with respect to a case.SOLUTION: A thermistor assembly body 110 includes a thermistor 111, rigid two lead members 112, and a first resin part 113. A first end part 1121 of the two lead members 112 is connected to the thermistor 111 and the thermistor 111 is sealed by the first resin part 113.SELECTED DRAWING: Figure 6

The present invention provides an improved plastic-sealed patch thermal varistor, comprising a thermistor chip, a varistor chip is arranged on one side of the thermistor chip, and a connecting piece is electrically connected to the lower part of the varistor chip and the thermistor chip, wherein the middle part of the right part of the connecting piece is integrally connected with a first pin; the upper part of the thermistor chip is electrically connected with a second pin; the upper part of the varistor chip is electrically connected with a third pin; and the outer sides of the thermistor chip and the varistor chip are provided with a plastic sealing layer. The present invention can inject solder paste into a paste storage conductive box through a tin injection port, so that the solder paste can be individually isolated through the paste storage conductive box, thereby avoiding the problem of bridging of the solder paste, and then avoiding the problem of short circuit after the thermal varistor is welded, and achieving the effect of paste storage welding.

The present invention belongs to the technical field of the preparation of electronic ceramic components. More specifically, it relates to a preparation method of a high temperature coefficient thermosensitive material. Graphene is uniformly mixed with ceramic powder. After reduction sintering, graphene is uniformly dispersed at the grain boundaries of barium titanate ceramic grains. During the reoxidation process, graphene is oxidized and removed to form two-dimensional pores, which serve as oxygen transmission paths to promote the reoxidation of the ceramic grain boundaries to form barriers, thereby preparing a high-density, low reoxidation temperature, high temperature coefficient porous barium titanate-based thermosensitive ceramic. The present invention can be applied to the existing preparation process of barium titanate thermosensitive ceramics. By adding only a small amount of graphene, the reoxidation temperature of barium titanate thermosensitive ceramics can be reduced, and a barium titanate thermosensitive ceramic with high density, a relatively high rise-to-resistance ratio, and a high temperature coefficient can be prepared.

The utility model relates to the technical field of thermistors, and discloses a high-corrosion-resistance thermistor which comprises a resistor body, a lead is arranged on the lower surface of the resistor body, a protective shell is arranged on the side wall of the resistor body, a sealing cover is arranged on the lower surface of the resistor body, and a fixing assembly is arranged on the side wall of the sealing cover. A sealing assembly is arranged on the upper surface of the sealing cover, the fixing assembly comprises a fixing block, the side wall of the fixing block is fixedly connected to the side wall of the sealing cover, a clamping sleeve is fixedly connected to the side wall of the protective shell, a first clamping groove is formed in the clamping sleeve, an elastic plate is fixedly connected to the upper surface of the fixing block, and a clamping block is fixedly connected to the side wall of the elastic plate. The sealing assembly comprises a mounting block, and the side wall of the mounting block is fixedly connected to the upper surface of the sealing cover. According to the utility model, the elastic plate slides into the clamping sleeve, so that the clamping block is clamped with the clamping groove I, the fixing effect is achieved, and the practicability of the equipment is improved through the structure.

In some embodiments, the multilayer electrical device may have a plurality of electrodes connected to respective terminals, with at least two specific terminals configured to allow relative movement with respect to one another to accommodate changes in the separation distance of each electrode due to temperature changes and to allow solder to provide a connection between the multilayer electrical device and the mounting surface when the multilayer electrical device is soldered onto the mounting surface. In some embodiments, the multilayer electrical device may further include a layer having a temperature dependent electrical property mounted between each of an adjacent pair of electrodes.

The application provides high-curie-temperature low-resistance lead-free thermosensitive ceramic and a preparation method thereof, and belongs to the technical field of electronic ceramic elements. 1‑x‑y La x (Bi 0.5 Na 0.5 ) y )(Ti 0.9996 Mn 0.0004 )O3; wherein the value range of x is 0.001<=x<=0.004, and the value range of y is 0.001<=y<=0.0075. The preparation method comprises the following steps: mixing (Bi 0.5 Na 0.5 )TiO3 powder synthesized by two-stage heating hydrothermal method, (Ba 1‑x La x )TiO3 powder synthesized by solid-phase reaction method, Mn(NO3)2 aqueous solution and sintering auxiliary agent AST powder, then performing granulation, molding, glue removal and sintering. The barium titanate-based thermosensitive ceramic prepared by the method has extremely low room temperature resistivity and relatively high curie temperature.

This negative-characteristic thermistor is provided with: a ceramic substrate formed from a ceramic composition containing Mn, Ni, and Fe; and an external electrode provided at an end portion of the ceramic substrate, in which the external electrode includes a base layer covering the end portion of the ceramic substrate and including Cu and glass, and a plating layer covering the base layer, and the Ni content, the Mn content, and the F content in the ceramic substrate satisfy the following formulae (1) and (2): 26.4 mol% < = [Ni] < = 29.5 mol%, 1.65 < = [Mn] / [Fe] < = 1.90 (2). Wherein [Ni], [Mn], and [Fe] are the contents (mol%) of Ni, Mn, and Fe, respectively, when the total content of Mn, Ni, and Fe contained in the ceramic matrix is 100 mol%.

Systems and methods for load pre-charging may include a machine having one or more machine batteries, one or more machine loads, and a pre-charge circuit intermediary to the one or more machine batteries and the one or more machine loads. The pre-charge circuit may include a power resistor electrically coupled in series with the one or more machine batteries. The pre-charge circuit may include a plurality of arrays of positive temperature control (PTC) resistors, the plurality of arrays of PTCs resistors electrically coupled in parallel with one another, and in series between the power resistor and the one or more machine loads.

The multilayer electronic component includes a laminate in which internal electrodes and dielectric layers are laminated, a base electrode, and an external electrode. The internal electrodes have a first internal electrode and a second internal electrode, the base electrode has a first base electrode and a second base electrode, and the external electrode has a first external electrode and a second external electrode. Each of the first external electrode and the second external electrode has a first portion connected to the first internal electrode or the second internal electrode and a second portion connected to any of the base electrodes. The average particle diameter of the metal particles contained in the first portion is smaller than the average particle diameter of the metal particles M contained in the second portion.

This invention provides a method for producing polymer positive temperature coefficient (PPTC) materials that are suitable for flexible applications and have a low environmental impact. [Solution] A method for preparing a PPTC compound and conformally applying the compound to a substrate, comprising the steps of: preparing and mixing raw materials to form a PPTC mixture; processing the PPTC mixture in a polymer compounding apparatus; heating the PPTC mixture and performing a beam irradiation step on the polymer compound to be extruded as a PPTC compound to crosslink the polymer chains within the PPTC compound; and applying the PPTC compound to the substrate using a high-temperature application step. Here, the PPTC compound is heated and conformally applied to the surface of the substrate.

By preventing burnt, cracked, or short-circuited electronic components from occurring in high-voltage environments, this invention provides multilayer electronic components with excellent voltage resistance and reliability. [Solution] The multilayer ceramic capacitor, which is a multilayer electronic component, includes a body containing a first dielectric layer 111a, a second dielectric layer 111b, and internal electrodes 121, 122, and external electrodes 131, 132 disposed on the body. The first dielectric layer mainly contains a BaTiO3-based material, and the second dielectric layer has a different main component from the first dielectric layer (α β Γ δ )Ti x O y The substance contains (β≧0, δ≧0, x>0, y>0) as its main component, where α is one or more of Ba, Er, Ca, and Sr, and Γ is one or more of Nb, Mg, Ta, In, Mn, Hf, Zr, and Al.

An electronic component that includes: a base body; and an external electrode that covers a part of an outer surface of the base body, the external electrode including: an underlying electrode containing copper and silicon; and a metal layer that covers an outer surface of the underlying electrode, wherein at least some of the copper has copper particles with a flattening ratio of 0.5 or less, and when the underlying electrode is viewed in section, the silicon is distributed so as to fill gaps between the copper particles.

An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer has a first volume and a first melt flow index, and the second fluoropolymer has a second volume and a second melt flow index. The second melt flow index ranges from 0.4 g / 10 min to 0.7 g / 10 min and is lower than the first melt flow index, and a volume ratio by dividing the second volume by the first volume ranges from 0.4 to 0.6.