175 results about "Thermoelectric element" patented technology

The refrigerator includes: a main body; a storage chamber formed inside the main body; a door provided so that the storage compartment can be opened and closed; an evaporator that evaporates the refrigerant to generate cold air; an evaporator duct disposed at a rear side of the storage compartment to supply the cold air generated by the evaporator to the storage compartment; and a thermoelectric cooling device including a thermoelectric element having a heating unit and a cooling unit. The thermoelectric cooling device is configured to heat air from the outside of the main body by the heating unit and discharge the air heated by the heating unit to the outside of the main body, cool air from the storage compartment by the cooling unit, and supply the air cooled by the cooling unit to the storage compartment, and is disposed above the storage compartment.

A container with active temperature control system is provided. The active temperature control system is operated to heat or cool a chamber sized to receive a beverage therein. The container includes an insulated vessel that has the chamber and a cooling or heating unit. The cooling or heating unit includes a thermoelectric element in thermal communication with the chamber, phase change material in thermal communication with the thermoelectric element, a power storage device, and circuitry to control the operation of the thermoelectric element. The cooling or heating unit is operable to increase or decrease or maintain a temperature of the beverage in the chamber by operating the thermoelectric element to draw heat from the chamber and transfer it to the module of phase change material.

Device for generating a dielectric barrier discharge, comprising: - a discharge reactor comprising a thermoelectric element (1) and an electrode (2), and - a control device (13) comprising a high-voltage source (12) and a low-voltage source (11), wherein the high-voltage source (12) is configured to apply a high-voltage potential to the electrode (2) sufficient to ignite the dielectric barrier discharge, wherein a gas is enriched with reactive species by the dielectric barrier discharge, wherein the low-voltage source (11) is configured to adjust a current through the thermoelectric element (1), wherein the control device (13) is configured to suitably adjust operating parameters of the high-voltage source (12) and the low-voltage source (11) for a desired composition of the enriched gas, wherein the control device (13) is configured toWhen setting the operating parameters, the gas flow rate through the discharge reactor and / or the composition and / or temperature of the gas at the inlet to the discharge reactor and / or the ambient temperature must be taken into account.

A pad is disclosed. The pad of the present disclosure comprises: a case having an upper plate; a thermoelectric element disposed inside the case; a plate in contact with the thermoelectric element and disposed below the upper plate; and an electric heating sheet disposed between the plate and the upper plate, wherein the upper surface of the electric heating sheet may be in contact with the upper plate, and the lower surface of the electric heating sheet may be in contact with the plate.

According to various embodiments, provided is a portable rehabilitation cooling therapy device comprising: a cooling device; and a gripping structure that is connected to the cooling device and includes a battery. The cooling device includes: a housing that includes a plurality of first holes and a plurality of second holes on the respective side surfaces and a plurality of third holes on the upper portion; a multi-layer thermoelectric element disposed inside the housing and capable of cooling one surface to -10°C or below by using power supplied from the battery; a heat sink that is disposed on the upper portion of the multi-layer thermoelectric element and includes a body and a plurality of heat dissipation fins protruding from the body and extending in a direction from the plurality of first holes toward the plurality of second holes; and a heat dissipation fan disposed on the heat sink.

The present application relates to a kind of ion polymer-based thermoelectric pile heat flux sensor device, the thermoelectric pile heat flux sensor includes in turn: first protective layer, first connecting circuit, thermal resistance layer, thermoelectric element, second connecting circuit and second protective layer, wherein the thermoelectric element is embedded in the thermal resistance layer and is made of ion conductor with free ion as main carrier. Since ion conductor has huge thermoelectric potential, only a few pairs of ion thermoelectric column need to be integrated to obtain the required thermoelectric voltage with the required sensitivity.

Embodiments disclosed in the present document relate to a thermoelectric element and a thermoelectric module and, specifically, to a thermoelectric element and a thermoelectric module for responding to partial disconnection of a thermoelectric element. A thermoelectric element according to an embodiment may comprise: a first substrate; a plurality of first electrodes disposed on the first substrate; a plurality of thermoelectric legs disposed on the first electrodes; a plurality of second electrodes disposed on the thermoelectric legs; and a second substrate disposed on the second electrodes, wherein the thermoelectric legs include: a plurality of outer legs arranged along the outer periphery of the first substrate and connected to each other in series; and a plurality of inner legs arranged inward of the outer legs and connected to each other in series, and the first electrodes include a first terminal electrode pair connected to both ends of the outer legs connected to each other in series.

The embodiment of the invention provides a camera defrosting system control method and device, equipment and a medium. The camera defrosting system comprises a thermoelectric sheet assembly, a heating assembly, a heat dissipation structure layer, a sensor assembly and an energy storage and control assembly. The operation heat of the energy storage and control assembly is transmitted to the thermoelectric sheet assembly through the heat dissipation structure layer. The heat dissipation structure layer is used for separating the heating assembly from the thermoelectric sheet assembly when the heating assembly emits heat; the thermoelectric sheet assembly is used for converting operation heat to charge the energy storage and control assembly; environmental parameters detected by a sensor assembly are obtained; a dynamic defrosting threshold value is determined based on the environment parameters; determining a target power regulation coefficient based on the charge state of the energy storage and control assembly and the operation state of the thermoelectric sheet assembly; and the heating assembly and the energy storage and control assembly are controlled based on the target power adjusting coefficient, the dynamic defrosting threshold value and the environment parameters. According to the embodiment of the invention, camera demisting can be carried out in a low-power-consumption and self-adaptive manner.

The invention discloses a temperature difference self-power-generation device utilizing waste heat of a buried steam pipeline and a working method, and belongs to the technical field of heat energy recovery and self power supply. The first heat-conducting plate is arranged on the outer wall of the steam pipeline, the hot-end ceramic substrate, the thermoelectric element, the cold-end ceramic substrate and the second heat-conducting plate are arranged outside the first heat-conducting plate, and the thermoelectric element is connected with the cathode lead and the anode lead. The second heat-conducting plate is connected with a heat pipe, and the upper end of the heat pipe extends out of the ground. Through the design that the annular thermoelectric power generation piece is attached to the outer wall of the steam pipeline, the contact thermal resistance of a heat source and the power generation piece is effectively reduced, it is ensured that the hot end is evenly heated, and the heat energy conversion efficiency is improved; a cold-end heat dissipation structure combining the heat pipes and the heat dissipation fins is adopted, cold-end heat is efficiently transmitted to surface air through the phase change heat transfer characteristic of a working medium, the cold-end temperature is remarkably reduced, the effective temperature difference of the thermoelectric power generation piece is maintained, and therefore the power generation efficiency is stably improved.

The disclosure is related to structures and method of making thermoelectric devices. The structures include an electrically nonconductive and thermally conductive substrate with direct bonded or electroplated copper. Thermoelement pairs are formed on a barrier layer deposited on the outer layers of the substrate in gaps formed from insulator material deposited on the barrier layer. Openings in the barrier layer may be filled with an insulator to isolate thermoelements, which may then be bridged by a metal layer. Thermoelement pairs may be combined to form larger devices.

The present application provides a thermostat and a manufacturing method thereof, which can easily assemble shell members constituting a shell and reduce manufacturing cost. The thermostat comprises a shell (1), a thermoelectric element (17) moving in an axial direction in response to the temperature of a cooling liquid, a valve body (15) opening and closing a communication part of a first flow passage (21) and a second flow passage (7) by moving away from and approaching a valve seat (20b) provided inside the shell in response to the movement of the thermoelectric element, and a force applying member (16) applying force to the valve body to the valve seat side. The shell comprises a first shell member (2) having a main body (20), the first flow passage and the second flow passage, and a second shell member (3) fastened to the first shell member by rotating in a circumferential direction of the first shell member and having a third flow passage (22).

The application discloses an n-type bismuth telluride-based thermoelectric element NiFeP alloy interface barrier layer and a preparation method thereof, and belongs to the technical field of thermoelectric materials and devices. The barrier layer in the application is an electroplated NiFeP ternary plating layer, the content of Fe is 15-20 wt%, the content of P is 2-4 wt%, the balance is Ni, the thickness is 5-10 microns, and the barrier layer is prepared through substrate pretreatment, electroplating solution preparation, electroplating deposition and post-treatment. The application also constructs a thermoelectric element containing the barrier layer, and the n-type bismuth telluride thermoelectric material layer is connected by a NiFeP alloy interface barrier layer, a SAC305 solder layer and a copper electrode layer in sequence. The barrier layer has excellent diffusion inhibition effect, the interface bonding strength is greater than 16 MPa and the contact resistivity is less than 8 mu omega cm after aging at 200 DEG C for 144 hours. 2 The preparation process is simple, the cost is relatively low, large-scale production is suitable, and the barrier layer is expected to play an important role in the application field of thermoelectric materials and devices.

To provide a thermoelectric conversion material capable of improving the efficiency of thermoelectric conversion.SOLUTION: A thermoelectric conversion material includes a base material composed of SiGe, a first additive element functioning as a dopant, a second additive element different from the first additive element, and oxygen. The second additive element includes at least one of Mg, Ca, and Ti. A content ratio of the second additive element relative to the base material is 0.5 at% or more and 5 at% or less. In a field of view selected such that a grain boundary crosses opposite sides of the field of view to each other that is the field of view of a cross-section of the base material, distributions of the second additive element and oxygen have a positive correlation. A correlation coefficient of the correlation is in a range of 0.2 or more and less than 1.0.SELECTED DRAWING: Figure 7

According to an embodiment, a display device includes: a display panel, a printed circuit board (PCB), a heat generating element comprising an electronic component including various circuitry coupled on the PCB and configured to emit heat based on driving of the display panel, a chassis positioned on a surface of the display panel, including a heat dissipation portion adjacent to the heat generating element, and a support portion configured to support the PCB, a thermoelectric element including at least one electrode interposed between the heat generating element and the heat dissipation portion, including a first surface in contact with the heat generating element and a second surface in contact with the heat dissipation portion, and a battery connected to the thermoelectric element. The thermoelectric element is configured to charge the battery based on a temperature difference between a first temperature of the first surface, associated with the heat emitted from the heat generating element, and a second temperature of the second surface, which is lower than the first temperature by the heat dissipation portion.

The invention relates to a thermoelectric heat pump including a heat exchanger block with a first channel for flow therethrough of a first heat transfer fluid such as a liquid medium and a separate second channel for flow therethrough of a second heat transfer fluid such as a liquid medium. The heat exchanger block includes a heat exchange cavity which is hydraulically separated by a partition into a first and a second sub-cavity which are connected to respectively the first and second channel and wherein the first heat transfer fluid in the first sub-cavity is in heat-exchanging contact with a first side of the partition and the second heat transfer fluid in the second sub-cavity is in heat-exchanging contact with a second side of the partition lying opposite the first side. The partition includes a thermoelectric element with a cold side and a hot side lying opposite thereto and at a distance therefrom. An outer peripheral edge extends between the cold and hot side, which thermoelectric element is configured to transport heat from the cold side to the hot side and wherein the cold side is in heat-exchanging contact with the first heat transfer fluid and wherein the hot side is in heat-exchanging contact with the second heat transfer fluid and wherein each channel is provided with a pump for pumping the respective heat transfer fluid through the channel.

The present invention provides a mass production method for novel thermoelectric elements, comprising: (a) filling a spacer portion located inside a mold portion with thermoelectric material powder so as to surround the inside and outside of the spacer portion; (b) applying pressure to the spacer portion with a punch; (c) sintering the thermoelectric material powder using spark plasma to produce a sintered body; and (d) cutting the sintered body into a predetermined size to produce a large number of thermoelectric elements.

A thermoelectric element according to an embodiment of the disclosure includes a first substrate, a first buffer layer disposed on the first substrate, a first electrode disposed on the first buffer layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second buffer layer disposed on the second electrode, and a second substrate disposed on the second buffer layer, wherein at least one of the first buffer layer and the second buffer layer includes silicone and an inorganic material, and a Young's modulus of at least one of the first buffer layer and the second buffer layer is 1 MPa to 65 MPa.

A thermoelectric leg, a method for manufacturing the same, and a thermoelectric element including the same are disclosed. The method for manufacturing the thermoelectric leg may include a sintered solid forming step, which includes a basic sintering step of sintering a powder of a soluble substance or a powder of a semiconductor substance in a hot-press step in a mold; an additional sintering step of performing one or more additional sintering steps in another mold with the sintered solid and the powder of the soluble substance or the powder of the semiconductor substance to form a sintered solid for dissolution that includes all of the soluble substance and the semiconductor substance; and a hollow forming step of exposing the soluble substance in the sintered solid for dissolution to a solvent and selectively removing it to form a hollow.

A refrigerator includes: a main body having an upper wall; the storage chamber is formed in the main body; the door is used for opening and closing the storage chamber; a thermoelectric element disposed on the upper wall and including a heating portion that generates heat and faces upward and a cooling portion that absorbs heat and faces downward; the cooling sink comprises a cooling sink base in contact with the refrigeration part and a plurality of cooling fins, and the plurality of cooling fins protrude from the cooling sink base in a first direction perpendicular to the lower surface of the cooling sink base and extend in a second direction parallel to the lower surface of the cooling sink base; the cooling sink is cooled along with heat absorption of the refrigeration part; a cooling fan provided on the upper wall so as to blow air toward the plurality of cooling sink fins in the second direction such that the air blown by the cooling fan is cooled by the cooling sink; and a cooling duct disposed in the upper wall.

The invention relates to an electric heating device. The invention relates to an electric heating device for heating a fluid, comprising a control unit (101), which has a control housing (102) and at least one printed circuit board (103) arranged therein and having at least one electrical circuit (104), and at least one electrical switching element (105), which is electrically conductively connected to the electrical circuit (104) on the printed circuit board (103). The invention relates to a thermoelectric device (100, 200) comprising at least one thermoelectric element or thermoelectric converter (106, 200) having a first side (107, 207) and a second side (108, 208), the first side (107, 207) being cooled and the second side (108, 208) being heated when an electric current is applied to the thermoelectric element (106, 200), and wherein the at least one electrical switching element (105) is connected to the first side (107, 207) of the thermoelectric element (106, 200) in a thermally conductive manner and the control housing (102) is connected to the second side (108, 208) of the thermoelectric element (106, 200) in a thermally conductive manner.

To provide a thermoelectric generator system in which cooling efficiency of a cooling fin is improved and power generation efficiency is excellent.SOLUTION: A thermoelectric generator system including a thermoelectric generator that generates power by a plate-shaped thermoelectric element 1 includes: a thermoelectric generator having a heat source 3 that heats one surface of the thermoelectric element 1 and a plurality of air-cooled cooling fins 2 that cool the other surface of the thermoelectric element; and an exhaust tube 4 that is configured to blow inflow air 5 to the cooling fin, extends in a vertical direction, extends in an upper direction, and collects and discharges exhaust air after cooling.SELECTED DRAWING: Figure 3

To provide a thin thermoelectric conversion element having flexibility.SOLUTION: A thermoelectric transducer comprising: a substrate having flexibility; a base layer formed on the substrate and made of a metal-oxide material; and a magnetic layer laminated on the base layer and having conductivity and ferromagnetic or antiferromagnetic properties, wherein a thickness of the base layer is not less than 10nm and not more than 50nm.SELECTED DRAWING: Figure 1

The present invention relates to a wavelength-tunable optical device in which a semiconductor laser diode chip equipped with a heater or a wavelength-selective filter equipped with a heater is in thermal contact with a thermoelectric element, the thermoelectric element is fixed at a constant temperature, and the channel is varied by varying the average power applied to the heater. The invention provides a method for stopping the operation of the heater even if a malfunction occurs in the heater, or for operating the heater regardless of the channel setting, and for varying the channel by changing the temperature of the thermoelectric element.

The application discloses a selective batch transfer method based on a phase change material, which comprises the following steps: preparing a patterned bump array on a heat-conducting substrate, coating rosin on the surface of the patterned bump array; obtaining a donor substrate with a micro-element array on the surface, and corresponding bonding the patterned bump array coated with rosin and the micro-element array; controlling the temperature of the heat-conducting substrate to change the state of the rosin, so that the micro-element array is fixedly connected with the corresponding patterned bump array, and then picking up the micro-element array from the donor substrate; bonding the picked-up micro-element array with a receptor substrate surface, and changing the rosin from a solid state to a liquid state, so that the patterned bump array is separated from the corresponding micro-element array. By using the method, batch, selective and non-polluted transfer of non-planar or planar micro-elements can be realized. The application further discloses a thermoelectric element array and a preparation method thereof.

A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other, the second outer periphery and the third outer periphery are opposite to each other between the first outer periphery and the fourth outer periphery, the first electrode part includes a first region vertically overlapping the plurality of second electrodes, at least one of the plurality of first electrodes includes an extension portion extending toward the first outer periphery from the first region, the first through-hole is formed in an inside of the first region, and a shortest distance between the second outer periphery and a first electrode, which is closest to the second through-hole among the plurality of first electrodes, is within ±10% of a shortest distance between the second outer periphery and the extension portion.

The application discloses a display panel and a display device. The display panel comprises a substrate, a driving circuit layer arranged on one side of the substrate, a plurality of sub-pixels arranged on one side of the driving circuit layer, a pixel definition layer for defining positions of the plurality of sub-pixels, the driving circuit layer comprising a plurality of first thermoelectric elements and a plurality of second thermoelectric elements with different Seebeck coefficients and arranged corresponding to the pixel definition layer, a plurality of first detection lines and a plurality of second detection lines, at least one of the first thermoelectric element and the second thermoelectric element being arranged around each sub-pixel, in adjacent sub-pixels, the first thermoelectric element is arranged around one sub-pixel, the second thermoelectric element is arranged around the other sub-pixel, and the first thermoelectric element and the second thermoelectric element around at least two adjacent sub-pixels are in contact and electrically connected, the first detection lines extend along a first direction, the second detection lines extend along a second direction, and the first detection lines and the second detection lines are electrically connected to the contact points of the first thermoelectric element and the second thermoelectric element. Through the above arrangement, the problem of low detection efficiency and insufficient accuracy of the display panel is solved.

The present invention relates to a power generation apparatus using a heat source, and more particularly, to a power generation apparatus using a heat source, the apparatus being characterized by comprising a heat source power generation structure that, when generating power using heat generated from a heat source, generates electrical energy using the heat generated from the heat source provided on the lower side to maximize the temperature difference between a high temperature part and a low temperature part of a thermoelectric element and enhance power generation efficiency, wherein the heat source power generation structure includes a heat collection module which collects the heat generated from the heat source, a thermoelectric element having the high temperature part formed on one surface thereof due to the heat collected through the heat collection module, and a cooling module which cools the other surface of the thermoelectric element to form the low temperature part on the other surface of the thermoelectric element. The heat collection module has a three-dimensional structure including a first heat collection plate provided adjacent to the heat source and a second heat collection plate formed above the first heat collection plate such that both sides of the second heat collection plate extending from the upper side and the lower side of the first heat collection plate can communicate with the outside in the front-rear direction. The thermoelectric element and the cooling module are individually provided on at least the upper side of the first heat collection plate and the outer side of the second heat collection plate.

The invention relates to the technical field of thermal rectification, and provides a thermal rectification device based on combination of a thermoelectric element and an electronic diode and a design method. The thermal rectification device based on the combination of the thermoelectric element and the electronic diode comprises the thermoelectric element and the electronic diode, one end of the thermoelectric element is a heat source end, the other end of the thermoelectric element is a heat dissipation end, and the electronic diode is connected with the two ends of the thermoelectric element through wires. When the heat rectification device works, the heat rectification ratio of the heat rectification device is equal to the thermoelectric figure of merit of the thermoelectric element. The thermal rectification ratio of the thermal rectification device completely depends on the thermoelectric performance of a thermoelectric element, and the thermal rectification device has stability, is not influenced by the physical dimension of materials and the processing technology, and is suitable for different scale occasions (from the nanoscale to the macroscale).

The invention relates to the technical field of robot end executors, in particular to a semiconductor thermoelectric temperature control adhesive hydrogel end executor. A semiconductor thermoelectric temperature control adhesive hydrogel end effector comprises temperature-sensitive hydrogel, a water supplementing system, a semiconductor thermoelectric piece, a mounting base and a shell connecting piece, all the parts are modularly assembled to form a compact functional module, and the specific structure is as follows: a microstructure array is arranged on the upper surface of the temperature-sensitive hydrogel, and a micro-channel is embedded in the temperature-sensitive hydrogel; the microstructure array is used for increasing the contact area and dredging phase change to separate out water; the microstructure array is used for increasing the effective contact area and preventing separated water from forming a continuous water film during phase change, and unstable adhesion force is prevented. The temperature-sensitive hydrogel adopts a laser processing or molding forming process. By integrating the active water replenishing system and the bidirectional thermoelectric temperature control module, the adhesive force of the temperature-sensitive hydrogel can be quickly, reversibly and accurately controlled.

The present invention relates to a flexible thermoelectric module and a unit including same. A flexible thermoelectric module according to one aspect of the present invention comprises: at least one unit pattern including at least one one-surface electrode arranged on one surface of a substrate, at least one other-surface electrode arranged on the other surface of the substrate, and at least one thermoelectric element electrically connecting the one-surface electrode and the other-surface electrode to each other; and at least one electrode line connecting the unit pattern.