39 results about "Thermoelectric element" patented technology

The present application provides a thermostat and a manufacturing method thereof, which can easily assemble shell members constituting a shell and reduce manufacturing cost. The thermostat comprises a shell (1), a thermoelectric element (17) moving in an axial direction in response to the temperature of a cooling liquid, a valve body (15) opening and closing a communication part of a first flow passage (21) and a second flow passage (7) by moving away from and approaching a valve seat (20b) provided inside the shell in response to the movement of the thermoelectric element, and a force applying member (16) applying force to the valve body to the valve seat side. The shell comprises a first shell member (2) having a main body (20), the first flow passage and the second flow passage, and a second shell member (3) fastened to the first shell member by rotating in a circumferential direction of the first shell member and having a third flow passage (22).

The application discloses an n-type bismuth telluride-based thermoelectric element NiFeP alloy interface barrier layer and a preparation method thereof, and belongs to the technical field of thermoelectric materials and devices. The barrier layer in the application is an electroplated NiFeP ternary plating layer, the content of Fe is 15-20 wt%, the content of P is 2-4 wt%, the balance is Ni, the thickness is 5-10 microns, and the barrier layer is prepared through substrate pretreatment, electroplating solution preparation, electroplating deposition and post-treatment. The application also constructs a thermoelectric element containing the barrier layer, and the n-type bismuth telluride thermoelectric material layer is connected by a NiFeP alloy interface barrier layer, a SAC305 solder layer and a copper electrode layer in sequence. The barrier layer has excellent diffusion inhibition effect, the interface bonding strength is greater than 16 MPa and the contact resistivity is less than 8 mu omega cm after aging at 200 DEG C for 144 hours. 2 The preparation process is simple, the cost is relatively low, large-scale production is suitable, and the barrier layer is expected to play an important role in the application field of thermoelectric materials and devices.

A thermoelectric leg, a method for manufacturing the same, and a thermoelectric element including the same are disclosed. The method for manufacturing the thermoelectric leg may include a sintered solid forming step, which includes a basic sintering step of sintering a powder of a soluble substance or a powder of a semiconductor substance in a hot-press step in a mold; an additional sintering step of performing one or more additional sintering steps in another mold with the sintered solid and the powder of the soluble substance or the powder of the semiconductor substance to form a sintered solid for dissolution that includes all of the soluble substance and the semiconductor substance; and a hollow forming step of exposing the soluble substance in the sintered solid for dissolution to a solvent and selectively removing it to form a hollow.

The application discloses a selective batch transfer method based on a phase change material, which comprises the following steps: preparing a patterned bump array on a heat-conducting substrate, coating rosin on the surface of the patterned bump array; obtaining a donor substrate with a micro-element array on the surface, and corresponding bonding the patterned bump array coated with rosin and the micro-element array; controlling the temperature of the heat-conducting substrate to change the state of the rosin, so that the micro-element array is fixedly connected with the corresponding patterned bump array, and then picking up the micro-element array from the donor substrate; bonding the picked-up micro-element array with a receptor substrate surface, and changing the rosin from a solid state to a liquid state, so that the patterned bump array is separated from the corresponding micro-element array. By using the method, batch, selective and non-polluted transfer of non-planar or planar micro-elements can be realized. The application further discloses a thermoelectric element array and a preparation method thereof.

A refrigerator includes a main body forming a storage compartment, and a heating unit and a cooling unit, wherein the cooling unit can include a thermoelectric element for cooling an internal air of the storage compartment, a fan driven so that air flows from an outside of the main body into the heating unit and is heated, and the heated air is discharged to the outside of the main body, a filter for filtering foreign substances from the air flowing into the heating unit from the outside of the main body by driving of the fan, and a controller for notifying of a clogging of the filter in response to a rotation speed of the fan being greater than a reference rotation speed.

A refrigerator includes a main body including a suction port and a plurality of discharge ports, a storage compartment formed inside the main body, a thermoelectric element for supplying cold air to the storage compartment while discharging generated heat, a heat sink receiving heat from the thermoelectric element, a blowing fan located below the heat sink to cool the heat sink, and a scroll case for accommodating the blowing fan, and the scroll case includes an inlet through which air flows from the suction port to the blowing fan. The scroll case includes a linear portion forming a part of the inlet, the linear portion being formed perpendicular to a flow direction of air traveling through the heat sink, and air having traveled through the blowing fan is respectively discharged in a plurality of directions through the plurality of discharge ports.

The present invention provides a self-powered wireless earphone comprising: first and second housing members constituting the body of the wireless earphone; a sound tube for guiding sound to the outside; and an eartip having an inner-skin member, an outer-skin member, and a thermoelectric element unit embedded in the outer-skin member and including a flexible thermoelectric material.

A thermoelectric element and a refrigerator may include: a thermoelectric material layer that has a plurality of anchor recesses formed on the upper surface and lower surface on the basis of cracks and having a depth of 0.1 μm to 10 μm; and a first diffusion-preventing layer that is disposed on the thermoelectric material layer and partially penetrates into the plurality of anchor recesses.

Provided is a refrigerator comprising: a main body including storage compartments; doors for opening and closing the storage compartments; and an ice-making device for making ice, wherein the ice-making device includes: an ice-making case; a partition for dividing an inner space of the ice-making case into a first space and a second space; an ice-making tray which is provided in the first space and which includes ice-making cells for storing water; a thermoelectric element which is provided on the partition, and which includes a high-temperature part that is provided on a first surface of the thermoelectric element and faces the second space, and a low-temperature part that is provided on a second surface of the thermoelectric element opposite to the first surface of the thermoelectric element and faces the first space; and a heat pipe for transferring heat between the ice-making tray and the low-temperature part in order to cool the water stored in the ice-making cells, and the high-temperature part is higher in temperature than the low-temperature part.

Provided is a refrigerator including a main body including a storage compartment, a door configured to open and close the storage compartment, and an ice maker configured to produce ice, wherein the ice maker includes an ice-making case, a partition dividing an internal space of the ice-making case into a first and second spaces, an ice-making tray in the first space, the ice-making tray including an ice-making cell configured to store water, a thermoelectric element on the partition, the thermoelectric element including a high-temperature portion on a first surface of the thermoelectric element and facing the second space, and a low-temperature portion on a second surface of the thermoelectric element opposite to the first surface of the thermoelectric element and facing the first space, and a heat pipe configured to transfer heat between the ice-making tray and the low-temperature portion to cool water stored in the ice-making cell.

The application discloses a method for improving the metalization connection strength of n-type Bi2Te3-based thermoelectric elements based on anchoring effect, and comprises the following steps: configuring a n-type Bi2Te3-based wafer surface treatment agent, the composition of which comprises 40-50% sulfuric acid (volume), 1-2% nitric acid (volume), and the rest is water; immersing a clean n-type Bi2Te3-based wafer into the surface treatment agent to perform surface etching; then immersing the etched n-type Bi2Te3-based wafer into ultrapure water to perform ultrasonic treatment; performing metalization connection on the ultrasonically treated n-type Bi2Te3-based wafer through electroplating or chemical plating, the plated metal is easy to form anchoring effect with the n-type Bi2Te3, the metalization connection strength is improved; and finally performing scribing and cutting to obtain the Bi2Te3-based thermoelectric elements with high metalization connection strength. The application makes the n-type Bi2Te3-based wafer have high surface roughness before electroplating, which is beneficial to forming anchoring effect with the plated metal such as nickel, so that the Bi2Te3-based thermoelectric elements with high metalization connection strength are obtained, and the thermoelectric elements are not physically damaged, and the product qualification rate can be improved.

This refrigerator comprises: a main body in which a storage compartment is provided; a thermoelectric element provided on an upper wall of the main body and including a heating portion and a heat absorbing portion provided on the opposite side to the heating portion; a heat dissipation sink provided to be in contact with the heating portion; a cooling sink provided to be in contact with the heat absorbing portion; and a sink insulating member provided on the outside the thermoelectric element in order to provide insulation between the heat dissipation sink and the cooling sink. The cooling sink comprises: a cooling plate including an upper surface, a lower surface, and a side surface portion provided between the upper surface and the lower surface; a protrusion portion protruding up from the upper surface of the cooling plate toward the heat absorbing portion; and a plurality of cooling fins protruding down from the lower surface of the cooling plate and forming a cooling flow path through which air can pass. The sink insulating member is provided to cover at least a portion of the side surface portion of the cooling plate.

A method of manufacturing a semiconductor structure includes forming a first dielectric layer surrounding an optical component. The method further includes forming a thermal control mechanism adjacent to the optical component and at least partially surrounded by the first dielectric layer. Forming the thermal control mechanism includes forming a first thermoelectric member having a first conductivity type, forming a second thermoelectric member having a second conductivity type opposite to the first conductivity type, wherein the second thermoelectric member is opposite to the first thermoelectric member; and forming a conductive structure over and electrically connected to the thermal control mechanism. The method further includes forming a second dielectric layer over the first dielectric layer and surrounding the conductive structure.

A method includes forming, over a substrate, an optical component and first, second and third thermal control mechanisms. The optical component includes first and second main paths, and first and second side paths each having opposite ends correspondingly coupled to the first and second main paths. The second side path is spaced from the first side path. Each of the first, second and third thermal control mechanisms includes a first thermoelectric member having a first conductivity type, a second thermoelectric member having a second conductivity type opposite to the first conductivity type, and a conductive structure that electrically connects the first thermoelectric member to the second thermoelectric member. The first side path is between the first and third thermal control mechanisms. The second side path is between the second and third thermal control mechanisms. The third thermal control mechanism is between the first and second side paths.

Cooling systems are described herein that may be used in connection with one or more attached devices to cool patient tissue. The disclosed cooling systems include a refrigeration unit containing a thermoelectric element in thermal communication with a heat exchanger, a fluid pump in fluid communication with a fluid inlet and a fluid outlet, tubing connecting the fluid inlet to the fluid outlet, a fluid cooling element in thermal contact with the thermoelectric element, and a temperature sensor positioned to detect a temperature of fluid within the tubing. The temperature of fluid within the tubing can be controlled by a control unit having a user interface and a power controller to adjust cooling power to the thermoelectric element. Various types of devices can be configured to receive and circulate cooled fluid from the cooling systems, such as retractor blades, retractor shims, cooling pads, and scope sheaths.

A soil moisture sensor acquires an amount of moisture contained in soil. The soil moisture sensor has a thermoelectric element disposed in the soil and capable of changing a temperature of the soil, a first temperature information acquisition section that acquires first temperature information indicating a change over time in the temperature of the soil caused by an operation of the thermoelectric element, a second temperature information acquisition section that acquires second temperature information indicating a change over time in the temperature of the soil caused by the operation of the thermoelectric element, and an arithmetic section that acquires moisture information based on the temperature information. The arithmetic device has a slope information acquisition section that acquires a temperature change amount per unit time using the first temperature information and the second temperature information, and a conversion section that converts the temperature change amount to the moisture amount using conversion information indicating a relationship between the temperature change amount and the moisture amount.

An energy transfer device (1) for wirelessly transmitting energy to a mobile device is described, comprising a transmitting coil (2), a ferrite element (4) coupled to the transmitting coil (2), control electronics connected to the transmitting coil (2) for controlling the transmitting coil (2), a heat sink (5), and a thermoelectric element (8). The thermoelectric element (8) is arranged between the ferrite element (4) and the heat sink (5).

A conductive member includes a conductor, a thermoelectric element provided on the conductor, having a heat absorbing surface in contact with a heat generating surface of the conductor and a heat radiating surface facing outside air, the thermoelectric element generating electric power by a temperature difference between the heat absorbing surface and the heat radiating surface, and a refrigerant flow unit configured to flow a refrigerant by the electric power generated by the thermoelectric element and cool the conductor by the flow of the refrigerant.

The present invention provides an optical receiving device and an optical receiving module having a tunable wavelength filter. [Solution] The optical receiving device includes a thermoelectric element 320 arranged on a substrate 310, a first tunable wavelength filter 330 with one end positioned on one side of the thermoelectric element and the other end positioned lower and inclined than the plane of the thermoelectric element, which transmits only a first wavelength that varies according to the temperature of the thermoelectric element, a second tunable wavelength filter 350 positioned above the first tunable wavelength filter and spaced apart on one side of the thermoelectric element, which transmits only a second wavelength that varies according to the temperature of the thermoelectric element, a first detector 360 positioned on the substrate at a distance from the thermoelectric element and on the optical axis of the received signal, which detects signals that pass through both the first tunable wavelength filter and the second tunable wavelength filter, and a second detector 370 positioned at a distance from the first detector on the substrate and which detects signals that have passed through the second tunable wavelength filter and are reflected by the first tunable wavelength filter.

Provided are an optical receiver and an optical module with multiple wavelength tunable filters, the module including: a thermoelectric element disposed on a substrate and having a changeable temperature; a first wavelength tunable filter having one end disposed on one side of the thermoelectric element and the other end inclined by being disposed lower than a plane of the thermoelectric element; a second wavelength tunable filter including a heater disposed at one side, disposed on the one side of the thermoelectric element while being disposed above the first wavelength tunable filter; a first detector disposed on the substrate while being spaced apart from the thermoelectric element; and a second detector disposed above the substrate while being spaced apart from the first detector.

There is provided a thermoelectric module including: a first substrate having a first main surface; a second substrate having a second main surface arranged to face the first main surface; a plurality of thermoelectric elements arranged between the first main surface and the second main surface; and an electrode arranged on the first main surface and connected to a first thermoelectric element and a second thermoelectric element among the plurality of thermoelectric elements. An insulating layer including a first portion and a second portion is arranged on the first main surface, the first portion being arranged to surround the electrode and to be spaced apart from the electrode, the second portion being arranged between the first thermoelectric element and the second thermoelectric element.

The present disclosure relates to a cooling device and a vehicle including the same. According to an aspect of the present disclosure, the cooling device includes a housing portion having a first hole formed at one side thereof and a second hole formed at the other side thereof, a heat exchange portion accommodated in an inner space of the housing portion and having one side communicated with the first hole and the other side communicated with the second hole, a thermoelectric element portion disposed above the heat exchange portion, and a radiation cooling portion disposed above the thermoelectric element portion and at least partially exposed to the outside.

A thermoelectric module according to an embodiment of the present invention includes: a cooling jacket with through-holes through which fluid can flow; a first thermoelectric element disposed on the cooling jacket; and a first shield member disposed on the first thermoelectric element and being thermally conductive, wherein the first thermoelectric element includes: a first substrate; a semiconductor device disposed on the first substrate; a second substrate disposed on the semiconductor device; a first electrode disposed between the first substrate and the semiconductor device; and a second electrode disposed between the second substrate and the semiconductor device, and the first shield member includes an overlapping portion disposed in a region where the first electrode and the second electrode overlap.

Thermoelectric generator for converting a temperature gradient into electrical energy, comprising a plurality of thermoelectric elements arranged between a hot-side interface and a cold-side interface, characterized in that the thermoelectric elements are manufactured by additive manufacturing through three-dimensional printing and consist of functionally graded materials, wherein the material composition varies continuously or stepwise along a heat flow direction, such that a gradient of electrical conductivity, thermal conductivity and Seebeck coefficient is generated within the thermoelectric elements.

The application discloses a packaging method and structure for a flexible thermoelectric element, and relates to the technical field of semiconductor device preparation.The packaging method comprises the following steps: preparing a thermoelectric series structure, wherein the thermoelectric series structure comprises an electrode layer, a P-type thermoelectric arm and an N-type thermoelectric arm; the electrode layer is composed of a plurality of metal electrodes; a cloth adhesive is coated on the outer surface of the electrode layer; a first packaging layer is attached to the outer side of the electrode layer of the thermoelectric series structure; a second packaging layer is attached to the outer side of the electrode layer of the thermoelectric series structure; finally, the packaging of the flexible thermoelectric element is completed after static pressure forming; the application adopts a non-continuous bonding structure of packaging cloth to package the thermoelectric element, and replaces traditional dense polymer packaging materials; by using the unique packaging mode of "point bonding and surface ventilation" between the packaging cloth and the device, the stability and comfort of the device structure are ensured.

The application discloses an infrared temperature measuring device calibration method, and the infrared temperature measuring device comprises a thermoelectric element and a thermistor, and the method comprises the following steps: setting a calibration environment temperature, a first calibration temperature and a second calibration temperature of a target object; obtaining a first measurement voltage of the thermoelectric element based on the first calibration temperature, and obtaining a second measurement voltage of the thermoelectric element based on the second calibration temperature; calculating a sensitivity coefficient of the thermoelectric element based on the first measurement voltage, the second measurement voltage, the first calibration temperature and the second calibration temperature; calculating an actual environment temperature based on the sensitivity coefficient of the thermoelectric element, the target calibration temperature and the corresponding measurement voltage; and calculating a zero-power resistance value of the thermistor based on the actual environment temperature, a thermistor measurement value and a thermistor constant. The scheme can improve the accuracy of infrared temperature measuring device parameter calibration, thereby improving the accuracy of infrared temperature measurement.

The invention relates to an alarm device (14) for a battery (10), comprising an outer housing (16) and an alarm unit (24) arranged in the outer housing (16), which is designed to send an alarm signal (S) in a specific fault case.The alarm device (14) comprises at least one thermoelectric element (32, 34) having a first contact area (32a) and a second contact area (32a) arranged in the interior (18) of the outer housing (16), the first contact area (32a) of which is thermally and physically connected to an interior (16a) of the outer housing (16), and which is designed to provide a voltage (U) at an input (40) of the alarm unit (24) depending on a temperature difference between a first temperature (T1) of the first contact area (32a) and a second temperature (T2) of the second contact area (32b), and wherein the alarm unit (24) is designed to send the alarm signal (S) depending on the presence of a voltage (U) at the input (40).

[Object] To provide a thermoelectric body that can be deposited on any substrate, which is not limited to a single crystal bulk material or an epitaxially grown thin film, and is capable of exhibiting high coercive force and residual magnetization with respect to in-plane magnetization.[Solving Means] A thermoelectric body that is a magnetic film for use in a thermoelectric generation element utilizing an anomalous Nernst effect, characterized by having an easy axis of magnetization in an in-plane direction and an amorphous structure. Favorably, the thermoelectric body is characterized in that SmpCo100-p (0<p≤50) or Smp(FeqCo100-q)100-p (0<p≤50, 0≤q≤100) is included.

A thermoelectric module includes a first substrate having a first main surface, a second substrate having a second main surface disposed opposite the first main surface, a plurality of thermoelectric elements disposed between the first main surface and the second main surface, and an electrode disposed on the first main surface and connected to a first thermoelectric element and a second thermoelectric element of the plurality of thermoelectric elements. An insulating layer is disposed on the first main surface and includes a first portion disposed around and separate from the electrode and a second portion disposed between the first thermoelectric element and the second thermoelectric element.