151results about How to "Rapid heating and cooling" patented technology

A steam generator is disclosed herein. The steam generator includes an inlet manifold, a discharge manifold, a heating gas duct, and at least one once-through heating area in the heating-gas duct. The once-through heating area is formed from multiple single-row header-and-tube assemblies. Each single-row header-and-tube assembly includes a plurality of steam generator tubes connected in parallel, an inlet header connected to the inlet manifold, and a discharge header connected to the discharge manifold. Each inlet header is connected to the inlet manifold by one of multiple first link pipes, and each discharge header is connected to the discharge manifold by one of multiple second link pipes. Each said steam generator tube of each of the single-row header-and-tube assemblies has an inside diameter that is less than an inside diameter of any of the first or second link pipes.

The invention relates to the field of test of mechanical properties of materials and in particular relates to a thermo-mechanical-environmental coupling effect testing device and application from room temperature to ultrahigh temperature. The device comprises an electronic universal testing machine, a loading control system, a power supply control system, an induction heater, a strain measurement system, a sample clamp, a temperature measuring system, a pressure control system, a display and analysis system and a vacuum system, wherein a vacuum cavity in the electronic universal testing machine is in a fully water-cooled design, and various functional windows, such as a sensor connector of the clamp and the electronic universal testing machine, an infrared or thermocouple temperature measuring opening of the temperature measuring system, a pressure control opening of the pressure control system, an induction power supply introduction opening of the power supply control system, an extensometer introduction opening of the strain measurement system and a connector of the vacuum system and the vacuum cavity, are reserved in different parts of the vacuum cavity. The device disclosed by the invention can quantitatively research the thermo-mechanical-environmental coupling effect and has the advantages of diversified tested mechanical property parameters, high sample heating and cooling speed and the like.

A thermoelectric cooling and heating device including a substrate, a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element includes a thermoelectric material, a Peltier contact contacting the thermoelectric material and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact. As such, the thermoelectric cooling and heating device selectively biases the thermoelectric elements to provide on one side of the thermolectric device a grid of localized heated or cooled junctions.

A reaction vessel has a reaction chamber, a loading reservoir connected to the reaction chamber via a first channel, and an aspiration port connected to the chamber via a second channel. To load the sample into the reaction chamber, the sample is dispensed into the loading reservoir and then drawn into the chamber by application of a vacuum to the aspiration port. A system for controlling the temperature of the sample in the reaction vessel includes one or more thermal elements for heating or cooling the sample and optionally optics for detecting one or more analytes in the sample.

Embodiments of the invention provide processes for vapor depositing tungsten-containing materials, such as metallic tungsten and tungsten nitride. In one embodiment, a method for forming a tungsten-containing material is provided which includes positioning a substrate within a processing chamber containing a lid plate, heating the lid plate to a temperature within a range from about 120° C. to about 180° C., exposing the substrate to a reducing gas during a pre-nucleation soak process, and depositing a first tungsten nucleation layer on the substrate during a first atomic layer deposition process within the processing chamber. The method further provides depositing a tungsten nitride layer on the first tungsten nucleation layer during a vapor deposition process, depositing a second tungsten nucleation layer on the tungsten nitride layer during a second atomic layer deposition process within the processing chamber, and exposing the substrate to another reducing gas during a post-nucleation soak process.

Embodiments of the invention provide apparatuses for vapor depositing tungsten-containing materials, such as metallic tungsten and tungsten nitride. In one embodiment, a processing chamber is provided which includes a lid assembly containing a lid plate, a showerhead, a mixing cavity, a distribution cavity, and a resistive heating element contained within the lid plate. In one example, the resistive heating element is configured to provide the lid plate at a temperature within a range from about 120° C. to about 180° C., preferably, from about 140° C. to about 160° C., more preferably, from about 145° C. to about 155° C. The mixing cavity may be in fluid communication with a tungsten precursor source containing tungsten hexafluoride and a nitrogen precursor source containing ammonia. In some embodiments, a single processing chamber may be used to deposit metallic tungsten and tungsten nitride materials by CVD processes.

An apparatus for controlling the temperature of a reaction mixture contained in a chamber of a reaction vessel comprises a thermal surface for contacting a flexible wall of the chamber and an automated machine for increasing the pressure in the chamber. The pressure increase in the chamber is sufficient to force the flexible wall to conform to the thermal surface for good thermal conductance. The apparatus also includes at least one thermal element for heating or cooling the surface to induce a temperature change within the chamber.

An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

The invention discloses a fluorescence quantitative PCR detecting system based on bottom scanning detection, comprising a temperature changing metal module capable of being inserted with a plurality of test tubes, a semiconductor freezer and a radiating device which are arranged into a whole in sequence from up to bottom. The system is characterized in that test tube slots of the temperature changing metal module are through holes running through the temperature changing metal module, the semiconductor freezer and the radiating device; the radiating device is a thermotube radiator, the thermotube extends to the outside of the whole structure, the extending end is connected with a radiator fin; a photoelectric detector is positioned at the bottom of the radiating device of the whole structure and is driven to scan by an electric motor; and the reagent fluorescence is detected from the bottom of the test tubes. The adoption of the system contributes to improving the luminous efficiency, obtaining higher fluorescence sensitivity and the fluorescence signal intensity, and improving the stability, ensures that the detection result is more accurate, realizes the rapid temperature rise and temperature reduction as well as the accurate temperature control of the temperature changing metal module, and greatly prolongs the service life of the temperature changing metal module.

The invention relates to a device for adjusting the temperature of a physiological fluid. The inventive device includes: a casing (1), a first heat energy generating unit (2), a heat energy receiving unit (3) through which the fluid flows along a passage from a fluid inlet (3a) to a fluid outlet (3b) and which consists of a flat body (3d) having a first large surface (3e) which is made from a heat conductor material, and a control unit (4) for controlling at least the first generating unit (2). According to the invention, the first generating unit (2) includes first units of Peltier cells (5) and at least one first contact plate (6) which is made from a heat conductor material and which is placed in contact with a first side (5b, 8b) of the units of Peltier cells (5). In addition, the receiving unit (3) is removably installed in the first generating unit (2) such that it is in contact with the first contact plate (6).

The invention discloses an ultra-high temperature heat-insulating property testing device and method. The ultra-high temperature heat-insulating property testing device comprises a heating furnace, wherein the heating furnace comprises a lower furnace body and an upper furnace body; the lower furnace body comprises a base and a base heat insulation layer arranged on the base; the top of the base heat insulation layer is downwards recessed to form a sample containing chamber; the upper furnace body comprises a furnace shell, an electric heating body arranged in the furnace shell, and a furnace shell heat insulation layer arranged between the electric heating body and the furnace shell; an air inlet and an air outlet communicated with the interior and exterior are formed in the furnace shell; valves are respectively arranged on the air inlet and the air outlet; after the upper furnace body is combined with the lower furnace body, the furnace shell and the base are combined to form a closed furnace chamber; the electric heating body is contacted with a heat-conducting gasket arranged on the top surface of the sample; contact-type heat conduction is realized between the electric heating body and the sample by virtue of the heat-conducting gasket; and the furnace shell heat insulation layer and the base heat insulation layer are contacted to form an overall heat insulation layer on the outer sides of the sample and the electric heating body. According to the device and method disclosed by the invention, the ultra-high temperature actual operation conditions can be simulated in a closed environment to the greatest degree.

A portable mold-temperature control unit includes a local heating system, a first fluid duct, a second fluid duct, and a fluid exchange system. The local heating system includes a local heater for heating fluid that is used to rapidly heat a mold. The first fluid duct carries hot fluid heated by the local heating system. The second fluid duct carries cool fluid that is used to rapidly cool a mold. The fluid exchange system includes an outlet that permits fluid to flow from the first and second fluid ducts to the mold during heating and cooling, respectively. The fluid exchange system also includes an inlet that receives the fluid as it returns from the mold. In one embodiment, the heating system reheats the fluid returning from the mold and reuses it to heat the mold again. In a more particular embodiment, the heating system includes a steam generator that generates steam used to heat the mold. In another embodiment, the portable mold-temperature control system includes a local cooling system that cools the fluid used to cool the mold. In a more particular embodiment, the local cooling system cools fluid returning from the mold and reuses it to cool the mold. A method for using the portable mold-temperature control unit is also disclosed.

The invention discloses a radiation heating device for cigarettes realizing no combustion under electric heating, belonging to the technical field of low-temperature cigarettes. The radiation heatingdevice comprises an outer shell and an inner shell, wherein a closed annular gap is formed between the inner shell and the outer shell, a radiation reflecting layer is arranged on the inner surface ofthe outer shell, a radiation heating material barrel is arranged in the annular gap, and the radiation heating material barrel is electrically connected with an electrode and guides the electrode outof the annular gap. For the radiation heating device for cigarettes realizing no combustion under electric heating, the heat exchange mode mainly adopting heat radiation is adopted, and the radiationheating device has the advantages that temperature can be rapidly increased and decreased, the temperature fluctuation is small, etc.

The invention is a centrifugal-temperature composite test box, and aims to provide a test box which can be installed and work on a centrifuge and realize a high / low-temperature calibration environment in order to provide a centrifugal-temperature composite calibration environment for an accelerometer. The centrifugal-temperature composite test box is mainly composed of a box body part, an expansion chamber and a gas circulation system. The test box and the accelerometer are separately installed. The box body part is a cylindrical sandwich structure including a heat insulation layer, a temperature carrying layer and an inner cavity. The centrifugal-temperature composite test box is implemented by the following scheme: the heat insulation layer is filled with heat insulation material, the temperature carrying layer is filled with temperature carrying liquid and is equipped with a temperature carrying liquid spiral circulation channel and a temperature carrying gas circulation channel, and the inner cavity is equipped with an air guide sleeve and an electric heating film; the expansion chamber is a closed cavity; the gas circulation system provides power for gas circulation in the cavity; and the temperature of the temperature carrying liquid is controlled directly or controlled by controlling the temperature of gas in the gas pipe, and heat exchange between the inner wall of a temperature carrying cavity and the gas in the inner cavity is utilized or the gas in the inner cavity is heated by the electric heating film so as to realize precise control on the temperature of the inner cavity.

The invention discloses a diffusion welding process for a heat exchanger core. The diffusion welding process comprises the following steps: (1) pre-welding pre-treatment: feeding the well assembled heat exchanger core into a diffusion welding furnace, and vacuumizing the interior of the furnace to be below 0.01 Pa; (2) diffusion welding: raising the temperature to 800-850 DEG C at the speed of 15-20 DEG C / min, keeping the temperature for 30 min, after that, raising the temperature to 1,100-1,150 DEG C at the speed of 10-15 DEG C / min, keeping the temperature for 3 h, and performing vacuum cooling to the room temperature, wherein the pressure (8-9.5 MPa) exerted before is kept in the first 2 h and reduced to 4-6 MPa in the last 1 h; and (3) postweld heat treatment: raising the temperature of the heat exchanger core to 1,150-2,000 DEG C, keeping the temperature for at least 20 h, and after that, reducing the temperature in a water quenching manner. According to the diffusion welding process, such parameters as welding temperature, diffusion time and pressure are controlled, the step of heat treatment after diffusion welding is added, so that brittle phases easily generated during diffusion welding are reduced, and the quality of a welded joint of the heat exchanger core is improved.

A substrate processing apparatus includes: a support member supporting a substrate in a process chamber; a first temperature adjusting member in thermal contact with the support member; and a second temperature adjusting member capable of thermally coming into contact with and separating from the support member, wherein the first temperature adjusting member and the second temperature adjusting member are temperature-adjusted to different temperatures respectively.

The invention discloses a device of an induction-type heating die, which is essentially applied to a forming machine. The device essentially comprises a die and a heating unit; wherein, the die is positioned on the forming machine and used for injecting and forming; the heating unit can extends into a die cavity of the die to rapidly heat the die cavity and the heating unit uses a heating coil for conducting variable frequency current to generate magnetic lines and the lines are concentrated on the die; due to electromagnetic induction effect, eddy current is generated and the die is heated rapidly owing to metal impedance of the die; after the die is heated to a certain heating degree, injection and forming are carried out. The induction-type heating device rapidly increases and decreases the temperature of the die and effectively reduces combining lines on product surface.

The invention discloses a horizontal high-pressure gas quenching-tempering-nitridation vacuum multipurpose furnace and relates to the field of metal vacuum thermal treatment. The furnace comprises a vacuum furnace main body, a heating chamber, a wind cooling system, a vacuum unit, a gas supplying system and an electric control system. The heating chamber comprises heating elements, a cylinder, a front cover and a back cover. The front cover and the back cover are provided with wind guiding holes. An air cylinder drives movable doors to open and close the wind guiding holes so as to guarantee circular flowing of cooling gas during tempering and gas quenching and to guarantee a closed structure of the heating chamber during nitridation. The furnace overcomes the disadvantages caused by adoption of metal nitridation tanks adopted by nitridation furnaces at present, namely slow heating and cooling speeds, low atmosphere pressure, and the like. The furnace is provided with using conditions for high-pressure high-flow-rate quenching and tempering, is simple in structure and practical, and truly achieves the using requirements on vacuum multipurpose furnaces.

The invention discloses a fast real-time DNA amplification instrument and a gene mutation detection method. The fast real-time DNA amplification instrument includes a reagent tank and a thermal cycle system. The reagent tank has at least one socket for placing a reaction tube. The thermal circulation system includes a heating body and a radiator, which are distributed on both sides of the reagent tank, and the heating body and the radiator can be driven by the driving mechanism to approach or move away from the reagent tank alternately. The rapid real-time DNA amplification instrument of the present invention realizes the rapid heating and cooling of the reagent by controlling the distance from the heating element and radiator to the reagent tank. This design is not only simple in structure, but also can help the reagent reach the set temperature point faster, Fast thermal cycle is realized, and at the same time, the gene mutation detection method of the present invention only takes 50 minutes from sampling to successful identification of single nucleotide mutations, while similar instruments on the market generally take 2-3 hours, which greatly improves the detection efficiency of gene mutations.

The invention provides a portable microfluidic PCR (Polymerase Chain Reaction) instrument and a gene sample fluorogenic quantitative detection method. The portable microfluidic PCR instrument comprises a control unit, a PCR chip, a temperature control unit and a fluorescence signal acquisition unit, the temperature control unit and the fluorescence signal acquisition unit are connected with the control unit; the PCR chip comprises a substrate, a reaction chamber is formed on the end face of one side of the matrix, a sealing cover plate is covered on the reaction chamber, the reaction chamber is communicated with the outside through a capillary shaped sample inlet and a capillary shaped sample outlet on the substrate; the temperature control unit comprises a temperature detector, a heating part and a refrigerating part, the heating part and the refrigerating part heats or refrigerates the substrate in the PCR chip; an acquisition end of the fluorescence signal acquisition unit is distributed correspondingly to one side of the sealing cover plate of the PCR chip, so that a fluorescence image in the reaction chamber is acquired. The fluorescence signal acquisition unit instrument can conduct the polymerase chain reaction, meanwhile, the fluorescence signal acquisition unit acquires the reaction circulation fluorescence image, so that the fluorogenic quantitative detection of a gene sample is realized.

The invention provides a temperature tactile representation device with variable heat capacity, which is provided with a semiconductor cooler, a radiator, two temperature sensors and a measurement and control circuit, wherein the semiconductor cooler is used as a core of temperature control and hand perception, and consists of a P-N structure which is energized with direct current and is provided a cold end surface and a hot end surface; the radiator comprises a switch chamber with a cavity and a cooling liquid-gas two-path switching system, the cooling liquid switching system feeds cooling liquid to the cavity of the switch chamber by a cooling liquid groove via pipelines, and the switch chamber is communicated with the cooling liquid groove via a cooling liquid outlet pipeline; the gas path switching system switches air by an air inlet pipeline and an air outlet pipeline which are communicated with the cavity of the switch chamber; the pipelines of the cooling liquid-gas two-path switching system are respectively provided with an electromagnetic valve and a pump which are in connection with output control signal of the measurement and control circuit; the measurement and control circuit has a well-known power supply circuit, an analog-to-digital conversion circuit, a signal conditioning circuit and a control chip; and the two temperature sensors are respectively used for collecting temperatures of hand and the semiconductor cooler and outputs the temperatures to the measurement and control circuit.

The invention discloses a temperature controller test device and a method for a calibration test and an aging test of a temperature controller. The temperature controller test device comprises a shell box body, a ring air bath constant temperature device disposed in the shell box body, a fast cooling upper cover device provided with an air door and arranged at the top of the cylindrical ring air bath constant temperature device and a single chip microcomputer control system. The ring air bath constant temperature device is a cylindrical ring cavity body disposed in the box body, and all parts are distributed on the periphery of the circle center in an axial symmetry mode. The single chip microcomputer control system controls the air door to be opened or closed under different work conditions. The temperature controller test device is compact in structure, small in size, attractive in appearance, simple in operation, easy in mounting and demounting of detected parts, convenient to use, good in safety performance, wide in test temperature scope, even in temperature field spatial distribution, high in temperature control accuracy, capable of being used for a dynamic test, the calibration test and the aging test in a temperature rising and dropping mode, accurate in test, fast in speed, high in efficiency and the like.

An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

A substrate processing apparatus includes: a mounting table to have the substrate placed thereon in a process chamber; a first temperature adjusting mechanism temperature-adjusting the substrate placed on the mounting table; a lifter mechanism lifting up the substrate from the mounting table in the process chamber; and a second temperature adjusting mechanism temperature-adjusting the substrate lifted up from the mounting table by the lifter mechanism, wherein the first temperature adjusting mechanism and the second temperature adjusting mechanism temperature-adjust the substrate to different temperatures respectively.

The invention discloses a compact and efficient heat exchanger core. The compact and efficient heat exchanger core comprises an upper metal cover plate, a lower metal cover plate and a plurality of intermediate metal plates, wherein first semi-circular hole structures are longitudinally and second semi-circular hole structures are transversely etched in the bottom surface of the upper metal cover plate, the top surface of the lower metal cover plate and the top and bottom surfaces of the intermediate metal plates, and the upper metal cover plate, the intermediate metal plates and the lower metal cover plate are sequentially stacked up and down; and the first semi-circular hole structures and the second semi-circular hole structures between the upper and lower adjacent intermediate metal plates, between the uppermost intermediate metal plate and the upper metal cover plate, and between the lowermost intermediate metal plate and the lower metal cover plate are correspondingly combined to form first round holes and second round holes correspondingly. The transversely and longitudinally chemically etched semi-circular hole structures are adopted, so that the boundary layer breakage capability is very strong, the flow disturbance can be enhanced, the heat exchange performance is improved, and the compact and efficient heat exchanger core is suitable for special occasions.

A device for magnetically annealing magnetoresistive elements formed on wafers includes a heated chuck and a delivery mechanism for individually placing the wafers individually on the chuck one at a time. A coil is adjacent to the chuck and generates a magnetic field after the wafer is heated to a Néel temperature of an anti-ferromagnetic layer. A control system regulates the temperature of the heated chuck, the strength of the magnetic field, and a time period during which each chuck is heated to control the annealing process. The annealed elements are incorporated in the fabrication of magnetic memory devices.

The invention relates to a stiffness-variable surgical manipulator, a surgical instrument and an operation method of the surgical instrument. The stiffness-variable surgical manipulator comprises multiple joints, the adjacent joints are in spherical contact, all the joints pass through a flexible pipe arranged concentrically with the joints, a flexible temperature control pipe wrapped outside theflexible pipe, a stiffness-variable pipe wrapped outside the flexible temperature control pipe, and at least one set of rope lines, the number of each set of rope lines is two, the rope lines are evenly distributed around the circle set concentrically with the joints, the diameter of the circumference is larger than the outer diameter of the stiffness-variable pipe, the two rope lines in the sameset are located at both ends of the circumferential diameter, and the flexible temperature control pipe can heat or cool the stiffness-variable pipe to change the stiffness state of the stiffness-variable pipe.