695results about How to "Efficient heat transfer" patented technology

A solar-powered power generation system and an associated method are provided. The system includes at least one trough solar absorption device for heating a heat transfer fluid to a first temperature, and at least one tower solar absorption device for further heating the transfer fluid to a second temperature. Thus, the generation system can efficiently heat the transfer fluid to high temperatures. Subsequently, the heated fluid can be used, e.g., to generate steam and/or electricity.

A cooling apparatus and method, and more particularly, an apparatus and method for cooling the air exiting an electronics enclosure, are disclosed. Air is taken into the enclosure and heated by the electronic equipment. The air is then expelled through a heat exchanger, which cools the exiting air. The exiting air is cooled using an external source of cooling liquid, which absorbs the heat from the exiting air. This absorbed heat is then expelled from the liquid outside of the environment containing the enclosure. Cooling the air exiting the enclosure causes the enclosure to present a neutral heat load to a room containing such an enclosure. Cooling the exiting air obviates the necessity of increasing the room air conditioning capacity to account for the heat added to the room by the electronics within the enclosure. Further, the disclosed apparatus and method decrease the possibility of moisture condensation within the enclosure and also provide more efficient cooling than is available from prior art devices and techniques.

An improved water heater for use in spas, hot tubs, pools, hydrotherapy pools, bath tubs, and similar bodies of water used indoors, outdoors, or both indoors and outdoors are used for both therapeutic and recreational purposes. The water heater uses heating element technology know as thick film on substrate comprising resistive elements bonded to the outer dry surface of a pipe to heat the pipe which in turn heats the water flowing therethrough. The heater is highly efficient due to the direct contact of the wet heating surface with the water and provides a smooth seamless inner heating surface by eliminating the need to pass electrical leads into the wet region of the heater. This virtually eliminates the risk of leaks in the water heater due to bulkhead fittings. The invention further eliminates the need for a heating element to be contained in the inner wet region of a spa heater, thereby reducing the risk of corrosion. The water heater is used in combination with an electronic controller having a microprocessor to control and regulate the operation of the water heater. The water heater can be used with electrical, electro-mechanical, and mechanical control systems for spas and can be retrofitted into existing spa applications.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

To provide a thermoelectric conversion module enabling cost reduction by reducing time and work required for assembly, and so on. A thermoelectric conversion module 10 comprises a tubular element unit 21 having a plurality of ring-like thermoelectric elements 22 coaxially arranged with air as an insulator sandwiched inbetween, wherein the ring-like thermoelectric element 22 is covered approximately entirely with electrodes 23a, 23b at its outer circumference surface 22a and inner circumference surface 22b, respectively, and generates electricity by temperature difference between the outer circumference surface 22a and the inner circumference surface 22b, a lead wire 31 electrically connecting the electrode 23a covered on the outer circumference surface 22a of one ring-like thermoelectric element 22 among the plurality of ring-like thermoelectric elements 22 to the electrode 23b covered on the inner circumference surface 22b of another ring-like thermoelectric element 22 adjacent to this one ring-like thermoelectric element 22, and a doubled cylindrical support unit 41 consisting of a SUS tube 42 whose outer circumference surface 42a supports the tubular element unit 21 and a SUS tube 43 whose inner circumference surface 43b supports the tubular element unit 21.

An air conditioning system for cooling or heating an air, and for feeding the heated or cooled air to predetermined portions is characterized by comprising: a first circulating circuit for circulating a first heating medium; a second circulating circuit for circulating a second heating medium; a control unit for controlling the heat for executing heat exchange between the first heating medium and the second heating medium to flow through either the heat exchanger or the first heat storing device. Moreover, an air temperature is controlled by heat of the second heating medium.

An improved water heater for use in spas, hot tubs, pools, hydrotherapy pools, bath tubs, and similar bodies of water used indoors, outdoors, or both indoors and outdoors are used for both therapeutic and recreational purposes. The water heater uses heating element technology know as thick film on substrate comprising resistive elements bonded to the outer dry surface of a substrate to heat the substrate which in turn heats the water flowing through the heating chamber. The heater is highly efficient due to the direct contact of the wet heating surface with the water and provides a smooth seamless inner heating surface by eliminating the need to pass electrical leads into the wet region of the heater. This virtually eliminates the risk of leaks in the water heater due to bulkhead fittings. The invention further eliminates the need for a heating element to be contained in the inner wet region of a spa heater, thereby reducing the risk of corrosion. The water heater can be used with electrical, electro-mechanical, and mechanical control systems for spas and can be retrofitted into existing spa applications.

A cooling plate for a battery pack with a plurality of battery cells is provided. The cooling plate includes a cooling fin with a substantially planar surface and a perimeter. The cooling plate includes a frame abutting the cooling fin and forming a seal with the cooling fin adjacent the perimeter of the same. The frame and the cooling fin define at least one fluid inlet, at least one fluid outlet, and a flow channel therebetween. The at least one fluid inlet and the at least one fluid outlet are disposed through the seal and are in fluid communication with the flow channel. The flow channel is disposed adjacent the perimeter and in heat transfer communication with the substantially planar surface of the cooling fin. A battery pack with the cooling plate, and a method for controlling a temperature of the battery pack, are also provided.

The invention provides a liner and a liquid heating container. The liner comprises a body, a heat conduction plate and a heating part, wherein the body comprises a barrel body and a barrel bottom connected with the bottom of the barrel body; the heat conduction plate fits to the outer wall face of the barrel bottom, and the heat conduction coefficient of the heat conduction plate is greater than that of the barrel bottom; the heating part is ring-shaped and fits to the lower surface of the heat conduction plate, and the projection of the heating part is positioned in the heat conduction plate;the thickness of the heat conduction plate is greater than or equal to 2mm; and/or, a spacing between the outer periphery of the contact part of the heating part and the heat conduction plate and theouter periphery of the heat conduction plate is greater than or equal to 3mm. For the liner provided by the invention, by increasing the spacing between the outer periphery of the contact part of theheating part and the heat conduction plate and the outer periphery of the heat conduction plate, heat generated by the heating part becomes bidirectional heat conduction from unidirectional heat conduction, so that the local thermal power density is greatly reduced, and the noises caused by heating water are reduced; and/or, the heat conduction plate is thickened, so that the local thermal shockis prevented, heat is uniformly transmitted as far as possible, and further, the noises caused by heating water are reduced.

This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

The invention described in this disclosure is an apparatus and method for clamping semiconductor wafers or other substrates or workpieces during etching, CVD, or surface modification processes. The purpose of the invention is to achieve improved heat transfer during processing between the wafer/substrate and a temperature controlled pedestal used for supporting it in the process chamber. The typical level of process heat put into the wafer during plasma-based etching or deposition processes will be up to about 10 Watts per centimeter squared while the maximum acceptable temperature differential between wafer/substrate and pedestal is less than about 100 Celsius. In such low gas pressure environments typical for plasma-based processes, the heat removal from the wafer/substrate by gaseous conduction may be inadequate to meet requirements. This invention achieves excellent heat transfer to the pedestal from the wafer/substrate when there is a thin, resilient, electrically insulating layer (tape) bonded to the wafer/substrate or the pedestal. Wafer/substrate clamping for improved process heat removal is achieved by a combination of vacuum clamping of the wafer/substrate beginning prior to evacuation of the processing chamber, along with or followed by electrostatic clamping of the wafer/substrate which continues during processing. The invention also permits the wafer/substrate to be rapidly and safely released from the electrostatic clamping when the chamber is returned to atmospheric pressure by a providing a slight pressure increase, above atmospheric pressure, between wafer and pedestal. The pedestal may have some roughening or narrow grooves on the wafer clamping surface, and some small holes from its surface leading to an evacuated plenum or channel within the pedestal. Alternatively, the pedestal may have a layer of a porous metal extending from its surface down to the evacuated channel or plenum which permits gas to be evacuated. These structures allow vacuum pumping of gas that might otherwise be trapped between the insulating layer and the pedestal. When a wafer/substrate is placed on the pedestal by loading at atmospheric pressure, vacuum pumping through the pedestal is commenced. This causes the workpiece to be pressed to the pedestal clamping surface with approximately atmospheric pressure compressing the soft layer against its clamping surface. This provides sufficient contact of the soft layer with the pedestal to greatly improve heat transfer from the wafer/substrate to the pedestal. A voltage is applied to the pedestal, beginning any time after the wafer is on the pedestal, to further clamp the wafer electrostatically. As the processing chamber is then pumped down to operating pressure for processing the electrostatic clamping voltage maintains sufficient pressure of the wafer/substrate against the pedestal to maintain the heat conductive contact between the soft layer and the pedestal. This permits good heat conduction to be maintained during the low pressure plasma-based etching or CVD processing. Following processing when the wafer/substrate is to be removed it may be rapidly de-clamped from the electrostatic clamping by application of a slight over-atmospheric pressure in the reservoir or pumping channels within the pedestal.

An apparatus for operably conveying heat away from a heat source includes a thermally conductive substrate having a thickness defining a planar boundary thereof, and an insert portion disposed in the substrate and being positioned so as not to extend beyond the planar boundary. The insert portion is a material having a thermal conductivity value of at least 1.5 times that of the substrate material along at least two axial directions, with one of such axial directions extending substantially perpendicularly to first and second opposed sides of the substrate.

Disclosed herein is a multi-cell battery pack having optimal temperature distribution throughout the battery pack and optimal air flow through the battery pack. Disclosed herein is a battery pack which provides optimal temperature distribution throughout the battery pack, wherein maximum cell temperature (T_max) and temperature differential amongst all cells in the battery pack (ΔT_cell) are optimized for efficient thermal management providing safety, improved performance and extended life of the battery pack and electrochemical cells. Also disclosed herein is a battery pack which provides optimal flow through the battery pack and minimal pressure drop (ΔP) throughout the battery pack.

This invention relates to a double- cycle high efficient heat pipe heat exchanging system that can control the heat exchanging quantity. There are evaporator and condenser two types of heat exchangers. The number of each type is one or several that formed by connected in parallel. This system includes: condensate supplying and distributing system; gas-liquid two phases flowing and separating system; gaseous phase transmitting and distributing system, liquid phase collecting and storing system; heat exchanging quantity controlling system. The evaporator of heat pipe, condenser, gas-liquid separator, liquid storage, solution circulating pump, liquid distributor, the connecting pipeline and related controlling parts are connected together to form the double cycles controllable heat pipe system. The solution pump, liquid distributor, evaporator and gas-liquid separator are connected together to form independent working fluid cycle, which settle the problems that working fluid carrying capacity is not enough and liquid distribution is uneven.

A cooking device for cooking items over a heat source has a base with an annular reservoir having an inside rim defining an opening, a substantially circular cooking plate supported by the base, a rack supported by the base over the cooking plate, and a lid supported by the base over the cooking plate and the rack. The base of the cooking device has an annular cooking plate supporting surface located radially outwardly from an outside rim of the annular reservoir, an annular rack supporting surface located radially outwardly from the cooking plate supporting surface, an annular lid supporting surface located radially outwardly from the rack supporting surface, an outer rim projecting radially outwardly and upwardly from the lid supporting surface, an upwardly-projecting annular sealing portion located intermediate the rack supporting portion and the lid supporting portion, an annular cooking plate retaining surface disposed radially outwardly from the cooking plate supporting surface, and discrete support elements projecting downwardly from the base. A reversible cooking plate has a grilling surface on one side and a griddle surface on an opposite side. In one position, the grilling surface is directed upwardly and is inclined at an angle, in a second position, the griddle surface is directed upwardly and is substantially horizontal. A rim of varying height extends around the periphery of the griddle surface and aligns the griddle surface at an angle when in the first position.

The present invention relates to thermosyphons, in particular for use in the cooling of electronic components. In a first embodiment a thermosyphon is manufactured by extruding a base (1) and milling a channel structure in the base to produce a plurality of fins (5) extending vertically from the base. A lid (3) comprising a number of fins (4) extending vertically from the lid is placed over the heat sink channel structure so that a thermosyphon of an expanding channel system is formed. In a second embodiment the evaporator and condenser sections are separated and connected by pipes. To form a leak proof seal between the lid and the base, joining is preferably done by friction stir welding. By providing an extruded thermosyphon, heat transfer is made more efficient than when junctions are used. The present invention provides a new way of efficiently manufacturing an integrated structure, while keeping the heat transfer of the structure high.

The invention provides a low-cost solar energy tracking and condensing power generation method, belongs to the field of solar utilization, relates to solar energy condensing light and heat power generation and condensing photovoltaic power generation and solar energy condensing light and heat utilization, and realizes a whole low-cost proposal for solar energy power generation through technical breakthroughs in various links. The method comprises that: a parallel linkage and a compensation mechanism control a reflecting mirror array to trace and condense light in low cost; heat induction of a power thermotube of an inverted valve is added to a thermotube cycle for evaporation and condensation; container type heat evaporation and pressurization replaces a feed pump to make a heat power generation cycle freely select working media for high-efficiency fully-enclosed operation; and a simple linear motor type hydrothermomagnetic power generation method can make the heat pressurization power generation cycle have higher efficiency and lower cost, make thermotubes on solar cell backboards radiate heat, condense light, generate power and the like. The low-cost whole resolution proposal can promote wide use of solar energy, and the technical breakthroughs in the various links can play important roles in saving energy in respective fields.