24824results about How to "Improve cooling efficiency" patented technology

Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, or more particularly, a gas supply device, for example, a shower head. The cooling device includes a separator configured to uniformly and efficiently cool the gas supply device.

There is provided a means for uniformly controlling the in-plane temperature of a semiconductor wafer at high speed in a high heat input etching process. A refrigerant channel structure in a circular shape is formed in a sample stage. Due to a fact that a heat transfer coefficient of a refrigerant is largely changed from a refrigerant supply port to a refrigerant outlet port, the cross sections of the channel structure is structured so as to be increased from a first channel areas towards a second channel areas in order to make the heat transfer coefficient of the refrigerant constant in the refrigerant channel structure. Thereby, the heat transfer coefficient of the refrigerant is prevented from increasing by reducing the flow rate of the refrigerant at a dry degree area where the heat transfer coefficient of the refrigerant is increased. Further, the cross section of the channel structure is structured so as to be reduced from the second channel areas towards a third channel areas, and thereby the heat transfer coefficient of the refrigerant is prevented from decreasing. Accordingly, the heat transfer coefficient of the refrigerant can be uniformed in the channel structure.

The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power supply is placed on top of the computer rack. In yet another variation, a dual column computer rack with a back-to-back configuration is implemented with DC power supplies placed in a top shelf of the one of the computer columns. The DC power supply may comprise of one or more direct current power supply modules configured to provide fail over protection. In another aspect of the invention, the power supply modules are placed in a separate rack and provide direct current to support computers in one or more computer racks.

A projection display apparatus comprises a liquid crystal unit assembly which includes a liquid crystal panel, an incident side polarizing plate and an emitting side polarizing plate which are arranged on an incident side and on an emitting side of the liquid crystal panel, respectively, and a color combining prism. The apparatus further comprises a fan; a duct which is connected to the fan and which is provided with an opening for supplying cooling air, wherein the opening is arranged near the liquid crystal panel and the incident side polarizing plate; a holder for holding the emitting side polarizing plate and the color combining prism; and a heat exchanger which is connected to the holder, wherein the heat exchanger uses liquid coolant.

The invention relates to a permanent magnetic coupling transmission, braking or load device with a cooling and lubricating device. The permanent magnetic coupling transmission, braking or load device is in a structure of a rotor disc, a rotating cylinder or in a combined / composite structure of the rotor disc and the rotating cylinder. The permanent magnetic coupling transmission, braking or load device consists of at least one group of axial magnetic field or / and radial magnetic field permanent magnetic coupling modules, at least one pair of a driving rotor disc / rotating cylinder coupling mechanism and a driving shaft coupling mechanism, at least one pair of a driven rotor disc / rotating cylinder coupling mechanism and a driven shaft coupling mechanism, one pair of air-gap space and coupling area adjusting mechanisms, at least one set of coolant cooling devices, at least one set of lubricating devices, at least one pair of integrated assembling mechanisms facilitating integration of system structure and a shell. The permanent magnetic coupling transmission, braking or load device is suitable for the technical fields such as transmission, speed regulation of transmission shaft and load, braking, rotating load, energy conservation and emission reduction, disconnection / connection power and the like. The invention is used for designing a technical scheme of a permanent magnetic coupling device, a speed regulation coupler device, automatic speed changing device, a brake device, a load / loading device, a centrifugal load speed regulation device or an engaging-disengaging device.

A heat dissipation apparatus is described. The heat dissipation apparatus is used in an electrical product, and especially in a notebook computer. The heat dissipation apparatus has two cooling fans, at least one heat pipe, and at least two heat dissipation fins. The first fan sucks cooling air from outside of the electrical product. The heat pipe coupling with a heat source transfers heat generated by the heat source to the heat dissipation fins. The first heat dissipation fin and the first fan remove part of the heat out of the electrical product. The second heat dissipation fin further connects with the heat source and the heat pipe to utilize the second fan to remove part of the heat exhausted by the first fan from the electrical product. The heat dissipation apparatus further comprises a third heat dissipation fin and a second heat pipe. The second heat pipe efficiently transfers the heat to each of the heat dissipation fins. The third heat dissipation fin is positioned in an outlet of the second fan to exchange heat again and thus enhance the heat dissipation efficiency.

The present invention includes a dual purpose carbonator / blending bottle connected to a source of beverage syrup, a source of potable water and to a source of pressurized carbon dioxide gas. The dual purpose bottle is retained within an ice bank water bath tank. A pair of ratio valves provide for metering the water and syrup at a desired ratio. The mixed beverage first flows through a serpentine coil, also located in water bath, and then flow into the dual purpose bottle. A refrigeration system provides for cooling an evaporator located in the water tank for forming the ice bank thereon. The carbonated beverage then flows from the bottle into a freeze cylinder. The freeze cylinder also includes a further evaporator coiled around an exterior perimeter thereof. The freeze cylinder evaporator is connected to and cooled by the same refrigeration system that cools the evaporator in the water bath tank. A scraping mechanism within the cylinder provides for scraping frozen beverage from the inner surface of the cylinder. A control mechanism provides for controlling the refrigeration system and the cooling of both evaporators. The beverage is therefore pre-cooled to a temperature just above its freezing point before delivery to the freeze cylinder. Thus, less cooling power is needed to reduce the beverage to a frozen state. The present invention utilizes a method of controlling the operation of the refrigeration system and the cooling of both evaporators thereof. The control system provides for directing refrigerant to one or the other of the evaporators as is most efficient so as to avoid short cycling or pressure build up. The present invention uses a control strategy that can more accurately maintain a pre-selected temperature differential between the inlet and outlet temperatures of the evaporators. The control algorithm utilizes a proportional integral differential control approach that safely permits a much narrower temperature difference so that a greater length of each freeze cylinder evaporator can be utilized for efficient heat transfer cooling.

A semiconductor package having heat sink at the outer surface is constructed on a lead frame. The package comprises a chip, a die pad, a plurality of leads, a plurality of bonding wires, and a molding compound. The die pad has a first surface and a second surface, and the chip has its active surface bonded to the first surface of the die pad. The area of the die pad is smaller than the area of the chip in order to expose the bonding pads on the active surface of the chip. The leads having an inner lead portions and an outer lead portions are disposed at the periphery of the die pad, and the inner lead portions are electrically connected to the bonding pads by a plurality of bonding wires. The molding compound encapsulates the chip, the die pad, the inner lead portions of the leads, and the bonding wires. The second surface of the die pad is exposed on the top surface of the package structure while the outer lead portion of the leads is exposed at the side edge of the package structure.