24826results about How to "Improve cooling efficiency" patented technology

An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

A vertical LED lamp with a 360-degree radiation and a high cooling efficiency includes a lampshade, a lamp base and a LED module. The LED module is contained in a chamber surrounded by the lampshade and the lamp base. The lamp base is able to provide DC for the LED module to work. The LED module is composed of a cooling column and a preset number of LED boards. The cooling column, shaped as a triangle or a tetragon or polygon and made of a thermal conductive material, is provided with a plugging slot on each surface for fitting with the LED bulb board, and plural fins formed on each surface for increasing areas to contact air Therefore, the LED lamp has 360-defree radiation and can perform with a better brightness and obtain a longer life.

A semiconductor package having heat sink at the outer surface is constructed on a lead frame. The package comprises a chip, a die pad, a plurality of leads, a plurality of bonding wires, and a molding compound. The die pad has a first surface and a second surface, and the chip has its active surface bonded to the first surface of the die pad. The area of the die pad is smaller than the area of the chip in order to expose the bonding pads on the active surface of the chip. The leads having an inner lead portions and an outer lead portions are disposed at the periphery of the die pad, and the inner lead portions are electrically connected to the bonding pads by a plurality of bonding wires. The molding compound encapsulates the chip, the die pad, the inner lead portions of the leads, and the bonding wires. The second surface of the die pad is exposed on the top surface of the package structure while the outer lead portion of the leads is exposed at the side edge of the package structure.

A tray 15 for a dry etching apparatus 1 has substrate accommodation holes 19A to 19D penetrating thickness direction and a substrate support portion 21 supporting an outer peripheral edge portion of a lower surface 2a of a substrate 2. A dielectric plate 23 has a tray support surface 28 supporting a lower surface of the tray 15, substrate placement portions 29A through 29D inserted from a lower surface side of the tray 15 into the substrate accommodation holes 19A through 19D and having a substrate placement surface 31 at its upper end surface for placing the substrate 2. A dc voltage applying mechanism 43 applies a dc voltage to an electrostatic attraction electrode 40. A heat conduction gas supply mechanism 45 supplies a heat conduction gas between the substrate 2 and substrate placement surface 31. The substrate 2 can be retained on the substrate placement surface 31 with high degree of adhesion. This results in that the cooling efficiency of the substrate 2 is improved and processing is uniformed at the entire region of the substrate surface including the vicinity of the outer peripheral edge.

Provided is a cooling device capable of controlling the temperature of an upper portion of a reactor, or more particularly, a gas supply device, for example, a shower head. The cooling device includes a separator configured to uniformly and efficiently cool the gas supply device.

There is provided a means for uniformly controlling the in-plane temperature of a semiconductor wafer at high speed in a high heat input etching process. A refrigerant channel structure in a circular shape is formed in a sample stage. Due to a fact that a heat transfer coefficient of a refrigerant is largely changed from a refrigerant supply port to a refrigerant outlet port, the cross sections of the channel structure is structured so as to be increased from a first channel areas towards a second channel areas in order to make the heat transfer coefficient of the refrigerant constant in the refrigerant channel structure. Thereby, the heat transfer coefficient of the refrigerant is prevented from increasing by reducing the flow rate of the refrigerant at a dry degree area where the heat transfer coefficient of the refrigerant is increased. Further, the cross section of the channel structure is structured so as to be reduced from the second channel areas towards a third channel areas, and thereby the heat transfer coefficient of the refrigerant is prevented from decreasing. Accordingly, the heat transfer coefficient of the refrigerant can be uniformed in the channel structure.

A secondary battery module includes a plurality of unit batteries, a housing receiving the unit batteries, a cell barrier plate disposed between the unit batteries to transfer heat generated from the unit batteries, a cooling plate disposed in contact with an end of the cell barrier plate, and a heat dissipation assembly disposed proximate to the cooling plate to dissipate heat transferred to the cooling plate.

The invention relates to a computer rack, frame or system having a direct current power supply positioned at the upper portion of the rack. In one variation, the DC power supply is placed in the highest shelf in the computer rack. In another variation, the DC power supply is placed on top of the computer rack. In yet another variation, a dual column computer rack with a back-to-back configuration is implemented with DC power supplies placed in a top shelf of the one of the computer columns. The DC power supply may comprise of one or more direct current power supply modules configured to provide fail over protection. In another aspect of the invention, the power supply modules are placed in a separate rack and provide direct current to support computers in one or more computer racks.

A projection display apparatus comprises a liquid crystal unit assembly which includes a liquid crystal panel, an incident side polarizing plate and an emitting side polarizing plate which are arranged on an incident side and on an emitting side of the liquid crystal panel, respectively, and a color combining prism. The apparatus further comprises a fan; a duct which is connected to the fan and which is provided with an opening for supplying cooling air, wherein the opening is arranged near the liquid crystal panel and the incident side polarizing plate; a holder for holding the emitting side polarizing plate and the color combining prism; and a heat exchanger which is connected to the holder, wherein the heat exchanger uses liquid coolant.

A roof top cooling unit has an evaporative cooling section that includes at least one evaporative module that pre-cools ventilation air and water; a condenser; a water reservoir and pump that captures and re-circulates water within the evaporative modules; a fan that exhausts air from the building and the evaporative modules and systems that refill and drain the water reservoir. The cooling unit also has a refrigerant section that includes a compressor, an expansion device, evaporator and condenser heat exchangers, and connecting refrigerant piping. Supply air components include a blower, an air filter, a cooling and / or heating coil to condition air for supply to the building, and optional dampers that, in designs that supply less than 100% outdoor air to the building, control the mixture of return and ventilation air.

A device for biopsy of body tissue. The device is driven by liquid CO2, and is provided with a control system to control various components to effectuate rotating core biopsies.

The invention relates to a permanent magnetic coupling transmission, braking or load device with a cooling and lubricating device. The permanent magnetic coupling transmission, braking or load device is in a structure of a rotor disc, a rotating cylinder or in a combined / composite structure of the rotor disc and the rotating cylinder. The permanent magnetic coupling transmission, braking or load device consists of at least one group of axial magnetic field or / and radial magnetic field permanent magnetic coupling modules, at least one pair of a driving rotor disc / rotating cylinder coupling mechanism and a driving shaft coupling mechanism, at least one pair of a driven rotor disc / rotating cylinder coupling mechanism and a driven shaft coupling mechanism, one pair of air-gap space and coupling area adjusting mechanisms, at least one set of coolant cooling devices, at least one set of lubricating devices, at least one pair of integrated assembling mechanisms facilitating integration of system structure and a shell. The permanent magnetic coupling transmission, braking or load device is suitable for the technical fields such as transmission, speed regulation of transmission shaft and load, braking, rotating load, energy conservation and emission reduction, disconnection / connection power and the like. The invention is used for designing a technical scheme of a permanent magnetic coupling device, a speed regulation coupler device, automatic speed changing device, a brake device, a load / loading device, a centrifugal load speed regulation device or an engaging-disengaging device.

A lamp structure includes a lamp housing. A plurality of air intake holes is respectively opened on two opposite sides of the lamp housing, and a plurality of vent holes is opened between the plurality of air intake holes on the two sides. A heat sink and a light-emitting element disposed on the heat sink are disposed inside the lamp housing. The heat sink is surrounded by a plurality of heat dissipation fins to form an accommodation chamber for accommodating a fan. When activated, the fan intakes an airflow respectively through the plurality of air intake holes on two sides of the lamp housing, blows the airflow to the plurality of heat dissipation fins, and ventilates the hot air through the vent holes, thereby realizing a double circulatory heat convection exchange effect.

The invention discloses a heat conductive silicone grease composition which mainly contains a carbon nano tube, graphite, phase-change capsule particles and silicone oil, wherein the carbon nano tube can speed up the conduction of heat further; the phase-change capsule particles are used for improving the initial temperature absorption velocity of a heat end; the phase-change capsule particles, the carbon nano tube and graphite in a fluid form full-three-dimensional network distribution of particles (phase-change capsule), a line ( the carbon nano tube) and a plane (graphite) in the fluid finally. The heat conductive silicone grease composition provided by the invention has high heat conduction rate and low heat resistivity, the heat radiation efficiency of the heat conductive silicone grease is improved greatly, the service life of the heat conductive silicone grease is prolonged greatly, and the heat conductive silicone grease composition has high practical value.

The invention relates to a nonpolar A side nitride film that comprises a silicon (102) underlay, metal layer which grows upon the silicon underlay sequentially, InGaAlN initial growth layer and the first InGaAlN buffer layer, it characterized in that: said silicon underlay is Si underlay which adopts the (102) side or offset angle. The nonpolar a side nitride film which grows on the silicon underlay can be used in LBD, laser, solar battery. The component extension configuration is adopted according to different component, for example the LBD and laser, and using the mature silicon craft further to produce relative diprosopia electrode component or peeling off component. The advantages of the invention are: the invention can increase the growth quality of nonpolar GaN base material, and decrease the cost; the craft of current component can be simplified greatly, the cost can be decreased, and increase the elimination efficiency and lightening efficiency greatly.

A heat sink comprises a base panel having a top surface and a bottom surface. A plurality of pin fins extend outwardly from the top surface and each fin has a cross-sectional configuration with two radiuses, a first radius and a second radius, wherein the first radius is larger than the second radius. The first and second radiuses are tangentially interconnected by intermediate portions, giving the pin fin cross-sectional configuration a raindrop shape, thereby generating low pressure drop across the heat sink by minimizing the drag force effects and maintaining large exposed surface area available for heat transfer.

The invention relates to a fracturing transmission and high-pressure discharging system. The fracturing transmission and high-pressure discharging system comprises a chassis and is characterized in that a high-power engine, a transfer case, a plurality of variable displacement plunger pumps and a double-acting fracturing pump are arranged on the chassis, the output end of the high-power engine is connected with the input end of the transfer case, the output end of the transfer case comprises a plurality of power take-off ports, and each power take-off port is connected with one variable displacement plunger pump; the variable displacement plunger pumps drive the double-acting fracturing pump through a hydraulic system. The fracturing transmission and high-pressure discharging system further comprises a system radiator and a heat dissipation plunger pump used for driving the system radiator, and the heat dissipation plunger pump is connected with one power take-off port of the transfer case. The power take-off ports of the transfer case and the variable displacement plunger pumps are arranged annularly. The fracturing transmission and high-pressure discharging system has the advantages that hydraulic driving replaces mechanical transmission, and working vibration is reduced; the layout space of a whole vehicle is saved, and meanwhile, operating efficiency and the stability of the whole vehicle are improved.

A heat dissipation apparatus is described. The heat dissipation apparatus is used in an electrical product, and especially in a notebook computer. The heat dissipation apparatus has two cooling fans, at least one heat pipe, and at least two heat dissipation fins. The first fan sucks cooling air from outside of the electrical product. The heat pipe coupling with a heat source transfers heat generated by the heat source to the heat dissipation fins. The first heat dissipation fin and the first fan remove part of the heat out of the electrical product. The second heat dissipation fin further connects with the heat source and the heat pipe to utilize the second fan to remove part of the heat exhausted by the first fan from the electrical product. The heat dissipation apparatus further comprises a third heat dissipation fin and a second heat pipe. The second heat pipe efficiently transfers the heat to each of the heat dissipation fins. The third heat dissipation fin is positioned in an outlet of the second fan to exchange heat again and thus enhance the heat dissipation efficiency.

A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip is mounted on and electrically connected to a surface of a substrate, and a thermally conductive member is stacked on the chip and electrically coupled to the surface of the substrate by bonding wires. An encapsulant is formed and encapsulates the chip, thermally conductive member, and bonding wires. A plurality of solder balls are implanted on an opposite surface of the substrate. The thermally conductive member is grounded via the bonding wires, substrate, and solder balls, and provides an EMI shielding effect for the chip to protect the chip against external electric and magnetic interference. The thermally conductive member has a coefficient of thermal expansion similar to that of the chip, and reduces thermal stress exerted on the chip and enhances mechanical strength of the chip to thereby prevent chip cracks.

The present invention includes a dual purpose carbonator / blending bottle connected to a source of beverage syrup, a source of potable water and to a source of pressurized carbon dioxide gas. The dual purpose bottle is retained within an ice bank water bath tank. A pair of ratio valves provide for metering the water and syrup at a desired ratio. The mixed beverage first flows through a serpentine coil, also located in water bath, and then flow into the dual purpose bottle. A refrigeration system provides for cooling an evaporator located in the water tank for forming the ice bank thereon. The carbonated beverage then flows from the bottle into a freeze cylinder. The freeze cylinder also includes a further evaporator coiled around an exterior perimeter thereof. The freeze cylinder evaporator is connected to and cooled by the same refrigeration system that cools the evaporator in the water bath tank. A scraping mechanism within the cylinder provides for scraping frozen beverage from the inner surface of the cylinder. A control mechanism provides for controlling the refrigeration system and the cooling of both evaporators. The beverage is therefore pre-cooled to a temperature just above its freezing point before delivery to the freeze cylinder. Thus, less cooling power is needed to reduce the beverage to a frozen state. The present invention utilizes a method of controlling the operation of the refrigeration system and the cooling of both evaporators thereof. The control system provides for directing refrigerant to one or the other of the evaporators as is most efficient so as to avoid short cycling or pressure build up. The present invention uses a control strategy that can more accurately maintain a pre-selected temperature differential between the inlet and outlet temperatures of the evaporators. The control algorithm utilizes a proportional integral differential control approach that safely permits a much narrower temperature difference so that a greater length of each freeze cylinder evaporator can be utilized for efficient heat transfer cooling.

An insulated shipping container system for transferring a temperature sensitive product comprising a substantially hollow insulated body having inner walls and outer walls defining a payload cavity to receive a payload and supports to space the payload from the insulated body thereby defining an internal air filled space to facilitate heat transfer. The insulated shipping container system further comprises a heat transfer element cavity configured to receive a heat transfer element and supports to space the heat transfer element from the insulated body thereby defining an internal air filled space to facilitate heat transfer. Also provided are methods for shipping temperature sensitive products and goods comprised of packing and assembling the insulated shipping container system disclosed herein.

A light-emitting device includes a light emitting portion comprising a substrate having a mounting surface for mounting a LED element and a metal portion formed on a surface of the substrate opposite to the mounting surface, the substrate comprising ceramic or a semiconductor and the metal portion being bondable to a solder material and a heat dissipating member comprising aluminum, aluminum alloy, magnesium or magnesium alloy, and having, on a surface thereof, a junction treated so as to be bondable to the solder material and a heat dissipating film formed in a periphery of the junction, wherein the metal portion of the light emitting portion is bonded to the junction of the heat dissipating member by the solder material.

A plasma display. The plasma display comprises a first circuit board and a second circuit board disposed in a space formed by a base plate and a back cover thereof. The first circuit board is mounted on the base plate and bears a first electronic element, the second circuit board is mounted on the first circuit board and bears a second electronic element requiring heat dissipation different from the first electronic element. A thermal conductive device is disposed between the second electronic element and the back cover to dissipate heat from the second electronic element to the back cover. Thereby, the electronic elements requiring different heat dissipation are positioned in divided areas to enhance heat dissipation efficiency.

The invention provides a Ka-band tilt-structure active phased array antenna, so as to provide an active phased array antenna which is high in integration density and can improve maintainability and interchangeability. According to the technical scheme, one path of RF signals transmitted by a transmitting signal processing terminal are transmitted to a power distribution / synthesis network (5) via a signal interface and a radio frequency interface to be divided into M paths of signals; according to information of an azimuth angle and a pitch angle of the phased array antenna provided by the transmitting signal processing terminal in real time, a beam controller (4) calculates and obtains beam pointing of the phased array antenna in real time through an FPGA; the beam pointing of the phased array antenna is converted into phase data needed by each array element under control of the beam controller (4); the data are transmitted to tilt-type TR assembly sub array modules in N channels respectively via a high and low-frequency interconnected multi-core high and low-frequency socket, and under control of the beam controller, M*N paths of signals are transmitted to an antenna array, and thus signal transmission is completed, and synchronous electric control scanning of beams transmitted by the phased array antenna is realized.

A semiconductor package having heat sink at the outer surface is constructed on a lead frame. The package comprises a chip, a die pad, a plurality of leads, a plurality of bonding wires, and a molding compound. The die pad has a first surface and a second surface, and the chip has its active surface bonded to the first surface of the die pad. The area of the die pad is smaller than the area of the chip in order to expose the bonding pads on the active surface of the chip. The leads having an inner lead portions and an outer lead portions are disposed at the periphery of the die pad, and the inner lead portions are electrically connected to the bonding pads by a plurality of bonding wires. The molding compound encapsulates the chip, the die pad, the inner lead portions of the leads, and the bonding wires. The second surface of the die pad is exposed on the top surface of the package structure while the outer lead portion of the leads is exposed at the side edge of the package structure.

A heat-dissipating structure for a LED lamp includes a heat-dissipating base, a heat-dissipating body and a plurality of heat pipes. The heat-dissipating body has an outer cylinder formed into a hollow cylinder. The inside surface of the outer cylinder is provided with a plurality of accommodating grooves. The condensed ends of the plurality of heat pipes are inserted into the accommodating grooves. The end to be heated of the heat pipe is adhered to the heat-dissipating base. Further, the inside surface and the outside surface of the outer cylinder are formed with a plurality of heat-dissipating fins made by aluminum extrusion, so that the heat pipes are encircled by the heat-dissipating fins. In this way, the heat can be conducted by the plurality of heat pipes so as to increase the total contacting area. Thus, the heat can be rapidly conducted to the outer cylinder. Further, the heat can be rapidly dissipated to the outside by the heat-dissipating fins, thereby to substantially increase the efficiency in the heat dissipation.

An LED lamp includes a hollow first heat sink (10), a plurality of LED modules (40) respectively mounted on outer sidewalls (120) of the first heat sink, a second heat sink (20) being enclosed by the first heat sink, and a plurality of heat pipes (30) connecting the second heat sink to the first heat sink. The second heat sink includes an annular base (22) and a plurality of fins (24, 240) extending outwardly and radially from an outer sidewall of the base. The heat pipes couple the base of the second heat sink with the first heat sink, so that heat generated by the LED modules can be transferred from the first heat sink to the second heat sink via the heat pipes, thereby enhancing a heat dissipating efficiency of the LED lamp.

An apparatus and method for impingement cooling of a turbine vane, in which the vane includes an insert having a plurality of impingement cavities formed therein and in series such that cooling air flows from a first impingement cavity onto the wall for impingement cooling, and is then directed into the second impingement cavity and redirected for impingement cooling on another part of the wall. Supports for the insert form seals that direct cooling air from one impingement cavity into the next impingement cavity in the series. A trailing edge impingement cavity directs cooling air through holes to provide impingement cooling to the trailing edge region, the cooling air passing through a trailing edge discharge passage to cool the trailing edge. The insert is formed as a single piece, and has from 3 to 5 impingement cavities separated by ribs.

An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor element, respectively, and facing in opposite directions; a first electrode on the first surface; a second electrode on the second surface; a first circuit board electrically connected to the first electrode via a metallic plate such that the metallic plate and the semiconductor element are on the first circuit board; a second circuit board on the second side of the semiconductor element, the second circuit board having a control circuit for the semiconductor element; and a metallic wire for directly electrically interconnecting the second electrode and the second circuit board.